BAL74E6327

BAL74/BAR74... Silicon Switching Diode • For high-speed switching applications • Pb-free (RoHS compliant) package 1) • Qualified according AEC Q101 BAL74 BAR74 !  !  Type BAL74 BAR74 Package SOT23 SOT23 Configuration single single Marking JCs JBs Maximum Ratings at TA = 25°C, unless otherwise specified Parameter Symbol Diode reverse voltage VR 50 Peak reverse voltage VRM 50 Forward current IF 250 Peak forward current IFM - Surge forward current, t = 1 µs IFS 4.5 Non-repetitive peak surge forward current IFSM - Total power dissipation Ptot 370 mW Junction temperature Tj 150 °C Storage temperature Tstg Thermal Resistance Parameter Symbol Value Unit Junction - soldering point 2), BAL74, BAR74 RthJS ≤ 260 K/W Value Unit V mA A TS ≤ 54°C -65 ... 150 1Pb-containing 2For package may be available upon special request calculation of RthJA please refer to Application Note Thermal Resistance 1 2007-04-19 BAL74/BAR74... Electrical Characteristics at TA = 25°C, unless otherwise specified Symbol Values Unit Parameter min. typ. max. DC Characteristics 50 V Breakdown voltage V(BR) I(BR) = 100 µA Reverse current IR µA VR = 50 V - - 0.1 VR = 50 V, TA = 150 °C - - 100 VF - - 1 V CT - - 2 pF trr - - 4 ns Forward voltage IF = 100 mA AC Characteristics Diode capacitance VR = 0 V, f = 1 MHz Reverse recovery time IF = 10 mA, IR = 10 mA, measured at IR = 1mA, RL = 100 Ω Test circuit for reverse recovery time D.U.T. ΙF Pulse generator: tp = 100ns, D = 0.05, tr = 0.6ns, Ri = 50Ω Oscillograph EHN00015 Oscillograph: R = 50Ω, tr = 0.35ns, C ≤ 1pF 2 2007-04-19 BAL74/BAR74... Reverse current IR = ƒ (TA) Forward Voltage VF = ƒ (TA) IF = Parameter VR = Parameter 10 5 BAR 74 EHB00012 BAR 74 1.0 nA V ΙR EHB00015 Ι F = 100 mA VF V R = 70 V 10 4 10 mA max. 5 1 mA 70V 10 3 25V 0.5 5 0.1 mA typ. 10 2 5 10 1 0 100 50 ˚C 0 150 0 50 100 TA ΙF 150 TA Forward current IF = ƒ (VF) 150 ˚C Peak forward current IFM = ƒ (tp) BAR 74 EHB00013 10 2 Ι FM mA BAR 74 EHB00014 D = 0.005 0.01 0.02 0.05 0.1 0.2 A 10 1 100 typ max 10 0 50 10 -1 tp D= tp T T 0 0 0.5 1.0 V 10-2 10-6 1.5 VF 10-5 10-4 10-3 10-2 10-1 s 100 t 3 2007-04-19 BAL74/BAR74... Forward current IF = ƒ (T S) BAL74, BAR74 300 mA IF 200 150 100 50 0 0 15 30 45 60 75 90 105 120 °C 150 TS 4 2007-04-19 Package SOT23 BAL74/BAR74... 0.4 +0.1 -0.05 1) 2 0.08...0.1 C 0.95 1.3 ±0.1 1 2.4 ±0.15 3 0.1 MAX. 10˚ MAX. B 1 ±0.1 10˚ MAX. 2.9 ±0.1 0.15 MIN. Package Outline A 5 0...8˚ 1.9 0.2 0.25 M B C M A 1) Lead width can be 0.6 max. in dambar area Foot Print 0.8 0.9 1.3 0.9 0.8 1.2 Marking Layout (Example) Manufacturer EH s 2005, June Date code (YM) Pin 1 BCW66 Type code Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel 4 0.2 8 2.13 2.65 0.9 Pin 1 1.15 3.15 5 2007-04-19 BAL74/BAR74... Edition 2006-02-01 Published by Infineon Technologies AG 81726 München, Germany © Infineon Technologies AG 2007. All Rights Reserved. Attention please! The information given in this dokument shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 6 2007-04-19