BGB741L7ESD
Pre-matched general purpose LNA MMIC for 50 MHz- 3.5 GHz applications
Product description
The BGB741L7ESD is a high performance broadband low noise amplifier (LNA) MMIC
based on Infineon’s silicon germanium carbon (SiGe:C) bipolar technology.
Feature list
•
•
•
•
Minimum noise figure NFmin = 1.05 dB at 2.4 GHz, 3 V, 10 mA
Supply voltage range VCC = 1.8 to 4.0 V at TA = 25 °C
High RF input power robustness of 20 dBm
Integrated ESD protection: 2 kV HBM at all pins
Product validation
Qualified for industrial applications according to the relevant tests of JEDEC47/20/22.
Potential applications
•
•
•
Satellite navigation systems (e.g. GPS, GLONASS, BeiDou, Galileo)
Wireless communications: WLAN 2.4 GHz and 5-6 GHz bands, broadband LTE or WiMAX LNA
ISM applications like RKE and smart meter, as well as for emerging wireless applications such as DVBTerrestrial
Device information
Table 1
Part information
Product name /
Ordering code
Package Pin configuration
BGB741L7ESD /
BGB741L7ESDE6327XTSA1
TSLP-7-1 1 = VCC
5 = VCtrl
2 = VBias
Marking Pieces /
Reel
3 = RFin
4 = RFout
AY
7500
6 = Current 7 = Ground
adjust
Attention: ESD (Electrostatic discharge) sensitive device, observe handling precautions
Datasheet
www.infineon.com
Please read the Important Notice and Warnings at the end of this document
v3.1
2021-07-14
BGB741L7ESD
Internally matched general purpose LNA MMIC for 50 MHz- 3.5 GHz applications
Functional block diagram
Functional block diagram
This functional block diagram explains how the BGB707L7ESD is used. The RF power on/off function is
controlled by applying VCtrl. By using an external resistor Rext, the pre-set current of 5.5 mA (when Rext is
omitted) can be increased. Base VB and collector VC voltages are applied to the respective pins RFin and RFout by
external inductors LB and LC.
DC,
VCC
Rext
1
VCC
2
internal
Biasing
3
Cin
LC
Out
4
RF-Out
GND
7
4
Current Adjust
On/Off
RF-In
5
5
LB Bias-Out
In
6
6
Cout
7
DC,
V ctrl
1
2
3
(on package backside)
BGB7XXL7ESD functional block
Figure 1
Datasheet
Functional block diagram
2
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2021-07-14
BGB741L7ESD
Internally matched general purpose LNA MMIC for 50 MHz- 3.5 GHz applications
Table of contents
Table of contents
Product description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Feature list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Product validation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Potential applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Device information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Functional block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Table of contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1
Operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
3
Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
4
4.1
4.2
4.3
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
DC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Characteristic DC diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5
Package information TSLP-7-1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Disclaimer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Datasheet
3
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BGB741L7ESD
Internally matched general purpose LNA MMIC for 50 MHz- 3.5 GHz applications
Operating conditions
1
Operating conditions
Table 2
Operation conditions at TA = 25 °C
Parameter
Symbol
Values
Min.
Typ.
Note or test
condition
V
–
Max.
Supply voltage
VCC
1.8
3
4
Control voltage in on-mode
VCtrl-on
1.2
–
VCC
Control voltage in off-mode
VCtrl-off
-0.3
Datasheet
Unit
0.3
4
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BGB741L7ESD
Internally matched general purpose LNA MMIC for 50 MHz- 3.5 GHz applications
Absolute maximum ratings
2
Absolute maximum ratings
Table 3
Absolute maximum ratings at TA = 25 °C (unless otherwise specified)
Parameter
Symbol
Values
Unit
Note or test condition
4
3.5
V
TA = 25 °C
TA = -55 °C
mA
–
Min.
–
Max.
Supply voltage
VCC
Supply current
ICC
30
DC current at RFin
IB
3
Control voltage
VCtrl
VCC
V
ESD stress pulse (HBM)
VESD
+/- 2
kV
RF input power
PRFin
20
dBm
Total power dissipation1)
Ptot
120
mW
TS ≤ 117 °C
Junction temperature
TJ
150
°C
–
Storage temperature
TStg
-55
Attention: Stresses above the max. values listed here may cause permanent damage to the device.
Exposure to absolute maximum rating conditions for extended periods may affect device
reliability. Exceeding only one of these values may cause irreversible damage to the integrated
circuit.
1
TS is the soldering point temperature. TS is measured on the emitter lead at the soldering point of the PCB
Datasheet
5
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BGB741L7ESD
Internally matched general purpose LNA MMIC for 50 MHz- 3.5 GHz applications
Thermal characteristics
3
Thermal characteristics
Table 4
Thermal resistance
Parameter
Symbol
Values
Min.
Junction - soldering point
RthJS
Typ.
–
275
Unit
Note or test condition
K/W
–
Max.
–
140
120
Ptot [mW]
100
80
60
40
20
0
0
50
100
150
Ts [°C]
Figure 2
Datasheet
Total power dissipation Ptot = f(TS)
6
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BGB741L7ESD
Internally matched general purpose LNA MMIC for 50 MHz- 3.5 GHz applications
Electrical characteristics
4
Electrical characteristics
4.1
DC characteristics
Table 5
DC characteristics at VCC = 3 V, TA = 25 °C
Parameter
Symbol
Values
Min.
Supply current in on-mode
ICC-on
Supply current in off-mode
ICC-off
Control current in on-mode
Control current in off-mode
Datasheet
Typ.
Unit
Note or test
condition
mA
VCtrl = 3 V
Rext = open
Rext = 30 kΩ
Rext = 3 kΩ
μA
VCtrl = 0 V
Max.
5.0
–
–
5.5
6
10
6.5
–
–
–
–
6
ICtrl-on
14
20
VCtrl = 3 V
ICtrl-off
–
0.1
VCtrl = 0 V
7
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BGB741L7ESD
Internally matched general purpose LNA MMIC for 50 MHz- 3.5 GHz applications
Electrical characteristics
4.2
Characteristic DC diagrams
The measurement setup is an application circuit according to Figure 1 on page 2, using the integrated biasing.
TA = 25 °C (unless otherwise specified).
Figure 3
Supply current vs external resistance ICC = f(Rext), VCtrl = 3 V, VCC = parameter
Figure 4
Supply current vs supply voltage ICC = f(VCC), VCtrl = 3 V, Rext = parameter
Datasheet
8
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BGB741L7ESD
Internally matched general purpose LNA MMIC for 50 MHz- 3.5 GHz applications
Electrical characteristics
Figure 5
Supply current vs control voltage ICC = f(VCtrl), VCC = 3 V, Rext = parameter
Figure 6
Supply current vs temperature ICC = f(TA), VCtrl = VCC = 3 V, Rext = open
Datasheet
9
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BGB741L7ESD
Internally matched general purpose LNA MMIC for 50 MHz- 3.5 GHz applications
Electrical characteristics
4.3
AC characteristics
The measurement setup is a test fixture with Bias-T’s in a 50 Ω system, TA = 25 °C.
Top View
VB
1
VCC
2
BiasOut
GND
Current
Adjust
6
On/Off
Control
5
Bias-T
In
VC
Bias-T
3
RF-In
RF-Out
4
Out
7
Figure 7
Datasheet
Testing setup
10
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BGB741L7ESD
Internally matched general purpose LNA MMIC for 50 MHz- 3.5 GHz applications
Electrical characteristics
Table 6
AC characteristics, VC = 3 V, f = 150 MHz
Parameter
Symbol
Values
Min.
Typ.
Unit
Note or test condition
dB
IC = 6 mA
IC = 10 mA
ZS = ZS,opt
Max.
Minimum noise figure 2)
NFmin
Noise figure in 50 Ω system 3)
NF50
1.1
1.05
IC = 6 mA
IC = 10 mA
ZS = ZL = 50 Ω
Transducer gain
|S21|²
19
21
IC = 6 mA
IC = 10 mA
Maximum stable power gain
Gms
20
21.5
IC = 6 mA
IC = 10 mA
Input 1 dB gain compression point
IP1dB
-5.5
-8
Input 3rd order intercept point
IIP3
5.5
3.5
Input return loss
RLin
14
18
Output return loss
RLout
12.5
18.5
2
3
–
1.05
0.95
–
dBm
ICq = 6 mA
ICq = 10 mA
IC = 6 mA
IC = 10 mA
dB
IC = 6 mA
IC = 10 mA
IC = 6 mA
IC = 10 mA
Test fixture losses are extracted
Parameter measured on an application board according to Figure 1 on page 2 presenting a 50 Ω system to
the device. ICq is the quiescent current, that is at small RF input power level. IC increases as RF input power
level approaches IP1dB.
Datasheet
11
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2021-07-14
BGB741L7ESD
Internally matched general purpose LNA MMIC for 50 MHz- 3.5 GHz applications
Electrical characteristics
Table 7
AC characteristics, VC = 3 V, f = 450 MHz
Parameter
Symbol
Values
Min.
Typ.
Unit
Note or test condition
dB
IC = 6 mA
IC = 10 mA
ZS = ZS,opt
Max.
Minimum noise figure 2)
NFmin
Noise figure in 50 Ω system 3)
NF50
1.1
1.05
IC = 6 mA
IC = 10 mA
ZS = ZL = 50 Ω
Transducer gain
|S21|²
18.5
20.5
IC = 6 mA
IC = 10 mA
Maximum available power gain
Gma
19
20.5
IC = 6 mA
IC = 10 mA
Input 1 dB gain compression point
IP1dB
-5
-7.5
Input 3rd order intercept point
IIP3
4
2.5
Input return loss
RLin
15.5
21
Output return loss
RLout
14.5
28
2
3
–
1.05
0.95
–
dBm
ICq = 6 mA
ICq = 10 mA
IC = 6 mA
IC = 10 mA
dB
IC = 6 mA
IC = 10 mA
IC = 6 mA
IC = 10 mA
Test fixture losses are extracted
Parameter measured on an application board according to Figure 1 on page 2 presenting a 50 Ω system to
the device. ICq is the quiescent current, that is at small RF input power level. IC increases as RF input power
level approaches IP1dB.
Datasheet
12
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BGB741L7ESD
Internally matched general purpose LNA MMIC for 50 MHz- 3.5 GHz applications
Electrical characteristics
Table 8
AC characteristics, VC = 3 V, f = 900 MHz
Parameter
Symbol
Values
Min.
Typ.
Unit
Note or test condition
dB
IC = 6 mA
IC = 10 mA
ZS = ZS,opt
Max.
Minimum noise figure 2)
NFmin
Noise figure in 50 Ω system 3)
NF50
1.1
1.05
IC = 6 mA
IC = 10 mA
ZS = ZL = 50 Ω
Transducer gain
|S21|²
18.5
20
IC = 6 mA
IC = 10 mA
Maximum available power gain
Gma
19
20.5
IC = 6 mA
IC = 10 mA
Input 1 dB gain compression point
IP1dB
-5
-7
Input 3rd order intercept point
IIP3
3
1.5
Input return loss
RLin
15.5
19
Output return loss
RLout
14.5
28.5
2
3
–
1.05
0.95
–
dBm
ICq = 6 mA
ICq = 10 mA
IC = 6 mA
IC = 10 mA
dB
IC = 6 mA
IC = 10 mA
IC = 6 mA
IC = 10 mA
Test fixture losses are extracted
Parameter measured on an application board according to Figure 1 on page 2 presenting a 50 Ω system to
the device. ICq is the quiescent current, that is at small RF input power level. IC increases as RF input power
level approaches IP1dB.
Datasheet
13
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BGB741L7ESD
Internally matched general purpose LNA MMIC for 50 MHz- 3.5 GHz applications
Electrical characteristics
Table 9
AC characteristics, VC = 3 V, f = 1.5 GHz
Parameter
Symbol
Values
Min.
Typ.
Unit
Note or test condition
dB
IC = 6 mA
IC = 10 mA
ZS = ZS,opt
Max.
Minimum noise figure 2)
NFmin
Noise figure in 50 Ω system 3)
NF50
1.1
1.05
IC = 6 mA
IC = 10 mA
ZS = ZL = 50 Ω
Transducer gain
|S21|²
18
19.5
IC = 6 mA
IC = 10 mA
Maximum available power gain
Gma
18.5
20
IC = 6 mA
IC = 10 mA
Input 1 dB gain compression point
IP1dB
-4.5
-6.5
Input 3rd order intercept point
IIP3
2.5
1
Input return loss
RLin
14.5
16
Output return loss
RLout
14
23
2
3
–
1.05
1.0
–
dBm
ICq = 6 mA
ICq = 10 mA
IC = 6 mA
IC = 10 mA
dB
IC = 6 mA
IC = 10 mA
IC = 6 mA
IC = 10 mA
Test fixture losses are extracted
Parameter measured on an application board according to Figure 1 on page 2 presenting a 50 Ω system to
the device. ICq is the quiescent current, that is at small RF input power level. IC increases as RF input power
level approaches IP1dB.
Datasheet
14
v3.1
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BGB741L7ESD
Internally matched general purpose LNA MMIC for 50 MHz- 3.5 GHz applications
Electrical characteristics
Table 10
AC characteristics, VC = 3 V, f = 1.9 GHz
Parameter
Symbol
Values
Min.
Typ.
Unit
Note or test condition
dB
IC = 6 mA
IC = 10 mA
ZS = ZS,opt
Max.
Minimum noise figure 2)
NFmin
Noise figure in 50 Ω system 3)
NF50
1.15
1.1
IC = 6 mA
IC = 10 mA
ZS = ZL = 50 Ω
Transducer gain
|S21|²
17.5
19
IC = 6 mA
IC = 10 mA
Maximum available power gain
Gma
18
19.5
IC = 6 mA
IC = 10 mA
Input 1 dB gain compression point
IP1dB
-4
-6
Input 3rd order intercept point
IIP3
2.5
1
Input return loss
RLin
13.5
15
Output return loss
RLout
13.5
21
2
3
–
1.05
1.05
–
dBm
ICq = 6 mA
ICq = 10 mA
IC = 6 mA
IC = 10 mA
dB
IC = 6 mA
IC = 10 mA
IC = 6 mA
IC = 10 mA
Test fixture losses are extracted
Parameter measured on an application board according to Figure 1 on page 2 presenting a 50 Ω system to
the device. ICq is the quiescent current, that is at small RF input power level. IC increases as RF input power
level approaches IP1dB.
Datasheet
15
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BGB741L7ESD
Internally matched general purpose LNA MMIC for 50 MHz- 3.5 GHz applications
Electrical characteristics
Table 11
AC characteristics, VC = 3 V, f = 2.4 GHz
Parameter
Symbol
Values
Min.
Typ.
Unit
Note or test condition
dB
IC = 6 mA
IC = 10 mA
ZS = ZS,opt
Max.
Minimum noise figure 2)
NFmin
Noise figure in 50 Ω system 3)
NF50
1.15
1.1
IC = 6 mA
IC = 10 mA
ZS = ZL = 50 Ω
Transducer gain
|S21|²
17
18.5
IC = 6 mA
IC = 10 mA
Maximum available power gain
Gma
17.5
19
IC = 6 mA
IC = 10 mA
Input 1 dB gain compression point
IP1dB
-3.5
-5.5
Input 3rd order intercept point
IIP3
3
1
Input return loss
RLin
12.5
13.5
Output return loss
RLout
12.5
18
2
3
–
1.1
1.05
–
dBm
ICq = 6 mA
ICq = 10 mA
IC = 6 mA
IC = 10 mA
dB
IC = 6 mA
IC = 10 mA
IC = 6 mA
IC = 10 mA
Test fixture losses are extracted
Parameter measured on an application board according to Figure 1 on page 2 presenting a 50 Ω system to
the device. ICq is the quiescent current, that is at small RF input power level. IC increases as RF input power
level approaches IP1dB.
Datasheet
16
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BGB741L7ESD
Internally matched general purpose LNA MMIC for 50 MHz- 3.5 GHz applications
Electrical characteristics
Table 12
AC characteristics, VC = 3 V, f = 3.5 GHz
Parameter
Symbol
Values
Min.
Typ.
Unit
Note or test condition
dB
IC = 6 mA
IC = 10 mA
ZS = ZS,opt
Max.
Minimum noise figure 2)
NFmin
Noise figure in 50 Ω system 3)
NF50
1.35
1.25
IC = 6 mA
IC = 10 mA
ZS = ZL = 50 Ω
Transducer gain
|S21|²
15
16.5
IC = 6 mA
IC = 10 mA
Maximum available power gain
Gma
16
17.5
IC = 6 mA
IC = 10 mA
Input 1 dB gain compression point
IP1dB
-2.5
-4.5
Input 3rd order intercept point
IIP3
3.5
1.5
Input return loss
RLin
10
10.5
Output return loss
RLout
10
13.5
2
3
–
1.25
1.2
–
dBm
ICq = 6 mA
ICq = 10 mA
IC = 6 mA
IC = 10 mA
dB
IC = 6 mA
IC = 10 mA
IC = 6 mA
IC = 10 mA
Test fixture losses are extracted
Parameter measured on an application board according to Figure 1 on page 2 presenting a 50 Ω system to
the device. ICq is the quiescent current, that is at small RF input power level. IC increases as RF input power
level approaches IP1dB.
Datasheet
17
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BGB741L7ESD
Internally matched general purpose LNA MMIC for 50 MHz- 3.5 GHz applications
Electrical characteristics
Table 13
AC characteristics, VC = 3 V, f = 5.5 GHz
Parameter
Symbol
Values
Min.
Typ.
Unit
Note or test condition
dB
IC = 6 mA
IC = 10 mA
ZS = ZS,opt
Max.
Minimum noise figure 2)
NFmin
Noise figure in 50 Ω system 3)
NF50
1.95
1.85
IC = 6 mA
IC = 10 mA
ZS = ZL = 50 Ω
Transducer gain
|S21|²
12
13
IC = 6 mA
IC = 10 mA
Maximum available power gain
Gma
14
15
IC = 6 mA
IC = 10 mA
Input 1 dB gain compression point
IP1dB
-1
-3
Input 3rd order intercept point
IIP3
8.5
4
Input return loss
RLin
7
8
Output return loss
RLout
7
8.5
2
3
–
1.8
1.75
–
dBm
ICq = 6 mA
ICq = 10 mA
IC = 6 mA
IC = 10 mA
dB
IC = 6 mA
IC = 10 mA
IC = 6 mA
IC = 10 mA
Test fixture losses are extracted
Parameter measured on an application board according to Figure 1 on page 2 presenting a 50 Ω system to
the device. ICq is the quiescent current, that is at small RF input power level. IC increases as RF input power
level approaches IP1dB.
Datasheet
18
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BGB741L7ESD
Internally matched general purpose LNA MMIC for 50 MHz- 3.5 GHz applications
Package information TSLP-7-1
5
Package information TSLP-7-1
Figure 8
TSLP-7-1 package
Note:
For package information including footprint, packing and assembly recommendation refer to:
https://www.infineon.com/cms/en/product/packages/PG-TSLP/PG-TSLP-7-1
Datasheet
19
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BGB741L7ESD
Internally matched general purpose LNA MMIC for 50 MHz- 3.5 GHz applications
Revision history
Revision history
Document
version
Date of
release
Description of changes
3.0
2018-09-26
New datasheet layout.
3.1
2021-07-14
Package outline marking corrected, link to Infineon package website added
Datasheet
20
v3.1
2021-07-14
Trademarks
All referenced product or service names and trademarks are the property of their respective owners.
Edition 2021-07-14
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2021 Infineon Technologies AG
All Rights Reserved.
Do you have a question about any
aspect of this document?
Email: erratum@infineon.com
Document reference
IFX-zev1491985034409
IMPORTANT NOTICE
The information given in this document shall in no
event be regarded as a guarantee of conditions or
characteristics (“Beschaffenheitsgarantie”).
With respect to any examples, hints or any typical
values stated herein and/or any information regarding
the application of the product, Infineon Technologies
hereby disclaims any and all warranties and liabilities
of any kind, including without limitation warranties of
non-infringement of intellectual property rights of any
third party.
In addition, any information given in this document is
subject to customer’s compliance with its obligations
stated in this document and any applicable legal
requirements, norms and standards concerning
customer’s products and any use of the product of
Infineon Technologies in customer’s applications.
The data contained in this document is exclusively
intended for technically trained staff. It is the
responsibility of customer’s technical departments to
evaluate the suitability of the product for the intended
application and the completeness of the product
information given in this document with respect to such
application.
WARNINGS
Due to technical requirements products may contain
dangerous substances. For information on the types
in question please contact your nearest Infineon
Technologies office.
Except as otherwise explicitly approved by Infineon
Technologies in a written document signed by
authorized representatives of Infineon Technologies,
Infineon Technologies’ products may not be used in
any applications where a failure of the product or
any consequences of the use thereof can reasonably
be expected to result in personal injury.