BSL316CL6327HTSA1

BSL316C OptiMOS™ 2 + OptiMOS™-P 2 Small Signal Transistor Product Summary Features P N -30 30 V VGS=±10 V 150 160 mW VGS=±4.5 V 270 280 -1.5 1.4 · Complementary P + N channel VDS · Enhancement mode RDS(on),max · Logic level (4.5V rated) · Avalanche rated ID A · Qualified according to AEC Q101 · 100% lead-free; RoHS compliant PG-TSOP6 · Halogen free according to IEC61249-2-21 6 1 2 5 4 3 Type Package Tape and Reel Information Marking Lead Free Packing BSL316C PG-TSOP-6 H6327: 3000 pcs / reel sPJ Yes Non dry Maximum ratings, at T j=25 °C, unless otherwise specified 1) Parameter Continuous drain current ID N T A=25 °C -1.5 1.4 T A=70 °C -1.2 1.1 -6.0 5.6 11 3.7 I D,pulse T A=25 °C Avalanche energy, single pulse E AS P: I D=-1.5 A, N: I D=1.4 A, R GS=25 W Gate source voltage V GS Power dissipation1) P tot Operating and storage temperature T j, T stg ESD class T A=25 °C JESD22-A114-HBM T solder A mJ ±20 V 0.5 W -55 ... 150 °C 0 (2|I D|R DS(on)max, I D=-1.18 A - 2.7 - N |V DS|>2|I D|R DS(on)max, I D=1.1 A - 2.3 - P I GSS µA N Drain-source on-state resistance Transconductance S 2) Performed on 40mm2 FR4 PCB. The traces are 1mm wide, 70μm thick and 20mm long; they are present on both sides of the PCB Rev. 2.3 page 2 2014-07-21 BSL316C Parameter Values Symbol Conditions Unit min. typ. max. - 212 282 - 71 94 - 69 91 - 26 35 P Crss - 56 84 N - 5 7 P t d(on) - 5.0 - - 3.4 - - 6.5 - - 2.3 - - 14.3 - - 5.8 - P tf - 7.5 - N - 1.0 - P Q gs - -0.6 - - -1.2 - - -2.4 - - -2.9 - - 0.3 - - 0.2 - 0.6 - 3.4 - Dynamic characteristics Input capacitance P C iss N Output capacitance P C oss N Reverse transfer capacitance Turn-on delay time V GS=0 V, P: V DS=-15 V, N: V DS= 15 V, f =1 MHz N Rise time P tr N Turn-off delay time P t d(off) N Fall time P: V DD=-15 V, V GS=-10 V, R G=6 W, I D=-1.5 A N: V DD=15 V, V GS=10 V, R G=6 W, I D=1.4 A pF ns Gate Charge Characteristics Gate to source charge Gate to drain charge Q gd Switching charge Qg Gate plateau voltage V plateau Gate to source charge N Q gs Gate to drain charge Q gd Switching charge Qg Gate plateau voltage V plateau Rev. 2.3 V DD=-15 V, I D=-1.5 A, V GS=0 to -5 V V DD=15 V, I D=1.4 A, V GS=0 to 5 V - page 3 nC 2014-07-21 BSL316C Parameter Values Symbol Conditions Unit min. typ. max. - - -0.5 - - 0.5 P I S,pulse - - -6.0 N - - 5.6 Reverse Diode Diode continuous forward current P IS N A T C=25 °C Diode pulse current Diode forward voltage Reverse recovery time P V SD V GS=0 V, I F=-1.5 A, T j=25 °C - -0.8 -1.1 N V GS=0 V, I F=1.4 A, T j=25 °C - 0.86 1.1 - 8.2 - - 9.1 - - 2.1 - - 2.6 - P t rr N Reverse recovery charge P Q rr V R=±15 V, I F=I S, di F/dt =100 A/µs N Rev. 2.3 page 4 V ns nC 2014-07-21 BSL316C 2 Power dissipation (N) P tot=f(T A) P tot=f(T A) 0.6 0.6 0.5 0.5 0.4 0.4 Ptot [W] Ptot [W] 1 Power dissipation (P) 0.3 0.3 0.2 0.2 0.1 0.1 0 0 0 40 80 120 0 160 40 TA [°C] 4 Drain current (N) I D=f(T A) I D=f(T A) parameter: V GS≤-10 V parameter: V GS≥10 V 1.6 1.6 1.4 1.4 1.2 1.2 1 1 ID [A] -ID [A] 120 160 120 160 TA [°C] 3 Drain current (P) 0.8 0.8 0.6 0.6 0.4 0.4 0.2 0.2 0 0 0 40 80 120 160 TA [°C] Rev. 2.3 80 0 40 80 TA [°C] page 5 2014-07-21 BSL316C 5 Safe operating area (P) 6 Safe operating area (N) I D=f(V DS); T A=25 °C; D =0 I D=f(V DS); T A=25 °C; D =0 parameter: t p parameter: t p 101 101 1 µs 1 µs 10 µs 10 µs 100 µs 100 µs 1 ms 100 100 1 ms 10 ms ID [A] -ID [A] 10 ms DC 10-1 DC 10-1 10-2 10-2 10-1 100 101 102 10-1 100 -VDS [V] 101 VDS [V] 7 Max. transient thermal impedance (P) 8 Max. transient thermal impedance (N) Z thJA=f(t p) Z thJA=f(t p) parameter: D =t p/T parameter: D =t p/T 103 103 0.5 0.5 ZthJA [K/W] 102 ZthJA [K/W] 102 0.2 0.1 0.05 101 0.2 0.1 0.05 101 0.02 0.01 0.02 0.01 single pulse single pulse 100 100 10-5 10-4 10-3 10-2 10-1 100 101 102 tp [s] Rev. 2.3 102 10-5 10-4 10-3 10-2 10-1 100 101 102 tp [s] page 6 2014-07-21 BSL316C 9 Typ. output characteristics (P) 10 Typ. output characteristics (N) I D=f(V DS); T j=25 °C I D=f(V DS); T j=25 °C parameter: V GS parameter: V GS 6 6 -10 V -5 V -4.5 V -4 V 10 V 5V 4.5 V 5 5 4 -3.5 V ID [A] -ID [A] 4 3 2 4V 3 2 -3 V 3.5 V 1 1 3V -2.5 V 0 2.5 V 0 0 1 2 3 0 1 2 -VDS [V] 3 VDS [V] 11 Typ. drain-source on resistance (P) 12 Typ. drain-source on resistance (N) R DS(on)=f(I D); T j=25 °C R DS(on)=f(I D); T j=25 °C parameter: V GS parameter: V GS 400 400 350 350 -3 V 3.5 V -3.5 V 300 300 RDS(on) [mW] RDS(on) [mW] 4V 250 -4 V 200 -4.5 V -5 V 150 4.5 V 200 5V 150 10 V -10 V 100 100 50 50 0 0 0 1 2 3 4 5 -ID [A] Rev. 2.3 250 0 1 2 3 4 5 ID [A] page 7 2014-07-21 BSL316C 13 Typ. transfer characteristics (P) 14 Typ. transfer characteristics (N) I D=f(V GS); |V DS |>2 | ID| RDS(on)max I D=f(V GS); |V DS |>2 | I D | R DS(on)max parameter: T j parameter: T j 6 6 5 5 25 °C 150 °C 25 °C 4 ID [A] -ID [A] 4 3 3 150 °C 2 2 1 1 0 0 0 1 2 3 4 0 5 1 2 -VGS [V] 3 4 VGS [V] 16 Drain-source on-state resistance (N) R DS(on)=f(T j); I D=-1.5 A; V GS=-10 V R DS(on)=f(T j); I D=1.4 A; V GS=10 V 300 300 250 250 200 200 RDS(on) [mW] RDS(on) [mW] 15 Drain-source on-state resistance (P) 98% 150 5 98% 150 typ typ 100 100 50 50 0 0 -60 -20 20 60 100 140 180 Tj [°C] Rev. 2.3 -60 -20 20 60 100 140 180 Tj [°C] page 8 2014-07-21 BSL316C 17 Typ. gate threshold voltage (P) 18 Typ. gate threshold voltage (N) V GS(th)=f(T j); V GS=V DS; I D=-11 µA V GS(th)=f(T j); V GS=V DS; I D=3.7 µA 2.8 2.8 2.4 2.4 2 1.6 VGS(th) [V] -VGS(th) [V] max min 2 typ 1.2 1.6 typ 1.2 min max 0.8 0.8 0.4 0.4 0 0 -60 -20 20 60 100 140 180 -60 -20 20 Tj [°C] 60 100 140 180 Tj [°C] 19 Typ. capacitances (P) 20 Typ. capacitances (N) C =f(V DS); V GS=0 V; f =1 MHz C =f(V DS); V GS=0 V; f =1 MHz 103 102 Ciss Coss C [pF] C [pF] Ciss 102 Coss 101 Crss Crss 101 100 0 10 20 30 -VDS [V] Rev. 2.3 0 10 20 30 VDS [V] page 9 2014-07-21 BSL316C 21 Forward characteristics of reverse diode (P) 22 Forward characteristics of reverse diode (N) I F=f(V SD) I F=f(V SD) parameter: T j parameter: T j 101 101 100 100 150 °C 25 °C 150 °C IF [A] -IF [A] 25 °C 10-1 10-1 25 °C, 98% 98%, 150°C 150 °C, 98% 98%, 25 °C 10-2 10-2 0 0.5 1 1.5 2 0 0.5 1 -VSD [V] 24 Avalanche characteristics (N) I AS=f(t AV); R GS=25 W I AS=f(t AV); R GS=25 W parameter: T j(start) parameter: T j(start) 10 IAV [A] 10 -IAV [A] 2 VSD [V] 23 Avalanche characteristics (P) 25 °C 1 100 °C 125 °C 0.1 1 25 °C 125 °C 100 °C 0.1 1 10 100 1000 tAV [µs] Rev. 2.3 1.5 1 10 100 1000 tAV [µs] page 10 2014-07-21 BSL316C 25 Typ. gate charge (P) 26 Typ. gate charge (N) V GS=f(Q gate); I D=-1.5 A pulsed V GS=f(Q gate); I D=1.4 A pulsed parameter: V DD parameter: V DD 10 10 8 8 6V -6 V -15 V 15 V 24 V -24 V 6 VGS [V] -VGS [V] 6 4 4 2 2 0 0 0 1 2 3 4 5 0 0.2 0.4 -Qgate [nC] 0.6 0.8 28 Drain-source breakdown voltage (N) V BR(DSS)=f(T j); I D=-250 µA V BR(DSS)=f(T j); I D=250 µA 36 36 34 34 32 32 VBR(DSS) [V] -VBR(DSS) [V] 1.2 140 180 Qgate [nC] 27 Drain-source breakdown voltage (P) 30 30 28 28 26 26 24 24 -60 -20 20 60 100 140 180 Tj [°C] Rev. 2.3 1 -60 -20 20 60 100 Tj [°C] page 11 2014-07-21 BSL316C Package Outline: TSOP6 Footprint: Packaging: Dimensions in mm Note: For symmetric types there is no defined Pin 1 orientation in the reel. Rev. 2.3 page 12 2014-07-21 BSL316C Published by Infineon Technologies AG 81726 Munich, Germany © 2008 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Rev. 2.3 page 13 2014-07-21