AUTOMOTIVE GRADE
AUIRFR3710Z
Features
Advanced Process Technology
Ultra Low On-Resistance
175°C Operating Temperature
Fast Switching
Repetitive Avalanche Allowed up to Tjmax
Lead-Free, RoHS Compliant
Automotive Qualified *
HEXFET® Power MOSFET
VDSS
100V
RDS(on)
max.
18m
ID (Silicon Limited)
56A
ID (Package Limited)
42A
D
Description
Specifically designed for Automotive applications, this HEXFET®
Power MOSFET utilizes the latest processing techniques to
achieve extremely low on-resistance per silicon area. Additional
features of this design are a 175°C junction operating temperature,
fast switching speed and improved repetitive avalanche rating .
These features combine to make this design an extremely efficient
and reliable device for use in Automotive applications and a wide
variety of other applications.
Base part number
D-Pak
S
D-Pak
AUIRFR3710Z
G
Gate
D
Drain
Standard Pack
Form
Quantity
Tube
75
Tape and Reel Left
3000
Package Type
AUIRFR3710Z
G
S
Source
Orderable Part Number
AUIRFR3710Z
AUIRFR3710ZTRL
Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress
ratings only; and functional operation of the device at these or any other condition beyond those indicated in the specifications is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The thermal resistance
and power dissipation ratings are measured under board mounted and still air conditions. Ambient temperature (TA) is 25°C, unless
otherwise specified.
Symbol
Parameter
Max.
ID @ TC = 25°C
Continuous Drain Current, VGS @ 10V (Silicon Limited)
56
ID @ TC = 100°C
Continuous Drain Current, VGS @ 10V (Silicon Limited)
39
ID @ TC = 25°C
IDM
PD @TC = 25°C
Continuous Drain Current, VGS @ 10V (Package Limited)
Pulsed Drain Current
Maximum Power Dissipation
42
220
140
VGS
EAS
EAS (Tested)
IAR
EAR
TJ
TSTG
Linear Derating Factor
Gate-to-Source Voltage
Single Pulse Avalanche Energy (Thermally Limited)
Single Pulse Avalanche Energy Tested Value
Avalanche Current
Repetitive Avalanche Energy
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds (1.6mm from case)
Thermal Resistance
Symbol
RJC
RJA
RJA
Parameter
Junction-to-Case
Junction-to-Ambient ( PCB Mount)
Junction-to-Ambient
Units
A
W
0.95
± 20
150
200
See Fig.15,16, 12a, 12b
W/°C
V
mJ
A
mJ
-55 to + 175
°C
300
Typ.
Max.
Units
–––
–––
–––
1.05
50
110
°C/W
HEXFET® is a registered trademark of Infineon.
*Qualification standards can be found at www.infineon.com
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AUIRFR3710Z
Static @ TJ = 25°C (unless otherwise specified)
V(BR)DSS
V(BR)DSS/TJ
RDS(on)
VGS(th)
gfs
Parameter
Drain-to-Source Breakdown Voltage
Breakdown Voltage Temp. Coefficient
Static Drain-to-Source On-Resistance
Gate Threshold Voltage
Forward Trans conductance
IDSS
Drain-to-Source Leakage Current
IGSS
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Min. Typ. Max. Units
Conditions
100 ––– –––
V VGS = 0V, ID = 250µA
––– 0.088 ––– V/°C Reference to 25°C, ID = 1mA
–––
15
18
m VGS = 10V, ID = 33A
2.0
–––
4.0
V VDS = VGS, ID = 250µA
39
––– –––
S VDS = 25V, ID = 33A
––– –––
20
VDS = 100V, VGS = 0V
µA
––– ––– 250
VDS = 100V,VGS = 0V,TJ =125°C
––– ––– 200
VGS = 20V
nA
––– ––– -200
VGS = -20V
Dynamic Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
Qg
Qgs
Qgd
td(on)
tr
td(off)
tf
Total Gate Charge
Gate-to-Source Charge
Gate-to-Drain Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
–––
–––
–––
–––
–––
–––
–––
69
15
25
14
43
53
42
100
–––
–––
–––
–––
–––
–––
LD
Internal Drain Inductance
–––
4.5
–––
LS
Internal Source Inductance
–––
7.5
–––
–––
–––
–––
–––
–––
–––
2930
290
180
1200
180
430
–––
–––
–––
–––
–––
–––
Min.
Typ. Max. Units
–––
–––
56
–––
–––
220
–––
–––
–––
–––
35
41
1.3
53
62
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
Coss
Output Capacitance
Output Capacitance
Coss
Effective Output Capacitance
Coss eff.
Diode Characteristics
Parameter
Continuous Source Current
IS
(Body Diode)
Pulsed Source Current
ISM
(Body Diode)
VSD
Diode Forward Voltage
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
ton
Forward Turn-On Time
ID = 33A
nC VDS = 80V
VGS = 10V
VDD = 50V
ID = 33A
ns
RG = 6.8
VGS = 10V
Between lead,
6mm (0.25in.)
nH
from package
and center of die contact
VGS = 0V
VDS = 25V
ƒ = 1.0MHz
pF
VGS = 0V, VDS = 1.0V ƒ = 1.0MHz
VGS = 0V, VDS = 80V ƒ = 1.0MHz
VGS = 0V, VDS = 0V to 80V
Conditions
MOSFET symbol
showing the
A
integral reverse
p-n junction diode.
V TJ = 25°C,IS = 33A, VGS = 0V
ns TJ = 25°C ,IF = 33A, VDD = 50V
nC di/dt = 100A/µs
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
Notes:
Repetitive rating; pulse width limited by max. junction temperature. (See fig. 11)
Limited by TJmax , starting TJ = 25°C, L = 0.28mH, RG = 25, IAS = 33A, VGS =10V. Part not recommended for use above this value.
Pulse width 1.0ms; duty cycle 2%.
Coss eff. is a fixed capacitance that gives the same charging time as Coss while VDS is rising from 0 to 80% VDSS
Limited by TJmax , see Fig.12a, 12b, 15, 16 for typical repetitive avalanche performance.
This value determined from sample failure population, starting TJ = 25°C, L = 0.28mH, RG = 25, IAS = 33A, VGS =10V.
When mounted on 1" square PCB (FR-4 or G-10 Material). For recommended footprint and soldering techniques refer to
application note #AN-994
R is measured at TJ approximately 90°C.
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AUIRFR3710Z
1000
1000
BOTTOM
100
TOP
ID, Drain-to-Source Current (A)
ID, Drain-to-Source Current (A)
TOP
VGS
15V
10V
6.0V
5.0V
4.8V
4.5V
4.3V
4.0V
100
10
4.0V
60µs PULSE WIDTH
Tj = 25°C
1
0.1
1
10
BOTTOM
4.0V
10
1
60µs PULSE WIDTH
Tj = 175°C
0.1
0.1
100
100
100
T J = 175°C
100
T J = 25°C
VDS = 25V
60µs PULSE WIDTH
2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
Gfs, Forward Transconductance (S)
ID , Drain-to-Source Current )
1000
T J = 25°C
80
60
T J = 175°C
40
20
V DS = 10V
0
0
VGS, Gate-to-Source Voltage (V)
Fig. 3 Typical Transfer Characteristics
3
10
Fig. 2 Typical Output Characteristics
Fig. 1 Typical Output Characteristics
1.0
1
V DS, Drain-to-Source Voltage (V)
V DS, Drain-to-Source Voltage (V)
10
VGS
15V
10V
6.0V
5.0V
4.8V
4.5V
4.3V
4.0V
10
20
30
40
50
60
70
80
ID ,Drain-to-Source Current (A)
Fig. 4 Typical Forward Trans conductance
Vs. Drain Current
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AUIRFR3710Z
100000
12.0
VGS = 0V,
f = 1 MHZ
C iss = C gs + Cgd, C ds SHORTED
ID = 33A
C oss = Cds + Cgd
10000
C, Capacitance(pF)
VGS, Gate-to-Source Voltage (V)
C rss = C gd
Ciss
1000
Coss
Crss
100
10.0
VDS = 80V
VDS = 50V
VDS = 20V
8.0
6.0
4.0
2.0
10
0.0
1
10
100
0
VDS , Drain-to-Source Voltage (V)
1000
ID, Drain-to-Source Current (A)
ISD, Reverse Drain Current (A)
10.00
T J = 25°C
VGS = 0V
0.10
0.4
0.6
0.8
1.0
1.2
1.4
1.6
VSD , Source-to-Drain Voltage (V)
Fig. 7 Typical Source-to-Drain Diode
Forward Voltage
4
40
50
60
70
80
OPERATION IN THIS AREA
LIMITED BY R DS (on)
100
T J = 175°C
0.2
30
Fig 6. Typical Gate Charge vs.
Gate-to-Source Voltage
1000.00
1.00
20
QG Total Gate Charge (nC)
Fig 5. Typical Capacitance vs.
Drain-to-Source Voltage
100.00
10
1.8
100µsec
10
1msec
1
Tc = 25°C
Tj = 175°C
Single Pulse
10msec
0.1
1
10
100
1000
VDS , Drain-to-Source Voltage (V)
Fig 8. Maximum Safe Operating Area
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AUIRFR3710Z
3.0
Limited By Package
50
ID, Drain Current (A)
RDS(on) , Drain-to-Source On Resistance
(Normalized)
60
40
30
20
10
ID = 56A
VGS = 10V
2.5
2.0
1.5
1.0
0.5
0
25
50
75
100
125
150
-60 -40 -20 0
175
20 40 60 80 100 120 140 160 180
T J , Junction Temperature (°C)
T C , Case Temperature (°C)
Fig 9. Maximum Drain Current Vs.
Case Temperature
Fig 10. Normalized On-Resistance
Vs. Temperature
Thermal Response ( Z thJC )
10
1
D = 0.50
0.1
0.01
0.20
0.10
0.05
0.02
0.01
J
R1
R1
J
1
R2
R2
R3
R3
C
1
2
2
3
3
Ci= iRi
Ci= iRi
0.001
SINGLE PULSE
( THERMAL RESPONSE )
C
Ri (°C/W)
i (sec)
0.576
0.000540
0.249
0.001424
0.224
0.007998
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthjc + Tc
0.0001
1E-006
1E-005
0.0001
0.001
0.01
0.1
t1 , Rectangular Pulse Duration (sec)
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case
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15V
+
V
- DD
IAS
20V
0.01
tp
Fig 12a. Unclamped Inductive Test Circuit
V(BR)DSS
tp
A
EAS , Single Pulse Avalanche Energy (mJ)
D.U.T
RG
700
DRIVER
L
VDS
ID
3.4A
4.8A
BOTTOM 33A
TOP
600
500
400
300
200
100
0
25
50
75
100
125
150
175
Starting T J , Junction Temperature (°C)
Fig 12c. Maximum Avalanche Energy
vs. Drain Current
I AS
Fig 12b. Unclamped Inductive Waveforms
Id
Vds
Vgs
Vgs(th)
Qgs1 Qgs2
Qgd
Qgodr
Fig 13a. Gate Charge Waveform
VGS(th) Gate threshold Voltage (V)
4.0
3.0
ID = 250µA
2.0
1.0
-75 -50 -25
0
25
50
75 100 125 150 175 200
T J , Temperature ( °C )
Fig 14. Threshold Voltage Vs. Temperature
Fig 13b. Gate Charge Test Circuit
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AUIRFR3710Z
1000
Avalanche Current (A)
Duty Cycle = Single Pulse
100
Allowed avalanche Current vs
avalanche pulsewidth, tav
assuming Tj = 25°C due to
avalanche losses
0.01
10
0.05
0.10
1
0.1
1.0E-06
1.0E-05
1.0E-04
1.0E-03
1.0E-02
1.0E-01
tav (sec)
Fig 15. Typical Avalanche Current Vs. Pulse width
Notes on Repetitive Avalanche Curves , Figures 15, 16:
EAR , Avalanche Energy (mJ)
200
TOP
Single Pulse
BOTTOM 1% Duty Cycle
ID = 33A
150
(For further info, see AN-1005 at www.infineon.com)
1. Avalanche failures assumption:
Purely a thermal phenomenon and failure occurs at a temperature far in
excess of Tjmax. This is validated for every part type.
2. Safe operation in Avalanche is allowed as long as Tjmax is not exceeded.
3. Equation below based on circuit and waveforms shown in Figures 12a, 12b.
4. PD (ave) = Average power dissipation per single avalanche pulse.
100
5. BV = Rated breakdown voltage (1.3 factor accounts for voltage increase
during avalanche).
6. Iav = Allowable avalanche current.
50
7. T = Allowable rise in junction temperature, not to exceed Tjmax (assumed as
0
25
50
75
100
125
150
175
Starting T J , Junction Temperature (°C)
25°C in Figure 15, 16).
tav = Average time in avalanche.
D = Duty cycle in avalanche = tav ·f
ZthJC(D, tav) = Transient thermal resistance, see Figures 13)
PD (ave) = 1/2 ( 1.3·BV·Iav) = T/ ZthJC
Iav = 2T/ [1.3·BV·Zth]
Fig 16. Maximum Avalanche Energy
Vs. Temperature
7
EAS (AR) = PD (ave)·tav
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AUIRFR3710Z
Fig 17. Peak Diode Recovery dv/dt Test Circuit for N-Channel HEXFET® Power MOSFETs
Fig 18a. Switching Time Test Circuit
8
Fig 18b. Switching Time Waveforms
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AUIRFR3710Z
D-Pak (TO-252AA) Package Outline (Dimensions are shown in millimeters (inches))
D-Pak (TO-252AA) Part Marking Information
Part Number
AUFR3710Z
YWWA
IR Logo
XX
Date Code
Y= Year
WW= Work Week
XX
Lot Code
Note: For the most current drawing please refer to IR website at http://www.irf.com/package/
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AUIRFR3710Z
D-Pak (TO-252AA) Tape & Reel Information (Dimensions are shown in millimeters (inches))
TR
TRR
16.3 ( .641 )
15.7 ( .619 )
12.1 ( .476 )
11.9 ( .469 )
FEED DIRECTION
TRL
16.3 ( .641 )
15.7 ( .619 )
8.1 ( .318 )
7.9 ( .312 )
FEED DIRECTION
NOTES :
1. CONTROLLING DIMENSION : MILLIMETER.
2. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS ( INCHES ).
3. OUTLINE CONFORMS TO EIA-481 & EIA-541.
13 INCH
16 mm
NOTES :
1. OUTLINE CONFORMS TO EIA-481.
Note: For the most current drawing please refer to IR website at http://www.irf.com/package/
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AUIRFR3710Z
Qualification Information
Qualification Level
Moisture Sensitivity Level
Machine Model
ESD
Human Body Model
Charged Device Model
RoHS Compliant
Automotive
(per AEC-Q101)
Comments: This part number(s) passed Automotive qualification. Infineon’s
Industrial and Consumer qualification level is granted by extension of the higher
Automotive level.
D-Pak
MSL1
Class M4†
AEC-Q101-002
Class H1C †
AEC-Q101-001
Class C3†
AEC-Q101-005
Yes
† Highest passing voltage.
Revision History
Date
11/23/2015
Comments
Updated datasheet with corporate template
Corrected ordering table on page 1.
Published by
Infineon Technologies AG
81726 München, Germany
© Infineon Technologies AG 2015
All Rights Reserved.
IMPORTANT NOTICE
The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics
(“Beschaffenheitsgarantie”). With respect to any examples, hints or any typical values stated herein and/or any
information regarding the application of the product, Infineon Technologies hereby disclaims any and all warranties and
liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third
party.
In addition, any information given in this document is subject to customer’s compliance with its obligations stated in this
document and any applicable legal requirements, norms and standards concerning customer’s products and any use of
the product of Infineon Technologies in customer’s applications.
The data contained in this document is exclusively intended for technically trained staff. It is the responsibility of
customer’s technical departments to evaluate the suitability of the product for the intended application and the
completeness of the product information given in this document with respect to such application.
For further information on the product, technology, delivery terms and conditions and prices please contact your nearest
Infineon Technologies office (www.infineon.com).
WARNINGS
Due to technical requirements products may contain dangerous substances. For information on the types in question
please contact your nearest Infineon Technologies office.
Except as otherwise explicitly approved by Infineon Technologies in a written document signed by authorized
representatives of Infineon Technologies, Infineon Technologies’ products may not be used in any applications where a
failure of the product or any consequences of the use thereof can reasonably be expected to result in personal injury.
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