BC856...-BC860...
PNP Silicon AF Transistor
• For AF input stages and driver applications
• High current gain
• Low collector-emitter saturation voltage
• Low noise between 30 hz and 15 kHz
• Complementary types:
BC846...-BC850... (NPN)
• Pb-free (RoHS compliant) package1)
• Qualified according AEC Q101
1Pb-containing
package may be available upon special request
1
2007-09-25
BC856...-BC860...
Type
Marking
Pin Configuration
BC856A
3As
1=B
2=E
3=C
-
-
-
SOT23
BC856B
3Bs
1=B
2=E
3=C
-
-
-
SOT23
BC856BW
3Bs
1=B
2=E
3=C
-
-
-
SOT323
BC857A
3Es
1=B
2=E
3=C
-
-
-
SOT23
BC857B
3Fs
1=B
2=E
3=C
-
-
-
SOT23
BC857BF
3Fs
1=B
2=E
3=C
-
-
-
TSFP-3
BC857BL3
3F
1=B
2=E
3=C
-
-
-
TSLP-3-1
BC857BW
3Fs
1=B
2=E
3=C
-
-
-
SOT323
BC857C
3Gs
1=B
2=E
3=C
-
-
-
SOT23
BC857CW
3Gs
1=B
2=E
3=C
-
-
-
SOT323
BC858A
3Js
1=B
2=E
3=C
-
-
-
SOT23
BC858B
3Ks
1=B
2=E
3=C
-
-
-
SOT23
BC858BL3
3K
1=B
2=E
3=C
-
-
-
TSLP-3-1
BC858BW
3Ks
1=B
2=E
3=C
-
-
-
SOT323
BC858C
3Ls
1=B
2=E
3=C
-
-
-
SOT23
BC858CW
3Ls
1=B
2=E
3=C
-
-
-
SOT323
BC859B
4Bs
1=B
2=E
3=C
-
-
-
SOT23
BC859C
4Cs
1=B
2=E
3=C
-
-
-
SOT23
BC860B
4Fs
1=B
2=E
3=C
-
-
-
SOT23
BC860BW
4Fs
1=B
2=E
3=C
-
-
-
SOT323
BC860CW
4Gs
1=B
2=E
3=C
-
-
-
SOT323
2
Package
2007-09-25
BC856...-BC860...
Maximum Ratings
Parameter
Symbol
Collector-emitter voltage
VCEO
Value
V
BC856...
65
BC857..., BC860...
45
BC858..., BC859...
30
Collector-base voltage
VCBO
BC856...
80
BC857..., BC860...
50
BC858..., BC859...
30
5
Emitter-base voltage
VEBO
Collector current
IC
100
Peak collector current
ICM
200
Total power dissipation
Ptot
330
TS ≤ 128 °C, BC857BF-BC858BF
250
TS ≤ 135 °C, BC857BL3, BC860BL3
250
TS ≤ 124 °C, BC856W-BC860W
250
Junction temperature
Tj
Storage temperature
Tstg
Thermal Resistance
Parameter
Symbol
Junction - soldering point1)
RthJS
mA
mW
TS ≤ 71 °C, BC856-BC860
150
°C
-65 ... 150
Value
BC856-BC860
≤ 240
BC857BF-BC858BF
≤ 90
BC857BL3, BC858BL3
≤ 60
BC856W-BC860W
≤ 105
1For
Unit
Unit
K/W
calculation of RthJA please refer to Application Note Thermal Resistance
3
2007-09-25
BC856...-BC860...
Electrical Characteristics at TA = 25°C, unless otherwise specified
Symbol
Values
Parameter
min.
typ. max.
DC Characteristics
Collector-emitter breakdown voltage
V(BR)CEO
IC = 10 mA, IB = 0 , BC856...
65
-
-
IC = 10 mA, IB = 0 , BC857..., BC860...
45
-
-
IC = 10 mA, IB = 0 , BC858..., BC859...
30
-
-
IC = 10 µA, IE = 0 , BC856...
80
-
-
IC = 10 µA, IE = 0 , BC857..., BC860...
50
-
-
IC = 10 µA, IE = 0 , BC858..., BC859...
30
-
-
5
-
-
Collector-base breakdown voltage
Unit
V
V(BR)CBO
Emitter-base breakdown voltage
V(BR)EBO
IE = 1 µA, IC = 0
Collector-base cutoff current
µA
ICBO
VCB = 45 V, IE = 0
-
-
0.015
VCB = 30 V, IE = 0 , TA = 150 °C
-
-
5
DC current gain1)
-
hFE
IC = 10 µA, VCE = 5 V, hFE-grp.A
-
140
-
IC = 10 µA, VCE = 5 V, hFE-grp.B
-
250
-
IC = 10 µA, VCE = 5 V, hFE-grp.C
-
480
-
IC = 2 mA, VCE = 5 V, hFE-grp.A
125
180
250
IC = 2 mA, VCE = 5 V, hFE-grp.B
220
290
475
IC = 2 mA, VCE = 5 V, hFE-grp.C
420
520
800
Collector-emitter saturation voltage1)
mV
VCEsat
IC = 10 mA, IB = 0.5 mA
-
75
300
IC = 100 mA, IB = 5 mA
-
250
650
IC = 10 mA, IB = 0.5 mA
-
700
-
IC = 100 mA, IB = 0.5 mA
-
850
-
IC = 2 mA, VCE = 5 V
600
650
750
IC = 10 mA, VCE = 5 V
-
-
820
Base emitter saturation voltage1)
VBEsat
Base-emitter voltage1)
1Pulse
VBE(ON)
test: t < 300µs; D < 2%
4
2007-09-25
BC856...-BC860...
Electrical Characteristics at TA = 25°C, unless otherwise specified
Symbol
Parameter
Values
Unit
min.
typ.
max.
fT
-
250
-
MHz
Ccb
-
1.5
-
pF
Ceb
-
8
-
AC Characteristics
Transition frequency
IC = 20 mA, VCE = 5 V, f = 100 MHz
Collector-base capacitance
VCB = 10 V, f = 1 MHz
Emitter-base capacitance
VEB = 0.5 V, f = 1 MHz
Short-circuit input impedance
h11e
kΩ
IC = 2 mA, VCE = 5 V, f = 1 kHz, hFE-grp.A
-
2.7
-
IC = 2 mA, VCE = 5 V, f = 1 kHz, hFE-grp.B
-
4.5
-
IC = 2 mA, VCE = 5 V, f = 1 kHz, hFE-grp.C
-
8.7
-
Open-circuit reverse voltage transf. ratio
10-4
h12e
IC = 2 mA, VCE = 5 V, f = 1 kHz, hFE-grp.A
-
1.5
-
IC = 2 mA, VCE = 5 V, f = 1 kHz, hFE-grp.B
-
2
-
IC = 2 mA, VCE = 5 V, f = 1 kHz, hFE-grp.C
-
3
-
Short-circuit forward current transf. ratio
h21e
-
IC = 2 mA, VCE = 5 V, f = 1 kHz, hFE-grp.A
-
200
-
IC = 2 mA, VCE = 5 V, f = 1 kHz, hFE-grp.B
-
330
-
IC = 2 mA, VCE = 5 V, f = 1 kHz, hFE-grp.C
-
600
-
Open-circuit output admittance
µS
h22e
IC = 2 mA, VCE = 5 V, f = 1 kHz, hFE-grp.A
-
18
-
IC = 2 mA, VCE = 5 V, f = 1 kHz, hFE-grp.B
-
30
-
IC = 2 mA, VCE = 5 V, f = 1 kHz, hFE-grp.C
-
60
-
F
-
1
4
dB
Vn
-
-
0.11
µV
Noise figure
IC = 0.2 mA, VCE = 5 V, f = 1 kHz,
D f = 200 Hz, RS = 2 kΩ, BC859, BC850
Equivalent noise voltage
IC = 200 mA, VCE = 5 V, RS = 2 kΩ,
f = 10...50 Hz, BC860
5
2007-09-25
BC856...-BC860...
DC current gain hFE = ƒ(IC)
Collector-emitter saturation voltage
VCE = 1 V
IC = ƒ(VCEsat ), hFE = 20
EHP00382
10 3
h FE 5
EHP00380
10 2
mA
ΙC
100 C
100 C
25 C
-50 C
25 C
-50 C
10 2
10 1
5
5
10 1
10
5
5
10 0
10 -2
5
10 -1
5 10
0
5 10
1
mA 10
ΙC
0
10 -1
2
0
0.1
0.2
0.3
0.4
V 0.5
VCEsat
Base-emitter saturation voltage
Collector cutoff current ICBO = ƒ(TA)
IC = ƒ(VBEsat), hFE = 20
VCBO = 30 V
EHP00379
10 2
mA
ΙC
EHP00381
10 4
nA
Ι CB0
10
10 3
100 C
25 C
-50C
1
5
max
10 2
5
5
typ
10 1
5
10 0
5
10
0
5
10 -1
10 -1
0
0.2
0.4
0.6
0.8
V
1.2
V BEsat
0
50
100
C
150
TA
6
2007-09-25
BC856...-BC860...
Transition frequency fT = ƒ(IC)
VCE = 5 V
Collector-base capacitance Ccb = ƒ(VCB)
Emitter-base capacitance Ceb = ƒ(VEB)
EHP00378
10 3
12
pF
MHz
5
10
CCB(CEB )
fT
9
8
7
10
2
6
5
5
4
CEB
3
2
CCB
1
10 1
10 -1
5 10 0
5
10 1
mA
ΙC
0
0
10 2
4
8
12
16
V
Total power dissipation P tot = ƒ(TS)
Total power dissipation P tot = ƒ(TS)
BC856-BC860
BC857BF, BC858BF
360
300
mW
300
250
270
225
240
200
Ptot
Ptot
mW
210
175
180
150
150
125
120
100
90
75
60
50
30
25
0
0
22
VCB(VEB
15
30
45
60
75
90 105 120
0
0
°C 150
TS
15
30
45
60
75
90 105 120 °C
150
TS
7
2007-09-25
BC856...-BC860...
Total power dissipation P tot = ƒ(TS)
Total power dissipation P tot = ƒ(TS)
BC857BL3, BC858BL3
BC856W-BC860W
300
300
mW
250
250
225
225
200
200
Ptot
Ptot
mW
175
175
150
150
125
125
100
100
75
75
50
50
25
25
0
0
15
30
45
60
75
90 105 120 °C
0
0
150
15
30
45
60
90 105 120 °C
75
TS
150
TS
Permissible Pulse Load
Permissible Puls Load RthJS = ƒ (t p)
Ptotmax/PtotDC = ƒ(tp )
BC857BF, BC858BF
BC856/W-BC860/W
10 2
EHP00377
10 3
Ptot max
5
Ptot DC
tp
tp
D=
T
K/W
10 2
RthJS
T
D=
0
0.005
0.01
0.02
0.05
0.1
0.2
0.5
5
10 1
D=0.5
0.2
0.1
0.05
0.02
0.01
0.005
0
10 1
10 0
5
10 0
10 -6
10
-5
10
-4
10
-3
10
-2
s
10
10 -1 -6
10
0
10
-5
10
-4
10
-3
10
-2
s
10
0
tp
tp
8
2007-09-25
BC856...-BC860...
Permissible Pulse Load
Permissible Puls Load RthJS = ƒ (t p)
Ptotmax/PtotDC = ƒ(tp )
BC857BL3, BC858BL3
BC857BF, BC858BF
10 2
10 2
D=0
0.005
0.01
0.02
0.05
0.1
0.2
0.5
10 1
10 0 -6
10
RthJS
Ptotmax/PtotDC
10 3
10
-5
10
-4
10
10 1
0.5
0.2
0.1
0.05
0.02
0.01
0.005
D=0
10 0
-3
10
-2
s
10
10 -1 -7
10
0
tp
10
-6
10
-5
10
-4
10
-3
10
-2
s
10
0
tp
Permissible Pulse Load
Ptotmax/PtotDC = ƒ(tp )
BC857BL3, BC858BL3
Ptotmax/ PtotDC
10 3
10
D=0
0.005
0.01
0.02
0.05
0.1
0.2
0.5
2
10 1
10 0 -7
10
10
-6
10
-5
10
-4
10
-3
10
-2
s
10
0
tp
9
2007-09-25
Package SOT23
BC856...-BC860...
0.4 +0.1
-0.05
1)
2
0.08...0.1
C
0.95
1.3 ±0.1
1
2.4 ±0.15
3
0.1 MAX.
10˚ MAX.
B
1 ±0.1
10˚ MAX.
2.9 ±0.1
0.15 MIN.
Package Outline
A
5
0...8˚
1.9
0.2
0.25 M B C
M
A
1) Lead width can be 0.6 max. in dambar area
Foot Print
0.8
0.9
1.3
0.9
0.8
1.2
Marking Layout (Example)
Manufacturer
EH s
2005, June
Date code (YM)
Pin 1
BCW66
Type code
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø330 mm = 10.000 Pieces/Reel
4
0.2
8
2.13
2.65
0.9
Pin 1
1.15
3.15
10
2007-09-25
Package SOT323
BC856...-BC860...
Package Outline
0.9 ±0.1
2 ±0.2
0.3 +0.1
-0.05
0.1 MAX.
3x
0.1
M
0.1
A
1
2
1.25 ±0.1
0.1 MIN.
2.1 ±0.1
3
0.15 +0.1
-0.05
0.65 0.65
0.2
M
A
Foot Print
0.8
1.6
0.6
0.65
0.65
Marking Layout (Example)
Manufacturer
2005, June
Date code (YM)
BCR108W
Type code
Pin 1
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø330 mm = 10.000 Pieces/Reel
0.2
2.3
8
4
Pin 1
2.15
1.1
11
2007-09-25
Package TSFP-3
BC856...-BC860...
Package Outline
0.2 ±0.05
0.55 ±0.04
1
1.2 ±0.05
0.2 ±0.05
3
2
0.2 ±0.05
10˚ MAX.
0.8 ±0.05
1.2 ±0.05
0.15 ±0.05
0.4 ±0.05
0.4 ±0.05
Foot Print
1.05
0.45
0.4
0.4
0.4
Marking Layout (Example)
Manufacturer
BCR847BF
Type code
Pin 1
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø330 mm = 10.000 Pieces/Reel
4
0.2
1.2
1.5
8
0.3
Pin 1
0.7
1.35
12
2007-09-25
Package TSLP-3-1
BC856...-BC860...
Package Outline
Bottom view
0.4 +0.1
0.6 ±0.05
0.5 ±0.035
2
1 ±0.05
3
0.65 ±0.05
3
1)
2
1
1)
0.05 MAX.
0.35 ±0.05
Pin 1
marking
2 x 0.15 ±0.035
2 x 0.25 ±0.035
1
0.25 ±0.035
1)
Top view
1)
1) Dimension applies to plated terminal
Foot Print
R0.1
0.2
0.225
0.2
0.225
0.315
0.35
1
0.3
0.945
0.35
0.45
0.275
0.6
0.355
For board assembly information please refer to Infineon website "Packages"
0.17
0.15
Copper
Solder mask
Stencil apertures
Marking Layout (Example)
BFR193L3
Type code
Pin 1 marking
Laser marking
Standard Packing
Reel ø180 mm = 15.000 Pieces/Reel
0.5
1.16
Pin 1
marking
8
4
0.76
13
2007-09-25
BC856...-BC860...
Edition 2006-02-01
Published by
Infineon Technologies AG
81726 München, Germany
© Infineon Technologies AG 2007.
All Rights Reserved.
Attention please!
The information given in this dokument shall in no event be regarded as a guarantee
of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any
examples or hints given herein, any typical values stated herein and/or any information
regarding the application of the device, Infineon Technologies hereby disclaims any
and all warranties and liabilities of any kind, including without limitation warranties of
non-infringement of intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices
please contact your nearest Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements components may contain dangerous substances.
For information on the types in question please contact your nearest
Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or
systems with the express written approval of Infineon Technologies, if a failure of
such components can reasonably be expected to cause the failure of that
life-support device or system, or to affect the safety or effectiveness of that
device or system.
Life support devices or systems are intended to be implanted in the human body,
or to support and/or maintain and sustain and/or protect human life. If they fail,
it is reasonable to assume that the health of the user or other persons
may be endangered.
14
2007-09-25
