BAS3005B-02VE6327

BAS3005B.... Medium Power AF Schottky Diode • Forward current: 0.5 A • Reverse voltage: 30 V • Low capacitance, low reverse current • For high efficiency DC/DC conversion, fast switching, protecting and clamping applications • Pb-free (RoHS compliant) package • Qualified according AEC Q101 BAS3005B-02LRH* BAS3005B-02V  Type Package Configuration Marking BAS3005B-02LRH* BAS3005B-02V TSLP-2-17 SC79 single, leadless single 5B 3 *Preliminary Maximum Ratings at TA = 25 °C, unless otherwise specified Parameter Symbol Diode reverse voltage1) VR RMS reverse voltage VR(RMS) Forward current1) IF Value 30 Unit V 500 Average rectified forward current (50/60Hz, sinus) IFAV 500 Repetitive peak forward current IFRM 3.5 IFSM 5 mA A (tp ≤ 1 ms, D ≤ 0.25) Non-repetitive peak surge forward current (t ≤ 10ms) 150 Junction temperature Tj Operating temperature range Top -55 ...125 Storage temperature Tstg -65 ...150 1 °C 2012-07-02 BAS3005B.... 1For TA > 25°C the derating of VR and IF has to be considered. Please refer to the attached curves. Thermal Resistance Parameter Symbol Value Unit Junction - soldering point1) RthJS ≤ 80 K/W 1For calculation of RthJA please refer to Application Note Thermal Resistance Electrical Characteristics at TA = 25°C, unless otherwise specified Parameter Symbol Values min. typ. max. DC Characteristics Reverse current1) µA IR VR = 5 V - 1 5 VR = 10 V - 2 10 VR = 30 V - 5 25 Forward voltage1) mV VF IF = 1 mA - 200 250 IF = 10 mA - 260 310 IF = 100 mA - 360 410 IF = 200 mA - 410 470 IF = 500 mA - 550 620 - 6 10 AC Characteristics Diode capacitance CT Unit pF VR = 5 V, f = 1 MHz 1Pulsed test: tp = 300 µs; D = 0.01 2 2012-07-02 BAS3005B.... Diode capacitance CT = ƒ (VR) Reverse current IR = ƒ (TA) f = 1MHz VR = Parameter 10 -2 25 A 10 -3 IR CT pF 15 10 -4 10 10 -5 5 10 -6 0 0 5 10 15 20 V 10 -7 0 30 30 V 20 V 10 V 5V 25 50 75 °C 100 VR Forward Voltage VF = ƒ (TA) IF = Parameter 10 -2 0.6 A V 10 -3 0.5 125 °C 500 mA 0.45 VF IR Reverse current IR = ƒ(VR ) TA = Parameter 10 -4 150 TA 85 °C 0.4 0.35 200 mA 0.3 10 -5 0.25 100 mA 0.2 25 °C 0.15 10 -6 10 mA 0.1 0.05 10 -7 0 5 10 15 20 V 0 -50 30 VR 1 mA -25 0 25 50 75 100 °C 150 TA 3 2012-07-02 BAS3005B.... Forward current IF = ƒ (VF) Permissible Reverse voltage VR = ƒ (TA) TA = Parameter tp = Parameter, Duty cycle < 0.01 Device mounted on PCB with Rth = 160 k/W 0 10 35 A 300µs V 100ms IF VRmax 10 -1 25 20 10 -2 15 -40 °C 25 °C 85 °C 125°C 10 -3 DC 10 5 10 -4 0 0.1 0.2 0.3 0.4 V 0 0 0.6 VF 25 50 75 100 °C 150 TA Forward current IF = ƒ (TS ) 600 mA 500 450 IF 400 350 300 250 200 150 100 50 0 0 20 40 60 80 100 120 °C 150 TS 4 2012-07-02 Package SC79 5 BAS3005B.... 2012-07-02 BAS3005B.... Date Code marking for discrete packages with one digit (SCD80, SC79, SC75 1) ) CES-Code Month 2 0 03 2 0 04 2005 2006 2 0 07 2008 2009 2010 2011 2012 2 0 13 2014 01 a p A P a p A P a p A P 02 b q B Q b q B Q b q B Q 03 c r C R c r C R c r C R 04 d s D S d s D S d s D S 05 e t E T e t E T e t E T 06 f u F U f u F U f u F U 07 g v G V g v G V g v G V 08 h x H X h x H X h x H X 09 j y J Y j y J Y j y J Y 10 k z K Z k z K Z k z K Z 11 l 2 L 4 l 2 L 4 l 2 L 4 12 n 3 N 5 n 3 N 5 n 3 N 5 1) New Marking Layout for SC75, implemented at October 2005. . 6 2012-07-02 Package TSLP-2-17 BAS3005B.... Package Outline Top view Bottom view 0.39 +0.01 -0.03 0.6 ±0.05 0.05 MAX. 1 1 0.25 ±0.035 1) 2 1±0.05 0.65 ±0.05 2 0.5 ±0.035 1) Cathode marking 1) Dimension applies to plated terminal Foot Print 0.45 Copper Solder mask 0.375 0.35 0.275 1 0.925 0.3 0.35 0.6 0.275 For board assembly information please refer to Infineon website "Packages" Stencil apertures Marking Layout (Example) BAR90-02LRH Type code Cathode marking Laser marking Standard Packing Reel ø180 mm = 15.000 Pieces/Reel Reel ø330 mm = 50.000 Pieces/Reel (optional) 0.5 Cathode marking 8 1.16 4 0.76 7 2012-07-02 BAS3005B.... Edition 2009-11-16 Published by Infineon Technologies AG 81726 Munich, Germany  2009 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 8 2012-07-02