BSO130P03SHXUMA1

BSO130P03S H OptiMOS®-P Small-Signal-Transistor Product Summary Features • P-Channel • Enhancement mode V DS -30 V R DS(on),max 13 mΩ ID -11.7 A • Logic level PG-DSO-8 • 150°C operating temperature • qualified according JEDEC for target applications • Pb-free lead plating; RoHS compliant • Halogen-free according to IEC61249-2-21 Type Package Marking BSO130P03S H PG-DSO-8 130P3S Lead free Yes Halogen free packing Yes dry Maximum ratings, at T j=25 °C, unless otherwise specified Parameter Continuous drain current Value Symbol Conditions ID Unit ≤10 secs steady state T A=25 °C1) -11.7 -9.2 T A=70 °C1) -9.3 -7.4 A Pulsed drain current I D,pulse T A=25 °C2) -47 Avalanche energy, single pulse E AS I D=11.7 A, R GS=25 Ω 148 mJ Gate source voltage V GS ±25 V Power dissipation P tot Operating and storage temperature T j, T stg ESD T A=25 °C1) 1.56 W -55 ... 150 °C 260 °C JESD22-A114 HBM Soldering temperature 55/150/56 IEC climatic category; DIN IEC 68-1 Rev. 1.3 2.36 page 1 2010-05-07 BSO130P03S H Parameter Values Symbol Conditions Unit min. typ. max. - - 35 minimal footprint, t p≤10 s - - 110 minimal footprint, steady state - - 150 6 cm2 cooling area1), t p≤10 s - - 50 6 cm2 cooling area1), steady state - - 80 Thermal characteristics Thermal resistance, junction - soldering point R thJS Thermal resistance, junction - ambient R thJA K/W Electrical characteristics, at T j=25 °C, unless otherwise specified Static characteristics Drain-source breakdown voltage V (BR)DSS V GS=0 V, I D=-250µA -30 - - Gate threshold voltage V GS(th) V DS=V GS, I D=-140 µA -1 -1.5 -2.2 Zero gate voltage drain current I DSS V DS=-30 V, V GS=0 V, T j=25 °C - -0.1 -1 V DS=-30 V, V GS=0 V, T j=125 °C - -10 -100 V µA Gate-source leakage current I GSS V GS=-25 V, V DS=0 V - - -100 nA Drain-source on-state resistance R DS(on) V GS=-10 V, I D=-11.7 A - 9.9 13.0 mΩ Transconductance g fs |V DS|>2|I D|R DS(on)max, I D=-9.3 A 14 27 - S 1) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 µm thick) copper area for drain connection. PCB is vertical in still air. Rev. 1.3 page 2 2010-05-07 BSO130P03S H Parameter Values Symbol Conditions Unit min. typ. max. - 2650 3520 - 708 942 Dynamic characteristics Input capacitance C iss V GS=0 V, V DS=-25 V, f =1 MHz Output capacitance C oss Reverse transfer capacitance C rss - 580 870 Turn-on delay time t d(on) - 13 20 Rise time tr - 16 24 Turn-off delay time t d(off) - 70 105 Fall time tf - 62 93 Gate to source charge Q gs - -7 -9 Gate charge at threshold Q g(th) - -3.7 -5.0 Gate to drain charge Q gd - -21 -32 Switching charge Q sw - -25 -36 Gate charge total Qg - -61 -81 Gate plateau voltage V plateau - -2.6 - Output charge Q oss - -22 -29 - - -2.1 - - -45 V DD=-15 V, V GS=-10 V, I D=-1 A, R G=6 Ω pF ns Gate Charge Characteristics 3) V DD=-24 V, I D=11.3 A, V GS=0 to -10 V V DD=-15 V, V GS=0 V nC V Reverse Diode Diode continous forward current IS Diode pulse current I S,pulse Diode forward voltage V SD V GS=0 V, I F=-11.7 A, T j=25 °C - -0.84 -1.2 V Reverse recovery time t rr V R=15 V, I F=-11.7 A, di F/dt =100 A/µs - 26 33 ns Reverse recovery charge Q rr - 16 20 nC 2) 3) Rev. 1.3 T A=25 °C A See figure 3 See figure 16 for gate charge parameter definition page 3 2010-05-07 BSO130P03S H 2 Drain current P tot=f(T A); t p≤10 s I D=f(T A); |V GS|≥10 V; t p≤10 s 3 12 2.5 10 2 8 -I D [A] P tot [W] 1 Power dissipation 1.5 6 1 4 0.5 2 0 0 0 40 80 120 160 0 40 80 T A [°C] 120 3 Safe operating area 4 Max. transient thermal impedance I D=f(V DS); T A=25 °C1); D =0 Z thJS=f(t p) parameter: t p parameter: D =t p/T 102 160 T A [°C] 102 100 100 10 µs 1 µs 0.5 100 µs 101 1 ms 10 ms 0.05 Z thJS [K/W] -I D [A] 10-1 1 0.02 100 1 0.01 10-1 DC 0.1 0.2 10 0.1 limited by on-state resistance 100 101 10 0.1 single pulse 10-2 Rev. 1.3 0.01 0.1 1 10 100 10-1 100 101 102 -V DS [V] page 4 10-2 0.01 0.00001 0.0001 0.001 0.01 0.1 1 10 10-5 10-4 10-3 10-2 10-1 100 101 t p [s] 2010-05-07 BSO130P03S H 5 Typ. output characteristics 6 Typ. drain-source on resistance I D=f(V DS); T j=25 °C R DS(on)=f(I D); T j=25 °C parameter: V GS parameter: V GS 45 40 -10 V -2.5 V -3.5 V -4.5 V 40 -2.7 V -3.2 V -3 V 35 35 30 -3.2 V R DS(on) [mΩ] -I D [A] 30 25 -3 V 20 25 -3.5 V 20 15 -4.5 V 10 -10 V 15 -2.7 V 10 -2.5 V 5 5 -2.3 V 0 0 0 1 2 3 0 10 20 -V DS [V] 30 40 -I D [A] 7 Typ. transfer characteristics 8 Typ. forward transconductance I D=f(V GS); |V DS|>2|I D|R DS(on)max g fs=f(I D); T j=25 °C parameter: T j 60 40 40 g fs [S] -I D [A] 30 20 20 10 C °150 C °25 0 0 0 1 2 3 4 Rev. 1.3 0 10 20 30 -I D [A] -V GS [V] page 5 2010-05-07 BSO130P03S H 9 Drain-source on-state resistance 10 Typ. gate threshold voltage R DS(on)=f(T j); I D=-11.7 A; V GS=-10 V V GS(th)=f(T j); V GS=V DS; I D=-140 µA 20 2.5 2 12 1.5 -V GS(th) [V] R DS(on) [mΩ] 98 % 16 typ. 8 4 max. typ. min. 1 0.5 0 0 -60 -20 20 60 100 140 180 -60 -20 20 60 T j [°C] 100 140 180 T j [°C] 11 Typ. capacitances 12 Forward characteristics of reverse diode C =f(V DS); V GS=0 V; f =1 MHz I F=f(V SD) parameter: T j 104 100 10000 25 °C, typ 150 °C, typ 103 10 Coss 1000 25 °C, 98% I F [A] C [pF] Ciss 150 °C, 98% Crss 1 102 0.1 100 0 10 20 30 Rev. 1.3 0 0.5 1 1.5 -V SD [V] -V DS [V] page 6 2010-05-07 BSO130P03S H 13 Avalanche characteristics 14 Typ. gate charge I AS=f(t AV); R GS=25 Ω V GS=f(Q gate); I D=-11.7 A pulsed parameter: T j(start) parameter: V DD 100 10 9 -6 V -15 V -24 V 8 6 C °25 -V GS [V] -I AV [A] 7 10 5 4 C °100 C °125 3 2 1 1 0 1 10 100 1000 0 20 40 60 -Q gate [nC] t AV [µs] 15 Drain-source breakdown voltage 16 Gate charge waveforms V BR(DSS)=f(T j); I D=-250 µA 36 V GS 34 Qg 32 -V BR(DSS) [V] 30 28 V g s(th) 26 24 Q g(th) 22 Q sw Q gs 20 -60 -20 20 60 100 140 Q g ate Q gd 180 T j [°C] Rev. 1.3 page 7 2010-05-07 BSO130P03S H Package Outline P-DSO-8: Outline Rev. 1.3 page 8 2010-05-07 BSO130P03S H Published by Infineon Technologies AG 81726 Munich, Germany © 2008 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Rev. 1.3 page 9 2010-05-07