AUIRL1404Z
AUIRL1404ZS
AUIRL1404ZL
AUTOMOTIVE GRADE
Features
Logic Level
Advanced Process Technology
Ultra Low On-Resistance
175°C Operating Temperature
Fast Switching
Repetitive Avalanche Allowed up to Tjmax
Lead-Free, RoHS Compliant
Automotive Qualified *
HEXFET® Power MOSFET
40V
VDSS
RDS(on) typ.
2.5m
max.
ID (Silicon Limited)
3.1m
180A
ID (Package Limited)
160A
D
D
Description
Specifically designed for Automotive applications, this HEXFET® Power
MOSFET utilizes the latest processing techniques to achieve extremely low
on-resistance per silicon area. Additional features of this design are a 175°C
junction operating temperature, fast switching speed and improved repetitive
avalanche rating . These features combine to make this design an extremely
efficient and reliable device for use in Automotive applications and a wide
variety of other applications.
Base part number
Package Type
AUIRL1404Z
AUIRL1404ZL
TO-220
TO-262
AUIRL1404ZS
D2-Pak
S
S
D
G
TO-220AB
AUIRL1404Z
G
D2Pak
AUIRL1404ZS
G
S
D
TO-262
AUIRL1404ZL
G
D
S
Gate
Drain
Source
Standard Pack
Form
Quantity
Tube
50
Tube
50
Tube
50
Tape and Reel Left
800
Orderable Part Number
AUIRL1404Z
AUIRL1404ZL
AUIRL1404ZS
AUIRL1404ZSTRL
Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress
ratings only; and functional operation of the device at these or any other condition beyond those indicated in the specifications is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The thermal resistance
and power dissipation ratings are measured under board mounted and still air conditions. Ambient temperature (TA) is 25°C, unless
otherwise specified.
Symbol
Parameter
Max.
ID @ TC = 25°C
Continuous Drain Current, VGS @ 10V (Silicon Limited)
ID @ TC = 100°C
ID @ TC = 25°C
Continuous Drain Current, VGS @ 10V (Silicon Limited)
Continuous Drain Current, VGS @ 10V (Package Limited)
130
160
IDM
PD @TC = 25°C
Pulsed Drain Current
Maximum Power Dissipation
790
200
VGS
EAS
EAS (tested)
IAR
EAR
TJ
TSTG
Linear Derating Factor
Gate-to-Source Voltage
Single Pulse Avalanche Energy (Thermally Limited)
Single Pulse Avalanche Energy Tested Value
Avalanche Current
Repetitive Avalanche Energy
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds (1.6mm from case)
Mounting torque, 6-32 or M3 screw
Thermal Resistance
Symbol
RJC
RCS
RJA
RJA
Parameter
Junction-to-Case
Case-to-Sink, Flat, Greased Surface
Junction-to-Ambient
Junction-to-Ambient ( PCB Mount, steady state)
Units
180
A
W
1.3
± 16
190
490
See Fig.15,16, 12a, 12b
-55 to + 175
W/°C
V
mJ
A
mJ
°C
300
10 lbf•in (1.1N•m)
Typ.
Max.
Units
–––
0.50
–––
0.75
–––
62
40
°C/W
HEXFET® is a registered trademark of Infineon.
*Qualification standards can be found at www.infineon.com
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AUIRL1404Z/S/L
Static @ TJ = 25°C (unless otherwise specified)
Parameter
Drain-to-Source Breakdown Voltage
V(BR)DSS
V(BR)DSS/TJ Breakdown Voltage Temp. Coefficient
RDS(on)
Static Drain-to-Source On-Resistance
VGS(th)
gfs
Gate Threshold Voltage
Forward Trans conductance
IDSS
Drain-to-Source Leakage Current
IGSS
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Min.
40
–––
–––
–––
–––
1.4
120
–––
–––
–––
–––
Typ.
–––
0.034
2.5
–––
–––
–––
–––
–––
–––
–––
–––
Max. Units
Conditions
–––
V VGS = 0V, ID = 250µA
––– V/°C Reference to 25°C, ID = 1mA
3.1
VGS = 10V, ID = 75A **
4.7 m VGS = 5.0V, ID = 40A
5.9
VGS = 4.5V, ID = 40A
2.7
V VDS = VGS, ID = 250µA
–––
S VDS = 10V, ID = 75A**
20
VDS = 40V, VGS = 0V
µA
250
VDS = 40V,VGS = 0V,TJ =125°C
200
VGS = 16V
nA
-200
VGS = -16V
Dynamic Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
Qg
Qgs
Qgd
td(on)
tr
td(off)
tf
Total Gate Charge
Gate-to-Source Charge
Gate-to-Drain Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
–––
–––
–––
–––
–––
–––
–––
75
28
40
19
180
30
49
110
–––
–––
–––
–––
–––
–––
LD
Internal Drain Inductance
–––
4.5
–––
LS
Internal Source Inductance
–––
7.5
–––
Ciss
Coss
Input Capacitance
Output Capacitance
––– 5080 –––
––– 970 –––
Crss
Coss
Coss
Coss eff.
Reverse Transfer Capacitance
Output Capacitance
Output Capacitance
Effective Output Capacitance
––– 570 –––
––– 3310 –––
––– 870 –––
––– 1280 –––
Diode Characteristics
Parameter
Continuous Source Current
IS
(Body Diode)
Pulsed Source Current
ISM
(Body Diode)
VSD
Diode Forward Voltage
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
ton
Forward Turn-On Time
ID = 75A**
nC VDS = 32V
VGS = 5.0V
VDD = 20V
ID = 75A**
ns
RG= 4.0
VGS = 5.0V
Between lead,
6mm (0.25in.)
nH
from package
and center of die contact
VGS = 0V
VDS = 25V
ƒ = 1.0MHz
pF
VGS = 0V, VDS = 1.0V ƒ = 1.0MHz
VGS = 0V, VDS = 32V ƒ = 1.0MHz
VGS = 0V, VDS = 0V to 32V
Min. Typ. Max. Units
–––
–––
180
–––
–––
790
–––
–––
–––
–––
26
18
1.3
39
27
Conditions
MOSFET symbol
showing the
A
integral reverse
p-n junction diode.
V TJ = 25°C,IS = 75A**,VGS = 0V
ns TJ = 25°C ,IF = 75A** , VDD = 20V
nC di/dt = 100A/µs
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
Notes:
Repetitive rating; pulse width limited by max. junction temperature. (See fig.11)
Limited by TJmax, starting TJ = 25°C, L = 0.066mH, RG = 25, IAS = 75A, VGS =10V. Part not recommended for use above this value.
Pulse width 1.0ms; duty cycle 2%.
Coss eff. is a fixed capacitance that gives the same charging time as Coss while VDS is rising from 0 to 80% VDSS.
Limited by TJmax , see Fig.12a, 12b, 15, 16 for typical repetitive avalanche performance.
This value determined from sample failure population 100% tested to this value in production.
This is only applied to TO-220AB package.
When mounted on 1" square PCB (FR-4 or G-10 Material). For recommended footprint and soldering
techniques refer to application note #AN-994
TO-220Pak device will have an Rth value of 0.65°C/W.
Calculated continuous current based on maximum allowable junction temperature. Bond wire current limit is 160A. Note that current l
imitations arising from heating of the device leads may occur with some lead mounting arrangements.
** All AC and DC test conditions based on former package limited current of 75A.
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1000
1000
VGS
10V
7.0V
5.0V
4.5V
4.0V
3.5V
3.3V
3.0V
BOTTOM
100
TOP
ID, Drain-to-Source Current (A)
ID, Drain-to-Source Current (A)
TOP
10
3.0V
60µs PULSE WIDTH
Tj = 25°C
1
0.1
1
10
BOTTOM
100
3.0V
10
60µs PULSE WIDTH
Tj = 175°C
1
0.1
100
10
100
Fig. 2 Typical Output Characteristics
Fig. 1 Typical Output Characteristics
200
Gfs, Forward Transconductance (S)
1000
ID , Drain-to-Source Current )
1
V DS, Drain-to-Source Voltage (V)
V DS, Drain-to-Source Voltage (V)
T J = 175°C
100
10
T J = 25°C
VDS = 10V
60µs PULSE WIDTH
1.0
2
3
4
5
6
7
8
9
VGS, Gate-to-Source Voltage (V)
Fig. 3 Typical Transfer Characteristics
3
VGS
10V
7.0V
5.0V
4.5V
4.0V
3.5V
3.3V
3.0V
10
T J = 25°C
150
100
T J = 175°C
50
V DS = 10V
0
0
50
100
150
200
ID ,Drain-to-Source Current (A)
Fig. 4 Typical Forward Transconductance
vs. Drain Current
2015-10-27
AUIRL1404Z/S/L
100000
6.0
VGS = 0V,
f = 1 MHZ
Ciss = C gs + Cgd, C ds SHORTED
Crss = C gd
VGS, Gate-to-Source Voltage (V)
ID = 75A
C, Capacitance(pF)
Coss = Cds + Cgd
10000
Ciss
Coss
1000
Crss
VDS = 32V
VDS = 20V
5.0
4.0
3.0
2.0
1.0
0.0
100
1
10
0
100
20
40
60
80
QG Total Gate Charge (nC)
VDS , Drain-to-Source Voltage (V)
Fig 5. Typical Capacitance vs. Drain-to-Source Voltage
Fig 6. Typical Gate Charge vs. Gate-to-Source Voltage
1000.00
T J = 175°C
100.00
10.00
T J = 25°C
VGS = 0V
1.00
0.0
0.5
1.0
1.5
2.0
VSD , Source-to-Drain Voltage (V)
2.5
ID, Drain-to-Source Current (A)
ISD, Reverse Drain Current (A)
10000
OPERATION IN THIS AREA
LIMITED BY R DS (on)
1000
100µsec
100
1msec
10
Tc = 25°C
Tj = 175°C
Single Pulse
10msec
1
1
10
100
VDS , Drain-to-Source Voltage (V)
Fig. 7 Typical Source-to-Drain Diode
Forward Voltage
4
Fig 8. Maximum Safe Operating Area
2015-10-27
AUIRL1404Z/S/L
2.0
RDS(on) , Drain-to-Source On Resistance
(Normalized)
200
Limited By Package
ID, Drain Current (A)
150
100
50
ID = 75A
VGS = 10V
1.5
1.0
0.5
0
25
50
75
100
125
150
-60 -40 -20 0
175
20 40 60 80 100 120 140 160 180
T J , Junction Temperature (°C)
T C , Case Temperature (°C)
Fig 9. Maximum Drain Current vs.
Case Temperature
Fig 10. Normalized On-Resistance
vs. Temperature
1
Thermal Response ( Z thJC )
D = 0.50
0.20
0.10
0.05
0.1
0.02
0.01
0.01
0.001
J
SINGLE PULSE
( THERMAL RESPONSE )
0.0001
1E-006
1E-005
R1
R1
J
1
R2
R2
R3
R3
C
1
2
2
3
Ri (°C/W)
i (sec)
0.212
0.000213
0.277
0.001234
0.261
0.021750
C
3
Ci= iRi
Ci= iRi
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthjc + Tc
0.0001
0.001
0.01
0.1
1
t1 , Rectangular Pulse Duration (sec)
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case
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15V
DRIVER
L
VDS
+
V
- DD
IAS
20V
tp
A
0.01
Fig 12a. Unclamped Inductive Test Circuit
V(BR)DSS
tp
EAS , Single Pulse Avalanche Energy (mJ)
800
D.U.T
RG
ID
TOP
15A
24A
BOTTOM 75A
700
600
500
400
300
200
100
0
25
50
75
100
125
150
175
Starting T J , Junction Temperature (°C)
I AS
Fig 12b. Unclamped Inductive Waveforms
Fig 12c. Maximum Avalanche Energy vs. Drain Current
Fig 13a. Gate Charge Test Circuit
Id
Vds
Vgs
VGS(th) Gate threshold Voltage (V)
3.0
2.5
2.0
ID = 250µA
1.5
1.0
0.5
Vgs(th)
-75 -50 -25
0
25
50
75 100 125 150 175 200
T J , Temperature ( °C )
Qgs1 Qgs2
Qgd
Qgodr
Fig 14. Threshold Voltage vs. Temperature
Fig 13b. Gate Charge Waveform
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100
Duty Cycle = Single Pulse
Avalanche Current (A)
0.01
Allowed avalanche Current vs
avalanche pulsewidth, tav
assuming Tj = 25°C due to
avalanche losses
0.05
0.10
10
1
1.0E-05
1.0E-04
1.0E-03
1.0E-02
1.0E-01
tav (sec)
Fig 15. Avalanche Current vs. Pulse width
Notes on Repetitive Avalanche Curves , Figures 15, 16:
(For further info, see AN-1005 at www.infineon.com)
1. Avalanche failures assumption:
Purely a thermal phenomenon and failure occurs at a temperature far in
excess of Tjmax. This is validated for every part type.
2. Safe operation in Avalanche is allowed as long as Tjmax is not exceeded.
3. Equation below based on circuit and waveforms shown in Figures 12a, 12b.
4. PD (ave) = Average power dissipation per single avalanche pulse.
5. BV = Rated breakdown voltage (1.3 factor accounts for voltage increase
during avalanche).
6. Iav = Allowable avalanche current.
7. T = Allowable rise in junction temperature, not to exceed Tjmax (assumed as
25°C in Figure 14, 15).
tav = Average time in avalanche.
D = Duty cycle in avalanche = tav ·f
ZthJC(D, tav) = Transient thermal resistance, see Figures 13)
EAR , Avalanche Energy (mJ)
200
TOP
Single Pulse
BOTTOM 1.0% Duty Cycle
ID = 75A
150
100
50
0
25
50
75
100
125
150
175
Starting T J , Junction Temperature (°C)
PD (ave) = 1/2 ( 1.3·BV·Iav) = T/ ZthJC
Iav = 2T/ [1.3·BV·Zth]
EAS (AR) = PD (ave)·tav
Fig 16. Maximum Avalanche Energy vs. Temperature
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Fig 17. Peak Diode Recovery dv/dt Test Circuit for N-Channel HEXFET® Power MOSFETs
Fig 18a. Switching Time Test Circuit
Fig 18b. Switching Time Waveforms
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TO-220AB Package Outline (Dimensions are shown in millimeters (inches))
TO-220AB Part Marking Information
Part Number
AUIRL1404Z
YWWA
IR Logo
XX
Date Code
Y= Year
WW= Work Week
XX
Lot Code
Note: For the most current drawing please refer to IR website at http://www.irf.com/package/
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AUIRL1404Z/S/L
D2Pak (TO-263AB) Package Outline (Dimensions are shown in millimeters (inches))
D2Pak (TO-263AB) Part Marking Information
Part Number
AUIRL1404ZS
YWWA
IR Logo
XX
Date Code
Y= Year
WW= Work Week
XX
Lot Code
Note: For the most current drawing please refer to IR website at http://www.irf.com/package/
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AUIRL1404Z/S/L
TO-262 Package Outline (Dimensions are shown in millimeters (inches)
TO-262 Part Marking Information
Part Number
AUIRL1404ZL
YWWA
IR Logo
XX
Date Code
Y= Year
WW= Work Week
XX
Lot Code
Note: For the most current drawing please refer to IR website at http://www.irf.com/package/
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AUIRL1404Z/S/L
D2Pak (TO-263AB) Tape & Reel Information (Dimensions are shown in millimeters (inches))
TRR
1.60 (.063)
1.50 (.059)
4.10 (.161)
3.90 (.153)
FEED DIRECTION 1.85 (.073)
1.65 (.065)
1.60 (.063)
1.50 (.059)
11.60 (.457)
11.40 (.449)
0.368 (.0145)
0.342 (.0135)
15.42 (.609)
15.22 (.601)
24.30 (.957)
23.90 (.941)
TRL
10.90 (.429)
10.70 (.421)
1.75 (.069)
1.25 (.049)
4.72 (.136)
4.52 (.178)
16.10 (.634)
15.90 (.626)
FEED DIRECTION
13.50 (.532)
12.80 (.504)
27.40 (1.079)
23.90 (.941)
4
330.00
(14.173)
MAX.
NOTES :
1. COMFORMS TO EIA-418.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION MEASURED @ HUB.
4. INCLUDES FLANGE DISTORTION @ OUTER EDGE.
60.00 (2.362)
MIN.
26.40 (1.039)
24.40 (.961)
3
30.40 (1.197)
MAX.
4
Note: For the most current drawing please refer to IR website at http://www.irf.com/package/
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AUIRL1404Z/S/L
Qualification Information
Automotive
(per AEC-Q101)
Comments: This part number(s) passed Automotive qualification. Infineon’s
Industrial and Consumer qualification level is granted by extension of the higher
Automotive level.
Qualification Level
Moisture Sensitivity Level
TO-220 Pak
N/A
D2-Pak
MSL1
TO-262
Machine Model
Human Body Model
ESD
Charged Device Model
RoHS
Compliant
† Highest
passing voltage.
Class M4 (+/- 425V)†
AEC-Q101-002
Class H1C (+/- 2000V)†
AEC-Q101-001
Class C5 (+/- 1125V)†
AEC-Q101-005
Yes
Revision History
Date
10/27/2015
Comments
Updated datasheet with corporate template
Corrected ordering table on page 1.
Published by
Infineon Technologies AG
81726 München, Germany
© Infineon Technologies AG 2015
All Rights Reserved.
IMPORTANT NOTICE
The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics
(“Beschaffenheitsgarantie”). With respect to any examples, hints or any typical values stated herein and/or any
information regarding the application of the product, Infineon Technologies hereby disclaims any and all warranties and
liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third
party.
In addition, any information given in this document is subject to customer’s compliance with its obligations stated in this
document and any applicable legal requirements, norms and standards concerning customer’s products and any use of
the product of Infineon Technologies in customer’s applications.
The data contained in this document is exclusively intended for technically trained staff. It is the responsibility of
customer’s technical departments to evaluate the suitability of the product for the intended application and the
completeness of the product information given in this document with respect to such application.
For further information on the product, technology, delivery terms and conditions and prices please contact your nearest
Infineon Technologies office (www.infineon.com).
WARNINGS
Due to technical requirements products may contain dangerous substances. For information on the types in question
please contact your nearest Infineon Technologies office.
Except as otherwise explicitly approved by Infineon Technologies in a written document signed by authorized
representatives of Infineon Technologies, Infineon Technologies’ products may not be used in any applications where a
failure of the product or any consequences of the use thereof can reasonably be expected to result in personal injury.
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