BGM1033N7E6327XUSA1

BGM1033N7 GPS and GLONASS Front-End Module Data Sheet Revision 3.2, 2011-07-18 RF & Protection Devices Edition 2011-07-18 Published by Infineon Technologies AG 81726 Munich, Germany © 2011 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. BGM1033N7 GPS and GLONASS Front-End Module BGM1033N7 GPS and GLONASS Front-End Module Revision History: 2011-07-18, Revision 3.2 Previous Revision: 2011-06-30, Revision 3.1 Page Subjects (major changes since last revision) 9 Updated value for Out-of-band 3rd Order Intercept Point 16 Updated carrier tape drawing Trademarks of Infineon Technologies AG AURIX™, C166™, CanPAK™, CIPOS™, CIPURSE™, EconoPACK™, CoolMOS™, CoolSET™, CORECONTROL™, CROSSAVE™, DAVE™, EasyPIM™, EconoBRIDGE™, EconoDUAL™, EconoPIM™, EiceDRIVER™, eupec™, FCOS™, HITFET™, HybridPACK™, I²RF™, ISOFACE™, IsoPACK™, MIPAQ™, ModSTACK™, my-d™, NovalithIC™, OptiMOS™, ORIGA™, PRIMARION™, PrimePACK™, PrimeSTACK™, PRO-SIL™, PROFET™, RASIC™, ReverSave™, SatRIC™, SIEGET™, SINDRION™, SIPMOS™, SmartLEWIS™, SOLID FLASH™, TEMPFET™, thinQ!™, TRENCHSTOP™, TriCore™. Other Trademarks Advance Design System™ (ADS) of Agilent Technologies, AMBA™, ARM™, MULTI-ICE™, KEIL™, PRIMECELL™, REALVIEW™, THUMB™, µVision™ of ARM Limited, UK. AUTOSAR™ is licensed by AUTOSAR development partnership. Bluetooth™ of Bluetooth SIG Inc. CAT-iq™ of DECT Forum. COLOSSUS™, FirstGPS™ of Trimble Navigation Ltd. EMV™ of EMVCo, LLC (Visa Holdings Inc.). EPCOS™ of Epcos AG. FLEXGO™ of Microsoft Corporation. FlexRay™ is licensed by FlexRay Consortium. HYPERTERMINAL™ of Hilgraeve Incorporated. IEC™ of Commission Electrotechnique Internationale. IrDA™ of Infrared Data Association Corporation. ISO™ of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLAB™ of MathWorks, Inc. MAXIM™ of Maxim Integrated Products, Inc. MICROTEC™, NUCLEUS™ of Mentor Graphics Corporation. Mifare™ of NXP. MIPI™ of MIPI Alliance, Inc. MIPS™ of MIPS Technologies, Inc., USA. muRata™ of MURATA MANUFACTURING CO., MICROWAVE OFFICE™ (MWO) of Applied Wave Research Inc., OmniVision™ of OmniVision Technologies, Inc. Openwave™ Openwave Systems Inc. RED HAT™ Red Hat, Inc. RFMD™ RF Micro Devices, Inc. SIRIUS™ of Sirius Satellite Radio Inc. SOLARIS™ of Sun Microsystems, Inc. SPANSION™ of Spansion LLC Ltd. Symbian™ of Symbian Software Limited. TAIYO YUDEN™ of Taiyo Yuden Co. TEAKLITE™ of CEVA, Inc. TEKTRONIX™ of Tektronix Inc. TOKO™ of TOKO KABUSHIKI KAISHA TA. UNIX™ of X/Open Company Limited. VERILOG™, PALLADIUM™ of Cadence Design Systems, Inc. VLYNQ™ of Texas Instruments Incorporated. VXWORKS™, WIND RIVER™ of WIND RIVER SYSTEMS, INC. ZETEX™ of Diodes Zetex Limited. Last Trademarks Update 2011-02-24 Data Sheet 3 Revision 3.2, 2011-07-18 BGM1033N7 GPS and GLONASS Front-End Module Table of Contents Table of Contents Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2 2.1 2.2 2.3 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ESD Integrity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . RF Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 3.1 3.2 3.3 Application Circuit and Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Application Circuit Schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Application Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 11 12 13 4 4.1 4.2 4.3 Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Package Footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Product Marking Pattern . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 14 15 15 5 Packing Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Data Sheet 4 7 7 8 9 Revision 3.2, 2011-07-18 GPS and GLONASS Front-End Module 1 BGM1033N7 Features Main features: • • • • • • • • • • • • Operating frequencies: 1575.42 MHz and 1598.06-1605.38 MHz High Gain: 14.8 dB Low Noise Figure (GPS): 1.65 dB Low current consumption: 4.0 mA Out-of-band rejection in cellular bands: > 43 dBc Input compression point in cellular bands: 30 dBm Supply voltage: 1.5 V to 3.6 V Tiny TSNP-7-10 leadless package (2.3 x 1.7 x 0.73 mm3) RF output internally matched to 50 Ω IEC ESD contact discharge of RF input pin: 6 kV Only 3 external SMD parts RoHS compliant package (Pb-free) Description The BGM1033N7 is a combination of a low-insertion-loss pre-filter with Infineon’s high performance low noise amplifier (LNA) for Global Positioning System (GPS) and Globalnaya Navigatsionnaya Sputnikovaya Sistema (GLONASS) applications. Both, GPS and GLONASS frequency bands, can be used at the same time. Through the low insertion loss of the filter, the BGM1033N7 provides 14.8 dB gain, 1.65 dB noise figure and high linearity performance. In addition BGM1033N7 provides very high out-of-band attenuation in conjunction with a high input compression point. It can withstand IEC ESD contact discharge at the RF input as high as 6 kV. Its current consumption is as low as 4.0 mA. It operates over the 1.5 V to 3.6 V supply voltage range. Product Name Package Marking BGM1033N7 TSNP-7-10 M33 Data Sheet 5 Revision 3.2, 2011-07-18 BGM1033N7 GPS and GLONASS Front-End Module Features SO PON AI VCC BIAS Pre-Filter RFIN RFOUT LNA BGM1033N7 GND Figure 1 Data Sheet BGM1033_Blockdiagram_with_externals.vsd Block Diagram with Main External Components 6 Revision 3.2, 2011-07-18 BGM1033N7 GPS and GLONASS Front-End Module Electrical Characteristics 2 Electrical Characteristics 2.1 Absolute Maximum Ratings Table 1 Absolute Maximum Ratings Parameter Symbol Values Min. Typ. Max. Unit Note / Test Condition Voltage at pin PON to GND VPON -0.3 – 3.6 V – Voltage at pin VCC to GND VCC -0.3 – 3.6 V – Voltage at pin RFIN to GND VRFIN -3 – 3 V – Voltage at pin SO to GND VBO -3 – 3 V – Voltage at pin AI to GND VAI -0.3 – 0.75 V – -0.3 – VCC+0.3 V – Voltage at pin RFOUT to GND VRFOUT Current into pin VCC IVCC – – 25 mA – RF input power inband PIN – – 0 dBm Continuous wave signal f = 1575.42 MHz 50 Ω source and load impedances RF input power out of band PIN,OBB – – 25 dBm Continuous wave signal f = 50 - 1460 MHz and 1710 - 4000 MHz 50 Ω source and load impedances Total power dissipation Ptot – – 90 mW – Junction temperature Tj – – 150 °C – Ambient temperature range TA -40 – 85 °C – Storage temperature range Tstg -65 – 150 °C – Attention: Stresses above the max. values listed here may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Maximum ratings are absolute ratings; exceeding only one of these values may cause irreversible damage to the integrated circuit. Data Sheet 7 Revision 3.2, 2011-07-18 BGM1033N7 GPS and GLONASS Front-End Module Electrical Characteristics 2.2 ESD Integrity Table 2 ESD Integrity Parameter Symbol Values Min. Typ. Max. Unit Note / Test Condition ESD capability HBM of pins 1, 2, 5 and 6 VESD1 – – 2 kV According to JESD22-A114 ESD capability HBM of pins 3 and 4 VESD2 – – 300 V According to JESD22-A114 ESD contact discharge capability of RF input pin 3 VESD3 – – 6 kV According to IEC61000-4-2 ESD capability MM of RF input VESD4 pin 3 and pre-filter output pin 4 – – 50 V According to JESD22-A115 Data Sheet 8 Revision 3.2, 2011-07-18 BGM1033N7 GPS and GLONASS Front-End Module Electrical Characteristics 2.3 RF Characteristics Table 3 Typical Characteristics: TA = 25 °C, VCC = 2.7 V, VPON,ON = 2.7 V, VPON,OFF = 0 V1) Parameter Symbol Values Min. Typ. Max. Unit Note / Test Condition Supply Voltage VCC 1.5 2.7 3.6 V – Supply Current ICC – 4.0 – mA ON-Mode – 0.2 3 μA OFF-Mode 1.0 – Vcc V ON-Mode 0 – 0.4 V OFF-Mode – 9.5 – μA ON-Mode – – 1 μA OFF-Mode – 5 – μs OFF- to ON-Mode – 5 – μs ON- to OFF-mode – Power On Control Voltage Power On Control Current 2) Power Gain Settling Time VPON IPON tS Passband Parameters @ f = 1575.42, 1598.061605.38 MHz – – – – – Insertion Power Gain |S21|2 – 14.8 – dB Noise Figure GPS NF – 1.65 2.2 dB ZS = 50 Ω f = 1575.42 MHz Noise Figure GLONASS3) NF – 2.0 2.5 dB ZS = 50 Ω f = 1598.06-1605.38 MHz Group Delay Ripple ΤG – 8 – ns f = 1575 MHz, 1598 - 1605 MHz Input Return Loss RLIN – 15 – dB – Output Return Loss RLOUT – 15 – dB – 3) 2 Reverse Isolation 1/|S12| – 22 – dB – Inband Input 3rd Order Intercept Point IIP3 – -6 – dBm f1 = 1575.42 MHz f2 = f1 + 1 MHz Inband Input 1 dB Compression Point IP1dB – -6 – dBm f1 = 1575.42 MHz Out-of-band 3rd Order Intercept Point4) IIP3OOB – 60 – dBm f1 = 1712.7 MHz f2 = 1850 MHz Out-of-band Input 1 dB Compression Point5) IP1dB_900M – 30 – dBm f1 = 900 MHz Out-of-band Input 1 dB Compression Point5) IP1dB_1710M – 30 – dBm f1 = 1710 MHz Stopband Parameters – – – – – – Rejection6) Rej750M – 54 – dBc f = 750 MHz 6) Rej900M – 53 – dBc f = 806 MHz - 928 MHz 6) Rej1800M – 43 – dBc f = 1710 MHz - 1980 MHz Rejection Rejection Data Sheet 9 Revision 3.2, 2011-07-18 BGM1033N7 GPS and GLONASS Front-End Module Electrical Characteristics Typical Characteristics: TA = 25 °C, VCC = 2.7 V, VPON,ON = 2.7 V, VPON,OFF = 0 V1) Table 3 Parameter 6) Symbol Values Min. Typ. Max. Unit Note / Test Condition Rejection Rej2400M – 54 – dBc f = 2400 MHz - 2500 MHz Stability k – >1 – – f = 20 MHz - 20 GHz 1) 2) 3) 4) 5) 6) Measured on application board including PCB losses (unless noted otherwise) To be within 1 dB of the final gain OFF- to ON-mode; to be within 3 dB of the final gain ON- to OFF-mode PCB and connector losses subtracted, verified on AQL base Input power = +10 dBm for each tone Guaranteed by device design, not measured in production Rejection = |(1/|S21|2 at stopband frequency)| + |(1/|S21|2 at 1575.42 MHz)| Data Sheet 10 Revision 3.2, 2011-07-18 BGM1033N7 GPS and GLONASS Front-End Module Application Circuit and Block Diagram 3 Application Circuit and Block Diagram 3.1 Application Circuit Schematic BGM1033N7 (Topview) L2 8.2nH SO AI L1 8.2nH 4 5 7 GND 2 6 RFOUT RFIN 3 PON VCC 1 BGM1033_Application_circuit_with_externals.vsd Figure 2 Application Circuit with Chip Outline (top view) Table 4 Parts List C1 1μF Part Number Part Type Manufacturer Size Comment C1 Chip capacitor Various 0402 Supply filtering L1 Chip inductor muRata LQW15A 0402 Matching + ESD protection inductor L2 Chip inductor muRata LQW15A 0402 Input Matching N1 BGM1033N7 Infineon TSNP-7-10 GPS FE-Module Data Sheet 11 Revision 3.2, 2011-07-18 BGM1033N7 GPS and GLONASS Front-End Module Application Circuit and Block Diagram 3.2 Pin Description Table 5 Pin Definition and Function Pin No. Name 1 VCC Power Supply 2 PON Power On/Off 3 RFIN RF Input 4 SO Pre-Filter Output 5 AI LNA Input 6 RFOUT RF Output 7 GND DC and RF ground Data Sheet Pin Type Buffer Type Function 12 Revision 3.2, 2011-07-18 BGM1033N7 GPS and GLONASS Front-End Module Application Circuit and Block Diagram 3.3 Application Board BGM1033_AppBoard_Layout_top.vsd Figure 3 Top view of Application Board Vias Vias Rogers RO4003C, 0.2mm Copper 35µm FR4, 0.8mm BGM1033 _AppBoard _ Cross_Section.vsd Figure 4 Data Sheet Cross-Section view of Application Board 13 Revision 3.2, 2011-07-18 BGM1033N7 GPS and GLONASS Front-End Module Package Information 4 Package Information 4.1 Package Footprint Figure 5 Recommended PCB Footprint for the TSNP-7-10 Package (subject to be changed) Data Sheet 14 Revision 3.2, 2011-07-18 BGM1033N7 GPS and GLONASS Front-End Module Package Information 4.2 Package Dimensions Figure 6 TSNP-7-10 Package Outline (bottom and side views) 4.3 Product Marking Pattern Figure 7 Marking Pattern (top view) Data Sheet 15 Revision 3.2, 2011-07-18 BGM1033N7 GPS and GLONASS Front-End Module Packing Information 5 Packing Information Figure 8 TSNP-7-10 Carrier tape Figure 9 TSNP-7-10 Pin 1 orientation in tape Data Sheet 16 Revision 3.2, 2011-07-18 w w w . i n f i n e o n . c o m Published by Infineon Technologies AG