BSL202SNH6327XTSA1

BSL202SN OptiMOS®2 Small-Signal-Transistor Product Summary Features VDS • N-channel RDS(on),max • Enhancement mode • Super Logic level (2.5V rated) 20 V VGS=4.5 V 22 mW VGS=2.5 V 36 ID 7.5 A • Avalanche rated • dv /dt rated TSOP-6 • Pb-free lead plating; RoHS compliant 6 • Qualified according to AEC Q101 5 4 • Halogen free according to IEC61249-2-21 1 2 3 Type Package Tape and Reel Information Marking Lead Free Packing BSL202SN TSOP-6 H6327: 3000 pcs/ reel sPD Yes Non dry Maximum ratings, at T j=25 °C, unless otherwise specified Parameter Symbol Conditions Continuous drain current ID Value T A=25 °C 7.5 T A=70 °C 6.0 Unit A Pulsed drain current I D,pulse T A=25 °C 30 Avalanche energy, single pulse E AS I D=7.5 A, R GS=25 W 30 mJ Reverse diode dv /dt dv /dt I D=7.5 A, V DS=16 V, di /dt =200 A/µs, T j,max=150 °C 6 kV/µs Gate source voltage V GS Power dissipation1) P tot Operating and storage temperature T j, T stg ESD Class T A=25 °C JESD22-A114 -HBM Soldering Temperature V 2 W -55 ... 150 °C 0 (0V to 250V) 260 °C IEC climatic category; DIN IEC 68-1 Rev 2.0 ±12 55/150/56 page 1 2014-01-08 BSL202SN Parameter Values Symbol Conditions Unit min. typ. max. - - 50 minimal footprint - - 230 6 cm2 cooling area1) - - 62.5 Thermal characteristics Thermal resistance, junction - minimal footprint R thJS SMD version, device on PCB R thJA K/W Electrical characteristics, at T j=25 °C, unless otherwise specified Static characteristics Drain-source breakdown voltage V (BR)DSS V GS= 0 V, I D= 250 µA 20 - - Gate threshold voltage V GS(th) V DS=VGS, I D=30 µA 0.7 0.95 1.2 Drain-source leakage current I DSS V DS=20 V, V GS=0 V, T j=25 °C - - 1 V DS=20 V, V GS=0 V, T j=150 °C - - 100 V mA Gate-source leakage current I GSS V GS=12 V, V DS=0 V - - 100 nA Drain-source on-state resistance R DS(on) V GS=2.5 V, I D=5.9 A - 26 36 mW V GS=4.5 V, I D=7.5 A - 17 22 25 - Transconductance g fs |V DS|>2|I D|R DS(on)max, I D=7.5 A S 1) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm 2 (single layer, 70 µm thick) copper area for drain connection. PCB is vertical in still air. (t < 5 sec.) Rev 2.0 page 2 2014-01-08 BSL202SN Parameter Values Symbol Conditions Unit min. typ. max. - 863 1147 - 278 370 Dynamic characteristics Input capacitance C iss Output capacitance C oss Reverse transfer capacitance Crss - 40 60 Turn-on delay time t d(on) - 8.26 - Rise time tr - 27.5 - Turn-off delay time t d(off) - 18.9 - Fall time tf - 4.06 - Gate to source charge Q gs - 1.82 2.42 Gate to drain charge Q gd - 1.1 1.6 Gate charge total Qg - 5.8 8.7 Gate plateau voltage V plateau - 2 - V - - 2 A - - 30 - 0.8 1.2 V - 14.7 - ns - 4.62 - nC V GS=0 V, V DS=10 V, f =1 MHz V DD=10 V, V GS=4.5 V, I D=7.5 A, R G,ext=6 W pF ns Gate Charge Characteristics V DD=10 V, I D=7.5 A, V GS=0 to 4.5 V nC Reverse Diode Diode continous forward current IS Diode pulse current I S,pulse Diode forward voltage V SD Reverse recovery time t rr Reverse recovery charge Q rr Rev 2.0 T A=25 °C V GS=0 V, I F=7.5 A, T j=25 °C V R=10 V, I F=7.5 A, di F/dt =100 A/µs page 3 2014-01-08 BSL202SN 1 Power dissipation 2 Drain current P tot=f(T A) I D=f(T A); V GS≥4.5 V 8 2 7 6 1.6 1.2 ID [A] Ptot [W] 5 4 3 0.8 2 0.4 1 0 0 0 40 80 120 160 0 40 80 TA [°C] 120 160 TA [°C] 3 Safe operating area 4 Max. transient thermal impedance I D=f(V DS); T A=25 °C; D =0 Z thJA=f(t p) parameter: t p parameter: D =t p/T 102 102 limited by on-state resistance 10 µs 0.5 100 µs 101 1 ms 0.2 101 0.1 10 ms ZthJA [K/W] ID [A] 100 DC 10-1 0.05 0.02 100 0.01 10-2 single pulse 10-3 10-1 10-2 10-1 100 101 102 VDS [V] Rev 2.0 10-5 10-4 10-3 10-2 10-1 100 101 tp [s] page 4 2014-01-08 BSL202SN 5 Typ. output characteristics 6 Typ. drain-source on resistance I D=f(V DS); T j=25 °C R DS(on)=f(I D); T j=25 °C parameter: V GS parameter: V GS 16 60 4.5 V 1.8 V 2V 3V 2.2 V 14 2.5 V 12 50 2.4 V 40 2.2 V RDS(on) [mW] ID [A] 10 8 6 30 2.5 V 3V 20 2V 3.5 V 4.5 V 4 6V 10 2 1.8 V 1.6 V 0 0 0 1 2 3 0 4 8 VDS [V] 12 16 ID [A] 7 Typ. transfer characteristics 8 Typ. forward transconductance I D=f(V GS); |V DS|>2|I D|R DS(on)max g fs=f(I D); T j=25 °C 8 30 7 25 6 20 25 °C gfs [S] ID [A] 5 4 15 3 10 2 150 °C 5 1 0 0 0 1 2 3 VGS [V] Rev 2.0 0 1 2 3 4 5 6 7 8 ID [A] page 5 2014-01-08 BSL202SN 9 Drain-source on-state resistance 10 Typ. gate threshold voltage R DS(on)=f(T j); I D=7.5 A; V GS=4.5 V V GS(th)=f(T j); V DS=VGS; I D=30 µA 40 1.6 30 1.2 98 % 98 % VGS(th) [V] RDS(on) [mW] parameter: I D 20 typ typ 0.8 2% 10 0.4 0 0 -60 -20 20 60 100 140 -60 -20 20 Tj [°C] 60 100 140 Tj [°C] 11 Typ. capacitances 12 Forward characteristics of reverse diode C =f(V DS); V GS=0 V; f =1 MHz; Tj=25°C I F=f(V SD) parameter: T j 104 102 101 Ciss 103 IF [A] C [pF] 100 Coss 25 °C 10-1 150 °C, 98% 102 150 °C 25 °C, 98% Crss 10-2 101 10-3 0 5 10 15 20 VDS [V] Rev 2.0 0 0.4 0.8 1.2 1.6 VSD [V] page 6 2014-01-08 BSL202SN 13 Avalanche characteristics 14 Typ. gate charge I AS=f(t AV); R GS=25 W V GS=f(Q gate); I D=7.5 A pulsed parameter: T j(start) parameter: V DD 101 10 9 25 °C 8 100 °C 125 °C 7 16 V VGS [V] IAV [A] 6 100 10 V 5 4V 4 3 2 1 10-1 0 100 101 102 0 103 2 tAV [µs] 4 6 8 10 12 14 Qgate [nC] 15 Drain-source breakdown voltage 16 Gate charge waveforms V BR(DSS)=f(T j); I D=250 µA 25 V GS 24 Qg 23 VBR(DSS) [V] 22 21 20 V gs(th) 19 18 Q g(th) 17 Q sw Q gs 16 -60 -20 20 60 100 Q gate Q gd 140 Tj [°C] Rev 2.0 page 7 2014-01-08 BSL202SN Package Outline: TSOP6 Footprint: Packaging: Dimensions in mm Rev 2.0 page 8 2014-01-08 BSL202SN Published by Infineon Technologies AG 81726 München, Germany © Infineon Technologies AG 2006. All Rights Reserved. Attention please! The information given in this data sheet shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Rev 2.0 page 9 2014-01-08