BAS28E6433HTMA1

BAS28... Silicon Switching Diode • For high-speed switching applications • Electrical insulated diodes • Pb-free (RoHS compliant) package 1) • Qualified according AEC Q101 BAS28/W " ! ,  ,  Type Package Configuration Marking BAS28 BAS28W SOT143 SOT343 parallel pair parallel pair JTs JTs Maximum Ratings at TA = 25°C, unless otherwise specified Parameter Symbol Value Diode reverse voltage VR 80 Peak reverse voltage VRM 85 Forward current IF 200 Peak forward current I FM - Surge forward current, t = 1 µs I FS 4.5 Non-repetitive peak surge forward current I FSM Total power dissipation Ptot BAS28W, TS ≤ 103°C 250 Storage temperature T stg 1Pb-containing mA A mW 330 Tj V - BAS28, T S ≤ 31°C Junction temperature Unit 150 °C -55 ... 150 package may be available upon special request 1 2007-04-19 BAS28... Thermal Resistance Parameter Symbol Junction - soldering point 1) RthJS Value Unit K/W BAS28 ≤ 360 BAS28W ≤ 190 Electrical Characteristics at TA = 25°C, unless otherwise specified Parameter Symbol Values Unit min. typ. max. DC Characteristics 85 V Breakdown voltage V(BR) I(BR) = 100 µA Reverse current IR µA VR = 75 V - - 0.1 VR = 25 V, TA = 150 °C - - 30 VR = 75 V, TA = 150 °C - - 50 Forward voltage mV VF IF = 1 mA - - 715 IF = 10 mA - - 855 IF = 50 mA - - 1000 IF = 100 mA - - 1200 IF = 150 mA - - 1250 CT - - 2 pF trr - - 4 ns AC Characteristics Diode capacitance VR = 0 V, f = 1 MHz Reverse recovery time IF = 10 mA, IR = 10 mA, measured at IR = 1mA , RL = 100 Ω Test circuit for reverse recovery time D.U.T. ΙF Pulse generator: tp = 100ns, D = 0.05, tr = 0.6ns, Ri = 50Ω Oscillograph EHN00019 1For Oscillograph: R = 50Ω, tr = 0.35ns, C ≤ 1pF calculation of RthJA please refer to Application Note Thermal Resistance 2 2007-04-19 BAS28... Reverse current IR = ƒ (TA) Forward Voltage VF = ƒ (TA) IF = Parameter VR = Parameter 10 5 1.0 nA BAS 28 V EHB00037 Ι F = 100 mA VF 10 4 IR 10 mA 10 3 1 mA 0.5 0.1 mA 70 V 25 V 10 2 10 1 0 0 25 50 75 100 °C 0 150 50 100 TA C 150 TA Forward current IF = ƒ (VF) Peak forward current IFM = ƒ (tp) TA = 25 °C TA = 25 °C BAS28 150 BAS 28 10 2 EHB00035 Ι FM ΙF mA BAS 28 EHB00036 D = 0.005 0.01 0.02 0.05 0.1 0.2 A 10 1 100 typ 10 0 max 50 10 -1 tp D= tp T T 0 0 0.5 1.0 V 10-2 10-6 1.5 VF 10-5 10-4 10-3 10-2 10-1 s 100 t 3 2007-04-19 BAS28... Forward current IF = ƒ (T S) Forward current IF = ƒ (T S) BAS28 BAS28W 220 220 mA 180 180 160 160 140 140 IF IF mA 120 120 100 100 80 80 60 60 40 40 20 20 0 0 15 30 45 60 90 105 120 °C 75 0 0 150 15 30 45 60 90 105 120 °C 75 TS 150 TS Permissible Puls Load RthJS = ƒ (tp) Permissible Pulse Load BAS28W IFmax / I FDC = ƒ (t p) BAS28W 10 2 10 3 IFmax/ IFDC RthJS K/W 10 2 - D=0 0.005 0.01 0.02 0.05 0.1 0.2 0.5 10 1 0.5 0.2 0.1 0.05 0.02 0.01 0.005 D=0 10 1 10 0 -6 10 10 -5 10 -4 10 -3 10 -2 s 10 10 0 -6 10 0 tp 10 -5 10 -4 10 -3 10 -2 s 10 0 tp 4 2007-04-19 Package SOT143 BAS28... 2 0.1 MAX. 10˚ MAX. 1 1 ±0.1 0.2 0.8 +0.1 -0.05 0.4 +0.1 -0.05 A 5 0...8˚ 0.2 M A 0.25 M B 1.7 0.08...0.1 1.3 ±0.1 3 2.4 ±0.15 4 B 10˚ MAX. 2.9 ±0.1 1.9 0.15 MIN. Package Outline Foot Print 1.2 0.8 0.9 1.1 0.9 0.8 1.2 0.8 0.8 Marking Layout (Example) RF s 56 Manufacturer Pin 1 2005, June Date code (YM) BFP181 Type code Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel 0.2 2.6 8 4 Pin 1 3.15 1.15 5 2007-04-19 Package SOT343 BAS28... Package Outline 0.9 ±0.1 2 ±0.2 0.1 MAX. 1.3 0.1 A 1 2 0.1 MIN. 0.15 1.25 ±0.1 3 2.1 ±0.1 4 0.3 +0.1 -0.05 +0.1 0.15 -0.05 +0.1 0.6 -0.05 4x 0.1 0.2 M M A Foot Print 1.6 0.8 0.6 1.15 0.9 Marking Layout (Example) Manufacturer 2005, June Date code (YM) BGA420 Type code Pin 1 Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel 0.2 2.3 8 4 Pin 1 2.15 1.1 6 2007-04-19 BAS28... Edition 2006-02-01 Published by Infineon Technologies AG 81726 München, Germany © Infineon Technologies AG 2007. All Rights Reserved. Attention please! The information given in this dokument shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office ( www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 7 2007-04-19