0
登录后你可以
  • 下载海量资料
  • 学习在线课程
  • 观看技术视频
  • 写文章/发帖/加入社区
会员中心
创作中心
发布
  • 发文章

  • 发资料

  • 发帖

  • 提问

  • 发视频

创作活动
BGS14MA11E6327XTSA1

BGS14MA11E6327XTSA1

  • 厂商:

    EUPEC(英飞凌)

  • 封装:

    UFLGA11

  • 描述:

    SP4T LTE Switch

  • 数据手册
  • 价格&库存
BGS14MA11E6327XTSA1 数据手册
BGS14MA11 B G S 1 4 M A 11 M I P I 2 . 0 S P 4 T s w i tc h f o r LT E d i v e r s i t y, Tx a n d L A A a p p l i c at i o n s Key Features • • • • • • • 0.1 to 6.0 GHz coverage for LTE and LAA application LTE TX power handling capabilities Ultra low insertion loss: 0.3dB for band 41 and 0.85dB for LTE U/ LAA Small form factor 1.15mm x 1.55mm Fully compatible with MIPI 2.0 RFFE standard Select pin for USID allows two devices per MIPI RFFE bus No decoupling capacitors required (Unless DC applied on RF lines) Applications The SP4T switch is a band selection switch for LTE applications. With LTE TX power handling capability it’s suitable for both LTE diversity path and LTE uplink Tx applications. The switch covers up to 6GHz so it supports Band 42, Band 43 and also LAA. Product Validation Qualified for industrial applications according to the relevant tests of JEDEC47/20/22. Block diagram RF1 RF2 ANT RF3 RF4 SP4T VIO VDD GND MIPI Interface SCLK SDATA USID_SELECT Data Sheet www.infineon.com Revision 2.1 2018-07-17 BGS14MA11 MIPI 2.0 SP4T switch for LTE diversity, Tx and LAA applications Table of Contents Table of Contents Table of Contents 1 1 2 Features 2 Maximum Ratings 3 3 Operation range 4 4 RF Characteristics 5 5 MIPI RFFE Specification 7 6 Package related information Data Sheet 12 1 Revision 2.1 2018-07-17 BGS14MA11 MIPI 2.0 SP4T switch for LTE diversity, Tx and LAA applications Features 1 Features • • • • • • • • • • • • • • • • Ultra low insertion loss 0.3dB for band 41 and 0.85dB for LTE U/ LAA LTE TX Power Handling Capabilities 0.1 to 6.0 GHz coverage for LTE and LAA application Low harmonic generation High port-to-port-isolation Suitable for C2K / LTE / WCDMA Applications On chip control logic including ESD protection Fully compatible with MIPI 2.0 RFFE standard Software programmable MIPI RFFE USID USID swap feature Small form factor 1.15mm x 1.55mm No power supply blocking required Select pin for USID allows two devices per MIPI RFFE bus No decoupling capacitors required (Unless DC applied on RF lines) High EMI robustness RoHS and WEEE compliant package Description This SP4T RF switch is a perfect solution for multimode handsets based on LTE and WCDMA. It is based on Infineon’s proprietary technology and has excellent RF performance. The ultra-low insertion loss helps customers to achieve high system sensitivity, the coverage of LTE Tx power and 6GHz enables very broad application. It features DC-free RF ports, external DC blocking capacitors at the RF ports are only required if DC voltage is applied externally. Its on chip MIPI RFFE 2.0 controller is fully compatible with industry standard, with external USID_SEL pin it can support two devices per MIPI RFFE bus. Product Name Marking Package BGS14MA11 A1 ATSLP-11 Data Sheet 2 Revision 2.1 2018-07-17 BGS14MA11 MIPI 2.0 SP4T switch for LTE diversity, Tx and LAA applications Maximum Ratings 2 Maximum Ratings Table 1: Maximum Ratings, Table I at TA = 25 ◦C, unless otherwise specified Parameter Symbol Values Unit Note / Test Condition Min. Typ. Max. Frequency Range f 0.1 – 6.0 GHz 1) Supply voltage 2) VDD -0.5 – 3.6 V – -55 – 150 ◦ Storage temperature range TSTG RF input power at all TRx ports C – PRF _max – – 35 dBm ESD capability, CDM 3) VESDCDM -500 – +500 V ESD capability, HBM 4) VESDHBM -1 – +1 kV VESDANT -8 – +8 kV Tj – – 125 ◦ ESD capability, system level (RF port) 5) short momentary / 50Ω ANT vs system GND, with 27 nH shunt inductor Junction temperature C – Switch has a low-pass response. For higher frequencies, losses have to be considered for their impact on thermal heating. The DC voltage at RF ports VRFDC has to be 0V. 2) Note: Consider potential ripple voltages on top of V . Including RF ripple, V DD DD must not exceed the maximum ratings: VDD = VDC + VRipple . 3) Field-Induced Charged-Device Model ANSI/ESDA/JEDEC JS-002. Simulates charging/discharging events that occur in production equipment and processes. Potential for CDM ESD events occurs whenever there is metal-to-metal contact in manufacturing. 4) Human Body Model ANSI/ESDA/JEDEC JS-001 (R = 1,5 kΩ, C = 100 pF). 5) IEC 61000-4-2 (R = 330 Ω, C = 150 pF), contact discharge. 1) Warning: Stresses above the max. values listed here may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Maximum ratings are absolute ratings; exceeding only one of these values may cause irreversible damage to the integrated circuit. Table 2: Maximum Ratings, Table II at TA = 25 ◦C, unless otherwise specified Parameter Thermal resistance junction - soldering Symbol Values Unit Note / Test Condition Min. Typ. Max. RthJS – – 62 K/W – VRFDC 0 – 0 V No DC voltages allowed on RF- point Maximum DC-voltage on RF-Ports and RF-Ground Data Sheet Ports 3 Revision 2.1 2018-07-17 BGS14MA11 MIPI 2.0 SP4T switch for LTE diversity, Tx and LAA applications Operation range 3 Operation range Table 3: Operation range at T A = −40 ◦C to 85 ◦C Parameter Symbol Values Min. Typ. Max. Unit Note / Test Condition Supply Voltage V DD 1.7 1.8 3.4 V – Supply Current IDD – 60 125 µA – Supply Current in Standby mode IDD_SB – 0.5 1 µA VIO=low or MIPI lowpower mode RFFE supply voltage VIO 1.65 1.8 1.95 V – RFFE input high voltage1 VIH 0.7*VIO – VIO V – VIL 0 – 0.3*VIO V – RFFE output high voltage VOH 0.8*VIO – VIO V – 1 RFFE output low voltage VOL 0 – 0.2*VIO V – RFFE control input capacitance CCtrl – – 2 pF – RFFE supply current IVIO – 2 – µA Idle State Unit Note / Test Condition RFFE input low voltage 1 1 1 SCLK and SDATA Table 4: RF input power Parameter Symbol Values Min. Typ. Max. RF input power on TRX ports PRF – – 34 dBm CW / VSWR 1:1 / 25 ◦C RF input power on TRX ports PRF – – 29 dBm CW / VSWR 6:1 / 85 ◦C Data Sheet 4 Revision 2.1 2018-07-17 BGS14MA11 MIPI 2.0 SP4T switch for LTE diversity, Tx and LAA applications RF Characteristics 4 RF Characteristics Table 5: RF Characteristics at TA = −40 ◦C...85 ◦C, PIN = 0 dBm, Supply Voltage VDD= 1.7...3.4V, unless otherwise specified. Open ports are terminated with 50 Ω. Parameter Symbol Insertion Loss Note / Test Condition Min. Typ. Max. – 0.20 0.40 dB 698–960 MHz – 0.23 0.45 dB 1428–1920 MHz IL – – 0.25 0.26 0.45 0.50 dB dB 1990–2170 MHz 2170–2690 MHz – 0.40 0.60 dB 3400–3600 MHz – 0.42 0.70 dB 3600–3800 MHz – 0.85 1.50 dB 5000–6000 MHz 23 27 – dB 698–960 MHz 19 21 – dB 1428–1920 MHz 18 20 – dB 1990–2170 MHz 17 19 – dB 2170–2690 MHz 14 16 – dB 3400–3600 MHz 14 15 – dB 3600–3800 MHz 10 11 – dB 5000–6000 MHz 36 40 – dB 698–960 MHz 30 35 – dB 1428–1920 MHz 28 32 – dB 1990–2170 MHz 26 28 – dB 2170–2690 MHz 22 26 – dB 3400–3600 MHz 21 25 – dB 3600–3800 MHz 14 18 – dB 5000–6000 MHz 1) All TRx Ports Isolation Unit 1) All TRx Ports Return Loss Values RL 1) 2) All TRx Ports ISO Harmonic Generation (UMTS Band 1, Band 5) 1) 2nd harmonic generation PH2 – -72 -66 dBm 25 dBm, 50 Ω, CW mode 3 harmonic generation PH3 – -74 -71 dBm 25 dBm, 50 Ω, CW mode rd Intermodulation Distortion (UMTS Band 1, Band 5)1) 2nd order intermodulation IMD2 low – – -110 dBm IMT, US Cell (see Tab. 7) 3 order intermodulation IMD3 – – -110 dBm IMT, US Cell (see Tab. 8) 2 IMD2 high – – -110 dBm IMT, US Cell (see Tab. 7) rd nd order intermodulation 1) On application board without any matching components. 2) Isolation to inactive ports when one path is active (port to port isolation). Data Sheet 5 Revision 2.1 2018-07-17 BGS14MA11 MIPI 2.0 SP4T switch for LTE diversity, Tx and LAA applications RF Characteristics Table 6: Switching Time at TA = 25 ◦C, PIN = 0 dBm, Supply Voltage VDD= 1.7...3.4V, unless otherwise specified Parameter Symbol Values Min. Typ. Max. Unit Note / Test Condition 10 % to 90 % RF signal Switching Time RF Rise Time tRT – – 2 µs Switching Time tST – 3 4.5 µs Power Up Settling Time tPup – 10 25 µs 50% last SCLK falling edge to 90% RF signal, see Fig. 1 After power down mode 1) Don’t change switch state during first 10µs of power-up. SDATA TINT SCLK 90% RF Signal Figure 1: MIPI to RF time Table 7: IMD2 Testcases Band CW tone 1 (MHz) CW tone 1 (dBm) CW tone 2 (MHz) IMT 1950 15 US Cell 835 15 Band CW tone 1 (MHz) CW tone 1 (dBm) CW tone 2 (MHz) CW tone 2 (dBm) IMT 1950 20 1760 -15 US Cell 835 20 790 -15 190 (IMD2 low) 4090 (IMD2 high) 45 (IMD2 low) 1715 (IMD2 high) CW tone 2 (dBm) -15 -15 Table 8: IMD3 Testcases Data Sheet 6 Revision 2.1 2018-07-17 BGS14MA11 MIPI 2.0 SP4T switch for LTE diversity, Tx and LAA applications MIPI RFFE Specification 5 MIPI RFFE Specification All sequences are implemented according to the ’MIPI Alliance Specification for RF Front-End Control Interface’ document version 2.0 - 25. September 2014. Table 9: MIPI Features Feature Supported MIPI RFFE 1.10 and 2.0 standards Yes Register 0 write command sequence Yes Register read and write command sequence Yes Extended register read and write command se- Yes Comment quence Support for standard frequency range operations Yes Up to 26 MHz for read and write Yes Up to 52 MHz for write1) for SCLK Support for extended frequency range operations for SCLK Half speed read Yes Full speed read Yes Full speed write Yes Programmable Group SID Yes Trigger functionality Yes Broadcast / GSID write to PM TRIG register Yes Reset Yes Status / error sum register Yes Extended product ID register Yes Revision ID register Yes Group SID register Yes USID select pin Yes 1) Via VIO, PM TRIG or software register1) External pin to provide 2 USIDs. See Tab. 10 only supported by MIPI 2.0 Standard Data Sheet 7 Revision 2.1 2018-07-17 BGS14MA11 MIPI 2.0 SP4T switch for LTE diversity, Tx and LAA applications MIPI RFFE Specification Table 10: MIPI USID Selection Selection Pin Level 1) Default Connection USID_SEL= GND USID= 0xD USID_SEL= VIO USID= 0x1 1) No unspecified voltage levels including floating are allowed. Table 11: Startup Behavior Feature State Power status Power Comment down Power down mode after start-up mode Trigger function Data Sheet Enabled Enabled after start-up. Programmable via behavior control register 8 Revision 2.1 2018-07-17 BGS14MA11 MIPI 2.0 SP4T switch for LTE diversity, Tx and LAA applications MIPI RFFE Specification Table 12: Register Mapping, Table I Register Address Register Name Data Bits Function Description 0x00 SW_CTRL0 6:0 SW_CTRL0 RF Switch Control 0x1C PM_TRIG PWR_MODE(1), Operation Mode 0: Normal operation (ACTIVE) 7 Default Broadcast_ID Support Trigger Support R/W 0 No Yes R/W 1 Yes No R/W 1: Low Power Mode (LOW POWER) 6 PWR_MODE(0), State Bit Vector 0: No action (ACTIVE) 0 1: Powered Reset (STARTUP to ACTIVE to LOW POWER) 5 TRIGGER_MASK_2 0: Data masked (held in shadow REG) 0 No 1: Data not masked (ready for transfer to active REG) 4 TRIGGER_MASK_1 0: Data masked (held in shadow REG) 0 1: Data not masked (ready for transfer to active REG) 3 TRIGGER_MASK_0 0: Data masked (held in shadow REG) 0 1: Data not masked (ready for transfer to active REG) 2 TRIGGER_2 0: No action (data held in shadow REG) 0 Yes 1: Data transferred to active REG 1 TRIGGER_1 0: No action (data held in shadow REG) 0 1: Data transferred to active REG 0 TRIGGER_0 0: No action (data held in shadow REG) 0 1: Data transferred to active REG 0x1D PRODUCT_ID 7:0 PRODUCT_ID This is a read-only register. However, during the programming of the USID a write command sequence is performed on this register, even though the write does not change its value. 33 No No R 0x1E MAN_ID 7:0 MANUFACTURER_ID [7:0] This is a read-only register. However, during the programming of the USID, a write command sequence is performed on this register, even though the write does not change its value. 0x1A No No R 0x1F MAN_USID 7:6 RESERVED Reserved for future use 00 No No R 5:4 MANUFACTURER_ID [9:8] These bits are read-only. However, during the programming of the USID, a write command sequence is performed on this register even though the write does not change its value. 01 3:0 USID[3:0] Programmable USID. Performing a write to this register using the described programming sequences will program the USID in devices supporting this feature. These bits store the USID of the device. See Tab. 10 No No R/W Data Sheet 9 Revision 2.1 2018-07-17 BGS14MA11 MIPI 2.0 SP4T switch for LTE diversity, Tx and LAA applications MIPI RFFE Specification Table 13: Register Mapping, Table II Register Address Register Name Data Bits Function 0x20 EXT_PROD_ID1) 7:0 EXT_PRODUCT_ID 0x21 REV_ID 7:4 MAIN_REVISION 3:0 SUB_REVISION 0x22 GSID1) 7:4 GSID0[3:0] Primary Group Slave ID. 0x0 3:0 RESERVED Reserved for secondary Group Slave ID. 0x0 7 UDR_RST Reset all configurable non-RFFE Reserved registers to default values. 0: Normal operation 1: Software reset 0 6:0 RESERVED Reserved for future use 0000000 7 RESERVED Reserved for future use 0 6 COMMAND_FRAME_PAR_ERR Command Sequence received with parity error − discard command. 0 0x23 UDR_RST 0x24 ERR_SUM1) Description Default Broadcast_ID Support Trigger Support R/W 0x00 No No R 0x4 No No R/W No No R/W No No R/W No No R 0x0 5 COMMAND_LENGTH_ERR Command length error. 0 4 ADDRESS_FRAME_ PAR_ERR Address frame with parity error. 0 3 DATA_FRAME_PAR_ERR Data frame with parity error. 0 2 READ_UNUSED_REG Read command to an invalid address. 0 1 WRITE_UNUSED_REG Write command to an invalid address. 0 0 BID_GID_ERR Read command with a BROADCAST_ID or GROUP_ID. 0 1) Only supported by MIPI 2.0 Standard Data Sheet 10 Revision 2.1 2018-07-17 BGS14MA11 MIPI 2.0 SP4T switch for LTE diversity, Tx and LAA applications MIPI RFFE Specification Table 14: Modes of Operation (Truth Table, Register_0) State Value (Bin.) Mode 1 00000000 ALL OFF (Isolation) 2 00000001 RF1 ON 3 00000010 RF2 ON 4 00000100 RF3 ON 5 00001000 RF4 ON 6 00000011 RF1 and RF2 ON 7 00000101 RF1 and RF3 ON 8 00001001 RF1 and RF4 ON 9 00000110 RF2 and RF3 ON 10 00001010 RF2 and RF4 ON 11 00001100 RF3 and RF4 ON 12 00000111 RF1 and RF2 and RF3 ON RF1 and RF2 and RF4 ON 13 00001011 14 00001101 RF1 and RF3 and RF4 ON 15 00001110 RF2 and RF3 and RF4 ON 16 00001111 RF1 and RF2 and RF3 and RF4 ON 17 00XX0000 ALL OFF (Isolation) 1) Reserved Data Sheet 11 Revision 2.1 2018-07-17 BGS14MA11 MIPI 2.0 SP4T switch for LTE diversity, Tx and LAA applications Package related information 6 Package related information The switch has a package size of 1150 µm in x-dimension and 1550 µm in y-dimension with a maximum deviation of ±50 µm in each dimension. Fig. 2 shows the footprint from top view. The definition of each pin can be found in Tab. 16. Table 15: Mechanical Data Parameter Symbol Value Unit Package X-Dimension X 1150 ± 50 µm Package Y-Dimension Y 1550 ± 50 µm Package Height H 0.65 max µm ANT RF2 6 RF1 7 5 4 RF3 3 RF4 VDD 8 11 GND USID_SEL 9 10 2 VIO 1 SCLK SDATA Figure 2: Footprint, top view Table 16: Pin Definition No. Name Pin Type Function 1 SCLK I/O MIPI RFFE Clock (Input) 2 VIO Power MIPI RFFE Power Supply 3 RF4 RF Rx port 4 4 RF3 RF Rx port 3 5 ANT RF RF Input port 6 RF2 RF Rx port 2 7 RF1 RF Rx port 1 8 VDD Power Power supply 9 USID-SEL I/O User ID selection pin 10 SDATA I/O MIPI RFFE Data 11 GND Ground Ground Data Sheet 12 Revision 2.1 2018-07-17 BGS14MA11 MIPI 2.0 SP4T switch for LTE diversity, Tx and LAA applications Package related information Figure 3: Package Outline Drawing (top, side and bottom views) Optional solder mask dam 0.25 0.25 0.4 0.4 0.2 0.2 0.25 0.25 0.4 copper 0.4 solder mask stencil apertures ALL DIMENSIONS ARE IN UNITS MM Figure 4: Land Pattern Drawing Data Sheet 13 Revision 2.1 2018-07-17 BGS14MA11 MIPI 2.0 SP4T switch for LTE diversity, Tx and LAA applications Package related information TYPE CODE PIN1 MARKING (LASERED) DATE CODE (YW) Figure 5: Laser marking 4 0.75 4 1.7 8 PIN 1 INDEX MARKING 1.3 ALL DIMENSIONS ARE IN UNITS MM THE DRAWING IS IN COMPLIANCE WITH ISO 128 & PROJECTION METHOD 1 [ ] Figure 6: Carrier Tape Data Sheet 14 Revision 2.1 2018-07-17 BGS14MA11 MIPI 2.0 SP4T switch for LTE diversity, Tx and LAA applications Package related information Table 17: Year date code marking - digit "Y" Year "Y" Year "Y" Year "Y" 2000 0 2010 0 2020 0 2001 1 2011 1 2021 1 2002 2 2012 2 2022 2 2003 3 2013 3 2023 3 2004 4 2014 4 2024 4 2005 5 2015 5 2025 5 2006 6 2016 6 2026 6 2007 7 2017 7 2027 7 2008 8 2018 8 2028 8 2009 9 2019 9 2029 9 Table 18: Week date code marking - digit "W" Data Sheet Week "W" Week "W" Week "W" Week "W" Week "W" 1 A 12 N 23 4 34 h 45 v 2 B 13 P 24 5 35 j 46 x 3 C 14 Q 25 6 36 k 47 y 4 D 15 R 26 7 37 l 48 z 5 E 16 S 27 a 38 n 49 8 6 F 17 T 28 b 39 p 50 9 7 G 18 U 29 c 40 q 51 2 8 H 19 V 30 d 41 r 52 3 9 J 20 W 31 e 42 s 10 K 21 Y 32 f 43 t 11 L 22 Z 33 g 44 u 15 Revision 2.1 2018-07-17 Revision History Page or Item Subjects (major changes since previous revision) Revision 2.1, 2018-07-17 1 ´NDA Required´ removed Trademarks All referenced product or service names and trademarks are the property of their respective owners. Edition 2018-07-17 Published by Infineon Technologies AG 81726 Munich, Germany c 2018 Infineon Technologies AG. All Rights Reserved. Do you have a question about any aspect of this document? Email: erratum@infineon.com IMPORTANT NOTICE The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics ("Beschaffenheitsgarantie"). With respect to any examples, hints or any typical values stated herein and/or any information regarding the application of the product, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. In addition, any information given in this document is subject to customer’s compliance with its obligations stated in this document and any applicable legal requirements, norms and standards concerning customer’s products and any use of the product of Infineon Technologies in customer’s applications. The data contained in this document is exclusively intended for technically trained staff. It is the responsibility of customer’s technical departments to evaluate the suitability of the product for the intended application and the completeness of the product information given in this document with respect to such application. For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). WARNINGS Due to technical requirements products may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies office. Except as otherwise explicitly approved by Infineon Technologies in a written document signed by authorized representatives of Infineon Technologies, Infineon Technologies products may not be used in any applications where a failure of the product or any consequences of the use thereof can reasonably be expected to result in personal injury.
BGS14MA11E6327XTSA1 价格&库存

很抱歉,暂时无法提供与“BGS14MA11E6327XTSA1”相匹配的价格&库存,您可以联系我们找货

免费人工找货