BFR193L3E6327XTMA1

BFR193L3 NPN Bipolar RF Transistor • For low noise, high-gain amplifiers up to 2 GHz • For linear broadband amplifiers 3 • fT = 8 GHz, NFmin = 1 dB at 900 MHz 1 2 • Pb-free (RoHS compliant) package • Qualification report according to AEC-Q101 available ESD (Electrostatic discharge) sensitive device, observe handling precaution! Type BFR193L3 Marking RC Pin Configuration 1=B 2=E 3=C Package TSLP-3-1 Maximum Ratings at TA = 25 °C, unless otherwise specified Parameter Symbol Value Unit Collector-emitter voltage VCEO 12 Collector-emitter voltage VCES 20 Collector-base voltage VCBO 20 Emitter-base voltage VEBO 2 Collector current IC 80 Base current IB 10 Total power dissipation1) Ptot 580 mW Junction temperature TJ 150 °C Storage temperature TStg V mA TS ≤ 89°C -55 ... 150 Thermal Resistance Parameter Symbol Junction - soldering point2) RthJS 1T Value Unit 105 K/W S is measured on the collector lead at the soldering point to the pcb calculation of RthJA please refer to Application Note AN077 (Thermal Resistance Calculation) 2For 1 2012-08-08 BFR193L3 Electrical Characteristics at T A = 25°C, unless otherwise specified Symbol Parameter Values Unit min. typ. max. 12 - - V ICES - - 100 µA ICBO - - 100 nA IEBO - - 1 µA hFE 70 100 140 DC Characteristics Collector-emitter breakdown voltage V(BR)CEO IC = 1 mA, I B = 0 Collector-emitter cutoff current VCE = 20 V, VBE = 0 Collector-base cutoff current VCB = 10 V, IE = 0 Emitter-base cutoff current VEB = 1 V, IC = 0 DC current gain - IC = 30 mA, VCE = 8 V, pulse measured 2 2012-08-08 BFR193L3 Electrical Characteristics at TA = 25°C, unless otherwise specified Symbol Values Parameter Unit min. typ. max. fT 6 8 - Ccb - 0.63 0.9 Cce - 0.22 - Ceb - 2.25 - AC Characteristics (verified by random sampling) Transition frequency GHz IC = 50 mA, VCE = 8 V, f = 500 MHz Collector-base capacitance pF VCB = 10 V, f = 1 MHz, VBE = 0 , emitter grounded Collector emitter capacitance VCE = 10 V, f = 1 MHz, VBE = 0 , base grounded Emitter-base capacitance VEB = 0.5 V, f = 1 MHz, VCB = 0 , collector grounded Minimum noise figure dB NFmin IC = 10 mA, VCE = 8 V, ZS = ZSopt , f = 900 MHz - 1 - - 1.6 - - 19 - - 12.5 - IC = 10 mA, VCE = 8 V, ZS = ZSopt , f = 1.8 GHz Power gain, maximum available1) Gma IC = 30 mA, VCE = 8 V, ZS = ZSopt , ZL = ZLopt , f = 900 MHz IC = 30 mA, VCE = 8 V, ZS = ZSopt , ZL = ZLopt , f = 1.8 GHz |S21e|2 Transducer gain dB IC = 30 mA, VCE = 8 V, ZS = ZL = 50Ω , f = 900 MHz - 14.5 - IC = 30 mA, VCE = 8 V, ZS = ZL = 50Ω , f = 1.8 GHz - 9 - 1/2 ma = |S21 / S12| (k-(k²-1) ) 1G 3 2012-08-08 BFR193L3 Total power dissipation P tot = ƒ(TS) 700 mW Ptot 500 400 300 200 100 0 0 15 30 45 60 75 90 105 120 °C 150 TS 4 2012-08-08 Package TSLP-3-1 BFR193L3 Package Outline Bottom view 0.4 +0.1 0.6 ±0.05 0.5 ±0.035 2 1 ±0.05 3 0.65 ±0.05 3 1) 2 1 1) 0.05 MAX. 0.35 ±0.05 Pin 1 marking 2 x 0.15 ±0.035 2 x 0.25 ±0.035 1 0.25 ±0.035 1) Top view 1) 1) Dimension applies to plated terminal Foot Print R0.1 0.2 0.225 0.2 0.225 0.315 0.35 1 0.3 0.945 0.35 0.45 0.275 0.6 0.355 For board assembly information please refer to Infineon website "Packages" 0.17 0.15 Copper Solder mask Stencil apertures Marking Layout (Example) BFR193L3 Type code Pin 1 marking Laser marking Standard Packing Reel ø180 mm = 15.000 Pieces/Reel 0.5 1.16 Pin 1 marking 8 4 0.76 5 2012-08-08 BFR193L3 Edition 2009-11-16 Published by Infineon Technologies AG 81726 Munich, Germany  2009 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 6 2012-08-08