BSZ019N03LS
MOSFET
OptiMOSTMPower-MOSFET,30V
TSDSON-8FL(S3O8)
Features
•OptimizedforhighperformanceBuckconverter(Server,VGA)
•VeryLowFOMQOSSforHighFrequencySMPS
•LowFOMSWforHighFrequencySMPS
•ExcellentgatechargexRDS(on)product(FOM)
•Verylowon-resistanceRDS(on)@VGS=4.5V
•100%avalanchetested
•Superiorthermalresistance
•N-channel
•QualifiedaccordingtoJEDEC1)fortargetapplications
•Pb-freeleadplating;RoHScompliant
•Halogen-freeaccordingtoIEC61249-2-21
Table1KeyPerformanceParameters
Parameter
Value
Unit
VDS
30
V
RDS(on),max
1.9
mΩ
ID
149
A
QOSS
25
nC
QG(0V..10V)
44
nC
S1
8D
S2
7D
S3
6D
G4
5D
Type/OrderingCode
Package
Marking
RelatedLinks
BSZ019N03LS
PG-TSDSON-8 FL
019N03L
-
1)
J-STD20 and JESD22
Final Data Sheet
1
Rev.2.4,2020-11-13
OptiMOSTMPower-MOSFET,30V
BSZ019N03LS
TableofContents
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Electrical characteristics diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Disclaimer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Final Data Sheet
2
Rev.2.4,2020-11-13
OptiMOSTMPower-MOSFET,30V
BSZ019N03LS
1Maximumratings
atTA=25°C,unlessotherwisespecified
Table2Maximumratings
Parameter
Symbol
Values
Unit
Note/TestCondition
149
94
130
82
22
A
VGS=10V,TC=25°C
VGS=10V,TC=100°C
VGS=4.5V,TC=25°C
VGS=4.5V,TC=100°C
VGS=4.5V,TA=25°C,RthJA=60K/W
-
596
A
TC=25°C
-
-
20
A
TC=25°C
EAS
-
-
150
mJ
ID=20A,RGS=25Ω
Gate source voltage
VGS
-20
-
20
V
-
Power dissipation
Ptot
-
-
69
2.1
W
TC=25°C
TA=25°C,RthJA=60K/W
Operating and storage temperature
Tj,Tstg
-55
-
150
°C
IEC climatic category;
DIN IEC 68-1: 55/150/56
Unit
Note/TestCondition
Min.
Typ.
Max.
ID
-
-
ID,pulse
-
Avalanche current, single pulse
IAS
Avalanche energy, single pulse
Continuous drain current1)
Pulsed drain current2)
3)
2Thermalcharacteristics
Table3Thermalcharacteristics
Parameter
Symbol
Thermal resistance, junction - case
Device on PCB,
6 cm2 cooling area4)
Values
Min.
Typ.
Max.
RthJC
-
-
1.8
K/W
-
RthJA
-
-
60
K/W
-
1)
Rating refers to the product only with datasheet specified absolute maximum values, maintaining case temperature
at 25°C. For higher case temperature please refer to Diagram 2. De-rating will be required based on the actual
environmental conditions.
2)
See Diagram 3 for more detailed information
3)
See Diagram 13 for more detailed information
4)
Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 µm thick) copper area for drain connection.
PCB is vertical in still air.
Final Data Sheet
3
Rev.2.4,2020-11-13
OptiMOSTMPower-MOSFET,30V
BSZ019N03LS
3Electricalcharacteristics
atTj=25°C,unlessotherwisespecified
Table4Staticcharacteristics
Parameter
Symbol
Drain-source breakdown voltage
Values
Unit
Note/TestCondition
-
V
VGS=0V,ID=1mA
-
2
V
VDS=VGS,ID=250µA
-
0.1
10
1
100
µA
VDS=30V,VGS=0V,Tj=25°C
VDS=30V,VGS=0V,Tj=125°C
IGSS
-
10
100
nA
VGS=20V,VDS=0V
Drain-source on-state resistance
RDS(on)
-
2.0
1.6
2.5
1.9
mΩ
VGS=4.5V,ID=20A
VGS=10V,ID=20A
Gate resistance
RG
0.4
0.8
1.6
Ω
-
Transconductance
gfs
70
140
-
S
|VDS|>2|ID|RDS(on)max,ID=30A
Unit
Note/TestCondition
Min.
Typ.
Max.
V(BR)DSS
30
-
Gate threshold voltage
VGS(th)
1.2
Zero gate voltage drain current
IDSS
Gate-source leakage current
Table5Dynamiccharacteristics
Parameter
Symbol
Input capacitance1)
Values
Min.
Typ.
Max.
Ciss
-
2800
3800
pF
VGS=0V,VDS=15V,f=1MHz
Output capacitance1)
Coss
-
960
1300
pF
VGS=0V,VDS=15V,f=1MHz
Reverse transfer capacitance
Crss
-
140
-
pF
VGS=0V,VDS=15V,f=1MHz
Turn-on delay time
td(on)
-
5.4
-
ns
VDD=15V,VGS=10V,ID=30A,
RG,ext=1.6Ω
Rise time
tr
-
6.8
-
ns
VDD=15V,VGS=10V,ID=30A,
RG,ext=1.6Ω
Turn-off delay time
td(off)
-
28
-
ns
VDD=15V,VGS=10V,ID=30A,
RG,ext=1.6Ω
Fall time
tf
-
4.6
-
ns
VDD=15V,VGS=10V,ID=30A,
RG,ext=1.6Ω
Unit
Note/TestCondition
Table6Gatechargecharacteristics2)
Parameter
Symbol
Gate to source charge1)
Gate charge at threshold
Values
Min.
Typ.
Max.
Qgs
-
7.0
9.3
nC
VDD=15V,ID=30A,VGS=0to4.5V
Qg(th)
-
4.6
-
nC
VDD=15V,ID=30A,VGS=0to4.5V
Gate to drain charge
Qgd
-
6.5
8.5
nC
VDD=15V,ID=30A,VGS=0to4.5V
Switching charge
Qsw
-
9.0
-
nC
VDD=15V,ID=30A,VGS=0to4.5V
Gate charge total
Qg
-
22
29
nC
VDD=15V,ID=30A,VGS=0to4.5V
Gate plateau voltage
Vplateau
-
2.5
-
V
VDD=15V,ID=30A,VGS=0to4.5V
Gate charge total1)
Qg
-
44
59
nC
VDD=15V,ID=30A,VGS=0to10V
Gate charge total, sync. FET
Qg(sync)
-
18
-
nC
VDS=0.1V,VGS=0to4.5V
Qoss
-
25
33
nC
VDD=15V,VGS=0V
1)
1)
1)
Output charge
1)
2)
Defined by design. Not subject to production test
See ″Gate charge waveforms″ for parameter definition
Final Data Sheet
4
Rev.2.4,2020-11-13
OptiMOSTMPower-MOSFET,30V
BSZ019N03LS
Table7Reversediode
Parameter
Symbol
Diode continuous forward current
Values
Unit
Note/TestCondition
69
A
TC=25°C
-
596
A
TC=25°C
-
0.8
1
V
VGS=0V,IF=20A,Tj=25°C
-
20
-
nC
VR=15V,IF=IS,diF/dt=400A/µs
Min.
Typ.
Max.
IS
-
-
Diode pulse current
IS,pulse
-
Diode forward voltage
VSD
Reverse recovery charge
Qrr
Final Data Sheet
5
Rev.2.4,2020-11-13
OptiMOSTMPower-MOSFET,30V
BSZ019N03LS
4Electricalcharacteristicsdiagrams
Diagram1:Powerdissipation
Diagram2:Draincurrent
80
160
70
140
60
120
50
100
ID[A]
Ptot[W]
10V
40
4.5V
80
30
60
20
40
10
20
0
0
40
80
120
0
160
0
20
40
60
TC[°C]
80
100
120
140
160
TC[°C]
Ptot=f(TC)
ID=f(TC);parameter:VGS
Diagram3:Safeoperatingarea
Diagram4:Max.transientthermalimpedance
3
101
10
1 µs
10 µs
102
100 µs
ZthJC[K/W]
100
ID[A]
1 ms
1
10
10 ms
DC
0.5
0.2
0.1
0.05
10-1
0.02
100
0.01
single pulse
10-1
10-1
100
101
102
10-2
10-6
10-5
10-4
VDS[V]
10-2
10-1
100
tp[s]
ID=f(VDS);TC=25°C;D=0;parameter:tp
Final Data Sheet
10-3
ZthJC=f(tp);parameter:D=tp/T
6
Rev.2.4,2020-11-13
OptiMOSTMPower-MOSFET,30V
BSZ019N03LS
Diagram5:Typ.outputcharacteristics
Diagram6:Typ.drain-sourceonresistance
400
4
10 V
5V
4V
4.5 V
350
300
3 3.2 V
3.5 V
3.5 V
RDS(on)[mΩ]
ID[A]
250
200
3.2 V
150
4V
4.5 V
5V
2
7V
8V
10 V
3V
100
1
50
2.5 V
0
0
1
2
0
3
0
10
20
VDS[V]
30
40
50
ID[A]
ID=f(VDS);Tj=25°C;parameter:VGS
RDS(on)=f(ID);Tj=25°C;parameter:VGS
Diagram7:Typ.transfercharacteristics
Diagram8:Typ.forwardtransconductance
200
300
180
250
160
140
200
gfs[S]
ID[A]
120
100
150
80
100
60
40
150 °C
25 °C
50
20
0
0
1
2
3
4
5
0
0
VGS[V]
80
120
160
ID[A]
ID=f(VGS);|VDS|>2|ID|RDS(on)max;parameter:Tj
Final Data Sheet
40
gfs=f(ID);Tj=25°C
7
Rev.2.4,2020-11-13
OptiMOSTMPower-MOSFET,30V
BSZ019N03LS
Diagram9:Drain-sourceon-stateresistance
Diagram10:Typ.gatethresholdvoltage
4
2.5
2.0
3
VGS(th)[V]
RDS(on)[mΩ]
1.5
2
typ
1.0
1
0.5
0
-60
-20
20
60
100
140
0.0
-60
180
-20
20
Tj[°C]
60
100
140
180
Tj[°C]
RDS(on)=f(Tj);ID=30A;VGS=10V
VGS(th)=f(Tj);VGS=VDS;ID=250µA
Diagram11:Typ.capacitances
Diagram12:Forwardcharacteristicsofreversediode
4
103
10
25 °C
25 °C, max
150 °C
150 °C, max
Ciss
Coss
102
IF[A]
C[pF]
103
Crss
102
101
101
0
5
10
15
20
25
30
100
0.0
0.2
VDS[V]
0.6
0.8
1.0
1.2
VSD[V]
C=f(VDS);VGS=0V;f=1MHz
Final Data Sheet
0.4
IF=f(VSD);parameter:Tj
8
Rev.2.4,2020-11-13
OptiMOSTMPower-MOSFET,30V
BSZ019N03LS
Diagram13:Avalanchecharacteristics
Diagram14:Typ.gatecharge
2
10
12
15 V
10
6V
24 V
8
VGS[V]
IAV[A]
25 °C
100 °C
101
125 °C
6
4
2
100
100
101
102
103
tAV[µs]
0
0
10
20
30
40
50
Qgate[nC]
IAS=f(tAV);RGS=25Ω;parameter:Tj(start)
VGS=f(Qgate);ID=30Apulsed;parameter:VDD
Diagram15:Drain-sourcebreakdownvoltage
Diagram Gate charge waveforms
34
32
VBR(DSS)[V]
30
28
26
24
22
20
-60
-20
20
60
100
140
180
Tj[°C]
VBR(DSS)=f(Tj);ID=1mA
Final Data Sheet
9
Rev.2.4,2020-11-13
OptiMOSTMPower-MOSFET,30V
BSZ019N03LS
5PackageOutlines
PACKAGE - GROUP
NUMBER:
REVISION: 03
DIMENSIONS
A
b
c
D
D1
D2
E
E1
E2
e
L
L1
L2
aaa
PG-TSDSON-8-U03
DATE: 20.10.2020
MILLIMETERS
MIN.
MAX.
0.90
1.10
0.24
0.44
(0.20)
3.20
3.40
2.19
2.39
1.54
1.74
3.20
3.40
2.01
2.21
0.10
0.30
0.65
0.30
0.50
0.40
0.60
0.50
0.70
0.06
Figure1OutlinePG-TSDSON-8FL,dimensionsinmm
Final Data Sheet
10
Rev.2.4,2020-11-13
OptiMOSTMPower-MOSFET,30V
BSZ019N03LS
RevisionHistory
BSZ019N03LS
Revision:2020-11-13,Rev.2.4
Previous Revision
Revision
Date
Subjects (major changes since last revision)
2.3
2020-08-12
Update current rating and footnotes
2.4
2020-11-13
Update package drawing
Trademarks
Allreferencedproductorservicenamesandtrademarksarethepropertyoftheirrespectiveowners.
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Publishedby
InfineonTechnologiesAG
81726München,Germany
©2020InfineonTechnologiesAG
AllRightsReserved.
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informationgiveninthisdocumentwithrespecttosuchapplication.
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Final Data Sheet
11
Rev.2.4,2020-11-13