BSO203P
OptiMOS -P Power-Transistor
TM
Product Summary
Feature
• P-Channel
• Enhancement mode
• 150°C operating temperature
• Avalanche rated
• dv/dt rated
BSO203P
P-SO 8
V
RDS(on)
21
mΩ
-8.2
S1
1
8
D1
G1
2
7
D1
S2
3
6
D2
G2
4
5
D2
Top View
Package
-20
ID
• Super Logic Level (2.5 V rated)
Type
VDS
A
SIS00070
Maximum Ratings,at Tj = 25 °C, unless otherwise specified
Parameter
Symbol
Continuous drain current
ID
Value
A
TA=25°C
-8.2
TA=70°C
-6.6
ID puls
Pulsed drain current
Unit
-32.8
TA=25°C
EAS
97
mJ
dv/dt
-6
kV/µs
Gate source voltage
VGS
±12
V
Power dissipation
Ptot
2
W
-55... +150
°C
Avalanche energy, single pulse
ID =-8.2 A , VDD =-10V, RGS =25Ω
Reverse diode dv/dt
IS =-8.2A, VDS =-16V, di/dt=200A/µs, Tjmax =150°C
TA=25°C
Tj , Tstg
Operating and storage temperature
IEC climatic category; DIN IEC 68-1
Rev.1.2
55/150/56
Page 1
2002-01-08
BSO203P
Thermal Characteristics
Symbol
Parameter
Values
Unit
min.
typ.
max.
-
-
50
@ min. footprint, t < 10s
-
-
110
@ 6 cm 2 cooling area
-
-
62.5
Characteristics
Thermal resistance, junction - soldering point
RthJS
SMD version, device on PCB:
RthJA
1)
K/W
Electrical Characteristics, at Tj = 25 °C, unless otherwise specified
Parameter
Symbol
Values
Unit
min.
typ.
max.
V(BR)DSS
-20
-
-
VGS(th)
-0.6
0.9
-1.2
Static Characteristics
Drain-source breakdown voltage
V
VGS =0, ID=-250µA
Gate threshold voltage, VGS = VDS
ID =-100µA
IDSS
Zero gate voltage drain current
µA
VDS =-20V, VGS =0, Tj =25°C
-
-0.1
-1
VDS =-20V, VGS =0, Tj =150°C
-
-10
-100
IGSS
-
-10
-100
nA
RDS(on)
-
26
35
mΩ
RDS(on)
-
18.6
21
Gate-source leakage current
VGS =-12V, VDS =0
Drain-source on-state resistance
VGS =-2.5V, ID =-6.4A
Drain-source on-state resistance
VGS =-4.5, ID =-8.2A
1Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm2 (one layer, 70 µm thick) copper area for drain
connection. PCB is vertical without blown air; t ≤10 sec.
Rev.1.2
Page 2
2002-01-08
BSO203P
Electrical Characteristics, at Tj = 25 °C, unless otherwise specified
Parameter
Symbol
Conditions
Values
Unit
min.
typ.
max.
17
34
-
S
pF
Dynamic Characteristics
Transconductance
gfs
çVDS ç≥2*çIDç*RDS(on)max
ID =-6.6A
Input capacitance
Ciss
VGS =0, VDS =-15V,
-
2242
-
Output capacitance
Coss
f=1MHz
-
852
-
Reverse transfer capacitance
Crss
-
690
-
Turn-on delay time
td(on)
VDD =-10V, VGS =-4.5V,
-
15.5
23.2
Rise time
tr
ID =-1A, RG=6Ω
-
25.9
38.9
Turn-off delay time
td(off)
-
59
88.5
Fall time
tf
-
63.3
95
-
-3.5
-5.2
-
-15.1
-22.6
-
-32.4
-48.6
V(plateau) VDD =-15V, ID =-8.2A
-
-1.6
-
V
IS
-
-
-2.5
A
-
-
-32.8
ns
Gate Charge Characteristics
Gate to source charge
Qgs
Gate to drain charge
Qgd
Gate charge total
Qg
VDD =-15V, ID =-8.2A
VDD =-15V, ID =-8.2A,
nC
VGS =0 to -4.5V
Gate plateau voltage
Reverse Diode
Inverse diode continuous
TA=25°C
forward current
Inverse diode direct current,
ISM
pulsed
Inverse diode forward voltage
VSD
VGS =0, IF=8.2A
-
0.85
1.3
V
Reverse recovery time
trr
VR =-10V, |IF | = |lD |,
-
35.7
44.6
ns
Reverse recovery charge
Qrr
diF /dt=100A/µs
-
18.7
23.4
nC
Rev.1.2
Page 3
2002-01-08
BSO203P
1 Power dissipation
2 Drain current
Ptot = f (TA )
ID = f (TA )
parameter: |VGS |≥ 4.5 V
2.2
BSO203P
-10
W
A
1.8
-8
1.6
-7
1.4
ID
Ptot
BSO203P
-6
1.2
-5
1
-4
0.8
-3
0.6
-2
0.4
-1
0.2
0
0
20
40
60
80
100
120
°C
0
0
160
20
40
60
80
100
120
TA
4 Transient thermal impedance
ID = f ( VDS )
ZthJS = f (tp )
parameter : D = 0 , TA = 25 °C
-10
parameter : D = tp /T
/I D
=
A
S(
o
V
160
TA
3 Safe operating area
2 BSO203P
°C
10 2
DS
BSO203P
K/W
tp = 120.0µs
n)
RD
10 1
Z thJS
1 ms
-10 1
ID
10 ms
-10 0
10 0
10 -1
D = 0.50
0.20
10
-2
0.10
0.05
-10 -1
DC
0.02
10 -3
0.01
single pulse
-10 -2 -1
-10
-10
0
-10
1
V
-10
2
VDS
Rev.1.2
Page 4
10 -4 -7
10
10
-6
10
-5
10
-4
10
-3
10
-2
s
10
0
tp
2002-01-08
BSO203P
5 Typ. output characteristic
6 Typ. drain-source on resistance
ID = f (VDS ); Tj=25°C
RDS(on) = f (ID )
parameter: tp = 80 µs
parameter: VGS
0.03
90
Vgs = -2.5V
A
Vgs = -3.5V
Ω
Vgs = -3V
Vgs = -3V
RDS(on)
- ID
70
60
Vgs = -4V
Vgs = -4.5V
Vgs = -6V
Vgs = -10V
50
0.02
Vgs = -3.5V
0.015
Vgs = -2.5V
40
0.01
30
20
Vgs = -4V
Vgs = -4.5V
Vgs = -5V
Vgs = -6V
Vgs = -8V
Vgs = -10V
Vgs = -2V
0.005
10
0
0
2
4
6
0
0
10
V
5
10
15
20
25
30
35
40
A 50
- ID
- V DS
7 Typ. transfer characteristics
8 Typ. forward transconductance
ID= f ( VGS ); |VDS |≥ 2 x |ID| x RDS(on)max
gfs = f(ID); Tj=25°C
parameter: tp = 80 µs
parameter: tp = 80 µs
35
60
A
S
- ID
g fs
25
40
20
30
15
20
10
10
5
0
0
0.5
1
1.5
2
V
0
0
3
- V GS
Rev.1.2
5
10
15
20
25
35
A
- ID
Page 5
2002-01-08
BSO203P
9 Drain-source on-resistance
10 Gate threshold voltage
RDS(on) = f(Tj )
VGS(th) = f (Tj)
parameter: ID = -8.2 A, VGS = -4.5 V
parameter: VGS = VDS , ID = -100 µA
30
1.4
mΩ
V
98%
- VGS(th)
RDS(on)
26
24
1
98%
0.8
22
20
typ.
typ.
0.6
18
0.4
2%
16
0.2
14
12
-60
-20
20
60
100
0
-60
°C 160
Tj
-20
20
60
100
°C 160
Tj
11 Typ. capacitances
12 Forward character. of reverse diode
C = f (VDS)
IF = f (VSD)
parameter: VGS =0, f=1 MHz
parameter: Tj , tp = 80 µs
10
4
-10 2
BSO203P
A
pF
C iss
C
IF
-10 1
Coss
10 3
C rss
-10 0
Tj = 25 °C typ
Tj = 150 °C typ
Tj = 25 °C (98%)
Tj = 150 °C (98%)
10 2
0
5
V
15
- V DS
Rev.1.2
-10 -1
0
0.4
0.8
1.2
1.6
2
2.4 V
3
VSD
Page 6
2002-01-08
BSO203P
13 Typ. avalanche energy
14 Typ. gate charge
EAS = f (Tj ), par.: ID = -8.2 A
|VGS| = f (QGate )
VDD = -10 V, RGS = 25 Ω
parameter: ID = -8.2 A pulsed
100
12
V
mJ
10
80
- VGS
E AS
9
70
60
8
7
50
6
40
5
0.2 VDS max.
0.5 VDS max.
0.8 VDS max.
4
30
3
20
2
10
1
0
25
50
75
100
150
°C
Tj
0
0
10
20
30
40
nC
60
|QGate |
15 Drain-source breakdown voltage
V(BR)DSS = f (Tj )
-24.5
BSO203P
V
V (BR)DSS
-23.5
-23
-22.5
-22
-21.5
-21
-20.5
-20
-19.5
-19
-18.5
-18
-60
-20
20
60
100
°C
180
Tj
Rev.1.2
Page 7
2002-01-08
BSO203P
Rev.1.2
Page 8
2002-01-08