BCM20733A3KML1G

CYW20733 Single-Chip Bluetooth Transceiver Wireless Input Devices The Cypress CYW20733 is a Bluetooth 3.0 + EDR compliant, stand-alone baseband processor with an integrated 2.4 GHz transceiver. The device is ideal for applications in wireless input devices including game controllers, keyboards, and joysticks. Built-in firmware adheres to the Bluetooth Human Interface Device (HID) profile and Bluetooth Device ID profile specifications. The CYW20733 radio has been designed to provide low power, low cost, and robust communications for applications operating in the globally available 2.4 GHz unlicensed ISM band. It is fully compliant with the Bluetooth Radio Specification 3.0 + EDR. The singlechip Bluetooth transceiver is a monolithic component implemented in a standard digital CMOS process and requires minimal external components to make a fully compliant Bluetooth device. The CYW20733 is available in three package options: a 81-pin, 8 mm × 8 mm FBGA, a 121-pin, 9 mm × 9 mm FBGA, and a 56-pin, 7 mm x 7 mm QFN. Cypress Part Numbering Scheme Cypress is converting the acquired IoT part numbers from Broadcom to the Cypress part numbering scheme. Due to this conversion, there is no change in form, fit, or function as a result of offering the device with Cypress part number marking. The table provides Cypress ordering part number that matches an existing IoT part number. Table 1. Mapping Table for Part Number between Broadcom and Cypress Broadcom Part Number Cypress Part Number BCM20733 CYW20733 BCM20733A3KFB1G CYW20733A3KFB1G BCM20733A3KFB2G CYW20733A3KFB2G BCM20733A3KML1G CYW20733A3KML1G Features Integrated LDO to reduce BOM cost Bluetooth specification 3.0 + EDR compatible ■ Bluetooth HID profile version 1.1 compliant ■ Bluetooth Device ID profile version 1.3 compliant ■ Supports AFH ■ Excellent receiver sensitivity ■ On-chip support for common keyboard and mouse interfaces eliminates external processor ■ Infrared (IR) modulator ■ IR learning ■ Integrated 200 mW filterless Class-D audio amplifier ■ Triac control ■ Triggered Broadcom Fast Connect ■ One I/O capable of sinking 100 mA for high- current drive applications ■ Programmable key scan matrix interface, up to 8 × 20 keyscanning matrix ■ Three-axis quadrature signal decoder ■ ■ On-chip support for serial peripheral interface (master and slave modes) ■ Broadcom Serial Communications Interface (compatible with Philips® I2C slaves) ■ Two independent half-duplex PCM/I2S interfaces ■ Real-time clock supported with 32.768 kHz oscillator ■ Programmable output power control meets Class 2 or Class 3 requirements ■ On-chip PA with a maximum output power of +10dBm without external component ■ Integrated ARM7TDMI-S™-based microprocessor core ■ On-chip power on reset (POR) ■ On-chip software control power management unit ■ Three package types available: ❐ 81-pin FBGA package (8 mm × 8 mm) ❐ 121-pin FBGA package (9 mm × 9 mm) ❐ 56-pin QFN package (7 mm x 7 mm) ■ RoHS compliant ■ Applications ■ ■ ■ ■ Game controllers Wireless pointing devices: mice, trackballs Wireless keyboards Joysticks Cypress Semiconductor Corporation Document No. 002-14859 Rev. *S • ■ ■ ■ ■ 198 Champion Court Point-of-sale (POS) input devices Remote controls Home automation 3D glasses • San Jose, CA 95134-1709 • 408-943-2600 Revised November 9, 2017 CYW20733 Figure 1. Functional Block Diagram Muxed on GPIO Tx Rx Tx RTSN CTSN Rx RTSN MISO SDA/ CTSN MOSI SCK WDT Processing Unit (ARM7) Test UART Periph UART 1.2V VDDC VSS, VDDO, VDDC BSC/SPI Master Interface (BSC is I2Ccompat) 28 ADC Inputs CT ɇ ѐ ADC Speaker Digital Audio Block 1.2V POR Class-D Driver 1.2V VDDC Domain MIA POR System Bus 32 kHz LPCLK 24 MHz 384K ROM Peripheral Interface Block 80K RAM RF Control and Data 2.4 GHz Radio T/R Switch 1.2V LDO LDO CTRL Bluetooth Baseband Core 1.2V 32 kHz LPCLK I/O Ring Bus GPIO Control/ Status Registers IR Mod. and Learning Keyboard Matrix Scanner w/FIFO 3-Axis Mouse Signal Controller SPI M/S Frequency Synthesizer PMU WAKE 1.2V VDDRF Domain 28 ADC Inputs Ref Xtal PWM 8 x 20 6 quadrature inputs Scan (3 pair) + Hi -current Matrix Driver Controls IR 57 GPIO I/O AutoCal Document No. 002-14859 Rev. *S 1.62V -3.6V Power 24 MHz RF I/O I/O Ring Control Registers Volt. Trans 3V Speaker Out High Sink IO 57 GPIO Pins VDDO Domain ÷4 128 kHz LPCLK 128 kHz LPO 32 kHz Xtal (opƟonal) Page 2 of 67 CYW20733 Contents 1.Functional Description ....................................... 4 1.1 1.2 Integrated Radio Transceiver .............................. 4 1.1.1 Transmitter Path ...................................... 4 1.1.2 Receiver Path .......................................... 4 1.1.3 Local Oscillator ........................................ 4 1.1.4 Calibration ............................................... 4 1.1.5 Internal LDO Regulator ............................ 4 1.15 Infrared Learning ................................................19 Microprocessor Unit ............................................ 5 1.2.1 EEPROM Interface .................................. 5 1.2.2 Serial Flash Interface ............................... 5 1.19 Integrated Filterless Class-D Audio Amplifier .....20 1.2.3 Internal Reset .......................................... 5 1.2.4 External Reset ......................................... 6 1.3 Bluetooth Baseband Core ................................... 6 1.3.1 Frequency Hopping Generator ................ 6 1.3.2 E0 Encryption .......................................... 6 1.3.3 Link Control Layer ................................... 6 1.3.4 Adaptive Frequency Hopping .................. 6 1.3.5 Bluetooth Version 3.0 Features ............... 6 1.3.6 Test Mode Support .................................. 7 1.4 1.5 1.14 Infrared Modulator ..............................................18 Peripheral Transport Unit (PTU) ......................... 7 1.4.1 Broadcom Serial Control Interface .......... 7 1.16 Shutter Control for 3D Glasses ..........................19 1.17 Triac Control .......................................................20 1.18 Cypress Proprietary Control Signalling and Triggered Broadcom Fast Connect .............20 1.20 High-Current I/O .................................................21 1.21 Power Management Unit ....................................22 1.21.1 RF Power Management ..........................22 1.21.2 Host Controller Power Management ......22 1.21.3 BBC Power Management .......................22 2.Pin Assignments............................................... 23 2.1 Ball Maps ...........................................................29 2.1.1 81-Pin FBGA Ball Map ...........................29 2.1.2 121-Pin FBGA Ball Map .........................31 2.1.3 56-Pin QFN Diagram ..............................32 3.Specifications.................................................... 33 3.1 Electrical Characteristics ....................................33 1.4.2 UART Interface ........................................ 8 3.2 RF Specifications ...............................................37 PCM Interface ..................................................... 9 1.5.1 System Diagram ...................................... 9 3.3 Timing and AC Characteristics ...........................39 3.3.1 UART Timing ..........................................39 1.5.2 Slot Mapping .......................................... 10 1.5.3 Frame Synchronization .......................... 10 1.5.4 Data Formatting ..................................... 10 3.3.2 SPI Timing ..............................................40 3.3.3 BSC Interface Timing .............................41 3.3.4 PCM Interface Timing .............................43 1.6 I2S Interface ...................................................... 10 1.7 Clock Frequencies ............................................ 10 1.7.1 Crystal Oscillator ................................... 10 4.Mechanical Information.................................... 53 1.8 GPIO Port .......................................................... 12 1.9 Keyboard Scanner ............................................ 12 1.9.1 Theory of Operation ............................... 13 4.0.1 Tape Reel and Packaging Specifications .........................................56 5.Ordering Information ........................................ 62 1.10 Mouse Quadrature Signal Decoder ................... 13 1.10.1 Theory of Operation ............................... 13 6.IoT Resources ................................................... 62 1.11 ADC Port ........................................................... 13 A.Acronyms and Abbreviations.......................... 62 1.12 PWM ................................................................. 14 Document History........................................................... 64 1.13 Serial Peripheral Interface ................................. 15 Sales, Solutions, and Legal Information ...................... 67 Document No. 002-14859 Rev. *S 3.3.5 I2S Timing ...............................................48 Page 3 of 67 CYW20733 1. Functional Description 1.1 Integrated Radio Transceiver The CYW20733 has an integrated radio transceiver that has been optimized for use in 2.4 GHz Bluetooth wireless systems. It has been designed to provide low power, low cost, robust communications for applications operating in the globally available 2.4 GHz unlicensed ISM band. It is fully compliant with Bluetooth Radio Specification 3.0 + EDR and meets or exceeds the requirements to provide the highest communication link quality of service. 1.1.1 Transmitter Path The CYW20733 features a fully integrated zero IF transmitter. The baseband transmit data is GFSK modulated in the modem block and upconverted to the 2.4 GHz ISM band. The transmit path consists of signal filtering, I/Q upconversion, output power amplification, and RF filtering. It also incorporates the /4-DQPSK and 8-DPSK modulation schemes, which support the 2 Mbps and 3 Mbps enhanced data rates, respectively. Digital Modulator The digital modulator performs the data modulation and filtering required for the GFSK, /4-DQPSK, and 8-DPSK signals. The fully digital modulator minimizes any frequency drift or anomalies in the modulation characteristics of the transmitted signal and is much more stable than direct VCO modulation schemes. Power Amplifier The integrated power amplifier (PA) for the CYW20733 can transmit at a maximum power of +4 dBm for class 2 operation. The transmit power levels are for basic rate and EDR. Due to the linear nature of the PA, combined with some integrated filtering, no external filters are required for meeting Bluetooth and regulatory harmonic and spurious requirements. The CYW20733 internal PA can deliver a maximum output power of +10 dBm for basic rate and +8 dBm for EDR with a flexible supply range of 2.5V to 3.0V. 1.1.2 Receiver Path The receiver path uses a low-IF scheme to downconvert the received signal for demodulation in the digital demodulator and bit synchronizer. The receiver path provides a high degree of linearity, an extended dynamic range, and high-order on-chip channel filtering to ensure reliable operation in the noisy 2.4 GHz ISM band. The front-end topology with built-in out-of-band attenuation enables the CYW20733 to be used in most applications without off-chip filtering. Digital Demodulator and Bit Synchronizer The digital demodulator and bit synchronizer take the low-IF received signal and perform an optimal frequency tracking and bit synchronization algorithm. Receiver Signal Strength Indicator The radio portion of the CYW20733 provides a receiver signal strength indicator (RSSI) to the baseband. This enables the controller to take part in a Bluetooth power-controlled link by providing a metric of its own receiver signal strength to determine whether the transmitter should increase or decrease its output power. 1.1.3 Local Oscillator The local oscillator (LO) provides fast frequency hopping (1600 hops/second) across the 79 maximum available channels. The LO subblock employs an architecture for high immunity to LO pulling during PA operation. The CYW20733 uses an internal RF and IF loop filter. 1.1.4 Calibration The CYW20733 radio transceiver features an automated calibration scheme that is self-contained in the radio. No user interaction is required during normal operation or during manufacturing to provide the optimal performance. Calibration will optimize the gain and phase performance of all the major blocks within the radio to within 2% of optimal conditions. Calibrated blocks include filters, the matching networks between key components, and key gain blocks. The calibration process corrects for both process and temperature variations. It occurs transparently during normal operation and the setting time of the hops and will calibrate for temperature variations as the device cools and heats during normal operation in its environment. 1.1.5 Internal LDO Regulator To reduce the external BOM, the CYW20733 has an integrated 1.2V LDO regulator to provide power to the digital and RF circuits and system components. The 1.2V LDO regulator operates from a 1.62V to 3.63V input supply with a 60 mA maximum load current. In noisy environments, a ferrite bead may be needed between the digital and RF supply pins to isolate noise coupling and suppress noise into the RF circuits. Note: Always place the decoupling capacitors near the pins as close together as possible. Document No. 002-14859 Rev. *S Page 4 of 67 CYW20733 1.2 Microprocessor Unit The CYW20733 microprocessor unit (µPU) runs software from the link control (LC) layer up to the Human Interface Device (HID). The microprocessor is based on an ARM7™ 32-bit RISC processor with embedded ICE-RT debug and JTAG interface units. The µPU has 320 KB of ROM for program storage and boot-up, 80 KB of RAM for scratch-pad data, and patch RAM code. The internal boot ROM allows for flexibility during power-on reset to enable the same device to be used in various configurations, including UART, and with an external serial EEPROM or with an external flash memory. At power-up, the lower layer protocol stack is executed from the internal ROM memory. External patches may be applied to the ROM-based firmware to provide flexibility for bug fixes and feature additions. The device can also support the integration of user applications. 1.2.1 EEPROM Interface The CYW20733 provides the BSC (Broadcom Serial Control) master interface; the BSC is programmed by the CPU to generate four different types of BSC transfers on the bus: read-only, write-only, combined read/write, and combined write/read. BSC supports both low-speed and fast mode devices. The BSC is compatible with a Philips® I2C slave device, except that master arbitration (multiple I2C masters contending for the bus) is not supported. Native support for Microchip® 24LC128, Microchip 24AA128, and STMicroelectronics® M24128-BR is included. The EEPROM can contain customer application configuration information, including: application code, configuration data, patches, pairing information, BD_ADDR, baud rate, SDP service record, and file system information used for code. 1.2.2 Serial Flash Interface The CYW20733 includes an SPI master controller that can be used to access serial flash memory. The SPI master contains an AHB slave interface, transmit and receive FIFOs, and the SPI core PHY logic. Devices natively supported include the following: ■ Atmel® AT25BCM512B ■ MXIC MX25V512ZUI-20G 1.2.3 Internal Reset The CYW20733 has an integrated power-on reset circuit that resets all circuits to a known power-on state. Figure 1. Internal Reset Timing VDDO POR delay ~ 2 ms VDDO VDDO POR threshold VDDO POR VDDC POR threshold VDDC VDDC POR delay ~ 2 ms VDDC POR Crystal  warm‐up  delay:  ~ 5 ms Baseband Reset Start reading EEPROM and firmware boot. Crystal Enable Document No. 002-14859 Rev. *S Page 5 of 67 CYW20733 1.2.4 External Reset An external active-low reset signal, RESET_N, can be used to put the CYW20733 in the reset state. The RESET_N pin has an internal pull-up resistor and, in most applications, it does not require that anything be connected to it. RESET_N should only be released after the VDDO supply voltage level has been stabilized. Figure 2. External Reset Timing RESET_N Pulse width >20 µs Crystal  warm‐up  delay:  ~ 5 ms Baseband Reset Start reading EEPROM and firmware boot. Crystal Enable 1.3 Bluetooth Baseband Core The Bluetooth Baseband Core (BBC) implements all of the time-critical functions required for high-performance Bluetooth operation. The BBC manages the buffering, segmentation, and routing of data for all connections. It also buffers data that passes through it, handles data flow control, schedules ACL TX/RX transactions, monitors Bluetooth slot usage, optimally segments and packages data into baseband packets, manages connection status indicators, and composes and decodes HCI packets. In addition to these functions, it independently handles HCI event types and HCI command types. The following transmit and receive functions are also implemented in the BBC hardware to increase reliability and security of the TX/ RX data before sending over the air: ■ Receive Functions: Symbol timing recovery, data deframing, forward error correction (FEC), header error control (HEC), cyclic redundancy check (CRC), data decryption, and data de-whitening. ■ Transmit Functions: Data framing, FEC generation, HEC generation, CRC generation, link key generation, data encryption, and data whitening. 1.3.1 Frequency Hopping Generator The frequency hopping sequence generator selects the correct hopping channel number depending on the link controller state, Bluetooth clock, and the device address. 1.3.2 E0 Encryption The encryption key and the encryption engine are implemented using dedicated hardware to reduce software complexity and provide minimal intervention. 1.3.3 Link Control Layer The Link Control layer is part of the Bluetooth link control functions that are implemented in dedicated logic in the Link Control Unit (LCU). This layer consists of the command controller, which takes commands from the software, and other controllers that are activated or configured by the command controller to perform the link control tasks. Each task performs in a different state in the Bluetooth link controller. STANDBY and CONNECTION are the two major states. In addition, there are five substates: page, page scan, inquiry, inquiry scan, and sniff. 1.3.4 Adaptive Frequency Hopping The CYW20733 gathers link quality statistics on a channel-by-channel basis to facilitate channel assessment and channel map selection. The link quality is determined using both RF and baseband signal processing to provide a more accurate frequency-hop map. 1.3.5 Bluetooth Version 3.0 Features The CYW20733 is fully compliant with the Bluetooth 3.0 standard, including the following options: Document No. 002-14859 Rev. *S Page 6 of 67 CYW20733 ■ Enhanced power control ■ HCI read, encryption key size command The CYW20733 supports all of the new Bluetooth version 2.1 features: ■ Extended inquiry response ■ Sniff subrating ■ Encryption pause and resume ■ Secure simple pairing ■ Link supervision timeout changed event ■ Erroneous data reporting ■ Non-automatically flushable packet boundary flag ■ Security Mode 4 1.3.6 Test Mode Support The CYW20733 fully supports Bluetooth Test Mode, as described in Part 1 of the Bluetooth System Version 2.1 specification. This includes the transmitter tests, normal and delayed loopback tests, and reduced hopping sequence. In addition to the standard Bluetooth test mode, the device supports enhanced testing features to simplify RF debugging and qualification and type approval testing. These features include: ■ Fixed frequency carrier wave (unmodulated) transmission ■ Simplified type approval measurements (Japan) ■ Aid in transmitter performance analysis ■ Fixed frequency constant receiver mode ■ Receiver output directed to I/O pin ■ Direct BER measurements using standard RF test equipment ■ Facilitated spurious emissions testing for receive mode ■ Fixed frequency constant transmission ■ 8-bit fixed pattern or PRBS-9 ■ Modulated signal measurements with standard RF test equipment ■ Connectionless transmitter test ■ Hopping or fixed frequency ■ Multiple packet types ■ Multiple data patterns ■ Connectionless receiver test 1.4 Peripheral Transport Unit (PTU) 1.4.1 Broadcom Serial Control Interface The CYW20733 provides a 2-pin master BSC interface that can be used to retrieve configuration information from an external EEPROM or to communicate with peripherals such as track-ball or touch-pad modules, and motion tracking ICs used in mouse devices. The BSC interface is compatible with I2C slave devices. The BSC does not support multimaster capability or flexible waitstate insertion by either master or slave devices. Listed below are the transfer clock rates supported by the BSC: ■ 100 kHz ■ 400 kHz ■ 800 kHz (Not a standard I2C-compatible speed.) Document No. 002-14859 Rev. *S Page 7 of 67 CYW20733 ■ 4 MHz maximum (Compatibility with high-speed I2C-compatible devices is not guaranteed.) The following transfer types are supported by the BSC: ■ Read (up to 127 bytes can be read) ■ Write (up to 127 bytes can be written) ■ Read-then-Write (Up to 127 bytes can be read, and up to 127 bytes can be written.) ■ Write-then-Read (Up to 127 bytes can be written, and up to 127 bytes can be read.) Hardware controls the transfers, requiring minimal firmware setup and supervision. The clock pin (SCL) and data pin (SDA) are both open-drain I/O pins. Pull-up resistors external to the CYW20733 are required on both SCL and SDA for proper operation. 1.4.2 UART Interface The UART physical interface is a standard, 4-wire interface (RX, TX, RTS, and CTS) with adjustable baud rates from 9600 bps to 1.5 Mbps. During initial boot, UART speeds may be limited to 750 kbps. The baud rate may be selected via a vendor-specific UART HCI command. The CYW20733 has a 1040-byte receive FIFO and a 1040-byte transmit FIFO to support enhanced data rates. The interface supports the Bluetooth 3.0 UART HCI (H4) specification. The default baud rate for H4 is 115.2 kbaud. The UART clock is 24 MHz. The baud rate of the CYW20733 UART is controlled by two values. The first is a UART clock divisor (also called the DLBR register) that divides the UART clock by an integer multiple of 16. The second is a baud rate adjustment (also called the DHBR register) that is used to specify a number of UART clock cycles to stuff in the first or second half of each bit time. Up to eight UART cycles can be inserted into the first half of each bit time, and up to eight UART clock cycles can be inserted into the end of each bit time. When setting the baud rate manually, the UART clock divisor is an 8-bit value that is stored as 256 minus the chosen divisor. For example, a divisor of 13 is stored as 256 – 13 = 243 = 0xF3. The baud rate adjustment is also an 8-bit value, of which the four MSBs are the number of additional clock cycles to insert in the first half of each bit time, and the four LSBs are the number of clock cycles to insert in the second half of each bit time. If either of these two values is over eight, it is rounded to eight. To compute the baud rate, the calculation is expressed as: 24 MHz ÷ ((16 × UART clock divisor) + total inserted 24-MHz clock cycles) Table 2 contains example values to generate common baud rates. Table 2. Common Baud Rate Examples Desired Baud Rate UART Clock Divi(bps) sor 1500000 921600 460800 230400 115200 57600 38400 28800 19200 14400 9600 0xFF 0xFF 0xFD 0xFA 0xF3 0xE6 0xD9 0xCC 0xB2 0x98 0x64 Baud Rate Adjustment High Nibble Low Nibble 0x00 0x05 0x02 0x04 0x00 0x00 0x01 0x00 0x01 0x00 0x02 0x00 0x05 0x02 0x04 0x00 0x00 0x00 0x00 0x01 0x00 0x02 Actual Baud Rate (bps) 1500000 923077 461538 230769 115385 57692 38400 28846 19200 14423 9600 Error (%) 0.00 0.16 0.16 0.16 0.16 0.16 0.00 0.16 0.00 0.16 0.00 Normally, the UART baud rate is set by a configuration record downloaded after reset. Support for changing the baud rate during normal HCI UART operation is included through a vendor-specific command that allows the host to adjust the contents of the baud rate registers. The CYW20733 UART operates correctly with the host UART as long as the combined baud rate error of the two devices is within ±5%. Peripheral UART Interface The CYW20733 has a second UART that may be used to interface to other peripherals. This peripheral UART is accessed through the optional I/O ports, which can be configured individually and separately for each functional pin as shown in Table 3. Document No. 002-14859 Rev. *S Page 8 of 67 CYW20733 Table 3. CYW20733 Peripheral UART Pin Name Configured pin name pUART_TX P0 pUART_RX P2 pUART_CTS_N P3 pUART_RTS_N P1 P5 P4 P7 P6 P24 P25 P35 P30 P31 P33 – – P32 P34 – – 1.5 PCM Interface The CYW20733 PCM interface can connect to linear PCM codec devices in master or slave mode. In master mode, the device generates the PCM_BCLK and PCM_SYNC signals. In slave mode, these signals are provided by another master on the PCM interface as inputs to the device. The channels can be configured to either transmit or receive, but they must be assigned to different time slots. The two half-duplex channels cannot be combined to form a single full-duplex channel. 1.5.1 System Diagram Figure 3 shows options for connecting the device to a PCM codec device as a master or a slave. Figure 3. PCM Interface with Linear PCM Codec PCM_IN PCM Codec (Master) PCM_OUT PCM_BCLK CYW20733 (Slave) PCM_SYNC PCM Interface Slave Mode PCM_IN PCM Codec (Slave) PCM_OUT PCM_BCLK CYW20733 (Master) PCM_SYNC PCM Interface Master Mode PCM_IN PCM Codec (Hybrid) PCM_OUT PCM_BCLK CYW20733 (Hybrid) PCM_SYNC PCM Interface Hybrid Mode Document No. 002-14859 Rev. *S Page 9 of 67 CYW20733 1.5.2 Slot Mapping Table 4. PCM Interface Time-Slotting Scheme Audio Sample Rate Time-Slotting Scheme 8 kHz The number of slots depends on the selected interface rate, as follows: Interface rate Slot 1281 2562 5124 10248 204816 16 kHz The number of slots depends on the selected interface rate, as follows: Interface rate Slot 2561 5122 10244 20488 The PCM data output driver tri-states its output on unused slots to allow other devices to share the same PCM interface signals. The data output driver tristates its output after the falling edge of the PCM clock during the last bit of the slot. 1.5.3 Frame Synchronization The device supports both short and long frame synchronization types in both master and slave configurations. In short frame synchronization mode, the frame synchronization signal is an active-high pulse at the 8 kHz audio frame rate (which is a single bit period in width) and synchronized to the rising edge of the bit clock. The PCM slave expects PCM_SYNC to be high on the falling edge of the bit clock and the first bit of the first slot to start at the next rising edge of the clock. In the long frame synchronization mode, the frame synchronization signal is an active-high pulse at the 8 kHz audio frame rate. However, the duration is 3-bit periods, and the pulse starts coincident with the first bit of the first slot. 1.5.4 Data Formatting The device can be configured to generate and accept several different data formats. The device uses 13 of the 16 bits in each PCM frame. The location and order of these 13 bits is configurable to support various data formats on the PCM interface. The remaining three bits are ignored on the input and may be filled with zeros, ones, a sign bit, or a programmed value on the output. The default format is 13-bit two’s complement data, left justified, and clocked most significant bit first. 1.6 I2S Interface The I2S interface supports up to two half-duplex channels. The channels can be configured to either transmit or receive, but they must be assigned to different time slots (left or right). The two half-duplex channels cannot be combined to form a single full-duplex channel. The I2S interface is capable of operating in either slave or master mode. The device supports a 16-bit data width with 8-kHz and 16kHz frame rates. 1.7 Clock Frequencies The CYW20733 is set with a crystal frequency of 24 MHz. 1.7.1 Crystal Oscillator The crystal oscillator requires a crystal with an accuracy of ±20 ppm as defined by the Bluetooth specification. Two external load capacitors in the 5 pF to 30 pF range are required to work with the crystal oscillator. The selection of the load capacitors is crystal dependent. Table 5 shows the recommended crystal specification. Document No. 002-14859 Rev. *S Page 10 of 67 CYW20733 Figure 4. Recommended Oscillator Configuration—12 pF Load Crystal Table 5. Reference Crystal Electrical Specifications Parameter Input signal amplitude Conditions – Min Typ Max 400 – 2000 24.000 – Nominal frequency – – Oscillation mode – Fundamental Unit mVp-p MHz – Frequency tolerance @25°C – ±10 – ppm Tolerance stability over temp @0°C to +70°C – ±10 – ppm Equivalent series resistance – – – 50 Ω Load capacitance – – 12 – pF Operating temperature range – 0 – +70 °C Storage temperature range – –40 – +125 °C Drive level – – – 200 W Aging – – – ±10 ppm/year Shunt capacitance – – – 2 pF HID Peripheral Block The peripheral blocks of the CYW20733 all run from a single 128-kHz low-power RC oscillator. The oscillator can be turned on at the request of any of the peripherals. If a peripheral is not enabled, it shall not assert its clock request line. The keyboard scanner is a special case in that it may drop its clock request line even when enabled and then reassert the clock request line if a key-press is detected. Real-Time Clock and 32 kHz Crystal Oscillator The CYW20733 has a 48-bit counter that can be configured to be clocked directly from a 32.768 kHz or 32.000 kHz crystal oscillator. The real-time clock counter value is accessible via firmware. Figure 5 shows the 32 kHz crystal (XTAL) oscillator with external components, and Table 6 lists the oscillator’s characteristics. It is a standard Pierce oscillator using a comparator with hysteresis on the output to create a single-ended digital output. The hysteresis was added to eliminate any chatter when the input is around the threshold of the comparator and is ~100 mV. This circuit can be operated with a 32 kHz or 32.768 kHz crystal oscillator or be driven with a clock input at a similar frequency. The default component values are: R1 = 10 M, C1 = C2 = ~10 pF. The values of C1 and C2 are used to fine-tune the oscillator. Document No. 002-14859 Rev. *S Page 11 of 67 CYW20733 Figure 5. 32-kHz Oscillator Block Diagram C2 32.768 kHz XTAL R1 C1 Table 6. XTAL Oscillator Characteristics Parameter Symbol Conditions Minimum Typical Maximum Unit Output frequency Foscout – – 32.768 – kHz Frequency tolerance – Crystal dependent – 100 – ppm Start-up time Tstartup – – – 500 ms XTAL drive level Pdrv For crystal selection 0.5 – – W XTAL series resistance Rseries For crystal selection – – 70 k XTAL shunt capacitance Cshunt For crystal selection – – 1.3 pF 1.8 GPIO Port The CYW20733 has 40 general-purpose I/Os (GPIOs) in the 81-pin package and 58 GPIOs in the 121-pin package. All GPIOs support programmable pull-ups and are capable of driving up to 8 mA at 3.3V or 4 mA at 1.8V, except P26, P27, P28, and P29, which are capable of driving up to 16 mA at 3.3V or 8 mA at 1.8V. GPIO P57 is capable of sinking 100 mA for VDDIO = 3.0V and 60 mA for VDDIO = 1.62V. Port 0–Port 1, Port 8–Port 18, Port 20–Port 23, and Port 28–Port 38 All of these pins can be programmed as ADC inputs. Port 26–Port 29 P[26:29] consist of four pins. All pins are capable of sinking up to 16 mA for LEDs. These pins also have the PWM function, which can be used for LED dimming. 1.9 Keyboard Scanner The keyboard scanner is designed to autonomously sample keys and store them into buffer registers without the need for the host microcontroller to intervene. The scanner has the following features: ■ Ability to turn off its clock if no keys are pressed. ■ Sequential scanning of up to 160 keys in an 8 × 20 matrix. ■ Programmable number of columns from 1 to 20. ■ Programmable number of rows from 1 to 8. ■ 16-byte key-code buffer (can be augmented by firmware). ■ 128 kHz clock—allows scanning of full 160-key matrix in about 1.2 ms. ■ N-key rollover with selective 2-key lockout if ghost is detected. ■ Keys are buffered until host microcontroller has a chance to read it, or until overflow occurs. Document No. 002-14859 Rev. *S Page 12 of 67 CYW20733 ■ Hardware debouncing and noise/glitch filtering. ■ Low-power consumption. Single-digit µA-level sleep current. 1.9.1 Theory of Operation The key scan block is controlled by a state machine with the following states: Idle The state machine begins in the idle state. In this state, all column outputs are driven high. If any key is pressed, a transition occurs on one of the row inputs. This transition causes the 128 kHz clock to be enabled (if it is not already enabled by another peripheral) and the state machine to enter the scan state. Also in this state, an 8-bit row-hit register and an 8-bit key-index counter is reset to 0. Scan In the scan state, a row counter counts from 0 up to a programmable number of rows minus 1. After the last row is reached, the row counter is reset and the column counter is incremented. This cycle repeats until the row and column counters are both at their respective terminal count values. At that point, the state machine moves into the Scan-End state. As the keys are being scanned, the key-index counter is incremented. This counter is the value compared to the modifier key codes stored, or in the key-code buffer if the key is not a modifier key. It can be used by the microprocessor as an index into a lookup table of usage codes. Also, as the nth row is scanned, the row-hit register is ORed with the current 8-bit row input values if the current column contains two or more row hits. During the scan of any column, if a key is detected at the current row, and the row-hit register indicates that a hit was detected in that same row on a previous column, then a ghost condition may have occurred, and a bit in the status register is set to indicate this. Scan End This state determines whether any keys were detected while in the scan state. If yes, the state machine returns to the scan state. If no, the state machine returns to the idle state, and the 128 kHz clock request signal is made inactive. The microcontroller can poll the key status register. 1.10 Mouse Quadrature Signal Decoder The mouse signal decoder is designed to autonomously sample two quadrature signals commonly generated by an optomechanical mouse. The decoder has the following features: ■ Three pairs of inputs for X, Y, and Z (typical scroll wheel) axis signals. Each axis has two options: For the X axis, choose P2 or P32 as X0 and P3 or P33 as X1. ❐ For the Y axis, choose P4 or P34 as Y0 and P5 or P35 as Y1. ❐ For the Z axis, choose P6 or P36 as Z0 and P7 or P37 as Z1. ❐ ■ Control of up to four external high-current GPIOs to power external optoelectronics: Turn-on and turn-off time can be staggered for each HC-GPIO to avoid simultaneous switching of high currents and having multiple high-current devices on at the same time. ❐ Sample time can be staggered for each axis. ❐ Sense of the control signal can be active high or active low. ❐ Control signal can be tristated for off condition or driven high or low, as appropriate. ❐ 1.10.1 Theory of Operation The mouse decoder block has four 10-bit PWMs for controlling external quadrature devices and sampling the quadrature inputs at its core. The GPIO signals may be used to control such items as LEDs, external ICs that may emulate quadrature signals, photodiodes, and photodetectors. 1.11 ADC Port The CYW20733 contains a 16-bit ADC. Additionally: ■ There are 28 analog input channels. All channels are multiplexed on various GPIOs. ■ There is a built-in reference with bandgap-based reference modes. ■ The maximum conversion rate is 187 kHz. ■ There is a rail-to-rail input swing. Document No. 002-14859 Rev. *S Page 13 of 67 CYW20733 The ADC consists of an analog ADC core that performs the actual analog-to-digital conversion and digital hardware that processes the output of the ADC core into valid ADC output samples. Directed by the firmware, the digital hardware also controls the input multiplexers that select the ADC input signal (Vinp) and the ADC reference signals (Vref). Table 7. Sampling Rate and Effective Number of Bits Effective Number of Bits (ENOB) Mode Minimum 0 10.4 1 2 Typical Latencya (μs) Sampling Rate (kHz) 13.0 5.859 171 10.2 12.6 11.7 85 9.7 12.0 46.875 21 3 9.3 11.5 93.75 11 4 7.9 10.0 187 5 a. Settling time of the ADC and filter after switching channels. 1.12 PWM The CYW20733 has four internal PWMs. The PWM module consists of the following: ■ ■ PWM1–4 Each of the four PWM channels, PWM1–4, contains the following registers: 10-bit initial value register (read/write) ❐ 10-bit toggle register (read/write) ❐ 10-bit PWM counter value register (read) ❐ PWM configuration register shared among PWM1–4 (read/write). This 12-bit register is used: To configure each PWM channel ❐ To select the clock of each PWM channel ❐ To change the phase of each PWM channel Figure 6 on page 15 shows the structure of one PWM. ■ ❐ Document No. 002-14859 Rev. *S Page 14 of 67 CYW20733 Figure 6. PWM Block Diagram pwm_cfg_adr register pwm#_init_val_adr register pwm#_togg_val_adr register enable clk_sel o_flip 10 10 pwm#_cntr_adr 10 cntr value is ARM readable pwm_out Example: PWM cntr w/ pwm#_init_val = 0 (dashed line) PWM cntr w/ pwm#_init_val = x (solid line)                   10'H3FF pwm_togg_val_adr 10'Hx 10'H000 pwm_out 1.13 Serial Peripheral Interface The CYW20733 has two independent SPI interfaces. One is a master-only interface (SPI_1) and the other (SPI_2) can be either a master or a slave. Each interface has a 64-byte transmit buffer and a 64-byte receive buffer. To support more flexibility for user applications, the CYW20733 has optional I/O ports that can be configured individually and separately for each functional pin, as shown in Table 8. The CYW20733 acts as an SPI master device that supports 1.8V or 3.3V SPI slaves. The CYW20733 can also act as an SPI slave device that supports a 1.8V or 3.3V SPI master. Note: SPI voltage depends on VDDO/VDDM; therefore, it defines the type of devices that can be supported. Table 8. CYW20733 First SPI Set (Master Mode) Pin Name Configured Pin Name SPI_CLK SPI_MOSI SPI_CSa SPI_MISO SCL SDA P24 – – – P26 – – – P32b P33b – – P39 – a. Any GPIO can be used as SPI_CS when SPI is in master mode. b. Default for serial flash. Document No. 002-14859 Rev. *S Page 15 of 67 CYW20733 Table 9. CYW20733 Second SPI Set (Master Mode) Configuration SPI_CLK SPI_MOSI SPI_CSa SPI_MISO 1 p3 p0 p1 – 2 p3 p0 p5 – 3 p3 p4 p1 – 4 p3 p4 p5 – 5 p3 p27 p1 – 6 p3 p27 p5 – 7 p3 p38 p1 – 8 p3 p38 p5 – 9 p7 p0 p1 – 10 p7 p0 p5 – 11 p7 p4 p1 – 12 p7 p4 p5 – 13 p7 p27 p1 – 14 p7 p27 p5 – 15 p7 p38 p1 – 16 p7 p38 p5 – 17 p24 p0 p25 – 18 p24 p4 p25 – 19 p24 p27 p25 – 20 P24 P38 P25 – 21 p36 p0 p25 – 22 p36 p4 p25 – 23 p36 p27 p25 – 24 P36 P38 p25 – a. Any GPIO can be used as SPI_CS when SPI is in master mode. Document No. 002-14859 Rev. *S Page 16 of 67 CYW20733 Table 10. CYW20733 Second SPI Set (Slave Mode) Configuration SPI_CLK SPI_MOSI SPI_MISO SPI_CS 1 p3 p0 p1 p6 2 p3 p0 p1 p2 3 p3 p0 p5 p6 4 p3 p0 p5 p2 5 p3 p0 p25 p6 6 p3 p0 p25 p2 7 p3 p4 p1 p6 8 p3 p4 p1 p2 9 p3 p4 p5 p6 10 p3 p4 p5 p2 11 p3 p4 p25 p6 12 p3 p4 p25 p2 13 p7 p0 p1 p2 14 p7 p0 p1 p6 15 p7 p0 p5 p6 16 p7 p0 p5 p2 17 p7 p0 p25 p2 18 p7 p0 p25 p6 19 p7 p4 p1 p6 20 p7 p4 p1 p2 21 p7 p4 p5 p6 22 p7 p4 p5 p2 23 p7 p4 p25 p2 24 p7 p4 p25 p6 25 p24 p27 p1 p26 26 p24 p27 p1 p32 27 p24 p27 p1 p39 28 p24 p27 p5 p26 29 p24 p27 p5 p32 30 p24 p27 p5 p39 31 P24 P27 P25 P26 32 p24 p27 p25 p32 33 P24 P27 P25 P39 34 p24 p33 p1 p26 35 p24 p33 p1 p32 36 p24 p33 p1 p39 37 p24 p33 p5 p26 38 p24 p33 p5 p32 39 p24 p33 p5 p39 40 P24 P33 P25 P26 41 p24 p33 p25 p32 42 P24 P33 P25 P39 43 p24 p38 p1 p26 44 p24 p38 p1 p32 45 p24 p38 p1 p39 Document No. 002-14859 Rev. *S Page 17 of 67 CYW20733 Table 10. CYW20733 Second SPI Set (Slave Mode) (Cont.) Configuration SPI_CLK SPI_MOSI SPI_MISO SPI_CS 46 p24 p38 p5 p26 47 p24 p38 p5 p32 48 p24 p38 p5 p39 49 P24 P38 P25 P26 50 p24 p38 p25 p32 51 P24 P38 P25 P39 52 p36 p27 p1 p26 53 p36 p27 p1 p32 54 p36 p27 p1 p39 55 p36 p27 p5 p26 56 p36 p27 p5 p32 57 p36 p27 p5 p39 58 P36 P27 P25 P26 59 p36 p27 p25 p32 60 P36 P27 P25 P39 61 p36 p33 p1 p26 62 p36 p33 p1 p32 63 p36 p33 p1 p39 64 p36 p33 p5 p26 65 p36 p33 p5 p32 66 p36 p33 p5 p39 67 P36 P33 P25 P26 68 p36 p33 p25 p32 69 P36 P33 P25 P39 70 p36 p38 p1 p26 71 p36 p38 p1 p32 72 p36 p38 p1 p39 73 p36 p38 p5 p26 74 p36 p38 p5 p32 75 p36 p38 p5 p39 76 P36 P38 P25 P26 77 p36 p38 p25 p32 78 P36 P38 P25 P39 1.14 Infrared Modulator The CYW20733 includes hardware support for infrared TX. The hardware can transmit both modulated and unmodulated waveforms. For modulated waveforms, hardware inserts the desired carrier frequency into all IR transmissions. IR TX can be sourced from firmware-supplied descriptors, a programmable bit, or the peripheral UART transmitter. If descriptors are used, they include IR on/off state and the duration between 1–32767 µsec. The CYW20733 IR TX firmware driver inserts this information in a hardware FIFO and makes sure that all descriptors are played out without an underrun glitch. See Figure 7. Document No. 002-14859 Rev. *S Page 18 of 67 CYW20733 Figure 7. Infrared TX VCC R1 Infrared‐LD D1 U1 CYW20733 R2 Q1 IR TX 1.15 Infrared Learning The CYW20733 includes hardware support for infrared learning. The hardware can detect both modulated and unmodulated signals. For modulated signals, the CYW20733 can detect carrier frequencies between 10–500 kHz and the duration that the signal is present or absent. The CYW20733 firmware driver supports further analysis and compression of a learned signal. A learned signal can then be played back through the CYW20733 IR TX subsystem. See Figure 8. Figure 8. Infrared RX VCC U3 CYW20733 D2 Photodiode IR RX 1.16 Shutter Control for 3D Glasses The CYW20733, combined with the CYW20702, provides full system support for 3D glasses on televisions. The CYW20702 gets frame synchronization signals from the TV, converts them into proprietary timing control messages, then passes the messages to the CYW20733. The CYW20733 uses these messages to synchronize the shutter control for the 3D glasses with the television frames. Document No. 002-14859 Rev. *S Page 19 of 67 CYW20733 The CYW20733 can provide up to four synchronized control signals for left and right eye shutter control. These four lines can output pulses with microsecond resolution for on and off timing. The total cycle time can be set for any period up to 65535 msec. The pulses are synchronized to each other for left and right eye shutters. The CYW20733 seamlessly adjusts the timing of the control signals based on control messages from the CYW20702, ensuring that the 3D glasses remain synchronized to the TV display frame. 3D hardware control on the CYW20733 works independently of the rest of the system. The CYW20733 negotiates sniff with the CYW20702 and, except for sniff resynchronization periods, most of the CYW20733 circuitry remains in a low power state while the 3D glasses subsystem continues to provide shutter timing and control pulses. This significantly reduces total system power consumption. 1.17 Triac Control The CYW20733 includes hardware support for zero-crossing detection and trigger control for up to four triacs. The CYW20733 detects zero-crossing on the AC zero detection line and uses that to provide a pulse that is offset from the zero crossing. This allows the CYW20733 to be used in dimmer applications, as well as any other applications that require a control signal that is offset from an input event. The zero-crossing hardware includes an option to suppress glitches. See Figure . Figure 9. Triac Control (TBD) 1.18 Cypress Proprietary Control Signalling and Triggered Broadcom Fast Connect Cypress Proprietary Control Signaling (BPCS) and Triggered Broadcom Fast Connect (TBFC) are Cypress-proprietary baseband (ACL) suspension and low-latency reconnection mechanisms that reestablish the baseband connection with the peer controller that also supports BPCS/TBFC. The CYW20733 uses BPCS primitives to allow a Human Interface Device (HID) to suspend all RF traffic after a configurable idle period with no reportable activity. To conserve power, it can then enter one of its low power states while still logically remaining connected at the L2CAP and HID layers with the peer device. When an event requires the HID to deliver a report to the peer device, the CYW20733 uses the TBFC and BPCS mechanisms to reestablish the baseband connection and immediately resume L2CAP traffic, greatly reducing latency between the event and delivery of the report to the peer device. To achieve power savings and low latencies that cannot be achieved using long sniff intervals, certain applications may make use of the CYW20733 Broadcom Fast Connect (BFC) mechanism, which will eliminate the need to maintain an RF link, while still being able to establish ACL and L2CAP connections much faster than regular methods. 1.19 Integrated Filterless Class-D Audio Amplifier The CYW20733 has an integrated speaker driver that includes both the digital path and an internal audio amplifier. The digital audio path includes a FIFO, LPF, rate adapter, and PWM modulator. The output of the PWM modulator drives an on-chip class-D high efficiency audio amplifier as shown in the figure below. Document No. 002-14859 Rev. *S Page 20 of 67 CYW20733 Figure 10. Class-D Block Diagram 667 kHz or 1.33 MHz PWM Modulator 150 kHz From FIFO 16 Hi-Fi Rate Adapter 16 LPF 8 kHz 16 kHz 22.05 kHz 44.1 kHz 48 kHz 16 22 M 128 kHz 256 kHz 352.8 kHz 705.6 kHz 768 kHz To Class-D audio amplifier ΔΣMOD. M = 160 or 320 AP Interface 3 The on-chip Class-D audio amplifier is designed to drive up to 200 mW into an 8 load and has a range of 20 Hz to 20 kHz, covering the entire audio spectrum. The amplifier is designed to deliver maximum dynamic range and power efficiency while minimizing quiescent current. The amplifier has two nonoverlapping switch drivers and a pair of MOSFET power switches for bridge-tie load. The digital Class-D modulator converts the audio input to a PWM signal that drives the switch driver. The modulator bitstream is retimed by a low-jitter 24/48 MHz clock at the input of the nonoverlapping switch drivers, used to prevent large crowbar currents during switching. A large W/L aspect ratio of the power transistor is used to minimize the on-resistance of the devices for improved efficiency. The integrated audio amplifier requires a 3.0V regulated power supply. The required LDO characteristic is shown in Table 11. Table 11. LDO Requirement for the Integrated Audio Amplifier Parameter Condition Minimum Typical Maximum Unit Output voltage – 2.9 – 3.1 V Output load current – – – 200 mA rms Load regulation Vin = 2.9V and load current = 200 mA – – 40 mV Power supply rejection ration (PSRR) – 60 – – dB Output impedance – – – 20 m Output spot noise At 1 kHz – – 1.5 Vrms/ sqrt (Hz) Output noise – – – 50 Vrms 1.20 High-Current I/O The CYW20733 has one high-current I/O pin (GPIO P57) capable of sinking up to 100 mA with a maximum output voltage of 0.4V (VDDIO = 3.0V). For VDDIO = 1.62V, GPIO P57 is limited to sinking up to 60 mA. This pin can be used for LEDs, motors, or other high current devices. This pin can also be used as a GPIO if high current sink capability is not required. An example usage for driving a motor/vibrator is shown in Figure 11. Document No. 002-14859 Rev. *S Page 21 of 67 CYW20733 Figure 11. Motor/Vibrator Circuit D1 VCC MA2S111 U1 CYW20733 MG1 P57 1 1 2 2 Motor C1 10 uF 1.21 Power Management Unit The Power Management Unit (PMU) provides power management features that can be invoked by software through power management registers or packet handling in the baseband core. 1.21.1 RF Power Management The BBC generates power-down control signals for the transmit path, receive path, PLL, and power amplifier to the 2.4 GHz transceiver, which then processes the power-down functions accordingly. 1.21.2 Host Controller Power Management Power is automatically managed by the firmware based on input device activity. As a power-saving task, the firmware controls the disabling of the on-chip regulator when in Deep-sleep mode. 1.21.3 BBC Power Management There are several low-power operations for the BBC: ■ Physical layer packet handling turns RF on and off dynamically within packet TX and RX. ■ Bluetooth-specified low-power connection sniff mode. While in these low-power connection modes, the CYW20733 runs on the Low-Power Oscillator (LPO) and wakes up after a predefined time period. The CYW20733 automatically adjusts its power dissipation based on user activity. The following power modes are supported: ■ Active mode ■ Idle mode ■ Suspend mode ■ Power-down mode ■ HIDOFF mode The CYW20733 transitions to the next lower state after a programmable period of user inactivity. Busy mode is immediately entered when user activity resumes. HIDOFF mode is one of the power modes in which the core is powered down and only supervisory circuits running directly from the battery retain power. Document No. 002-14859 Rev. *S Page 22 of 67 CYW20733 2. Pin Assignments Table 12. Pin Descriptions Pin Number 81-pin FBGA 121-pin FBGA 56-pin QFN Pin Name I/O Power Domain Description Radio I/O D1 E1 9 RFP I/O VDDTF RF antenna port RF Power Supplies B1 C1 6 VDDIF I VDDIF IFPLL power supply E1 F1 11 VDDLNA I VDDLNA RF front-end supply F1 G1 12 VDDRF I VDDRF VCO, LOGEN supply G1 H1 13 VDDPX I VDDPX RFPLL and crystal oscillator supply C1 D1 7 VDDTF I VDDTF PA supply Power Supplies A3, J7 A2, L7 5 VDDC I VDDC Baseband core supply A7 B4, A8, E11 54 VDDO I VDDO I/O pad and core supply J6 L8 28 VDDM I VDDM I/O pad supply – L3 – VDD1P2 I VDD1P2 Speaker differential clock conversion power supply – K10, L10 – VDDSP I VDDSP Speaker analog power supply Ground C2, D2, E2, F2, G2, E3, F3, H3, J3, E4, E5, E6, E7 F8, H7, G7, F7, Center H6, G6, H5, G5, paddle F5, H4, G4, J3, H3, G3, K2, J2, H2, G2, F2, E2, D2 VSS I VSS Ground – K3 – VSS1P2 I – Speaker differential clock conversion ground – J9, J10, J11 – VSSSP I – Speaker analog ground Clock Generator and Crystal Interface J1 K1 16 XTALI I VDDRF Crystal oscillator input. See “Crystal Oscillator” on page 10 for options. J2 L1 15 XTALO O VDDPX Crystal oscillator output. – C2 – TP1 I VDDPX XTAL divide by 2. Connect to GND if main XTAL = 24 MHz. H1 J1 14 RES O VDDPX External calibration resistor, 15 k at 1% B4 A3 – XTALI32K I VDDPX Low-power oscillator (LPO) input. Alternate function: • P39 (FBGA-81 only) D5 B3 – XTALO32K O VDDPX LPO output. Alternate function: • P38 (FBGA-81 only) B2 C3 2 RESET_N I/O PU VDDO Active-low system reset with open-drain output and internal pull-up resistor. G3 B2 1 TMC I VDDO Device test mode control. Connect to GND for all applications. H2 L2 17 TMA I VDDM ARM JTAG debug mode control. Connect to GND for all applications. – L11 – AMPLP O VDDSP Speaker driver positive output – K11 – AMPLN O VDDSP Speaker driver negative output Core Speaker Document No. 002-14859 Rev. *S Page 23 of 67 CYW20733 Table 12. Pin Descriptions (Cont.) Pin Number 81-pin FBGA 121-pin FBGA 56-pin QFN Pin Name I/O Power Domain Description PCM2/I2S G5 J8 24 PCM_SYNC I/O, PD VDDM Frame synchronization for PCM interface. Alternate function: • G4 J7 23 PCM_CLK I/O, PD VDDM Clock for PCM interface. Alternate function: • F4 K7 22 PCM_IN I, PU VDDM K8 25 PCM_OUT O, PD VDDM I2S clock Data input for PCM interface. Alternate function: • F5 I2S word select I2S data input Data output for PCM interface. Alternate function: • I2S data output UART J4 K6 20 UART_RXD I VDDM UART serial input – Serial data input for the HCI UART interface. J5 L6 21 UART_TXD O, PU VDDM UART serial output – Serial data output for the HCI UART interface. H4 L5 19 UART_RTS_N O, PU VDDM Request to send (RTS) for HCI UART interface. Leave unconnected if not used. H5 K5 18 UART_CTS_N I, PU VDDM Clear to send (CTS) for HCI UART interface. Leave unconnected if not used. H6 L9 26 SDA I/O, PU VDDM Data signal for an external I2C device. Alternate function: • SPI_1: MOSI (master only) H7 K9 27 SCL I/O, PU VDDM Clock signal for an external I2C device. Alternate function: • SPI_1: SPI_CLK (master only) BSC LDO Regulator Power Supplies A2 A1 3 LDOIN I LDOIN Battery input supply for the LDO A1 B1 4 LDOOUT O LDOOUT LDO output Document No. 002-14859 Rev. *S Page 24 of 67 CYW20733 Table 13. GPIO Pin Descriptionsa Pin Number 81-pin FBGA 121-pin FBGA Default Di56-pin Pin Name rection QFN POR State Power Domain Alternate Function Description H8 H9 29 P0 Input Floating VDDO • • • • • • • GPIO: P0 Keyboard scan input (row): KSI0 A/D converter input 29 Peripheral UART: puart_tx SPI_2: MOSI (master and slave) IR_RX 60Hz_main J8 G9 31 P1 Input Floating VDDO • • • • • • GPIO: P1 Keyboard scan input (row): KSI1 A/D converter input 28 Peripheral UART: puart_rts SPI_2: MISO (master and slave) IR_TX J9 H10 30 P2 Input Floating VDDO • • • • • GPIO: P2 Keyboard scan input (row): KSI2 Quadrature: QDX0 Peripheral UART: puart_rx SPI_2: SPI_CS (slave only) H9 H11 32 P3 Input Floating VDDO • • • • • GPIO: P3 Keyboard scan input (row): KSI3 Quadrature: QDX1 Peripheral UART: puart_cts SPI_2: SPI_CLK (master and slave) G8 G10 34 P4 Input Floating VDDO • • • • • • GPIO: P4 Keyboard scan input (row): KSI4 Quadrature: QDY0 Peripheral UART: puart_rx SPI_2: MOSI (master and slave) IR_TX G9 F10 33 P5 Input Floating VDDO • • • • • GPIO: P5 Keyboard scan input (row): KSI5 Quadrature: QDY1 Peripheral UART: puart_tx SPI_2: MISO (master and slave) F8 F11 35 P6 Input Floating VDDO • • • • • • GPIO: P6 Keyboard scan input (row): KSI6 Quadrature: QDZ0 Peripheral UART: puart_rts SPI_2: SPI_CS (slave only) 60Hz_main F9 E10 36 P7 Input Floating VDDO • • • • • GPIO: P7 Keyboard scan input (row): KSI7 Quadrature: QDZ1 Peripheral UART: puart_cts SPI_2: SPI_CLK (master and slave) E8 D11 37 P8 Input Floating VDDO • • • • GPIO: P8 Keyboard scan output (column): KSO0 A/D converter input 27 External T/R switch control: ~tx_pd Note: Not available during TMC = 1. Document No. 002-14859 Rev. *S Page 25 of 67 CYW20733 Table 13. GPIO Pin Descriptionsa (Cont.) Pin Number 81-pin FBGA 121-pin FBGA Default Di56-pin Pin Name rection QFN POR State Power Domain Alternate Function Description E9 D10 38 P9 Input Floating VDDO • • • • GPIO: P9 Keyboard scan output (column): KSO1 A/D converter input 26 External T/R switch control: tx_pd D8 E9 39 P10 Input Floating VDDO • • • • GPIO: P10 Keyboard scan output (column): KSO2 A/D converter input 25 External PA ramp control: ~PA_Ramp D9 C11 41 P11 Input Floating VDDO • • • GPIO: P11 Keyboard scan output (column): KSO3 A/D converter input 24 C9 C10 40 P12 Input Floating VDDO • • • GPIO: P12 Keyboard scan output (column): KSO4 A/D converter input 23 C8 B11 43 P13 Input Floating VDDO • • • • • GPIO: P13 Keyboard scan output (column): KSO5 A/D converter input 22 External PA ramp control: ~PA_Ramp Triac control 3 B9 B10 44 P14 Input Floating VDDO • • • • • GPIO: P14 Keyboard scan output (column): KSO6 A/D converter input 21 External T/R switch control: ~tx_pd Triac control 4 A9 A11 42 P15 Input Floating VDDO • • • • • GPIO: P15 Keyboard scan output (column): KSO7 A/D converter input 20 IR_RX 60Hz_main B7 A9 – P16 Input Floating VDDO • • • GPIO: P16 Keyboard scan output (column): KSO8 A/D converter input 19 B8 A10 – P17 Input Floating VDDO • • • GPIO: P17 Keyboard scan output (column): KSO9 A/D converter input 18 C7 B9 – P18 Input Floating VDDO • • • GPIO: P18 Keyboard scan output (column): KSO10 A/D converter input 17 G7 C9 – P19 Input Floating VDDO • • GPIO: P19 Keyboard scan output (column): KSO11 F7 D9 – P20 Input Floating VDDO • • • GPIO: P20 Keyboard scan output (column): KSO12 A/D converter input 15 D7 E8 – P21 Input Floating VDDO • • • • GPIO: P21 Keyboard scan output (column): KSO13 A/D converter input 14 Triac control 3 Document No. 002-14859 Rev. *S Page 26 of 67 CYW20733 Table 13. GPIO Pin Descriptionsa (Cont.) Pin Number 81-pin FBGA 121-pin FBGA Default Di56-pin Pin Name rection QFN POR State Power Domain Alternate Function Description A8 G8 – P22 Input Floating VDDO • • • • GPIO: P22 Keyboard scan output (column): KSO14 A/D converter input 13 Triac control 4 D6 C6 – P23 Input Floating VDDO • • • GPIO: P23 Keyboard scan output (column): KSO15 A/D converter input 12 G6 F9 45 P24 Input Floating VDDO • • • • • GPIO: P24 Keyboard scan output (column): KSO16 SPI_2: SPI_CLK (master and slave) SPI_1: MISO (master only) Peripheral UART: puart_tx F6 D8 46 P25 Input Floating VDDO • • • • GPIO: P25 Keyboard scan output (column): KSO17 SPI_2: MISO (master and slave) Peripheral UART: puart_rx A4 A5 56 P26 PWM0 Input Floating VDDO • GPIO: P26 • Keyboard scan output (column): KSO18 • SPI_2: SPI_CS (slave only) • SPI_1: MISO (master only) • Optical control output: QOC0 • Triac control 1 Current: 16 mA sink B3 B5 55 P27 PWM1 Input Floating VDDO • GPIO: P27 • Keyboard scan output (column): KSO19 • SPI_2: MOSI (master and slave) • Optical control output: QOC1 • Triac control 2 Current: 16 mA sink C3 A4 – P28 PWM2 Input Floating VDDO • GPIO: P28 • Optical control output: QOC2 • A/D converter input 11 • LED1 Current: 16 mA sink D3 C4 – P29 PWM3 Input Floating VDDO • GPIO: P29 • Optical control output: QOC3 • A/D converter input 10 • LED2 Current: 16 mA sink C6 C8 47 P30 Input Floating VDDO • • • • GPIO: P30 A/D converter input 9 Pairing button pin in default FW Peripheral UART: puart_rts B6 B8 – P31 Input Floating VDDO • • • • GPIO: P31 A/D converter input 8 EEPROM WP pin in default FW Peripheral UART: puart_tx Document No. 002-14859 Rev. *S Page 27 of 67 CYW20733 Table 13. GPIO Pin Descriptionsa (Cont.) Pin Number 81-pin FBGA 121-pin FBGA Default Di56-pin Pin Name rection QFN POR State Power Domain Alternate Function Description A6 B7 48 P32 Input Floating VDDO • • • • • • • GPIO: P32 A/D converter input 7 Quadrature: QDX0 SPI_2: SPI_CS (slave only) SPI_1: MISO (master only) Auxiliary clock output: ACLK0 Peripheral UART: puart_tx C4 B6 53 P33 Input Floating VDDO • • • • • • GPIO: P33 A/D converter input 6 Quadrature: QDX1 SPI_2: MOSI (slave only) Auxiliary clock output: ACLK1 Peripheral UART: puart_rx C5 C7 – P34 Input Floating VDDO • • • • • GPIO: P34 A/D converter input 5 Quadrature: QDY0 Peripheral UART: puart_rx External T/R switch control: tx_pd B5 D7 49 P35 Input Floating VDDO • • • • GPIO: P35 A/D converter input 4 Quadrature: QDY1 Peripheral UART: puart_cts A5 A7 50 P36 Input Floating VDDO • • • • • • • GPIO: P36 A/D converter input 3 Quadrature: QDZ0 SPI_2: SPI_CLK (master and slave) Auxiliary Clock Output: ACLK0 Battery detect pin in default FW External T/R switch control: ~tx_pd D4 A6 – P37 Input Floating VDDO • • • • • GPIO: P37 A/D converter input 2 Quadrature: QDZ1 SPI_2: MISO (slave only) Auxiliary clock output: ACLK1 D5 C5 51 P38 Input Floating VDDO • • • • • GPIO: P38 A/D converter input 1 SPI_2: MOSI (master and slave) IR_TX XTALO32K (FBGA-81 only) B4 D4 52 P39 Input Floating VDDO • • • • • • • GPIO: P39 SPI_2: SPI_CS (slave only) SPI_1: MISO (master only) Infrared control: IR_RX External PA ramp control: PA_Ramp 60Hz_main XTALI32K (FBGA-81 only) – H8 – P40 Input Floating VDDO • • GPIO: P40 pcm2_clk Document No. 002-14859 Rev. *S Page 28 of 67 CYW20733 Table 13. GPIO Pin Descriptionsa (Cont.) Pin Number 81-pin FBGA 121-pin FBGA Default Di56-pin Pin Name rection QFN POR State Power Domain Alternate Function Description – K4 – P41 Input Floating VDDO • • GPIO: P41 pcm2_sync – F6 – P42 Input Floating VDDO • • GPIO: P42 pcm2_di – J5 – P43 Input Floating VDDO • • GPIO: P43 pcm2_do – J4 – P44 Input Floating VDDO • GPIO: P44 – J6 – P45 Input Floating VDDO • GPIO: P45 – L4 – P46 Input Floating VDDO • GPIO: P46 – E7 – P47 Input Floating VDDO • GPIO: P47 – E6 – P48 Input Floating VDDO • GPIO: P48 – D6 – P49 Input Floating VDDO • GPIO: P49 – E5 – P50 Input Floating VDDO • GPIO: P50 – D5 – P51 Input Floating VDDO • GPIO: P51 – F4 – P52 Input Floating VDDO • GPIO: P52 – F3 – P53 Input Floating VDDO • GPIO: P53 – E4 – P54 Input Floating VDDO • GPIO: P54 – E3 – P55 Input Floating VDDO • GPIO: P55 – D3 – P56 Input Floating VDDO • GPIO: P56 – G11 – P57 Input Floating VDDO • • GPIO: P57 PWM3 a. During power-on reset, all inputs are disabled. 2.1 Ball Maps This section presents the CYW20733 ball maps. 2.1.1 81-Pin FBGA Ball Map Figure 12 shows the 81-pin FBGA package ball map. Document No. 002-14859 Rev. *S Page 29 of 67 CYW20733 Figure 12. 81-Pin FBGA Ball Map 1 2 3 4 5 6 7 8 9 A LDOOUT LDOIN VDDC P26 PWM0 P36 P32 VDDO P22 P15 A B VDDIF RESET_N P27 PWM1 P39/ XTALI32K P35 P31 P16 P17 P14 B C VDDTF VSS P28 PWM2 P33 P34 P30 P18 P13 P12 C D RFP VSS P29 PWM3 P37 P38/ XTALO32K P23 P21 P10 P11 D E VDDLNA VSS VSS VSS VSS VSS VSS P8 P9 E F VDDRF VSS VSS PCM_IN PCM_ OUT P25 P20 P6 P7 F G VDDPX VSS TMC PCM_ CLK PCM_ SYNC P24 P19 P4 P5 G H RES TMA VSS UART_ RTS_N UART_ CTS_N SDA SCL P0 P3 H J XTALI XTALO VSS UART_ RXD UART_ TXD VDDM VDDC P1 P2 J 1 2 3 4 5 6 7 8 9 Document No. 002-14859 Rev. *S Page 30 of 67 CYW20733 2.1.2 121-Pin FBGA Ball Map Figure 13 shows the 121-pin FBGA package ball map. Figure 13. 121-Pin FBGA Ball Map 1 2 3 4 5 6 7 8 9 10 11 A LDOIN VDDC XTALI32K P28 PWM2 P26 PWM0 P37 P36 VDDO P16 P17 P15 A B LDOOUT TMC XTALO32K VDDO P27 PWM1 P33 P32 P31 P18 P14 P13 B C VDDIF TP1 RESET_N P29 PWM3 P38 P23 P34 P30 P19 P12 P11 C D VDDTF VSS P56 P39 P51 P49 P35 P25 P20 P9 P8 D E RFP VSS P55 P54 P50 P48 P47 P21 P10 P7 VDDO E F VDDLNA VSS P53 P52 VSS P42 VSS VSS P24 P5 P6 F G VDDRF VSS VSS VSS VSS VSS VSS P22 P1 P4 P57 G H VDDPX VSS VSS VSS VSS VSS VSS P40 P0 P2 P3 H J RES VSS VSS P44 P43 P45 PCM_CLK PCM_ SYNC VSSSP VSSSP VSSSP J K XTALI VSS VSS1P2 P41 UART_ CTS_N UART_ RXD PCM_IN PCM_OUT SCL VDDSP AMPLN K L XTALO TMA VDD1P2 P46 UART_ RTS_N UART_ TXD VDDC VDDM SDA VDDSP AMPLP L 1 2 3 4 5 6 7 8 9 10 11 Document No. 002-14859 Rev. *S Page 31 of 67 CYW20733 2.1.3 56-Pin QFN Diagram Figure 14 shows the 56-pin QFN package. VDDO P33 P39 P38 P36 P35 P32 P30 P25 P24 P14 54 53 52 51 50 49 48 47 46 45 44 P13 P27 55 43 P26 56 Figure 14. 56-Pin QFN Diagram NC 8 35 P6 RFP 9 34 P4 NC 10 33 P5 VDDLNA 11 32 P3 VDDRF 12 31 P1 VDDPX 13 30 P2 RES 14 29 P0 28 P7 VDDM 36 27 7 SCL VDDTF 26 P8 SDA 37 25 6 PCM_OUT VDDIF 24 P9 PCM_SYNC 38 23 5 PCM_CLK VDDC 22 P10 PCM_IN 39 21 4 UART_TXD LDOOUT 20 P12 UART_RXD 40 19 3 UART_RTS_N LDOIN 18 P11 UART_CTS_N 41 17 2 TMA RESET_N 16 P15 XTALI 42 15 1 XTALO TMC Document No. 002-14859 Rev. *S Page 32 of 67 CYW20733 3. Specifications 3.1 Electrical Characteristics Table 14 shows the maximum electrical rating for voltages referenced to the VDD pin. Table 14. Maximum Electrical Rating Rating Symbol DC supply voltage for RF domain DC supply voltage for Core domain DC supply voltage for VDDM domain (UART/I2C) DC supply voltage for VDDO domain DC supply voltage for LDOIN DC supply voltage for VDDLNA DC supply voltage for VDDTF Voltage on input or output pin Operating ambient temperature range Storage temperature range Value – – – – – – – – Topr Tstg Unit 1.32 1.4 3.8 3.8 3.8 1.4 3.3 VSS – 0.3 to VDD + 0.3 0 to +70 –40 to +125 V V V V V V V V °C °C Table 15 shows the power supply characteristics for the range TJ = 0 to 125°C. Table 15. Power Supply Minimuma Parameter DC supply voltage for RF DC supply voltage for Core DC supply voltage for VDDM (UART/I2C) DC supply voltage for VDDO DC supply voltage for LDOIN DC supply voltage for VDDLNA DC supply voltage for VDDTF Maximuma Typical 1.14 1.14 1.62 1.62 1.62 1.14 1.14 1.2 1.2 – – – 1.2b 1.2b Unit 1.26 1.26 3.63 3.63 3.63 1.26 3.3 V V V V V V V a. Overall performance degrades beyond minimum and maximum supply voltages. b. 1.2V for Class 2 output with internal VREG. Table 16 shows the digital level characteristics for the LDO (VSS = 0V). Table 16. LDO Regulator Electrical Specifications Parameter Conditions Min Typ Max Unit Input voltage range – 1.62 – 3.63 Default output voltage – – 1.2 – V V Output voltage Range 0.88 – 1.32 V Step size – 40 80 mV Accuracy at any step –5 – +5 % Load current – – – 60 mA Line regulation Vin from 1.62 to 3.63V, Iload = 30 mA –0.5 – 0.5 %VO/V Load regulation Iload from 1 µA to 30 mA, Vin = 3.3V, Bonding R = 0.3 – 0.1 0.15 %VO/mA Quiescent current No load @Vin = 3.3V *Current limit enabled – 6a 12a µA Power-down current Vin = 3.3V, worst@70°C – – 200 nA a. Includes the bandgap quiescent current. Document No. 002-14859 Rev. *S Page 33 of 67 CYW20733 Table 17. ADC Specifications Parameter Symbol Conditions Min Typ Max Unit ADC Characteristics Number of Input channels – – – 28 – – Channel switching rate fch – – – 187 kHz V Input signal range Vinp – 0 – 3.63 Reference settling time – – 7.5 – – s Input resistance Rinp Single-ended, input range of 0–1.2V – 680 – k Single-ended, input range of 0–2.4V – 1.84 – M Single-ended, input range of 0–3.6V – 3 – M Input capacitance Cinp – – – 5 pF Conversion rate fC – 5.859 – 187 kHz Resolution R – – 16 – bits Effective number of bits – In guaranteed performance range – See Table 7 – bits Using on-chip ADC firmware driver – ±2 INL In guaranteed performance range –1 – 1 LSB1 DNL In guaranteed performance range –1 – 1 LSB1 Absolute voltage measurement error Integral nonlinearity1 Differential nonlinearity1 on page 14 % Notes: 1. LSBs are expressed at the 10-bit level. Table 18. Integrated Audio Amplifier Electrical Specifications Parameter Conditions Min Typ Max Unit Analog supply voltage – 2.9 3.0 3.1 V Digital supply voltage – 1.08 1.2 1.32 V Quiescent current Zero digital input – 2 – mA Power down current – – 0.5 – A Output power RL = 8Ω 200 240 – mW Maximum efficiency At 200 mW output power – 70 – % Dynamic range (DR) At –60 dBFs input 65 68 – dB Signal-to-noise plus distortion ratio (SNDR) At 200 mW output power – 40 – dB Table 19. Digital Levela Characteristics Symbol Min Typ Max Unit Input low voltage VIL – – 0.4 V Input high voltage VIH 0.75 × VDDO – – V Input low voltage (VDDO = 1.62V) VIL – – 0.4 V Input high voltage (VDDO = 1.62V) VIH 1.2 – – V V Output low voltage b VOL – – 0.4 Output high voltageb VOH VDDO – 0.4 – – V Input capacitance (VDDMEM domain) CIN – 0.12 – pF a. This table is also applicable to VDDMEM domain. b. At the specified drive current for the pad. Document No. 002-14859 Rev. *S Page 34 of 67 CYW20733 Table 20. Current Consumption, Class 1a Operational Mode Conditions Typ Unit Receive (1 Mbps) Peak current level during reception of a basic-rate packet. 28.2 mA Transmit (1 Mbps) Peak current level during the transmission of a basic-rate packet: GFSK output power = 10 dBm. 63.1 mA Receive (EDR) Peak current level during the reception of a 2 or 3 Mbps rate packet. 28.6 mA Transmit (EDR) Peak current level during the transmission of a 2 or 3 Mbps rate packet: EDR 63.7 output power = 8 dBm. mA DM1/DH1 (RX) Average current during basic rate maximum throughput connection, which includes only this packet type. 24.3 mA DM5/DH5 (RX) Average current during basic rate maximum throughput connection, which includes only this packet type. 26.3 mA 3DH1 (RX) Average current during extended data rate maximum throughput connection 24.9 which includes only this packet type. mA 3DH5 (RX) Average current during extended data rate maximum throughput connection, 26.4 which includes only this packet type. mA DM1/DH1 (TX) Average current during basic rate maximum throughput connection, which includes only this packet type. 29.6 mA DM5/DH5 (TX) Average current during basic rate maximum throughput connection, which includes only this packet type. 47.2 mA 3DH1 (TX) Average current during extended data rate maximum throughput connection, 29.7 which includes only this packet type. mA 3DH5 (TX) Average current during extended data rate maximum throughput connection, 44.8 which includes only this packet type. mA Paging – 23.7 mA Sniff slave (495 ms) Based on one attempt and no timeout parameter. Quality connection that rarely requires more than minimum packet exchange. Sniff master follows the optimal sniff protocol of the CYW20702 master. 290 A Sniff slave (22.5 ms) – 2.57 mA Sniff slave (11.25 ms) – 4.93 mA Average Current a. Current consumption measurements are taken at LDOIN. LDOIN = VDDIO = 2.6V, VDDPA = 3.0V. Document No. 002-14859 Rev. *S Page 35 of 67 CYW20733 Table 21. Current Consumption, Class 2 (0 dBm)a Operational Mode Conditions Typ Unit Receive (1 Mbps) Peak current level during the reception of a basic-rate packet. 29.0 mA Transmit (1 Mbps) Peak current level during the transmission of a basic-rate packet: GFSK output power = 0 dBm. 39.3 mA Receive (EDR) Peak current level during the reception of a 2 or 3 Mbps rate packet. 30.5 mA Transmit (EDR) Peak current level during the transmission of a 2 or 3 Mbps rate packet: EDR 39.3 output power = 0 dBm. mA DM1/DH1 (RX) Average current during basic rate maximum throughput connection, which includes only this packet type. 22.1 mA DM5/DH5 (RX) Average current during basic rate maximum throughput connection, which includes only this packet type. 25.8 mA 3DH1 (RX) Average current during extended data rate maximum throughput connection, 22.8 which includes only this packet type. mA 3DH5 (RX) Average current during extended data rate maximum throughput connection, 24.7 which includes only this packet type. mA DM1/DH1 (TX) Average current during basic rate maximum throughput connection, which includes only this packet type. 22.0 mA DM5/DH5 (TX) Average current during basic rate maximum throughput connection, which includes only this packet type. 30.9 mA 3DH1 (TX) Average current during extended data rate maximum throughput connection, 22.1 which includes only this packet type. mA 3DH5 (TX) Average current during extended data rate maximum throughput connection, 31.6 which includes only this packet type. mA Paging – 22.9 mA Sniff slave (495 ms) Based on one attempt and no timeout parameter. Quality connection that rarely requires more than minimum packet exchange. Sniff master follows optimal sniff protocol of CYW20702 master. 240 A Sniff slave (22.5 ms) – 2.27 mA Sniff slave (11.25 ms) – 4.46 mA Average Current a. Current consumption measurements are taken at LDOIN. LDOIN = VDDIO = 2.6V, VDDPA = 1.2V. Document No. 002-14859 Rev. *S Page 36 of 67 CYW20733 Table 22. Current Consumption Operational Mode Conditions Typ Unit Sleep Internal LPO is in use. 46.5 A HIDOFF – 1.1 A Inquiry scan (1.28 sec.) Periodic scan rate is R1 (1.28 seconds). 540 A Page Scan (R1) Periodic scan rate is R1 (1.28 seconds). 490 A Inquiry Scan + Page Scan (R1) Both inquiry and page scans are interlaced together at a periodic scan rate of 1.28 seconds. 940 A 3.2 RF Specifications Table 23. Receiver RF Specificationsa,b Parameter Conditions Minimum Typical c Maximum Unit General Frequency range – 2402 – 2480 MHz RX sensitivity d GFSK, 0.1% BER, 1 Mbps /4-DQPSK, 0.01% BER, 2 Mbps – –89 –85 dBm – –91 –85 dBm 8-DPSK, 0.01% BER, 3 Mbps – –86 –81 dBm Maximum input GFSK, 1 Mbps /4-DQPSK, 8-DPSK, 2/3 Mbps – – –20 dBm – – –20 dBm C/I cochannel GFSK, 0.1% BER – – 11 dB C/I 1 MHz adjacent channel GFSK, 0.1% BER – – 0 dB C/I 2 MHz adjacent channel GFSK, 0.1% BER – – –30.0 dB C/I > 3 MHz adjacent channel GFSK, 0.1% BER – – –40.0 dB C/I image channel GFSK, 0.1% BER – – –9.0 dB Maximum input Interference Performance C/I 1 MHz adjacent to image channel GFSK, 0.1% BER – – –20.0 dB – – 13 dB C/I 1 MHz adjacent to image channel /4-DQPSK, 0.1% BER /4-DQPSK, 0.1% BER /4-DQPSK, 0.1% BER /4-DQPSK, 0.1% BER /4-DQPSK, 0.1% BER /4-DQPSK, 0.1% BER C/I cochannel 8-DPSK, 0.1% BER C/I 1 MHz adjacent channel 8-DPSK, 0.1% BER – – 5 dB C/I 2 MHz adjacent channel 8-DPSK, 0.1% BER – – –25.0 dB C/I cochannel C/I 1 MHz adjacent channel C/I 2 MHz adjacent channel C/I > 3 MHz adjacent channel C/I image channel – – 0 dB – – –30.0 dB – – –40.0 dB – – –7.0 dB – – –20.0 dB – – 21 dB C/I > 3 MHz adjacent channel 8-DPSK, 0.1% BER – – –33.0 dB C/I image channel 8-DPSK, 0.1% BER – – 0 dB C/I 1 MHz adjacent to image channel 8-DPSK, 0.1% BER – – –13.0 dB Out-of-Band Blocking Performance (CW) e 30–2000 MHz 0.1% BER – –10.0 – dBm 2000–2399 MHz 0.1% BER – –27 – dBm 2498–3000 MHz 0.1% BER – –27 – dBm 3000 MHz–12.75 GHz 0.1% BER – –10.0 – dBm – –39.0 – – dBm Intermodulation Performance f BT, ∆f = 5 MHz Document No. 002-14859 Rev. *S Page 37 of 67 CYW20733 Table 23. Receiver RF Specificationsa,b (Cont.) Parameter Spurious Emissions Conditions Minimum Typical c Maximum Unit g 30 MHz to 1 GHz – – – –57 dBm 1 GHz to 12.75 GHz – – – –47 dBm a. b. c. d. e. f. All specifications are single ended. Unused inputs are left open. All specifications, except typical, are for commercial temperatures. Typical operating conditions are 1.22V operating voltage and 25°C ambient temperature. The receiver sensitivity is measured at a BER of 0.1% on the device interface. Meets this specification using front-end band-pass filter. f0 = –64 dBm Bluetooth-modulated signal, f1 = –39 dBm sine wave, f2 = –39 dBm Bluetooth-modulated signal, f0 = 2f1 – f2, and |f2 – f1| = n × 1 MHz, where n is 3, 4, or 5. For the typical case, n = 5. g. Includes baseband radiated emissions. Table 24. Transmitter RF Specifications a,b Parameter Conditions Minimum Typical Maximum Unit General Frequency range – 2402 – 2480 MHz Class1: GFSK Tx powercd – 6.5 10 – dBm Class1: EDR Tx powerde – 4.5 8 – dBm Class 2: GFSK Tx powerd – –0.5 3 – dBm Power control step – 2 4 6 dB Modulation Accuracy /4-DQPSK frequency stability /4-DQPSK RMS DEVM /4-QPSK peak DEVM /4-DQPSK 99% DEVM – –10 – 10 kHz – – – 20 % – – – 35 % – – – 30 % 8-DPSK frequency stability – –10 – 10 kHz 8-DPSK RMS DEVM – – – 13 % 8-DPSK peak DEVM – – – 25 % 8-DPSK 99% DEVM – – – 20 % +500 kHz – – – –20 dBc 1.0 MHz < |M – N| < 1.5 MHz – – – –26 dBc 1.5 MHz < |M – N| < 2.5 MHz – – – –20 dBm |M – N| > 2.5 MHz – – – –40 dBm 30 MHz to 1 GHz – – – –36.0 f dBm 1 GHz to 12.75 GHz – – – –30.0 f, g dBm 1.8 GHz to 1.9 GHz – – – –47.0 dBm 5.15 GHz to 5.3 GHz – – – –47.0 dBm In-Band Spurious Emissions Out-of-Band Spurious Emissions a. All specifications are for commercial temperatures. b. All specifications are single-ended. Unused inputs are left open. c. +10 dBm output for GFSK measured with VDDTF = 2.9 V. d. Power output is measured at the device without a front-end band-pass filter. e. +8 dBm output for EDR measured with VDDTF = 2.9 V. f. Maximum value is the value required for Bluetooth qualification. g. Meets this specification using a front-end band-pass filter. Document No. 002-14859 Rev. *S Page 38 of 67 CYW20733 3.3 Timing and AC Characteristics In this section, use the numbers listed in the Reference column of each table to interpret the following timing diagrams. 3.3.1 UART Timing Table 25. UART Timing Specifications Reference Characteristics Min Max Unit 1 Delay time, UART_CTS_N low to UART_TXD valid – 24 Baud out cycles 2 Setup time, UART_CTS_N high before midpoint of stop bit – 10 ns 3 Delay time, midpoint of stop bit to UART_RTS_N high – 2 Baud out cycles Figure 15. UART Timing UART_CTS_N UART_TXD 1 2 Midpoint of  STOP bit UART_RXD 3 UART_RTS_N Document No. 002-14859 Rev. *S Page 39 of 67 CYW20733 3.3.2 SPI Timing Figure 16. SPI Timing Diagram 5 CS 6 SCLK Mode 1 SCLK Mode 3 2 1 MSB MOSI LSB 4 3 Invalid bit MISO MSB LSB Table 26. SPI1 Timing Values—SCLK = 12 MHz and VDDM = 1.8Va Reference Characteristics Symbol Typicalb Min Max Unit 1 Output setup time, from MOSI data valid to sample edge of SCLK Tds_mo – 23 – ns 2 Output hold time, from sample edge of SCLK to MOSI data update Tdh_mo – 60 – ns 3 Input setup time, from MISO data valid to sample edge of SCLK Tds_mi – TBD – ns 4 Input hold time, from sample edge of SCLK to MISO data update Tdh_mi – TBD – ns Time from CS assert to first SCLK edge Tsu_cs ½ SCLK period – 1 – – ns Time from first SCLK edge to CS deassert Thd_cs ½ SCLK period – – ns 5c 6 c a. The SCLK period is based on the limitation of Tds_mi. SCLK is designed for a maximum speed of 12 MHz. The speed can be adjusted to as low as 400 Hz by configuring the firmware. b. Typical timing based on 20 pF//1 MΩ load and SCLK = 12 MHz. c. CS timing is firmware controlled. Document No. 002-14859 Rev. *S Page 40 of 67 CYW20733 Table 27. SPI1 Timing Values—SCLK = 12 MHz and VDDM = 3.3Va Reference Characteristics Symbol Typicalb Min Max Unit 1 Output setup time, from MOSI data valid to sample edge of SCLK Tds_mo – 34 – ns 2 Output hold time, from sample edge of SCLK to MOSI data update Tdh_mo – 49 – ns 3 Input setup time, from MISO data valid to sample edge of SCLK Tds_mi – TBD – ns 4 Input hold time, from sample edge of SCLK to MISO data update Tdh_mi – TBD – ns 5c Time from CS assert to first SCLK edge Tsu_cs ½ SCLK period – 1 – – ns 6c Time from first SCLK edge to CS deassert Thd_cs ½ SCLK period – – ns a. The SCLK period is based on the limitation of Tds_mi. SCLK is designed for a maximum speed of 12 MHz. The speed can be adjusted to as low as 400 Hz by configuring the firmware. b. Typical timing based on 20 pF//1 MΩ load and SCLK = 12 MHz. c. CS timing is firmware controlled. Table 28. SPI2 Timing Values—SCLK = 6 MHz and VDDM = 3.3Va Reference Characteristics Symbol Typicalb Min Max Unit 1 Output setup time, from MOSI data valid to sample edge of SCLK Tds_mo – 67 – ns 2 Output hold time, from sample edge of SCLK to MOSI data update Tdh_mo – 99 – ns 3 Input setup time, from MISO data valid to sample edge of SCLK Tds_mi – TBD – ns 4 Input hold time, from sample edge of SCLK to MISO data update Tdh_mi – TBD – ns Time from CS assert to first SCLK edge Tsu_cs ½ SCLK period – 1 – – ns Time from first SCLK edge to CS deassert Thd_cs ½ SCLK period – – ns 5c 6 c a. The SCLK period is based on the limitation of Tds_mi. SCLK is designed for a maximum speed of 6 MHz. The speed can be adjusted to as low as 400 Hz by configuring the firmware. b. Typical timing based on 20 pF//1 MΩ load and SCLK = 6 MHz. c. CS timing is firmware controlled in master mode and can be adjusted as required in slave mode. 3.3.3 BSC Interface Timing The specifications in Table 29 and Table 30 on page 43 reference Figure 17 on page 43. Table 29. BSC Interface Timing Specifications (up to 1 MHz) Reference 1 Characteristics Min Clock frequency Max Unit 100 – 400 800 kHz 1000 2 START condition setup time 3 START condition hold time 280 – ns 4 Clock low time 650 – ns 5 Clock high time 280 – ns 6 Data input hold timea 0 – ns 7 Data input setup time 100 – ns Document No. 002-14859 Rev. *S 650 – ns Page 41 of 67 CYW20733 Table 29. BSC Interface Timing Specifications (up to 1 MHz) Reference Characteristics Min Max Unit 8 STOP condition setup time 280 – ns 9 Output valid from clock – 400 ns 10 Bus free timeb 650 – ns a. As a transmitter, 125 ns of delay is provided to bridge the undefined region of the falling edge of SCL to avoid unintended generation of START or STOP conditions. b. Time that the CBUS must be free before a new transaction can start. Document No. 002-14859 Rev. *S Page 42 of 67 CYW20733 Table 30. BSC Interface Timing Specification (1 MHz through 4 MHz) Reference Characteristics 1 Clock 2 Min frequencya Max Unit 1.000 4.000 MHz START condition setup time 233 – ns 3 START condition hold time 66 – ns 4 Clock low timeb ½ SCL period – ns 5 Clock high timeb ½ SCL period – ns c 6 Data input hold time 0 – ns 7 Data input setup timed 33.4 – ns 8 STOP condition setup time 233 – ns 9 Output valid from clock – 150 ns 10 Bus free timee 650 – ns a. Maximum speed is achieved without clock stretching. Strict timing parameter adherence for modes beyond I2C fast mode may require that the total capacitance of the SDA and SCL traces be very similar so that signal transition times are very similar. b. Programmable by firmware. Use 50% of period for overclocking frequencies greater than 2.400 MHz. Can be asymmetric (65/35 duty) for modest overclocking—up to 2.400 MHz. c. As a transmitter, 125 ns of delay is provided to bridge the undefined region of the falling edge of SCL to avoid unintended generation of START or STOP conditions. d. Depends on the degree of overclocking. Application-specific programmability of the hardware block can affect this parameter. e. Time that CBUS must be free before a new transaction can start. Figure 17. BSC Interface Timing Diagram 1 5 SCL 2 4 8 6 3 7 SDA IN 10 9 SDA OUT 3.3.4 PCM Interface Timing The following is a list of the PCM interface timing diagrams. ■ PCM Electrical Timing Slave — Short Frame Sync ■ PCM Electrical Timing Master—Short Frame Sync ■ PCM Electrical Timing Burst (Slave Rx Only)—Short Frame Sync Document No. 002-14859 Rev. *S Page 43 of 67 CYW20733 ■ PCM Electrical Timing Slave—Long Frame Sync ■ PCM Electrical Timing Master—Long Frame Sync ■ PCM Electrical Timing Burst (Slave Rx Only)—Long Frame Sync Note: The TX and RX timings are combined on the same diagram. The CYW20733 can only either transmit or receive in a given slot. PCM Electrical Timing Slave — Short Frame Sync Figure 18. PCM Electrical Timing Slave—Short Frame Sync Diagram 1 2 3 PCM_BCLK 4 5 PCM_SYNC 9 Bit 15 (Previous Frame) PCM_OUT High impedance Bit 0 6 8 7 PCM_IN Bit 15 (Previous Frame) Bit 0 Table 31. PCM Electrical Timing Slave—Short Frame Sync Characteristics Reference Characteristics Minimum Typical Maximum Unit – – 12 MHz 1 PCM bit clock frequency 2 PCM bit clock low time 41 – – ns 3 PCM bit clock high time 41 – – ns 4 PCM_SYNC setup time 8 – – ns 5 PCM_SYNC hold time 8 – – ns 6 PCM_OUT delay 0 – 25 ns 7 PCM_IN setup 8 – – ns 8 PCM_IN hold 8 – – ns 9 Delay from rising edge of PCM_BCLK during last bit period to PCM_OUT becoming high impedance 0 – 25 ns Document No. 002-14859 Rev. *S Page 44 of 67 CYW20733 PCM Electrical Timing Master—Short Frame Sync Figure 19. PCM Electrical Timing Master—Short Frame Sync Diagram 1 2 3 PCM_BCLK 4 PCM_SYNC 8 PCM_OUT Bit 15 (Previous Frame) High impedance Bit 0 5 6 PCM_IN Bit 15 (Previous Frame) 7 Bit 0 Table 32. Values of PCM Electrical Timing Master—Short Frame Sync Characteristics Reference Minimum Typical Maximum Unit 1 PCM bit clock frequency Characteristics – – 12 MHz 2 PCM bit clock low time 41 – – ns 3 PCM bit clock high time 41 – – ns 4 PCM_SYNC delay 0 – 25 ns 5 PCM_OUT delay 0 – 25 ns 6 PCM_IN setup 8 – – ns 7 PCM_IN hold 8 – – ns 8 Delay from rising edge of PCM_BCLK during last bit period to PCM_OUT becoming high impedance 0 – 25 ns PCM Electrical Timing Burst (Slave Rx Only)—Short Frame Sync Figure 20. PCM Electrical Timing Burst (Slave Rx-Only)—Short Frame Sync Diagram 1 2 3 PCM_BCLK 4 5 PCM_SYNC 6 PCM_IN Bit 15 (previous frame) Document No. 002-14859 Rev. *S 7 Bit 0 Page 45 of 67 CYW20733 Table 33. Values of PCM Electrical Timing Burst (Slave Rx-Only)—Short Frame Sync Characteristics Reference Characteristics Minimum Typical Maximum Unit – – 24 MHz 1 PCM bit clock frequency 2 PCM bit clock low time 20.8 – – ns 3 PCM bit clock high time 20.8 – – ns 4 PCM_SYNC setup time 8 – – ns 5 PCM_SYNC hold time 8 – – ns 6 PCM_IN setup 8 – – ns 7 PCM_IN hold 8 – – ns PCM Electrical Timing Slave—Long Frame Sync Figure 21. PCM Electrical Timing Slave—Long Frame Sync Diagram 1 2 3 PCM_BCLK 4 5 PCM_SYNC 9 PCM_OUT Bit 0 High impedance Bit 1 6 8 7 PCM_IN Bit 1 Bit 0 Table 34. Values of PCM Electrical Timing Slave—Long Frame Sync Characteristics Reference Characteristics Minimum Typical Maximum Unit MHz 1 PCM bit clock frequency – – 12 2 PCM bit clock low time 41 – – ns 3 PCM bit clock high time 41 – – ns 4 PCM_SYNC setup time 8 – – ns 5 PCM_SYNC hold time 8 – – ns 6 PCM_OUT delay 0 – 25 ns 7 PCM_IN setup 8 – – ns 8 PCM_IN hold 8 – – ns 9 Delay from rising edge of PCM_BCLK during last bit period to PCM_OUT becoming high impedance 0 – 25 ns Document No. 002-14859 Rev. *S Page 46 of 67 CYW20733 PCM Electrical Timing Master—Long Frame Sync Figure 22. PCM Electrical Timing Master—Long Frame Sync Diagram 1 2 3 PCM_BCLK 4 PCM_SYNC 8 PCM_OUT Bit 0 Bit 1 Bit 0 Bit 1 High impedance 5 7 6 PCM_IN Table 35. Values of PCM Electrical Timing Master—Long Frame Sync Characteristics Reference Characteristics Minimum Typical Maximum Unit MHz 1 PCM bit clock frequency – – 12 2 PCM bit clock low time 41 – – ns 3 PCM bit clock high time 41 – – ns 4 PCM_SYNC delay 0 – 25 ns 5 PCM_OUT delay 0 – 25 ns 6 PCM_IN setup 8 – – ns 7 PCM_IN hold 8 – – ns 8 Delay from rising edge of PCM_BCLK during last bit period to PCM_OUT becoming high impedance 0 – 25 ns PCM Electrical Timing Burst (Slave Rx Only)—Long Frame Sync Figure 23. PCM Electrical Timing Burst (Slave Rx-Only)—Long Frame Sync Diagram 1 2 3 PCM_BCLK 4 5 PCM_SYNC 6 PCM_IN Bit 0 Document No. 002-14859 Rev. *S 7 Bit 1 Page 47 of 67 CYW20733 Table 36. Values of PCM Electrical Timing Burst (Slave Rx Only)—Long Frame Sync Characteristics Reference Characteristics Minimum Typical Maximum Unit – – 24 MHz 1 PCM bit clock frequency 2 PCM bit clock low time 20.8 – – ns 3 PCM bit clock high time 20.8 – – ns 4 PCM_SYNC setup time 8 – – ns 5 PCM_SYNC hold time 8 – – ns 6 PCM_IN setup 8 – – ns 7 PCM_IN hold 8 – – ns 3.3.5 I2S Timing The following is a list of the I2S timing diagrams. ■ I2S Electrical Timing Slave—Short Frame WS ■ I2S Electrical Timing Master—Short Frame WS ■ I2S Electrical Timing Burst (Slave Rx Only)—Short Frame WS ■ I2S Electrical Timing Slave—Long Frame WS ■ I2S Electrical Timing Master—Long Frame WS I2S Electrical Timing Burst (Slave Rx Only)—Long Frame WS Note: The TX and RX timings are combined on the same diagram. The CYW20733 can only either transmit or receive in a given slot. ■ I2S Electrical Timing Slave—Short Frame WS Figure 24. I2S Electrical Timing Slave — Short Frame WS Diagram 1 2 3 I2S_BCLK 4 I2S_WS I2S_OUT Bit 15 (previous frame) Bit 0 5 7 6 I2S_IN Bit 15 (previous frame) Bit 0 Table 37. Values of I2S Electrical Timing Slave—Short Frame WS Characteristics Reference Characteristics Minimum Typical Maximum Unit MHz 1 I2 S – – 12 2 I2S bit clock low time 41 – – ns 3 I2S bit clock high time 41 – – ns 4 I2S_WS setup time 8 – – ns 5 I2S_OUT delay 0 – 25 ns bit clock frequency Document No. 002-14859 Rev. *S Page 48 of 67 CYW20733 Table 37. Values of I2S Electrical Timing Slave—Short Frame WS Characteristics Reference Minimum Typical Maximum Unit 6 I2S_IN setup Characteristics 8 – – ns 7 I2S_IN hold 8 – – ns I2S Electrical Timing Master—Short Frame WS Figure 25. I2S Electrical Timing Master — Short Frame WS Diagram 1 2 3 I2S_BCLK 4 I2S_WS I2S_OUT Bit 15 (previous frame) Bit 0 5 6 Bit 15 (previous frame) I2S_IN 7 Bit 0 Table 38. Values of I2S Electrical Timing Master—Short Frame WS Characteristics Reference 1 Characteristics I2S bit clock frequency 2 Minimum Typical Maximum Unit – – 12 MHz 2 I S bit clock low time 41 – – ns 3 I2S bit clock high time 41 – – ns 4 I2S_WS delay 0 – 25 ns 5 I2S_OUT delay 0 – 25 ns 6 I2S_IN setup 8 – – ns 7 I2S_IN hold 8 – – ns Document No. 002-14859 Rev. *S Page 49 of 67 CYW20733 I2S Electrical Timing Burst (Slave Rx Only)—Short Frame WS Figure 26. I2S Electrical Timing Burst (Slave Rx Only) — Short Frame WS Diagram 1 2 3 I2S_BCLK 4 I2S_WS 6 5 I2S_IN Bit 15 (previous frame) Bit 0 Table 39. Values of I2S Electrical Timing Burst (Slave Rx-Only)—Short Frame WS Characteristics Reference Characteristics Minimum Typical Maximum Unit 1 I2S bit clock frequency – – 24 MHz 2 I2S bit clock low time 20.8 – – ns 2 3 I S bit clock high time 20.8 – – ns 4 I2S_WS setup time 8 – – ns 5 I2S_IN setup 8 – – ns 6 I2S_IN hold 8 – – ns I2S Electrical Timing Slave—Long Frame WS Figure 27. I2S Electrical Timing Slave — Long Frame WS Diagram 1 2 3 I2S_BCLK 4 I2S_WS I2S_OUT Bit 0 Bit 1 5 6 I2S_IN Bit 0 Document No. 002-14859 Rev. *S 7 Bit 1 Page 50 of 67 CYW20733 Table 40. Values of I2S Electrical Timing Slave—Long Frame WS Characteristics Reference Characteristics Minimum Typical Maximum Unit 1 I2S bit clock frequency 2 I2S bit clock low time 41 – – ns 3 I2S bit clock high time 41 – – ns 4 I2S_WS setup time 8 – – ns 5 I2S_OUT delay 0 – 25 ns 6 I2S_IN setup 8 – – ns 7 I2S_IN hold 8 – – ns – – 12 MHz I2S Electrical Timing Master—Long Frame WS Figure 28. I2S Electrical Timing Master — Long Frame WS Diagram 1 2 3 I2S_BCLK 4 I2S_WS I2S_OUT Bit 0 Bit 1 5 6 Bit 0 I2S_IN 7 Bit 1 Table 41. Values of I2S Electrical Timing Master—Long Frame WS Characteristics Reference Characteristics Minimum Typical Maximum Unit 1 I2 S – – 12 MHz 2 I2S bit clock low time 41 – – ns 3 I2S bit clock high time 41 – – ns 4 I2S_WS delay 0 – 25 ns 5 I2S_OUT delay 0 – 25 ns 6 I2S_IN setup 8 – – ns 7 I2S_IN hold 8 – – ns bit clock frequency Document No. 002-14859 Rev. *S Page 51 of 67 CYW20733 I2S Electrical Timing Burst (Slave Rx Only)—Long Frame WS Figure 29. I2S Electrical Timing Burst (Slave Rx Only) — Long Frame WS Diagram 1 2 3 I2S_BCLK 4 I2S_WS 5 I2S_IN Bit 0 6 Bit 1 Table 42. Values of I2S Electrical Timing Burst (Slave Rx Only)—Long Frame WS Characteristics Reference Characteristics Minimum Typical Maximum Unit 1 I2S bit clock frequency – – 24 MHz 2 I2S bit clock low time 20.8 – – ns 2 3 I S bit clock high time 20.8 – – ns 4 I2S_WS setup time 8 – – ns 5 I2S_IN setup 8 – – ns 6 I2S_IN hold 8 – – ns Document No. 002-14859 Rev. *S Page 52 of 67 CYW20733 4. Mechanical Information Figure 30. 81-Pin FBGA Document No. 002-14859 Rev. *S Page 53 of 67 CYW20733 Figure 31. 121-Pin FBGA Document No. 002-14859 Rev. *S Page 54 of 67 CYW20733 Figure 32. 56-Pin QFN Document No. 002-14859 Rev. *S Page 55 of 67 CYW20733 4.0.1 Tape Reel and Packaging Specifications Table 43. CYW20733 8 × 8 × 1.0 mm FBGA 81-Pin Tape Reel Specifications Quantity per reel 2500 pieces Reel diameter 13 inches Hub diameter 7 inches Tape width 16 mm Tape pitch 12 mm Table 44. CYW20733 9 x 9 x 1.0 mm FBGA 121-Pin Tape Reel Specifications Quantity per reel 1500 pieces Reel diameter 13 inches Hub diameter 4 inches Tape width 16 mm Tape pitch 12 mm Table 45. CYW20733 7 x 7 x 1.0 mm QFN 56-Pin Tape Reel Specifications Quantity per reel 2500 pieces Reel diameter 13 inches Hub diameter 7 inches Tape width 16 mm Tape pitch 12 mm Document No. 002-14859 Rev. *S Page 56 of 67 CYW20733 Figure 33. CYW20733 Reel/Labeling/Packaging Specification Reel Specifications:     0RLVWXUH6HQVLWLYLW\6WLFNHU  (Per MSL Labeling  Specification – P-PDE-1051)              (6':DUQLQJ &\SUHVV%DUFRGH/DEHO (Per Standard Barcode Label Specification – P-PDE-1101)  Device Orientation/Mix Lot Number:  (DFK5HHOPD\FRQWDLQXSWRWKUHHLQGLYLGXDOORWQXPEHUVZLWKLQZRUNZHHNV 7KHVHLQGLYLGXDOORWVPXVWEHODEHOHGRQWKHER[PRLVWXUHEDUULHUEDJDQGUHHO  3LQ7RS/HIW&RUQHU7RSRISDFNDJHWRZDUG6SURFNHW+ROHV  x x x x & Document No. 002-14859 Rev. *S Page 57 of 67 CYW20733 Figure 34. CYW20733 9 × 9 FBGA Package Tray (1 of 2) Document No. 002-14859 Rev. *S Page 58 of 67 CYW20733 Figure 35. CYW20733 9 × 9 FBGA Package Tray (2 of 2) Document No. 002-14859 Rev. *S Page 59 of 67 CYW20733 Figure 36. CYW20733 8 × 8 FBGA Package Tray (1 of 2) Document No. 002-14859 Rev. *S Page 60 of 67 CYW20733 Figure 37. CYW20733 8 × 8 FBGA Package Tray (2 of 2) NOTES: 1. Tray shall conform to JEDEC CS-004 standard on thin matrix trays for MQFP package. 2. Tray surfaces to be free of seams. 3. IQA specification SAC-X042 shall apply. 4. Material: MPPO, 150 degree C (max), Black, Stock Num 215-4004-508, 12X29 Matrix Document No. 002-14859 Rev. *S Page 61 of 67 CYW20733 5. Ordering Information Table 46. Ordering Information Part Number Package Ambient Operating Temperature CYW20733A3KFB1G Commercial 81-pin FBGA 0°C to 70°C CYW20733A3KFB2G Commercial 121-pin FBGA 0°C to 70°C CYW20733A3KML1G Commercial 56-pin QFN 0°C to 70°C 6. IoT Resources Cypress provides a wealth of data at http://www.cypress.com/internet-things-iot to help you to select the right IoT device for your design, and quickly and effectively integrate the device into your design. Cypress provides customer access to a wide range of information, including technical documentation, schematic diagrams, product bill of materials, PCB layout information, and software updates. Customers can acquire technical documentation and software from the Cypress Support Community website (http:// community.cypress.com/). A. Acronyms and Abbreviations The following list of acronyms and abbreviations may appear in this document. For a more complete list of acronyms and other terms used in Cypress documents, go to: http://www.cypress.com/glossary Acronym Description ADC analog-to-digital converter AFH adaptive frequency hopping AHB advanced high-performance bus APB advanced peripheral bus APU audio processing unit ARM7TDMI-S™ Acorn RISC Machine 7 Thumb instruction, Debugger, Multiplier, Ice, Synthesizable BSC Broadcom Serial Control BTC Bluetooth® controller COEX coexistence DFU device firmware update DMA direct memory access EBI external bus interface HCI Host Control Interface HV high voltage IDC initial digital calibration IF intermediate frequency IRQ interrupt request JTAG Joint Test Action Group LCU link control unit LDO low drop-out LHL lean high land LPO low power oscillator LV LogicVision™ MIA multiple interface agent PCM pulse code modulation PLL phase locked loop PMU power management unit Document No. 002-14859 Rev. *S Page 62 of 67 CYW20733 Acronym POR Description power-on reset PWM pulse width modulation QD quadrature decoder RAM random access memory RF radio frequency ROM read-only memory RX/TX receive, transmit SPI serial peripheral interface SW software UART universal asynchronous receiver/transmitter UPI µ-processor interface USB universal serial bus WD watchdog Document No. 002-14859 Rev. *S Page 63 of 67 CYW20733 Document History Document Title: CYW20733 Single-Chip Bluetooth Transceiver Wireless Input Devices Document Number: 002-14859 Revision ECN Orig. of Change ** – – *A *B *C *D – – – – Document No. 002-14859 Rev. *S – – – – Submission Date Description of Change 07/23/2010 20733-DS00-R Initial release 07/20/2010 Updated: Table 10: “Pin Descriptions,” on page 35 and Table 11: “GPIO Pin Descriptions,” on page 38. Figure 13: “81-Pin FBGA Ball Map,” on page 44. Table 16: “Integrated Audio Amplifier Electrical Specifications,” on page 48. Table 25: “PCM Electrical Timing Slave—Short Frame Sync Characteristics,” on page 57. Table 26: “Values of PCM Electrical Timing Master—Short Frame Sync Characteristics,” on page 58. “PCM Interface Timing” on page 57. “I2S Timing” on page 63. 08/30/2010 20733-DS02-R Updated: “Microprocessor Unit” on page 13: ROM memory capacity. “Link Control Layer” on page 15: Bluetooth Link Controller tasks. “UART Interface” on page 17: normal baud rate mode. “GPIO Port” on page 23. “Theory of Operation” on page 25: mouse decoder PWMs. “ADC Port” on page 26: analog input channels. Table 7: “CYW20733 First SPI Set (Master Mode),” on page 28. Table 11: “Pin Descriptions,” on page 35 and Table 12: “GPIO Pin Descriptions,” on page 37. Figure 13: “81-Pin FBGA Ball Map,” on page 44. Added: “Peripheral UART Interface” on page 19. 10/25/2010 20733-DS03-R Updated: “General Description” and “Features” on page 1 TBD for second package changed to 121-pin, 9 mm x 9 mm FBGA, throughout the document. Table 11: “Pin Descriptions,” on page 39 (added 121-pin info) Table 12: “GPIO Pin Descriptions,” on page 41 (added 121-pin info) Figure 14: “121-Pin FBGA Ball Map,” on page 49 (added) Figure 30: “81-Pin FBGA,” on page 73 Figure 31: “121-Pin FBGA,” on page 74 (121-pin outline drawing, added) Table 38: “CYW20733 8 × 8 × 1.0 mm FBGA TBD Tape Reel Specifications,” on page 75 Table 39: “CYW20733M 9 x 9 x 1.0 mm FBGA TBD Tape Reel Specifications,” on page 75 Figure 33: “CYW20733 9×9 FBGA Package Tray (1 of 2),” on page 77 Figure 35: “CYW20733 8×8 FBGA Package Tray (1 of 2),” on page 79 Table 40: “Ordering Information,” on page 81 04/04/2011 20733-DS04-R Updated: Figure 1: “Functional Block Diagram,” on page 2 “UART Interface” on page 19 Table 1: “Common Baud Rate Examples,” on page 20 Table 5: “XTAL Oscillator Characteristics,” on page 25 “Port 0–Port 1, Port 8 – Port 18, Port 20 – Port 23, and Port 28 – Port 38” on page 26 Table 6: “Sampling Rate and Effective Number of Bits,” on page 29 Table 12: “GPIO Pin Descriptions,” on page 40 Table 16: “ADC Specifications,” on page 50 Table 19: “Current Consumption, Class 1,” on page 52 Table 20: “Current Consumption, Class 2 (0 dBm),” on page 53 (added) Table 21: “Receiver RF Specifications” on page 54 Table 22: “Transmitter RF Specifications,” on page 55 Section 5: “Ordering Information,” on page 81 Page 64 of 67 CYW20733 Document Title: CYW20733 Single-Chip Bluetooth Transceiver Wireless Input Devices Document Number: 002-14859 *E – – 06/29/2011 20733-DS05-R Updated: Figure 1: “Functional Block Diagram,” on page 2 “GPIO Port” on page 25 “High Current I/O” on page 34 Table 10: “Pin Descriptions,” on page 36 Figure 13: “121-Pin FBGA Ball Map,” on page 46 Table 15: “ADC Specifications,” on page 48 Table 17: “Current Consumption, Class 1,” on page 49 Table 18: “Current Consumption, Class 2 (0 dBm),” on page 51 Added: Table 19: “Current Consumption,” on page 52Removed: “Integrated Filterless Class-D Audio Amplifier,” on page 35 Table 16: “Integrated Audio Amplifier Electrical Specifications,” on p. 49. *F – – 03/01/2012 20733-DS06-R Updated: Table 7: “CYW20733 First SPI Set (Master Mode),” on page 32 Table 10: “Pin Descriptions,” on page 38 Table 11: “GPIO Pin Descriptions,” on page 41 Table 15: “ADC Specifications,” on page 52 Table 17: “Current Consumption, Class 1,” on page 53 Table 18: “Current Consumption, Class 2 (0 dBm),” on page 55 Notes in Table 20 on page 57 and Table 21 on page 59 Table 23: “Values of SPI1 Timing Characteristics,” on page 61 Table 39: “CYW20733 8 × 8 × 1.0 mm FBGA 81-Pin Tape Reel Specifications,” on page 80 Table 40: “CYW20733 9 x 9 x 1.0 mm FBGA 121-Pin Tape Reel Specifications,” on page 80 Added: Information related to the 56-pin QFN package on page 1 “56-Pin QFN Diagram” on page 50 Table 24: “Values of SPI2 Timing Characteristics,” on page 62 Figure 32: “56-Pin QFN,” on page 79 Table 41: “CYW20733 7 x 7 x 1.0 mm QFN 56-Pin Tape Reel Specifications,” on page 80 Figure 33: “CYW20733 Reel/Labeling/Packaging Specification,” on page 81 *G – – 03/19/2012 20733-DS07-R Updated: Notes in Table 23: “Values of SPI1 Timing Characteristics,” on page 65 and Table 24: “Values of SPI2 Timing Characteristics,” on page 66 *H – – 05/18/2012 20733-DS08-R Updated: Table 8: “CYW20733 Second SPI Set (Master Mode),” on page 33. Table 9: “CYW20733 Second SPI Set (Slave Mode),” on page 34. *I – – 06/08/2012 20733-DS09-R Updated: Bluetooth HID profile version 1.0 to 1.1 on the cover page. “Calibration” on page 15. “Triac Control” on page 38. “Cypress Proprietary Control Signalling and Triggered Broadcom Fast Connect” on page 38. Table 15: “ADC Specifications,” on page 56 by fixing the Conditions for the Reference settling time and Input resistance parameters. Table 20: “Receiver RF Specifications” on page 59 by updating Df to uf in the intermodulation performance row. “SPI Timing” on page 63. *J – – 08/30/2012 20733-DS10-R Updated: Table 43: “Ordering Information,” on page 89. 10/01/2012 20733-DS11-R Updated: Cover page features to include Class-D audio amplifier. Figure 1: “Functional Block Diagram,” on page 2 by adding Class-D audio driver. Table 11: “Pin Descriptions,” on page 43. Figure 14: “56-Pin QFN Diagram,” on page 55. Added: “Integrated Filterless Class-D Audio Amplifier” on page 40. Table 17: “Integrated Audio Amplifier Electrical Specifications,” on page 58 *K – Document No. 002-14859 Rev. *S – Page 65 of 67 CYW20733 Document Title: CYW20733 Single-Chip Bluetooth Transceiver Wireless Input Devices Document Number: 002-14859 *L – – 11/26/2012 20733-DS12-R Updated: Table 17: “Integrated Audio Amplifier Electrical Specifications,” on page 58. Table 21: “Current Consumption,” on page 61. *M – – 01/21/2013 20733-DS13-R Updated: Table 12: “GPIO Pin Descriptions,” on page 46. *N – – 05/31/2013 20733-DS14-R Updated: Table 45: “Ordering Information,” on page 91. *O – – 08/12/2013 20733-DS15-R Updated: Table 21: “Current Consumption,” on page 62. *P – – 09/25/2013 20733-DS16-R Updated: Table 4: “Reference Crystal Electrical Specifications,” on page 26. *Q – – 07/10/2015 20733-DS17-R Updated document status. *R 5487130 UTSV 10/21/2016 Updated to Cypress Template Added Cypress part numbering scheme *S 5962319 AESATMP9 11/09/2017 Document No. 002-14859 Rev. *S Updated logo and copyright. Page 66 of 67 CYW20733 Sales, Solutions, and Legal Information Worldwide Sales and Design Support Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office closest to you, visit us at Cypress Locations. PSoC® Solutions Products ® ® ARM Cortex Microcontrollers Automotive Clocks & Buffers Interface Internet of Things Memory cypress.com/arm cypress.com/automotive cypress.com/clocks cypress.com/interface cypress.com/iot cypress.com/memory Microcontrollers cypress.com/mcu PSoC cypress.com/psoc Power Management ICs cypress.com/pmic Touch Sensing USB Controllers Wireless Connectivity PSoC 1 | PSoC 3 | PSoC 4 | PSoC 5LP | PSoC 6 Cypress Developer Community Forums | WICED IoT Forums | Projects | Video | Blogs | Training | Components Technical Support cypress.com/support cypress.com/touch cypress.com/usb cypress.com/wireless 67 © Cypress Semiconductor Corporation, 2010-2017. This document is the property of Cypress Semiconductor Corporation and its subsidiaries, including Spansion LLC (“Cypress”). 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Cypress products are not designed, intended, or authorized for use as critical components in systems designed or intended for the operation of weapons, weapons systems, nuclear installations, life-support devices or systems, other medical devices or systems (including resuscitation equipment and surgical implants), pollution control or hazardous substances management, or other uses where the failure of the device or system could cause personal injury, death, or property damage (“Unintended Uses”). A critical component is any component of a device or system whose failure to perform can be reasonably expected to cause the failure of the device or system, or to affect its safety or effectiveness. Cypress is not liable, in whole or in part, and you shall and hereby do release Cypress from any claim, damage, or other liability arising from or related to all Unintended Uses of Cypress products. You shall indemnify and hold Cypress harmless from and against all claims, costs, damages, and other liabilities, including claims for personal injury or death, arising from or related to any Unintended Uses of Cypress products. Cypress, the Cypress logo, Spansion, the Spansion logo, and combinations thereof, WICED, PSoC, CapSense, EZ-USB, F-RAM, and Traveo are trademarks or registered trademarks of Cypress in the United States and other countries. For a more complete list of Cypress trademarks, visit cypress.com. Other names and brands may be claimed as property of their respective owners. Document No. 002-14859 Rev. *S Revised November 9, 2017 Page 67 of 67