BAT1805E6327

BAT18... Silicon RF Switching Diode • Low-loss VHF / UHF switch above 10 MHz • PIN diode with low forward resistance • Pb-free (RoHS compliant) package BAT18-04 BAT18-05 ! ,  ! ,  ,  ,  Type BAT18-04 BAT18-05 Package SOT23 SOT23 Configuration series common cathode LS(nH) 1.8 1.8 Marking AUs ASs Maximum Ratings at T A = 25°C, unless otherwise specified Parameter Symbol Diode reverse voltage VR 35 V Forward current IF 100 mA Junction temperature Tj 150 °C Operating temperature range Top -55 ... 125 Storage temperature Tstg -55 ... 150 Value Unit Thermal Resistance Parameter Symbol Value Unit Junction - soldering point1) RthJS ≤ 290 K/W BAT18-04, BAT18-05 1For calculation of RthJA please refer to Application Note Thermal Resistance 1 2011-06-14 BAT18... Electrical Characteristics at T A = 25°C, unless otherwise specified Parameter Symbol Values min. typ. Unit max. DC Characteristics Reverse current IR nA VR = 20 V - - 20 VR = 20 V, TA = 60 °C - - 200 VF - 0.92 1.2 CT - 0.75 1 pF rf - 0.4 0.7 Ω τ rr - 120 - ns WI - 3 - µm Forward voltage V IF = 100 mA AC Characteristics Diode capacitance VR = 20 V, f = 1 MHz Forward resistance IF = 5 mA, f = 100 MHz Charge carrier life time IF = 10 mA, IR = 6 mA, measured at IR = 3 mA , RL = 100 Ω I-region width 2 2011-06-14 BAT18... Diode capacitance CT = ƒ (VR ) Forward resistance rf = ƒ (IF) f = 1MHz f = 100MHz CT 2.0 pF 1.8 BAT 18... EHD07019 10 1 rf BAT 18... EHD07020 Ω 1.6 1.4 1.2 10 0 1.0 0.8 0.6 0.4 0.2 0.0 0 10 20 V 10 -1 10 -1 30 10 0 10 1 mA 10 2 ΙF VR 3 2011-06-14 Package SOT23 BAT18... 0.4 +0.1 -0.05 1) 2 0.08...0.1 C 0.95 1.3 ±0.1 1 2.4 ±0.15 3 0.1 MAX. 10˚ MAX. B 1 ±0.1 10˚ MAX. 2.9 ±0.1 0.15 MIN. Package Outline A 5 0...8˚ 1.9 0.2 0.25 M B C M A 1) Lead width can be 0.6 max. in dambar area Foot Print 0.8 0.9 1.3 0.9 0.8 1.2 Marking Layout (Example) Manufacturer EH s 2005, June Date code (YM) Pin 1 BCW66 Type code Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel 4 0.2 8 2.13 2.65 0.9 Pin 1 1.15 3.15 4 2011-06-14 BAT18... Edition 2009-11-16 Published by Infineon Technologies AG 81726 Munich, Germany  2009 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 5 2011-06-14