AUTOMOTIVE GRADE
Features
Advanced Process Technology
Ultra Low On-Resistance
175°C Operating Temperature
Fast Switching
Repetitive Avalanche Allowed up to Tjmax
Lead-Free, RoHS Compliant
Automotive Qualified *
HEXFET® POWER MOSFET
Description
Specifically designed for Automotive applications, this
HEXFET® Power MOSFET utilizes the latest processing
techniques to achieve extremely low on-resistance per
silicon are. Additional features of this design are a 175°C
junction operating temperature, fast switching speed and
improved repetitive avalanche rating. These features
combine to make this product an extremely efficient and
reliable device for use in Automotive and wide variety of
other applications.
Package Type
AUIRFN7107
PQFN 5mm x 6mm
VDSS
75V
RDS(on) max
(@VGS = 10V)
8.5m
QG (typical)
51nC
ID
(@TC (Bottom) = 25°C)
75A
PQFN 5X6 mm
Applications
Injection
Heavy Loads
DC-DC Converter
Base Part Number
AUIRFN7107
G
D
S
Gate
Drain
Source
Standard Pack
Form
Quantity
Tape and Reel
4000
Complete Part Number
AUIRFN7107TR
Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only; and
functional operation of the device at these or any other condition beyond those indicated in the specifications is not implied. Exposure to absolutemaximum-rated conditions for extended periods may affect device reliability. The thermal resistance and power dissipation ratings are measured under
board mounted and still air conditions. Ambient temperature (TA) is 25°C, unless otherwise specified.
VDS
ID @ TA = 25°C
ID @ TA = 70°C
ID @ TC(Bottom) = 25°C
ID @ TC(Bottom) = 100°C
IDM
PD @TA = 25°C
PD @TC(Bottom) = 25°C
VGS
EAS
IAR
TJ
TSTG
Parameter
Drain-to-Source Voltage
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Pulsed Drain Current
Power Dissipation
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Single Pulse Avalanche Energy
Avalanche Current
Operating Junction and
Storage Temperature Range
Max.
75
14
12
75
53
300
4.4
125
0.029
± 20
123
45
-55 to + 175
Units
V
A
W
W/°C
V
mJ
A
°C
HEXFET® is a registered trademark of Infineon.
*Qualification standards can be found at www.infineon.com
1
2015-10-12
AUIRFN7107
Thermal Resistance
Symbol
Parameter
RJC (Bottom)
Junction-to-Case
Typ.
–––
RJC (Top)
Junction-to-Case
–––
27
RJA
Junction-to-Ambient
–––
34
RJA (
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