BGS15MU14
S P 5 T H i g h I s o l at i o n S w i tc h f o r Fe e d ba c k R e ce i v e
Features
• High linearity up to 20 dBm input power
• Fast switching speed (180 ns).
• Low insertion loss and high port-to-port isolation up to 6.0 GHz
• Low current consumption
• MIPI RFFE 2.1 compliant control interface
• Ultra low profile leadless plastic package
• Small form factor 1.5mm x 1.9mm (MSL1, 260◦ C per JEDEC J-STD-020)
1.9 x 1.5 mm2
• RoHS and WEEE compliant package
Potential Applications
Feedback receive signal routing from PA modules, high isolation general purpose Rx SP5T for LTE and 5G applicable up to 6GHz
Product Validation
Qualified for industrial applications according to the relevant tests of JEDEC47/20/22.
Block Diagram
Final Data Sheet
www.infineon.com
Please read the Important Notice and Warnings at the end of this document
Revision 2.0
2020-09-03
BGS15MU14
SP5T High Isolation Switch for Feedback Receive
Table of Contents
Table of Contents
Table of Contents
1
1
2
Features
2 Product Description
2
3 Maximum Ratings
3
4 Operation Ranges
4
5 RF Characteristics
5
6 MIPI RFFE Specification
11
7 Package Information
18
Final Data Sheet
1
Revision 2.0
2020-09-03
BGS15MU14
SP5T High Isolation Switch for Feedback Receive
Product Description
1 Features
• High linearity up to 20 dBm input power
• Fast switching speed (180 ns)
• Low insertion loss and high port-to-port isolation up to 6.0 GHz
• Low current consumption
• MIPI RFFE 2.1 compliant control interface
• Ultra low profile leadless plastic package
• Small form factor 1.5mm x 1.9mm (MSL1, 260◦ C per JEDEC J-STD-020)
• RoHS and WEEE compliant package
2 Product Description
The BGS15MU14 RF CMOS switch is specifically designed for LTE and 5G feedback receive applications. It offers high isolation ,
low insertion loss and low harmonic generation up to 6 GHz.
It is controlled via a MIPI RFFE controller. The on-chip controller allows power-supply voltages from 1.65 to 1.95 V. Unlike
GaAs technology, external DC blocking capacitors at the RF Ports are only required if DC voltage is applied externally. The
BGS15MU14 RF Switch is manufactured using Infineon’s patented MOS technology, offering the performance of GaAs with the
economy and integration of conventional CMOS including the inherent higher ESD robustness. The device has a very small
size of only 1.9 x 1.5 mm2 and a maximum thickness of 0.6 mm.
Table 1: Ordering Information
Type
Package
Marking
Ordering Information
BGS15MU14
PG-ULGA-14-1
K2
BGS15MU14 E6327
Final Data Sheet
2
Revision 2.0
2020-09-03
BGS15MU14
SP5T High Isolation Switch for Feedback Receive
Maximum Ratings
3 Maximum Ratings
Table 2: Maximum Ratings, Table I at T A = 25 ◦C, unless otherwise specified
Parameter
Symbol
Min.
Typ.
Max.
Frequency range 1)
f
0.4
–
6.0
GHz
Supply voltage
V IO
-0.5
–
2.2
V
–
CW; 50 Ohm
Max RF-input peak power
Values
Unit
Note / Test Condition
PRF
–
–
23
dBm
ESD robustness, CDM
2)
V ESD,CDM
-0.5
–
+0.5
kV
ESD robustness, HBM
3)
V ESD,HBM
-1
–
+1
kV
Storage temperature range
T STG
-55
–
150
◦
C
–
Junction temperature
Tj
–
–
125
◦
C
–
Switch has a low-pass response. For higher frequencies, losses have to be considered for their impact on thermal heating. The DC voltage at RF ports V RFDC
has to be 0 V.
2) Field-Induced Charged-Device Model ANSI/ESDA/JEDEC JS-002. Simulates charging/discharging events that occur in production equipment and processes.
Potential for CDM ESD events occurs whenever there is metal-to-metal contact in manufacturing.
3) Human Body Model ANSI/ESDA/JEDEC JS-001 (R = 1.5 kΩ, C = 100 pF).
4) IEC 61000-4-2 (R = 330 Ω, C = 150 pF), contact discharge.
1)
Table 3: Maximum Ratings, Table II at T A = 25 ◦C, unless otherwise specified
Parameter
Maximum DC-voltage on RF
Symbol
V RFDC
Values
Min.
Typ.
Max.
0
–
0
Unit
Note / Test Condition
V
No DC voltages allowed on RF
ports and RF ground
RFFE control voltage levels
ports
V SCLK,
V SDATA,
V SSEL
-0.7
–
V IO + 0.7
(max.2.5)
V
–
Warning: Stresses above the max. values listed here may cause permanent damage to the device. Maximum ratings
are absolute ratings; exceeding only one of these values may cause irreversible damage to the integrated circuit. Exposure to conditions at or below absolute maximum rating but above the specified maximum operation conditions may
affect device reliability and life time. Functionality of the device might not be given under these conditions.
Final Data Sheet
3
Revision 2.0
2020-09-03
BGS15MU14
SP5T High Isolation Switch for Feedback Receive
Operation Ranges
4 Operation Ranges
Table 4: Operation Ranges
Parameter
Symbol
Unit
Note / Test Condition
Min.
Typ.
Max.
Supply voltage
V IO
1.65
1.8
1.95
V
–
Supply current
IDD
–
60
100
µA
Operating State, V IO = 1.8 V
Supply current in standby mode
IDD,sb
–
2
8.5
µA
Idle state, power down mode
RFFE supply voltage
V IO
1.65
1.8
1.95
V
–
V IH
0.7*VIO
–
VIO
V
–
V IL
0
–
0.3*VIO
V
–
V OH
0.8*VIO
–
VIO
V
–
RFFE output low voltage
V OL
0
–
0.2*VIO
V
–
RFFE supply current
IIO
–
3
–
µA
–
TA
-40
25
85
◦
C
–
RFFE input high voltage
RFFE input low voltage
1)
1)
RFFE output high voltage1)
1)
Ambient temperature
Values
1) SCLK and SDATA
Table 5: RF Input Power
Parameter
RF input power
Final Data Sheet
Symbol
PRF
Values
Min.
Typ.
Max.
–
–
20
4
Unit
Note / Test Condition
dBm
CW; 50 Ohm
Revision 2.0
2020-09-03
BGS15MU14
SP5T High Isolation Switch for Feedback Receive
RF Characteristics
5 RF Characteristics
Table 6: RF Characteristics at T A = 25 ◦C, PIN = 0 dBm, Supply Voltage V IO = 1.8 V, unless otherwise specified
Parameter
Symbol
Insertion Loss
Values
Unit
Note / Test Condition
Min.
Typ.
Max.
–
0.46
0.51
dB
400–698 MHz
–
0.48
0.56
dB
699–960 MHz
–
0.55
0.71
dB
1200–2170 MHz
–
0.63
0.78
dB
2171–2690 MHz
–
0.78
0.98
dB
3300–4200 MHz
–
0.92
1.18
dB
4400–5000 MHz
–
1.05
1.39
dB
5150–5925 MHz
1)
All RF Ports
IL
1) Measured on application board, without any matching components.
Table 7: RF Characteristics at T A = −40 ◦C...85 ◦C, PIN = 0 dBm, Supply Voltage V IO = 1.65...1.95 V, unless otherwise specified
Parameter
Symbol
Insertion Loss
All RF Ports
Return Loss
All RF Ports
Values
Unit
Note / Test Condition
Min.
Typ.
Max.
–
0.46
0.62
dB
400–698 MHz
–
0.48
0.71
dB
699–960 MHz
–
0.55
0.81
dB
1200–2170 MHz
–
0.63
0.86
dB
2171–2690 MHz
–
0.78
1.10
dB
3300–4200 MHz
–
0.92
1.35
dB
4400–5000 MHz
–
1.05
1.57
dB
5150–5925 MHz
23
26
–
dB
400–698 MHz
21
27
–
dB
699–960 MHz
16
22
–
dB
1200–2170 MHz
14
18
–
dB
2171–2690 MHz
11
15
–
dB
3300–4200 MHz
9
13
–
dB
4400–5000 MHz
8
12
–
dB
5150–5925 MHz
1)
IL
1)
RL
1) Measured on application board, without any matching components.
Final Data Sheet
5
Revision 2.0
2020-09-03
BGS15MU14
SP5T High Isolation Switch for Feedback Receive
RF Characteristics
Table 8: RF Characteristics at T A = −40 ◦C...85 ◦C, PIN = 0 dBm, Supply Voltage V IO = 1.65...1.95 V, unless otherwise specified
Parameter
Symbol
Values
Unit
Note / Test Condition
–
dB
400–698 MHz
63
–
dB
699–960 MHz
57
–
dB
1200–2170 MHz
54
55
–
dB
2171–2690 MHz
51
55
–
dB
3300–4200 MHz
49
55
–
dB
4400–5000 MHz
46
51
–
dB
5150–5925 MHz
66
70
–
dB
400–698 MHz
62
67
–
dB
699–960 MHz
56
61
–
dB
1200–2170 MHz
55
59
–
dB
2171–2690 MHz
52
58
–
dB
3300–4200 MHz
51
58
–
dB
4400–5000 MHz
48
56
–
dB
5150–5925 MHz
64
68
–
dB
400–698 MHz
60
65
–
dB
699–960 MHz
53
59
–
dB
1200–2170 MHz
52
56
–
dB
2171–2690 MHz
50
55
–
dB
3300–4200 MHz
49
55
–
dB
4400–5000 MHz
47
56
–
dB
5150–5925 MHz
63
66
–
dB
400–698 MHz
58
62
–
dB
699–960 MHz
52
57
–
dB
1200–2170 MHz
50
54
–
dB
2171–2690 MHz
48
52
–
dB
3300–4200 MHz
47
51
–
dB
4400–5000 MHz
46
51
–
dB
5150–5925 MHz
63
65
–
dB
400–698 MHz
59
62
–
dB
699–960 MHz
53
56
–
dB
1200–2170 MHz
52
54
–
dB
2171–2690 MHz
48
52
–
dB
3300–4200 MHz
46
51
–
dB
4400–5000 MHz
42
48
–
dB
5150–5925 MHz
Min.
Typ.
Max.
64
66
60
55
Isolation1)
ANT_RF1 vs RFx
Isolation
ISO
1)
ANT_RF2 vs RFx
ISO
Isolation1)
ANT_RF3 vs RFx
ISO
Isolation1)
ANT_RF4 vs RFx
Isolation
ISO
1)
ANT_RF5 vs RFx
ISO
1) Measured on application board, without any matching components.
Final Data Sheet
6
Revision 2.0
2020-09-03
BGS15MU14
SP5T High Isolation Switch for Feedback Receive
RF Characteristics
Table 9: RF Characteristics at T A = −40 ◦C...85 ◦C, PIN = 0 dBm, Supply Voltage V IO = 1.65...1.95 V, unless otherwise specified
Parameter
Symbol
Values
Unit
Note / Test Condition
–
dB
400–698 MHz
64
–
dB
699–960 MHz
58
–
dB
1200–2170 MHz
50
55
–
dB
2171–2690 MHz
47
54
–
dB
3300–4200 MHz
45
54
–
dB
4400–5000 MHz
41
52
–
dB
5150–5925 MHz
Min.
Typ.
Max.
62
67
58
51
Isolation1)
Port to Port
ISO
1) Measured on application board, without any matching components.
Final Data Sheet
7
Revision 2.0
2020-09-03
BGS15MU14
SP5T High Isolation Switch for Feedback Receive
RF Characteristics
Table 10: RF Characteristics at T A = −40 ◦C...85 ◦C, PIN = 0 dBm, Supply Voltage V IO = 1.65...1.95 V, unless otherwise specified
Parameter
Symbol
Values
Min.
Typ.
Unit
Note / Test Condition
Max.
Harmonic Generation1) at VSWR 1:1, 12.5 % duty cycle, Pin +10 dBm
H2
2nd Harmonic distortions
H3
3rd Harmonic distortions
Intermodulation Distortion
–
-101
-97
dBm
600 - 915 MHz
–
-100
-95
dBm
1980 - 2170 MHz
–
-100
-95
dBm
2300 - 2690 MHz
–
-101
-95
dBm
3300 - 4200MHz
–
-101
-97
dBm
4400 - 5000MHz
–
2)
2)
-99
-92
dBm
5150 - 5925MHz
–
-100
-97
dBm
600 - 915 MHz
–
-98
-94
dBm
1980 - 2170 MHz
–
-98
-96
dBm
2300 - 2690 MHz
–
-97
-93
dBm
3300 - 4200MHz
–
-96
-94
dBm
4400 - 5000MHz
–
-96
-89
dBm
5150 - 5925MHz
–
-119
-115
dBm
B1 OOB Blocking at 2140M
1)
2nd intermodulation products
IMD2
Interferer1: +10 dBm @ 1950 MHz
Interferer2: -10 dBm @4090 MHz
–
-120
-116
dBm
B7 OOB Blocking at 2655 MHz
Interferer1: +10 dBm @ 2535 MHz
Interferer2: -10 dBm @ 5190 MHz
3rd intermodulation products
IMD3
–
-121
-117
dBm
B1 OOB Blocking at 2140 MHz
Interferer1: +10 dBm @ 1950 MHz
Interferer2: -10 dBm @ 1760 MHz
1) On EVB without any matching components.
2) RF2 Port excluded.(When RF2 Port included:
Final Data Sheet
typ. 96 dBm, Max. 75 dBm)
8
Revision 2.0
2020-09-03
BGS15MU14
SP5T High Isolation Switch for Feedback Receive
RF Characteristics
Table 11: IMD2 Testcases
Band
In-Band Frequency
Blocker Frequency 1
Blocker Power 1
Blocker Frequency 2
Blocker Power 2
[MHz]
[MHz]
[dBm]
[MHz]
[dBm]
Band 1
2140
1950
10
4090
-10
Band 2
1960
1880
10
3840
-10
Band 5
881.5
836.5
10
1718
-10
Band 7
2655
2535
10
5190
-10
Band 8
942
897
10
1839
-10
In-Band Frequency
Blocker Frequency 1
Blocker Power 1
Blocker Frequency 2
Blocker Power 2
[MHz]
[MHz]
[dBm]
[MHz]
[dBm]
Band 1
2140
1950
10
1760
-10
Band 2
1960
1880
10
1800
-10
Band 5
881.5
836.5
10
791.5
-10
Band 7
2655
2535
10
2415
-10
Band 8
942
897
10
852
-10
Band 1
2132
1732
10
1332
-10
Table 12: IMD3 Testcases
Band
Final Data Sheet
9
Revision 2.0
2020-09-03
BGS15MU14
SP5T High Isolation Switch for Feedback Receive
RF Characteristics
Table 13: Switching Time at T A = −40 ◦C...85 ◦C, PIN = 0 dBm, Supply Voltage V IO = 1.65...1.95 V, unless otherwise specified
Parameter
Symbol
Values
Min.
Typ.
Max.
–
6
8
Unit
Note / Test Condition
µs
Time from Power Up plus Switch command,
Switching Time
Power Up Settling Time
T pup
50 % last SCLK falling edge to 90 % RF signal
RF Switching Time ON
T st,on
–
180
210
ns
Time to switch between RF states,
50 % last SCLK falling edge to 90 % RF signal
RF Switching Time OFF
T st,off
–
45
55
ns
Time to switch between RF states, 50 % last
SCLK falling edge to minimum 20dB isolation
between ANT and switched RF port
Figure 1: MIPI Timing Diagram
Final Data Sheet
10
Revision 2.0
2020-09-03
BGS15MU14
SP5T High Isolation Switch for Feedback Receive
MIPI RFFE Specification
6 MIPI RFFE Specification
The MIPI RFFE interface is working in systems following the ’MIPI Alliance Specification for RF Front-End Control Interface
version 2.1 - 18 December 2017’ as well as the ’Qualcomm RFFE Vendor specification 80-N7876-1 Rev. W’.
Table 14: MIPI Features
Feature
Supported
MIPI RFFE 2.1 standard
Yes
Register 0 write command sequence
Yes
Register read and write command sequence
Yes
Extended register read and write command se-
Yes
Comment
Backward compatible to MIPI 2.0 standard
quence
Masked write command sequence
Yes
Indicated as Mask Write
Support for standard frequency range operations
Yes
SCLK range 32 kHz to 26 MHz for read and write com-
for SCLK
mands
Support for extended frequency range operations
Yes
SCLK range 26 MHz to 52 MHz for write commands
for SCLK
Half speed read
Yes
Full speed read
Yes
Full speed write
Yes
Longer Reach RFFE Bus Length Feature
Yes
Programmable driver strength
Yes
Programmable Group SID
Yes
Programmable USID
Yes
Trigger functionality
Yes
Extended Triggers and Trigger Masks
Yes
Broadcast / GSID write to PM TRIG register
Yes
Reset
Yes
Status / error sum register
Yes
Extended product ID register
Yes
Revision ID register
Yes
Group SID register
Yes
USID_Sel pin
No
USID selection via SDATA / SCLK swap feature
No
Up to 80 pF
Via VIO, PM TRIG or software register
Table 15: Startup Behavior
Feature
State
Comment
Power status
Low power
Lower power mode after start-up
Trigger function
Enabled
Enabled after start-up. Programmable via behavior control register
Final Data Sheet
11
Revision 2.0
2020-09-03
BGS15MU14
SP5T High Isolation Switch for Feedback Receive
MIPI RFFE Specification
Table 16: Register Mapping, Table I
Register
Address
Register Name
Data Function
Bits
Description
0x00
SW_CTRL0
7:5
RESERVED
Reserved for future use
4
SW_CTRL_RF5
0: RF5 off
3
SW_CTRL_RF4
Default
0
Broadcast_ID
Support
Trigger
Support
R/W
No
Yes
R/W,
Mask
Write
No
No
R
No
No
R/W
1: RF5 on
0: RF4 off
0
1: RF4 on
2
SW_CTRL_RF3
0: RF3 off
0
1: RF3 on
1
SW_CTRL_RF2
0: RF2 off
0
1: RF2 on
0
SW_CTRL_RF1
0: RF1 off
0
1: RF1 on
0x1A
RFFE_STATUS
7
SOFTWARE RESET
0: Normal operation
0
1: Software reset (reset of all configuration registers to default values except
for USID, GSID and PM_TRIG)
6
0x1B
GROUP_SID
Final Data Sheet
COMMAND_FRAME_PARITY_ERR
Command Sequence received with parity error.
0
5
COMMAND_LENGTH_ERR
Command length error.
0
4
ADDRESS_FRAME_PARITY_ERR
Address frame with parity error.
0
3
DATA_FRAME_PARITY_ERR
Data frame with parity error.
0
2
READ_UNUSED_REG
Read command to an invalid address.
0
1
WRITE_UNUSED_REG
Write command to an invalid address.
0
0
BID_GID_ERR
Read command with a BROADCAST_ID
or GROUP_ID.
0
7:4
RESERVED
RESERVED
0x0
3:0
GROUP_SID[3:0]
Group slave ID
0x0
12
Revision 2.0
2020-09-03
BGS15MU14
SP5T High Isolation Switch for Feedback Receive
MIPI RFFE Specification
Table 17: Register Mapping, Table II
Register
Address
Register Name
0x1C
PM_TRIG
Data
Bits
Function
Description
Default
7
PWR_MODE[1], Operation Mode
Defines normal ACTIVE operation and
LOW POWER mode. 0: Normal operation (ACTIVE). 1: Low Power Mode (LOW
POWER)
1
6
PWR_MODE[0], State Bit Vector
Single bit Powered Reset.0: No action
(ACTIVE). 1: Powered Reset (STARTUP to
ACTIVE to LOW POWER)
0
5
TRIGGER_MASK_2
Trigger Mask 2. 0: Data writes to registers tied to TRIGGER_2 are masked.
1: Data writes to registers tied to TRIGGER_2 are not masked.
0
4
TRIGGER_MASK_1
Trigger Mask 1. 0: Data writes to registers tied to TRIGGER_1 are masked. 1:
Data writes to registers tied to TRIGGER_1 are not masked.
0
3
TRIGGER_MASK_0
Trigger Mask 0. 0: Data writes to registers tied to TRIGGER_0 are masked.
1: Data writes to registers tied to TRIGGER_0 are not masked.
0
2
TRIGGER_2
Trigger 2. This bit has no effect if TRIGGER_MASK_2 is 1. 0: No action. Data
is held in shadow registers. 1: Data is
transferred from shadow registers to active registers for registers tied to TRIGGER_2.
0
1
TRIGGER_1
Trigger 1. This bit has no effect if TRIGGER_MASK_1 is 1. 0: No action. Data
is held in shadow registers. 1: Data is
transferred from shadow registers to active registers for registers tied to TRIGGER_1.
0
0
TRIGGER_0
Trigger 0. This bit has no effect if TRIGGER_MASK_0 is 1. 0: No action. Data
is held in shadow registers. 1: Data is
transferred from shadow registers to active registers for registers tied to TRIGGER_0.
0
Broadcast_ID
Support
Trigger
Support
R/W
Yes
No
R/W,
Mask
Write
No
Yes
0x1D
PRODUCT_ID
7:0
PRODUCT_ID[7:0]
This is a read-only register. However,
during the programming of the USID a
write command sequence is performed
on this register, even though the write
does not change its value.
0xCE
No
No
R
0x1E
MANUFACTURER_ID
7:0
MANUFACTURER_ID[7:0]
Manufacturer ID.
0x1A
No
No
R
0x1F
MAN_USID
7:6
MANUFACTURER_ID[11:10]
Manufacturer ID.
00
No
No
R
5:4
MANUFACTURER_ID[9:8]
Manufacturer ID.
01
3:0
USID[3:0]
These bits store the USID of the device.
0xA
No
No
R/W
0x20
EXT_PRODUCT_ID
7:0
EXT_PRODUCT_ID
Extension to PRODUCT_ID in register
0x1D.
0x00
No
No
R
0x21
REV_ID
7:4
MAIN_REVISION
Chip Main Revision
0x0
No
No
R
3:0
SUB_REVISION
Chip Sub Revision
0x1
7:4
GSID0[3:0]
Primary Group Slave ID.
0x0
No
No
R/W
3:0
GSID1[3:0]
Secondary Group Slave ID.
0x0
7
UDR_RST
0: Normal Operation, 1: Software Reset
0
Yes
No
R/W
6:0
RESERVED
Reserved for future use. Set to all 0.
0000
000
0x22
0x23
GSID
UDR_RST
Final Data Sheet
13
Revision 2.0
2020-09-03
BGS15MU14
SP5T High Isolation Switch for Feedback Receive
MIPI RFFE Specification
Table 18: Register Mapping, Table III
Register
Address
Register Name
0x24
EPR_SUM
0x2B
0x2C
BUS_LD
TEST_PATT
Final Data Sheet
Data
Bits
Function
Description
Default
7
RESERVED
Reserved for future error codes.
0
6
COMMAND_FRAME_PARITY_ERR
Command Sequence received with parity error.
0
5
COMMAND_LENGTH_ERR
Command length error.
0
4
ADDRESS_FRAME_PARITY_ERR
Address frame with parity error.
0
3
DATA_FRAME_PARITY_ERR
Data frame with parity error.
0
2
READ_UNUSED_REG
Read command to an invalid address.
0
1
WRITE_UNUSED_REG
Write command to an invalid address.
0
0
BID_GID_ERR
Read command with a BROADCAST_ID
or GROUP_ID.
0
7:4
RESERVED
RESERVED
0x0
3:0
BUS_LD[3:0]
Set approximate bus load
0x0: 10 pF
0x1: 20 pF
0x2: 30 pF
0x3: 40 pF
0x4: 50 pF
0x5: 60 pF
0x6: 70 pF
0x7: 80 pF
0x8-0xF: Spare
0x04
7:0
TEST_PATT[7:0]
Test Pattern
0xD2
14
Broadcast_ID
Support
Trigger
Support
R/W
No
No
R
No
No
R/W
No
No
R
Revision 2.0
2020-09-03
BGS15MU14
SP5T High Isolation Switch for Feedback Receive
MIPI RFFE Specification
Table 19: Register Mapping, Table IV
Register
Address
Register Name
0x2D
EXT_TRIGGER_MASK
Final Data Sheet
Data
Bits
Function
Description
Default
7
EXT_TRIGGER_MASK_10
Extended Trigger Mask 10
0: Data writes to registers tied to
EXT_TRIGGER_10 are masked.
1: Data writes to registers tied to
EXT_TRIGGER_10 are not masked.
1
6
EXT_TRIGGER_MASK_9
Extended Trigger Mask 9
0: Data writes to registers tied to
EXT_TRIGGER_9 are masked.
1: Data writes to registers tied to
EXT_TRIGGER_9 are not masked.
1
5
EXT_TRIGGER_MASK_8
Extended Trigger Mask 8
0: Data writes to registers tied to
EXT_TRIGGER_8 are masked.
1: Data writes to registers tied to
EXT_TRIGGER_8 are not masked.
1
4
EXT_TRIGGER_MASK_7
Extended Trigger Mask 7
0: Data writes to registers tied to
EXT_TRIGGER_7 are masked.
1: Data writes to registers tied to
EXT_TRIGGER_7 are not masked.
1
3
EXT_TRIGGER_MASK_6
Extended Trigger Mask 6
0: Data writes to registers tied to
EXT_TRIGGER_6 are masked.
1: Data writes to registers tied to
EXT_TRIGGER_6 are not masked.
1
2
EXT_TRIGGER_MASK_5
Extended Trigger Mask 5
0: Data writes to registers tied to
EXT_TRIGGER_5 are masked.
1: Data writes to registers tied to
EXT_TRIGGER_5 are not masked.
1
1
EXT_TRIGGER_MASK_4
Extended Trigger Mask 4
0: Data writes to registers tied to
EXT_TRIGGER_4 are masked.
1: Data writes to registers tied to
EXT_TRIGGER_4 are not masked.
1
0
EXT_TRIGGER_MASK_3
Extended Trigger Mask 3
0: Data writes to registers tied to
EXT_TRIGGER_3 are masked.
1: Data writes to registers tied to
EXT_TRIGGER_3 are not masked.
1
15
Broadcast_ID
Support
Trigger
Support
R/W
No
No
R/W,
mask
write
Revision 2.0
2020-09-03
BGS15MU14
SP5T High Isolation Switch for Feedback Receive
MIPI RFFE Specification
Table 20: Register Mapping, Table V
Register
Address
Register Name
0x2E
EXT_TRIGGER
0x78
TEST_REG0
Final Data Sheet
Data
Bits
Function
Description
Default
7
EXT_TRIGGER_10
Extended Trigger 10.
0: No action. Data is held in shadow registers.
1: Data is transferred from shadow registers to active registers for refisters tied
to EXT_TRIGGER_10
0
6
EXT_TRIGGER_9
Extended Trigger 9.
0: No action. Data is held in shadow registers.
1: Data is transferred from shadow registers to active registers for refisters tied
to EXT_TRIGGER_9
0
5
EXT_TRIGGER_8
Extended Trigger 8.
0: No action. Data is held in shadow registers.
1: Data is transferred from shadow registers to active registers for refisters tied
to EXT_TRIGGER_8
0
4
EXT_TRIGGER_7
Extended Trigger 7.
0: No action. Data is held in shadow registers.
1: Data is transferred from shadow registers to active registers for refisters tied
to EXT_TRIGGER_7
0
3
EXT_TRIGGER_6
Extended Trigger 6.
0: No action. Data is held in shadow registers.
1: Data is transferred from shadow registers to active registers for refisters tied
to EXT_TRIGGER_6
0
2
EXT_TRIGGER_5
Extended Trigger 5.
0: No action. Data is held in shadow registers.
1: Data is transferred from shadow registers to active registers for refisters tied
to EXT_TRIGGER_5
0
1
EXT_TRIGGER_4
Extended Trigger 4.
0: No action. Data is held in shadow registers.
1: Data is transferred from shadow registers to active registers for refisters tied
to EXT_TRIGGER_4
0
0
EXT_TRIGGER_3
Extended Trigger 4.
0: No action. Data is held in shadow registers.
1: Data is transferred from shadow registers to active registers for refisters tied
to EXT_TRIGGER_3
0
7
RESERVED
RESERVED
0
6
RESERVED
RESERVED
0
5
RESERVED
RESERVED
0
4
RESERVED
RESERVED
0
3
RESERVED
RESERVED
0
2
EN_DIRECT_MAPPING
Enables the direct mapping functionality for testing-purposes.
0
1
EN_DIGITAL_TEST
Enables the loopback-test functionality.
Deactivates the switch-control!
0
0
RESERVED
RESERVED
0
16
Broadcast_ID
Support
Trigger
Support
R/W
No
No
R/W,
mask
write
No
No
R/W
Revision 2.0
2020-09-03
BGS15MU14
SP5T High Isolation Switch for Feedback Receive
MIPI RFFE Specification
Table 21: Modes of Operation (Truth Table)
Register Bits
State
Mode
B3
B2
B1
B0
1
Isolation
x
x
x
0
0
0
0
0
2
RF5 on
x
x
x
1
0
0
0
0
3
RF4 on
x
x
x
0
1
0
0
0
4
RF3 on
x
x
x
0
0
1
0
0
5
RF2 on
x
x
x
0
0
0
1
0
6
RF1 on
x
x
x
0
0
0
0
1
Final Data Sheet
B7
B6
B5
B4
17
Revision 2.0
2020-09-03
BGS15MU14
SP5T High Isolation Switch for Feedback Receive
Package Information
7 Package Information
The switch has a package size of 1900 µm in X-dimension and 1500 µm in Y-dimension with a maximum deviation of ±50 µm
in each dimension. Fig. 2 shows the footprint from top view. The pin definitions are listed in Tab. 23.
Table 22: Mechanical Data
Parameter
Symbol
Value
Unit
Package X-dimension
X
1900 ± 50
µm
Package Y-dimension
Y
1500 ± 50
µm
Package height
H
600 ± 50
µm
1
13
14
12
11
10
2
15
9
3
4
5
6
7
8
Figure 2: Pin Configuration (top view)
Table 23: Pin Definition and Function
Pin No.
Name
Function
1
RF1
RF input port 1
2
GND
RF ground
3
RF2
RF output port 2
4
SDATA
MIPI RFFE data
5
SCLK
MIPI RFFE clock
6
VIO
MIPI RFFE power supply
7
RF3
RF output port 3
8
GND
RF ground
9
RF4
RF output port 4
10
GND
RF ground
11
RF5
RF output port 5
12
GND
RF ground
13
ANT
Antenna
14
GND
RF ground
15
GND
RF ground
Final Data Sheet
18
Revision 2.0
2020-09-03
BGS15MU14
SP5T High Isolation Switch for Feedback Receive
Package Information
Figure 3: Marking Specification (top view)
Table 24: Year date code marking digit "Y"
Final Data Sheet
Year
"Y"
Year
"Y"
2010
0
2020
0
2011
1
2021
1
2012
2
2022
2
2013
3
2023
3
2014
4
2024
4
2015
5
2025
5
2016
6
2026
6
2017
7
2027
7
2018
8
2028
8
2019
9
2029
9
19
Revision 2.0
2020-09-03
BGS15MU14
SP5T High Isolation Switch for Feedback Receive
Package Information
Table 25: Week date code marking - digit "W"
Final Data Sheet
Week
"W"
Week
"W"
Week
"W"
Week
"W"
Week
"W"
1
A
12
N
23
4
34
h
45
v
2
B
13
P
24
5
35
j
46
x
3
C
14
Q
25
6
36
k
47
y
4
D
15
R
26
7
37
l
48
z
5
E
16
S
27
a
38
n
49
8
6
F
17
T
28
b
39
p
50
9
7
G
18
U
29
c
40
q
51
2
8
H
19
V
30
d
41
r
52
3
9
J
20
W
31
e
42
s
10
K
21
Y
32
f
43
t
11
L
22
Z
33
g
44
u
20
Revision 2.0
2020-09-03
BGS15MU14
SP5T High Isolation Switch for Feedback Receive
Package Information
Figure 4: Package Outline Drawing (top, side and bottom views)
Figure 5: Footprint Recommendation
Final Data Sheet
21
Revision 2.0
2020-09-03
BGS15MU14
SP5T High Isolation Switch for Feedback Receive
Package Information
Figure 6: Carrier Tape Drawing (top and side views)
Final Data Sheet
22
Revision 2.0
2020-09-03
BGS15MU14
SP5T High Isolation Switch for Feedback Receive
Revision History
Page or Item
Subjects (major changes since previous revision)
Revision 2.0, 2020-09-03
All
Final Data Sheet
"Preliminary" status removed, general update to final version
23
Revision 2.0
2020-09-03
Trademarks
All referenced product or service names and trademarks are the property of their respective owners.
Edition 2020-09-03
Published by
Infineon Technologies AG
81726 Munich, Germany
c 2020 Infineon Technologies AG.
All Rights Reserved.
Do you have a question about any
aspect of this document?
Email: erratum@infineon.com
Document reference
Doc_Number
IMPORTANT NOTICE
The information given in this document shall in no event
be regarded as a guarantee of conditions or characteristics ("Beschaffenheitsgarantie"). With respect to any examples, hints or any typical values stated herein and/or
any information regarding the application of the product, Infineon Technologies hereby disclaims any and all
warranties and liabilities of any kind, including without
limitation warranties of non-infringement of intellectual
property rights of any third party. In addition, any information given in this document is subject to customer’s
compliance with its obligations stated in this document
and any applicable legal requirements, norms and standards concerning customer’s products and any use of
the product of Infineon Technologies in customer’s applications. The data contained in this document is exclusively intended for technically trained staff. It is the
responsibility of customer’s technical departments to
evaluate the suitability of the product for the intended
application and the completeness of the product information given in this document with respect to such application.
For further information on technology, delivery terms
and conditions and prices, please contact the nearest
Infineon Technologies Office (www.infineon.com).
WARNINGS
Due to technical requirements products may contain
dangerous substances. For information on the types
in question please contact your nearest Infineon Technologies office.
Except as otherwise explicitly approved by Infineon
Technologies in a written document signed by authorized representatives of Infineon Technologies, Infineon
Technologies products may not be used in any applications where a failure of the product or any consequences
of the use thereof can reasonably be expected to result
in personal injury.