AUIRFL024N
AUTOMOTIVE GRADE
HEXFET® Power MOSFET
Features
•
•
•
•
•
•
•
•
•
D
Advanced Planar Technology
Low On-Resistance
Dynamic dV/dT Rating
150°C Operating Temperature
Fast Switching
Fully Avalanche Rated
Repetitive Avalanche Allowed up to Tjmax
Lead-Free, RoHS Compliant
Automotive Qualified*
V(BR)DSS
55V
RDS(on) max.
G
S
75mΩ
ID
2.8A
D
S
D
Description
G
Specifically designed for Automotive applications, this
cellular design of HEXFET® Power MOSFETs utilizes
the latest processing techniques to achieve low onresistance per silicon area. This benefit combined
with the fast switching speed and ruggedized device
design that HEXFET power MOSFETs are well known
for, provides the designer with an extremely efficient
and reliable device for use in Automotive and a wide
variety of other applications.
Base part number
Package Type
AUIRFL024N
SOT-223
SOT-223
AUIRFL024N
G
D
S
Gate
Drain
Source
Standard Pack
Form
Quantity
Tube
95
Tape and Reel
Orderable Part Number
AUIRFL024N
2500
AUIRFL024NTR
Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These
are stress ratings only; and functional operation of the device at these or any other condition beyond those indicated in the
specifications is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions.
Ambient temperature (TA) is 25°C, unless otherwise specified.
Parameter
ID @ TA = 25°C
h
Continuous Drain Current, VGS @ 10V g
ID @ TA = 70°C
Continuous Drain Current, VGS @ 10V
ID @ TA = 25°C
Pulsed Drain Current
IDM
Max.
Continuous Drain Current, VGS @ 10V
c
Units
4.0
2.8
g
2.3
A
11.2
Power Dissipation (PCB Mount)
2.1
PD @TA = 25°C
h
Power Dissipation (PCB Mount) g
VGS
Linear Derating Factor (PCB Mount)
Gate-to-Source Voltage
1.0
8.3
± 20
mW/°C
V
EAS
Single Pulse Avalanche Energy (Thermally Limited)
214
mJ
IAR
Avalanche Current
2.8
A
EAR
dv/dt
TJ
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Operating Junction and
0.1
5.0
-55 to + 150
mJ
V/ns
TSTG
Storage Temperature Range
PD @TA = 25°C
c
g
d
cg
e
W
°C
Thermal Resistance
Parameter
RθJA
Junction-to-Ambient (PCB mount, steady state)
RθJA
Junction-to-Ambient (PCB mount, steady state)
g
h
Typ.
Max.
Units
90
120
°C/W
50
60
HEXFET® is a registered trademark of International Rectifier.
*Qualification standards can be found at http://www.irf.com/
1
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AUIRFL024N
Static Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
Parameter
V(BR)DSS
ΔV(BR)DSS/ΔTJ
RDS(on)
VGS(th)
gfs
IDSS
IGSS
Drain-to-Source Breakdown Voltage
Breakdown Voltage Temp. Coefficient
Static Drain-to-Source On-Resistance
Gate Threshold Voltage
Forward Transconductance
Drain-to-Source Leakage Current
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Min. Typ. Max. Units
55
–––
–––
2.0
3.0
–––
–––
–––
–––
–––
0.056
–––
–––
–––
–––
–––
–––
–––
–––
–––
75
4.0
–––
25
250
100
-100
V
V/°C
mΩ
V
S
μA
nA
Conditions
VGS = 0V, ID = 250μA
Reference to 25°C, ID = 1mA
VGS = 10V, ID = 2.8A
VDS = VGS, ID = 250μA
VDS = 25V, ID = 1.6A
VDS = 55V, VGS = 0V
VDS = 44V, VGS = 0V, TJ = 125°C
VGS = 20V
VGS = -20V
f
Dynamic Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
Parameter
Qg
Qgs
Qgd
td(on)
tr
td(off)
tf
Ciss
Coss
Crss
Total Gate Charge
Gate-to-Source Charge
Gate-to-Drain ("Miller") Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Min. Typ. Max. Units
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
8.1
13.4
22.2
17.7
400
145
60
18.3
3.0
7.7
–––
–––
–––
–––
–––
–––
–––
nC
ns
Conditions
ID = 1.68A
VDS = 28V
VGS = 10V, See Fig. 6 and 9
VDD = 28V
ID = 1.68A
RG = 24 Ω
RD = 17Ω, See Fig. 10
VGS = 0V
VDS = 25V
ƒ = 1.0MHz, See Fig. 5
f
f
pF
Diode Characteristics
Parameter
Min. Typ. Max. Units
IS
Continuous Source Current
–––
–––
2.8
ISM
(Body Diode)
Pulsed Source Current
–––
–––
11.2
VSD
trr
Qrr
ton
(Body Diode)
Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge
Forward Turn-On Time
–––
–––
–––
–––
35
50
1.0
53
75
c
Notes:
Repetitive rating; pulse width limited by
max. junction temperature. ( See fig. 11)
VDD = 25V, starting TJ = 25°C, L = 54.7mH
RG = 25Ω, IAS = 2.8A. (See Figure 12)
ISD ≤ 1.68A, di/dt ≤ 155A/µs, VDD ≤ V(BR)DSS,
TJ ≤ 150°C .
2
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Conditions
MOSFET symbol
A
V
ns
nC
showing the
integral reverse
p-n junction diode.
TJ = 25°C, IS = 1.68A, VGS = 0V
TJ = 25°C, IF = 1.68A
di/dt = 100A/μs
f
f
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
Pulse width ≤ 300µs; duty cycle ≤ 2%.
When mounted on FR-4 board using minimum recommended
footprint.
When mounted on 1 inch square copper board, for comparison
with other SMD devices.
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AUIRFL024N
100
100
VGS
15V
10V
8.0V
7.0V
6.0V
5.5V
5.0V
BOTTOM 4.5V
I D , Drain-to-Source Current (A)
I D , Drain-to-Source Current (A)
10
4.5V
1
20μs PULSE WIDTH
TJ = 25 °C
0.1
0.1
1
10
10
4.5V
1
2.0
RDS(on) , Drain-to-Source On Resistance
(Normalized)
I D , Drain-to-Source Current (A)
TJ = 150 ° C
TJ = 25 ° C
V DS = 25V
20μs PULSE WIDTH
5.0
5.5
6.0
Fig 3. Typical Transfer Characteristics
3
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10
100
Fig 2. Typical Output Characteristics,
100
VGS , Gate-to-Source Voltage (V)
1
VDS , Drain-to-Source Voltage (V)
Fig 1. Typical Output Characteristics,
1
4.5
20μs PULSE WIDTH
TJ = 150 °C
0.1
0.1
100
VDS , Drain-to-Source Voltage (V)
10
VGS
15V
10V
8.0V
7.0V
6.0V
5.5V
5.0V
BOTTOM 4.5V
TOP
TOP
6.5
ID = 2.8A
1.5
1.0
0.5
0.0
-60 -40 -20
VGS = 10V
0
20
40
60
80 100 120 140 160
TJ , Junction Temperature ( °C)
Fig 4. Normalized On-Resistance
Vs. Temperature
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AUIRFL024N
C, Capacitance (pF)
600
Ciss
500
20
VGS = 0V,
f = 1MHz
Ciss = Cgs + Cgd , Cds SHORTED
Crss = Cgd
Coss = Cds + Cgd
VGS , Gate-to-Source Voltage (V)
700
Coss
400
300
200
Crss
100
0
1
10
ID = 1.68 A
15
10
5
0
100
FOR TEST CIRCUIT
SEE FIGURE 13
0
5
10
15
20
QG , Total Gate Charge (nC)
VDS , Drain-to-Source Voltage (V)
Fig 5. Typical Capacitance Vs.
Drain-to-Source Voltage
Fig 6. Typical Gate Charge Vs.
Gate-to-Source Voltage
100
100
OPERATION IN THIS AREA LIMITED
BY RDS(on)
ID , Drain Current (A)
ISD , Reverse Drain Current (A)
VDS = 44V
VDS = 27V
10
1
TJ = 150 ° C
TJ = 25 ° C
0.1
0.2
V GS = 0 V
0.4
0.6
0.8
1.0
VSD ,Source-to-Drain Voltage (V)
Fig 7. Typical Source-Drain Diode
Forward Voltage
4
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1.2
10
100us
1ms
1
10ms
TC = 25 ° C
TJ = 150 ° C
Single Pulse
0.1
0.1
1
10
100
VDS , Drain-to-Source Voltage (V)
Fig 8. Maximum Safe Operating Area
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1000
AUIRFL024N
QG
10V
VGS
QGS
RD
V DS
QGD
D.U.T.
RG
+
- VDD
VG
10V
Charge
Pulse Width ≤ 1 µs
Duty Factor ≤ 0.1 %
Fig 9a. Basic Gate Charge Waveform
Fig 10a. Switching Time Test Circuit
Current Regulator
Same Type as D.U.T.
VDS
90%
50KΩ
.2μF
12V
.3μF
D.U.T.
+
V
- DS
10%
VGS
VGS
td(on)
3mA
IG
tr
t d(off)
tf
ID
Current Sampling Resistors
Fig 9b. Gate Charge Test Circuit
Fig 10b. Switching Time Waveforms
Thermal Response (Z thJC )
1000
100
D = 0.50
0.20
0.10
10
0.05
P DM
0.02
0.01
t1
1
t2
SINGLE PULSE
(THERMAL RESPONSE)
0.1
0.0001
0.001
Notes:
1. Duty factor D = t 1 / t 2
2. Peak TJ = P DM x Z thJC + TC
0.01
0.1
1
10
100
1000
t1, Rectangular Pulse Duration (sec)
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient
5
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AUIRFL024N
15V
L
VDS
D.U.T
RG
IAS
10V
tp
DRIVER
+
V
- DD
A
0.01Ω
Fig 12a. Unclamped Inductive Test Circuit
V(BR)DSS
EAS , Single Pulse Avalanche Energy (mJ)
500
TOP
400
BOTTOM
ID
1.3A
2.2A
2.8A
300
200
100
0
25
50
75
100
125
Starting TJ , Junction Temperature ( °C)
Fig 12c. Maximum Avalanche Energy
Vs. Drain Current
tp
I AS
Fig 12b. Unclamped Inductive Waveforms
6
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150
AUIRFL024N
SOT-223 (TO-261AA) Package Outline
Dimensions are shown in milimeters (inches)
SOT-223 (TO-261AA) Part Marking Information
FL024N
Date Code
Y= Year
WW= Work Week
A= Automotive, Lead Free
Note: For the most current drawing please refer to IR website at http://www.irf.com/package/
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AUIRFL024N
SOT-223 (TO-261AA) Tape & Reel Information
Dimensions are shown in milimeters (inches)
2.05 (.080)
1.95 (.077)
TR
4.10 (.161)
3.90 (.154)
0.35 (.013)
0.25 (.010)
1.85 (.072)
1.65 (.065)
7.55 (.297)
7.45 (.294)
16.30 (.641)
15.70 (.619)
7.60 (.299)
7.40 (.292)
1.60 (.062)
1.50 (.059)
TYP.
FEED DIRECTION
12.10 (.475)
11.90 (.469)
2.30 (.090)
2.10 (.083)
7.10 (.279)
6.90 (.272)
NOTES :
1. CONTROLLING DIMENSION: MILLIMETER.
2. OUTLINE CONFORMS TO EIA-481 & EIA-541.
3. EACH O330.00 (13.00) REEL CONTAINS 2,500 DEVICES.
13.20 (.519)
12.80 (.504)
15.40 (.607)
11.90 (.469)
4
330.00
(13.000)
MAX.
NOTES :
1. OUTLINE COMFORMS TO EIA-418-1.
2. CONTROLLING DIMENSION: MILLIMETER..
3. DIMENSION MEASURED @ HUB.
4. INCLUDES FLANGE DISTORTION @ OUTER EDGE.
50.00 (1.969)
MIN.
18.40 (.724)
MAX.
14.40 (.566)
12.40 (.488)
4
3
Note: For the most current drawing please refer to IR website at http://www.irf.com/package/
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AUIRFL024N
Qualification Information†
Automotive
(per AEC-Q101)
Comments: This part number(s) passed Automotive
qualification. IR’s Industrial and Consumer qualification
level is granted by extension of the higher Automotive
level.
Qualification Level
Moisture Sensitivity Level
Machine Model
ESD
††
SOT-223
MSL1
Class M2 (+/- 150V)†††
AEC-Q101-002
Human Body Model
Class H1A (+/- 350V)†††
AEC-Q101-001
Charged Device Model
Class C5 (+/- 2000V)
AEC-Q101-005
RoHS Compliant
†††
Yes
Qualification standards can be found at International Rectifiers web site: http//www.irf.com/
Exceptions (if any) to AEC-Q101 requirements are noted in the qualification report.
Highest passing voltage.
9
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AUIRFL024N
IMPORTANT NOTICE
Unless specifically designated for the automotive market, International Rectifier Corporation and its subsidiaries (IR) reserve the right to make corrections, modifications, enhancements, improvements, and other
changes to its products and services at any time and to discontinue any product or services without notice.
Part numbers designated with the AU prefix follow automotive industry and / or customer specific
requirements with regards to product discontinuance and process change notification. All products are sold
subject to IRs terms and conditions of sale supplied at the time of order acknowledgment.
IR warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with IRs standard warranty. Testing and other quality control techniques are used to the extent
IR deems necessary to support this warranty. Except where mandated by government requirements, testing
of all parameters of each product is not necessarily performed.
IR assumes no liability for applications assistance or customer product design. Customers are responsible
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applications, customers should provide adequate design and operating safeguards.
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that product or service voids all express and any implied warranties for the associated IR product or service
and is an unfair and deceptive business practice. IR is not responsible or liable for any such statements.
IR products are not designed, intended, or authorized for use as components in systems intended for surgical
implant into the body, or in other applications intended to support or sustain life, or in any other application
in which the failure of the IR product could create a situation where personal injury or death may occur. Should
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Only products certified as military grade by the Defense Logistics Agency (DLA) of the US Department of
Defense, are designed and manufactured to meet DLA military specifications required by certain military,
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IR products are neither designed nor intended for use in automotive applications or environments unless the
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number including the designation AU. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, IR will not be responsible for any failure to meet such requirements.
For technical support, please contact IRs Technical Assistance Center
http://www.irf.com/technical-info/
WORLD HEADQUARTERS:
101 N. Sepulveda Blvd., El Segundo, California 90245
Tel: (310) 252-7105
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AUIRFL024N
Revision History
Date
3/26/2014
11
Comments
• Updated part marking on page 7
• Updated data sheet with new IR corporate template
www.irf.com © 2014 International Rectifier
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