AUIRFR8403
AUIRFU8403
AUTOMOTIVE GRADE
Features
Advanced Process Technology
New Ultra Low On-Resistance
175°C Operating Temperature
Fast Switching
Repetitive Avalanche Allowed up to Tjmax
Lead-Free, RoHS Compliant
Automotive Qualified *
HEXFET® Power MOSFET
VDSS
RDS(on)
typ.
max.
ID (Silicon Limited)
ID (Package Limited)
Description
Specifically designed for Automotive applications, this HEXFET® Power MOSFET
utilizes the latest processing techniques to achieve extremely low on-resistance per
silicon area. Additional features of this design are a 175°C junction operating
temperature, fast switching speed and improved repetitive avalanche rating. These
features combine to make this design an extremely efficient and reliable device for
use in Automotive applications and wide variety of other applications.
Applications
Electric Power Steering (EPS)
Battery Switch
Start/Stop Micro Hybrid
Heavy Loads
DC-DC Converter
Base part number
Package Type
AUIRFU8403
I-Pak
AUIRFR8403
D-Pak
40V
2.4m
3.1m
127A
100A
G
S
G
S
D
I-Pak
AUIRFU8403
D-Pak
AUIRFR8403
G
Gate
Standard Pack
Form
Tube
Tube
Tape and Reel Left
D
D
D
Drain
S
Source
Orderable Part Number
Quantity
75
75
3000
AUIRFU8403
AUIRFR8403
AUIRFR8403TRL
Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress
ratings only; and functional operation of the device at these or any other condition beyond those indicated in the specifications is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The thermal resistance and
power dissipation ratings are measured under board mounted and still air conditions. Ambient temperature (TA) is 25°C, unless
otherwise specified.
Symbol
ID @ TC = 25°C
ID @ TC = 100°C
Parameter
Continuous Drain Current, VGS @ 10V (Silicon Limited)
Continuous Drain Current, VGS @ 10V (Silicon Limited)
ID @ TC = 25°C
Continuous Drain Current, VGS @ 10V (Package Limited)
IDM
PD @TC = 25°C
Pulsed Drain Current
Maximum Power Dissipation
Linear Derating Factor
VGS
Gate-to-Source Voltage
TJ
TSTG
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds (1.6mm from case)
Avalanche Characteristics
Single Pulse Avalanche Energy (Thermally Limited)
EAS
EAS (tested)
Single Pulse Avalanche Energy (Tested Limited)
Avalanche Current
IAR
EAR
Repetitive Avalanche Energy
Thermal Resistance
Symbol
Parameter
Junction-to-Case
RJC
Junction-to-Ambient ( PCB Mount)
RJA
Junction-to-Ambient
RJA
Max.
127
90
Units
A
100
520
99
0.66
W
W/°C
± 20
V
-55 to + 175
300
°C
114
148
See Fig. 14, 15, 24a, 24b
Typ.
–––
–––
–––
Max.
1.52
50
110
mJ
A
mJ
Units
°C/W
HEXFET® is a registered trademark of Infineon.
*Qualification standards can be found at www.infineon.com
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Static @ TJ = 25°C (unless otherwise specified)
Parameter
Drain-to-Source Breakdown Voltage
V(BR)DSS
V(BR)DSS/TJ Breakdown Voltage Temp. Coefficient
RDS(on)
Static Drain-to-Source On-Resistance
VGS(th)
Gate Threshold Voltage
IDSS
Drain-to-Source Leakage Current
IGSS
RG
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Internal Gate Resistance
Min.
40
–––
–––
2.2
–––
–––
–––
–––
–––
Typ. Max. Units
Conditions
––– –––
V VGS = 0V, ID = 250µA
0.03 ––– V/°C Reference to 25°C, ID = 5mA
2.4
3.1
m VGS = 10V, ID = 76A
3.0
3.9
V VDS = VGS, ID = 100µA
–––
1.0
VDS = 40V, VGS = 0V
µA
––– 150
VDS = 40V,VGS = 0V,TJ =125°C
––– 100
VGS = 20V
nA
––– -100
VGS = -20V
1.5
–––
Dynamic Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
gfs
Forward Trans conductance
Qg
Total Gate Charge
Qgs
Gate-to-Source Charge
Qgd
Gate-to-Drain Charge
Qsync
Total Gate Charge Sync. (Qg - Qgd)
td(on)
Turn-On Delay Time
Rise Time
tr
td(off)
Turn-Off Delay Time
Fall Time
tf
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
Coss eff. (ER) Effective Output Capacitance (Energy Related)
Coss eff. (TR) Effective Output Capacitance (Time Related)
Diode Characteristics
Parameter
Continuous Source Current
IS
(Body Diode)
Pulsed Source Current
ISM
(Body Diode)
VSD
Diode Forward Voltage
dv/dt
Peak Diode Recovery dv/dt
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
IRRM
Reverse Recovery Current
–––
66
18
22
44
10
32
31
23
3171
477
331
573
681
Min.
Typ. Max. Units
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
99
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
VDS = 10V, ID = 76A
ID = 76A
VDS = 20V
nC
VGS = 10V
283
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
S
VDD = 26V
ID = 76A
ns
RG = 2.7
VGS = 10V
VGS = 0V
VDS = 25V
pF ƒ = 1.0MHz, See Fig. 5
VGS = 0V, VDS = 0V to 32V
VGS = 0V, VDS = 0V to 32V
Conditions
MOSFET symbol
––– 127
showing the
A
integral reverse
––– 520
p-n junction diode.
0.9
1.3
V TJ = 25°C,IS = 76A,VGS = 0V
5.1
––– V/ns TJ = 175°C,IS = 76A,VDS = 40V
25
–––
TJ = 25°C
VR = 34V,
ns
26
–––
TJ = 125°C
IF = 76A
20
–––
TJ = 25°C
di/dt = 100A/µs
nC
21
–––
TJ = 125°C
1.2
–––
A TJ = 25°C
Notes:
Calculated continuous current based on maximum allowable junction temperature. Bond wire current limit is 100A by source
bonding technology. Note that current limitations arising from heating of the device leads may occur with some lead mounting
arrangements. (Refer to AN-1140)
Repetitive rating; pulse width limited by max. junction temperature. (See fig. 11)
Limited by TJmax , starting TJ = 25°C, L = 0.039mH, RG = 50, IAS = 76A, VGS =10V. Part not recommended for use above this value.
ISD 76A, di/dt 1255A/µs, VDD V(BR)DSS, TJ 175°C.
Pulse width 400µs; duty cycle 2%.
Coss eff. (TR) is a fixed capacitance that gives the same charging time as Coss while VDS is rising from 0 to 80% VDSS.
Coss eff. (ER) is a fixed capacitance that gives the same energy as Coss while VDS is rising from 0 to 80% VDSS.
When mounted on 1" square PCB (FR-4 or G-10 Material). For recommended footprint and soldering techniques refer to
application note #AN-994
Ris measured at TJ approximately 90°C.
Pulse drain current is limited by source bonding technology.
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AUIRFR/U8403
1000
1000
100
BOTTOM
10
1
4.3V
60µs PULSE WIDTH
100
BOTTOM
10
4.3V
60µs PULSE WIDTH
Tj = 25°C
Tj = 175°C
0.1
1
0.1
1
10
100
0.1
V DS, Drain-to-Source Voltage (V)
100
2.0
R DS(on) , Drain-to-Source On Resistance
(Normalized)
T J = 175°C
100
T J = 25°C
10
1
VDS = 10V
60µs PULSE WIDTH
0.1
ID = 76A
VGS = 10V
1.6
1.2
0.8
0.4
2
3
4
5
6
7
8
-60
-20
VGS, Gate-to-Source Voltage (V)
= C gd
Coss = Cds + Cgd
10000
Ciss
C oss
1000
100
140
180
14.0
VGS = 0V,
f = 1 MHZ
Ciss = C gs + Cgd, C ds SHORTED
Crss
60
Fig. 4 Normalized On-Resistance vs. Temperature
Fig. 3 Typical Transfer Characteristics
100000
20
T J , Junction Temperature (°C)
VGS, Gate-to-Source Voltage (V)
C, Capacitance (pF)
10
Fig. 2 Typical Output Characteristics
1000
ID, Drain-to-Source Current (A)
1
V DS, Drain-to-Source Voltage (V)
Fig. 1 Typical Output Characteristics
C rss
100
ID = 76A
12.0
VDS = 32V
VDS = 20V
10.0
8.0
6.0
4.0
2.0
0.0
0.1
1
10
100
VDS , Drain-to-Source Voltage (V)
Fig 5. Typical Capacitance vs. Drain-to-Source Voltage
3
VGS
15V
10V
7.0V
6.0V
5.5V
5.0V
4.5V
4.3V
TOP
ID, Drain-to-Source Current (A)
ID, Drain-to-Source Current (A)
TOP
VGS
15V
10V
7.0V
6.0V
5.5V
5.0V
4.5V
4.3V
0
10
20
30
40
50
60
70
80
90
QG, Total Gate Charge (nC)
Fig 6. Typical Gate Charge vs. Gate-to-Source Voltage
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AUIRFR/U8403
10000
ID, Drain-to-Source Current (A)
ISD, Reverse Drain Current (A)
1000
T J = 175°C
100
T J = 25°C
10
1
OPERATION IN THIS AREA
LIMITED BY R (on)
DS
1000
100µsec
100
1msec
10
10msec
1
DC
Tc = 25°C
Tj = 175°C
Single Pulse
0.1
VGS = 0V
0.01
0.1
0.2
0.4
0.6
0.8
1.0
1.2
1.4
0.1
1.6
VSD , Source-to-Drain Voltage (V)
Fig. 7 Typical Source-to-Drain Diode Forward Voltage
Limited By Package
ID, Drain Current (A)
100
80
60
40
20
0
25
50
75
100
125
150
175
Fig. 9 Maximum Drain Current vs. Case Temperature
Id = 5.0mA
49
48
47
46
45
44
43
42
41
40
-60
-20
20
60
100
140
180
T J , Temperature ( °C )
Fig 10. Drain-to-Source Breakdown Voltage
500
EAS , Single Pulse Avalanche Energy (mJ)
0.5
0.4
0.4
0.3
Energy (µJ)
100
50
TC , Case Temperature (°C)
0.3
0.2
0.2
0.1
0.1
ID
13A
24A
BOTTOM 76A
TOP
400
300
200
100
0
0.0
-5
0
5
10 15 20 25 30 35 40 45
VDS, Drain-to-Source Voltage (V)
Fig. 11 Typical COSS Stored Energy
4
10
Fig 8. Maximum Safe Operating Area
V(BR)DSS , Drain-to-Source Breakdown Voltage (V)
140
120
1
VDS , Drain-to-Source Voltage (V)
25
50
75
100
125
150
175
Starting T J , Junction Temperature (°C)
Fig 12. Maximum Avalanche Energy vs. Drain Current
2017-10-03
AUIRFR/U8403
Thermal Response ( Z thJC ) °C/W
10
1
D = 0.50
0.20
0.10
0.05
0.1
0.02
0.01
0.01
SINGLE PULSE
( THERMAL RESPONSE )
0.001
1E-006
1E-005
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthjc + Tc
0.0001
0.001
0.01
0.1
t1 , Rectangular Pulse Duration (sec)
Fig 13. Maximum Effective Transient Thermal Impedance, Junction-to-Case
1000
Avalanche Current (A)
Duty Cycle = Single Pulse
Allowed avalanche Current vs avalanche
pulsewidth, tav, assuming Tj = 150°C and
Tstart =25°C (Single Pulse)
100
0.01
10
0.05
0.10
1
Allowed avalanche Current vs avalanche
pulsewidth, tav, assuming j = 25°C and
Tstart = 150°C.
0.1
1.0E-06
1.0E-05
1.0E-04
1.0E-03
1.0E-02
1.0E-01
tav (sec)
Fig 14. Typical Avalanche Current Vs. Pulse width
EAR , Avalanche Energy (mJ)
120
TOP
Single Pulse
BOTTOM 1.0% Duty Cycle
ID = 76A
100
80
60
40
20
0
25
50
75
100
125
150
175
Notes on Repetitive Avalanche Curves , Figures 14, 15:
(For further info, see AN-1005 at www.infineon.com)
1. Avalanche failures assumption:
Purely a thermal phenomenon and failure occurs at a temperature far in
excess of Tjmax. This is validated for every part type.
2. Safe operation in Avalanche is allowed as long as Tjmax is not exceeded.
3. Equation below based on circuit and waveforms shown in Figures 24a, 24b.
4. PD (ave) = Average power dissipation per single avalanche pulse.
5. BV = Rated breakdown voltage (1.3 factor accounts for voltage increase
during avalanche).
6. Iav = Allowable avalanche current.
7. T = Allowable rise in junction temperature, not to exceed Tjmax (assumed as
25°C in Figure 13, 14).
tav = Average time in avalanche.
D = Duty cycle in avalanche = tav ·f
ZthJC(D, tav) = Transient thermal resistance, see Figures 13)
Starting T J , Junction Temperature (°C)
Fig 15. Maximum Avalanche Energy Vs. Temperature
5
PD (ave) = 1/2 ( 1.3·BV·Iav) = T/ ZthJC
Iav = 2T/ [1.3·BV·Zth]
EAS (AR) = PD (ave)·tav
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AUIRFR/U8403
8.0
4.5
ID = 76A
VGS(th) , Gate threshold Voltage (V)
RDS(on), Drain-to -Source On Resistance (m )
6.0
T J = 125°C
4.0
2.0
T J = 25°C
0.0
4
6
8
10
12
14
16
18
4.0
3.5
3.0
2.5
ID = 100µA
ID = 250µA
ID = 1.0mA
ID = 1.0A
2.0
1.5
1.0
20
-75
-25
VGS, Gate -to -Source Voltage (V)
125
175
225
90
6
4
TJ = 25°C
TJ = 125°C
IF = 51A
V R = 34V
80
TJ = 25°C
TJ = 125°C
70
QRR (nC)
5
IF = 51A
V R = 34V
3
2
60
50
40
30
20
1
10
0
0
200
400
600
800
0
1000
200
400
600
800
1000
diF /dt (A/µs)
diF /dt (A/µs)
Fig. 19 - Typical Stored Charge vs. dif/dt
Fig. 18 - Typical Recovery Current vs. dif/dt
80
6
5
IF = 76A
V R = 34V
4
TJ = 25°C
TJ = 125°C
IF = 76A
V R = 34V
TJ = 25°C
TJ = 125°C
60
QRR (nC)
IRRM (A)
75
Fig. 17 - Threshold Voltage vs. Temperature
Fig 16. On-Resistance vs. Gate Voltage
IRRM (A)
25
T J , Temperature ( °C )
3
2
40
20
1
0
0
0
200
400
600
800
diF /dt (A/µs)
Fig. 20 - Typical Recovery Current vs. dif/dt
6
1000
0
200
400
600
800
1000
diF /dt (A/µs)
Fig. 21 - Typical Stored Charge vs. dif/dt
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AUIRFR/U8403
R DS(on), Drain-to -Source On Resistance ( m)
10.0
VGS =
VGS =
VGS =
VGS =
VGS =
8.0
5.5V
6.0V
7.0V
8.0V
10V
6.0
4.0
2.0
0.0
0
100
200
300
400
500
ID, Drain Current (A)
Fig 22. Typical On-Resistance vs. Drain Current
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AUIRFR/U8403
Fig 23. Peak Diode Recovery dv/dt Test Circuit for N-Channel HEXFET® Power MOSFETs
V(BR)DSS
15V
L
VDS
tp
DRIVER
D.U.T
RG
IAS
20V
tp
+
V
- DD
0.01
Fig 24a. Unclamped Inductive Test Circuit
Fig 25a. Switching Time Test Circuit
A
I AS
Fig 24b. Unclamped Inductive Waveforms
Fig 25b. Switching Time Waveforms
Id
Vds
Vgs
Vgs(th)
Qgs1 Qgs2
Fig 26a. Gate Charge Test Circuit
8
Qgd
Qgodr
Fig 26b. Gate Charge Waveform
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AUIRFR/U8403
D-Pak (TO-252AA) Package Outline (Dimensions are shown in millimeters (inches))
D-Pak (TO-252AA) Part Marking Information
Part Number
AUIRFR8403
YWWA
IR Logo
XX
Date Code
Y= Year
WW= Work Week
XX
Lot Code
9
2017-10-03
AUIRFR/U8403
I-Pak (TO-251AA) Package Outline (Dimensions are shown in millimeters (inches)
I-Pak (TO-251AA) Part Marking Information
Part Number
AUIRFU8403
YWWA
IR Logo
XX
Date Code
Y= Year
WW= Work Week
XX
Lot Code
10
2017-10-03
AUIRFR/U8403
D-Pak (TO-252AA) Tape & Reel Information (Dimensions are shown in millimeters (inches))
TR
TRR
16.3 ( .641 )
15.7 ( .619 )
12.1 ( .476 )
11.9 ( .469 )
FEED DIRECTION
TRL
16.3 ( .641 )
15.7 ( .619 )
8.1 ( .318 )
7.9 ( .312 )
FEED DIRECTION
NOTES :
1. CONTROLLING DIMENSION : MILLIMETER.
2. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS ( INCHES ).
3. OUTLINE CONFORMS TO EIA-481 & EIA-541.
13 INCH
16 mm
NOTES :
1. OUTLINE CONFORMS TO EIA-481.
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AUIRFR/U8403
Qualification Information
Qualification Level
Moisture Sensitivity Level
Machine Model
Human Body Model
ESD
Charged Device Model
RoHS Compliant
Automotive
(per AEC-Q101)
Comments: This part number(s) passed Automotive qualification. Infineon’s
Industrial and Consumer qualification level is granted by extension of the higher
Automotive level.
D-Pak
MSL1
I-Pak
Class M2 (+/- 200V)†
AEC-Q101-002
Class H1C (+/- 2000V)†
AEC-Q101-001
Class C5 (+/- 2000V)†
AEC-Q101-005
Yes
† Highest passing voltage.
Revision History
Date
Comments
10/12/2015
Updated datasheet with corporate template
Corrected ordering table on page 1.
10/03/2017
Corrected typo error on part marking on page 9 and 10.
Published by
Infineon Technologies AG
81726 München, Germany
© Infineon Technologies AG 2015
All Rights Reserved.
IMPORTANT NOTICE
The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics
(“Beschaffenheitsgarantie”). With respect to any examples, hints or any typical values stated herein and/or any
information regarding the application of the product, Infineon Technologies hereby disclaims any and all warranties and
liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third
party.
In addition, any information given in this document is subject to customer’s compliance with its obligations stated in this
document and any applicable legal requirements, norms and standards concerning customer’s products and any use of
the product of Infineon Technologies in customer’s applications.
The data contained in this document is exclusively intended for technically trained staff. It is the responsibility of
customer’s technical departments to evaluate the suitability of the product for the intended application and the
completeness of the product information given in this document with respect to such application.
For further information on the product, technology, delivery terms and conditions and prices please contact your nearest
Infineon Technologies office (www.infineon.com).
WARNINGS
Due to technical requirements products may contain dangerous substances. For information on the types in question
please contact your nearest Infineon Technologies office.
Except as otherwise explicitly approved by Infineon Technologies in a written document signed by authorized
representatives of Infineon Technologies, Infineon Technologies’ products may not be used in any applications where a
failure of the product or any consequences of the use thereof can reasonably be expected to result in personal injury.
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