BSZ065N03LS
MOSFET
OptiMOSTMPower-MOSFET,V
TSDSON-8FL(S3O8)
Features
•OptimizedforhighperformanceBuckconverter(Server,VGA)
•VerylowFOMQOSSforHighFrequencySMPS
•LowFOMSWforHighFrequencySMPS
•ExcellentgatechargexRDS(on)product(FOM)
•Verylowon-resistanceRDS(on)@VGS=4.5V
•100%avalanchetested
•Superiorthermalresistance
•N-channel
•QualifiedaccordingtoJEDEC1)fortargetapplications
•Pb-freeleadplating;RoHScompliant
•Halogen-freeaccordingtoIEC61249-2-21
Table1KeyPerformanceParameters
Parameter
Value
Unit
VDS
30
V
RDS(on),max,VGS=10V
6.5
mΩ
RDS(on),max,VGS=4.5V
8.6
mΩ
ID
49
A
S1
8D
S2
7D
S3
6D
G4
5D
Type/OrderingCode
Package
Marking
RelatedLinks
BSZ065N03LS
PG-TSDSON-8 FL
065N03L
-
1)
J-STD20 and JESD22
Final Data Sheet
1
Rev.2.4,2020-12-21
OptiMOSTMPower-MOSFET,V
BSZ065N03LS
TableofContents
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Electrical characteristics diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Disclaimer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Final Data Sheet
2
Rev.2.4,2020-12-21
OptiMOSTMPower-MOSFET,V
BSZ065N03LS
1Maximumratings
atTA=25°C,unlessotherwisespecified
Table2Maximumratings
Parameter
Symbol
Values
Unit
Note/TestCondition
49
31
42
27
12
A
VGS=10V,TC=25°C
VGS=10V,TC=100°C
VGS=4.5V,TC=25°C
VGS=4.5V,TC=100°C
VGS=4.5V,TA=25°C,RthJA=60K/W
-
196
A
TC=25°C
-
-
20
A
TC=25°C
EAS
-
-
16
mJ
ID=20A,RGS=25Ω
Gate source voltage
VGS
-20
-
20
V
-
Power dissipation
Ptot
-
-
26
2.1
W
TC=25°C
TA=25°C,RthJA=60K/W
Operating and storage temperature
Tj,Tstg
-55
-
150
°C
IEC climatic category;
DIN IEC 68-1: 55/150/56
Unit
Note/TestCondition
Min.
Typ.
Max.
ID
-
-
ID,pulse
-
Avalanche current, single pulse
IAS
Avalanche energy, single pulse
Continuous drain current1)
Pulsed drain current2)
3)
2Thermalcharacteristics
Table3Thermalcharacteristics
Parameter
Symbol
Thermal resistance, junction - case
Device on PCB,
6 cm2 cooling area4)
Values
Min.
Typ.
Max.
RthJC
-
-
4.9
K/W
-
RthJA
-
-
60
K/W
-
1)
Rating refers to the product only with datasheet specified absolute maximum values, maintaining case temperature
at 25°C. For higher case temperature please refer to Diagram 2. De-rating will be required based on the actual
environmental conditions.
2)
See Diagram 3 for more detailed information
3)
See Diagram 13 for more detailed information
4)
Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 µm thick) copper area for drain connection.
PCB is vertical in still air.
Final Data Sheet
3
Rev.2.4,2020-12-21
OptiMOSTMPower-MOSFET,V
BSZ065N03LS
3Electricalcharacteristics
atTj=25°C,unlessotherwisespecified
Table4Staticcharacteristics
Parameter
Symbol
Drain-source breakdown voltage
Values
Unit
Note/TestCondition
-
V
VGS=0V,ID=1mA
-
2
V
VDS=VGS,ID=250µA
-
0.1
10
1
100
µA
VDS=30V,VGS=0V,Tj=25°C
VDS=30V,VGS=0V,Tj=125°C
IGSS
-
10
100
nA
VGS=20V,VDS=0V
Drain-source on-state resistance
RDS(on)
-
6.9
5.4
8.6
6.5
mΩ
VGS=4.5V,ID=20A
VGS=10V,ID=20A
Gate resistance
RG
0.5
1.0
2.0
Ω
-
Transconductance
gfs
34
67
-
S
|VDS|>2|ID|RDS(on)max,ID=30A
Unit
Note/TestCondition
Min.
Typ.
Max.
V(BR)DSS
30
-
Gate threshold voltage
VGS(th)
1.2
Zero gate voltage drain current
IDSS
Gate-source leakage current
Table5Dynamiccharacteristics
Parameter
Symbol
Input capacitance1)
Values
Min.
Typ.
Max.
Ciss
-
670
891
pF
VGS=0V,VDS=15V,f=1MHz
Output capacitance1)
Coss
-
270
359
pF
VGS=0V,VDS=15V,f=1MHz
Reverse transfer capacitance
Crss
-
40
-
pF
VGS=0V,VDS=15V,f=1MHz
Turn-on delay time
td(on)
-
2.5
-
ns
VDD=15V,VGS=10V,ID=30A,
RG,ext=1.6Ω
Rise time
tr
-
3.4
-
ns
VDD=15V,VGS=10V,ID=30A,
RG,ext=1.6Ω
Turn-off delay time
td(off)
-
12
-
ns
VDD=15V,VGS=10V,ID=30A,
RG,ext=1.6Ω
Fall time
tf
-
2.4
-
ns
VDD=15V,VGS=10V,ID=30A,
RG,ext=1.6Ω
Unit
Note/TestCondition
Table6Gatechargecharacteristics2)
Parameter
Symbol
Gate to source charge1)
Gate charge at threshold
Values
Min.
Typ.
Max.
Qgs
-
1.9
2.5
nC
VDD=15V,ID=30A,VGS=0to4.5V
Qg(th)
-
1.1
-
nC
VDD=15V,ID=30A,VGS=0to4.5V
Gate to drain charge
Qgd
-
1.7
2.2
nC
VDD=15V,ID=30A,VGS=0to4.5V
Switching charge
Qsw
-
2.6
-
nC
VDD=15V,ID=30A,VGS=0to4.5V
Gate charge total
Qg
-
5.2
7
nC
VDD=15V,ID=30A,VGS=0to4.5V
Gate plateau voltage
Vplateau
-
2.9
-
V
VDD=15V,ID=30A,VGS=0to4.5V
Gate charge total1)
Qg
-
10
13
nC
VDD=15V,ID=30A,VGS=0to10V
Gate charge total, sync. FET
Qg(sync)
-
4.2
-
nC
VDS=0.1V,VGS=0to4.5V
Qoss
-
6.9
9.2
nC
VDD=15V,VGS=0V
1)
1)
1)
Output charge
1)
2)
Defined by design. Not subject to production test
See ″Gate charge waveforms″ for parameter definition
Final Data Sheet
4
Rev.2.4,2020-12-21
OptiMOSTMPower-MOSFET,V
BSZ065N03LS
Table7Reversediode
Parameter
Symbol
Diode continuous forward current
Values
Unit
Note/TestCondition
26
A
TC=25°C
-
196
A
TC=25°C
-
0.89
1
V
VGS=0V,IF=20A,Tj=25°C
-
10
-
nC
VR=15V,IF=IS,diF/dt=400A/µs
Min.
Typ.
Max.
IS
-
-
Diode pulse current
IS,pulse
-
Diode forward voltage
VSD
Reverse recovery charge
Qrr
Final Data Sheet
5
Rev.2.4,2020-12-21
OptiMOSTMPower-MOSFET,V
BSZ065N03LS
4Electricalcharacteristicsdiagrams
Diagram1:Powerdissipation
Diagram2:Draincurrent
30
50
25
40
20
10 V
4.5 V
ID[A]
Ptot[W]
30
15
20
10
10
5
0
0
40
80
120
0
160
0
20
40
60
TC[°C]
80
100
120
Ptot=f(TC)
ID=f(TC);parameter:VGS
Diagram3:Safeoperatingarea
Diagram4:Max.transientthermalimpedance
3
0.5
1 µs
102
10 µs
10 ms
1 ms
101
0.1
ZthJC[K/W]
ID[A]
DC
0.2
100
100 µs
0.05
0.02
10-1
0.01
single pulse
100
10-1
100
101
102
10-2
10-6
10-5
10-4
VDS[V]
10-3
10-2
10-1
100
tp[s]
ID=f(VDS);TC=25°C;D=0;parameter:tp
Final Data Sheet
160
101
10
10-1
140
TC[°C]
ZthJC=f(tp);parameter:D=tp/T
6
Rev.2.4,2020-12-21
OptiMOSTMPower-MOSFET,V
BSZ065N03LS
Diagram5:Typ.outputcharacteristics
Diagram6:Typ.drain-sourceonresistance
160
16
10 V
5 V 4.5 V
4V
120
12
80
RDS(on)[mΩ]
ID[A]
3.2 V
3.5 V
3.5 V
8
4V
4.5 V
5V
7V
8V
10 V
3.2 V
40
4
3V
2.8 V
0
0
1
2
0
3
0
10
20
VDS[V]
30
40
50
ID[A]
ID=f(VDS);Tj=25°C;parameter:VGS
RDS(on)=f(ID);Tj=25°C;parameter:VGS
Diagram7:Typ.transfercharacteristics
Diagram8:Typ.forwardtransconductance
160
120
100
120
gfs[S]
ID[A]
80
80
60
40
40
20
150 °C
0
0
1
2
25 °C
3
4
5
0
0
VGS[V]
80
120
ID[A]
ID=f(VGS);|VDS|>2|ID|RDS(on)max;parameter:Tj
Final Data Sheet
40
gfs=f(ID);Tj=25°C
7
Rev.2.4,2020-12-21
OptiMOSTMPower-MOSFET,V
BSZ065N03LS
Diagram9:Drain-sourceon-stateresistance
Diagram10:Typ.gatethresholdvoltage
10
2.5
8
2.0
1.5
typ
VGS(th)[V]
RDS(on)[mΩ]
6
4
2
1.0
0.5
0
-60
-20
20
60
100
140
0.0
-60
180
-20
20
Tj[°C]
60
100
140
180
Tj[°C]
RDS(on)=f(Tj);ID=30A;VGS=10V
VGS(th)=f(Tj);VGS=VDS;ID=250µA
Diagram11:Typ.capacitances
Diagram12:Forwardcharacteristicsofreversediode
4
103
10
25 °C
25 °C, max
150 °C
150 °C, max
103
102
IF[A]
C[pF]
Ciss
Coss
102
101
Crss
101
0
5
10
15
20
25
30
100
0.0
VDS[V]
1.0
1.5
VSD[V]
C=f(VDS);VGS=0V;f=1MHz
Final Data Sheet
0.5
IF=f(VSD);parameter:Tj
8
Rev.2.4,2020-12-21
OptiMOSTMPower-MOSFET,V
BSZ065N03LS
Diagram13:Avalanchecharacteristics
Diagram14:Typ.gatecharge
2
10
12
15 V
10
6V
24 V
VGS[V]
IAV[A]
8
25 °C
101
100 °C
6
125 °C
4
2
100
100
101
102
103
tAV[µs]
0
0
2
4
6
8
10
12
Qgate[nC]
IAS=f(tAV);RGS=25Ω;parameter:Tj(start)
VGS=f(Qgate);ID=30Apulsed;parameter:VDD
Diagram15:Drain-sourcebreakdownvoltage
Diagram Gate charge waveforms
34
32
VBR(DSS)[V]
30
28
26
24
22
20
-60
-20
20
60
100
140
180
Tj[°C]
VBR(DSS)=f(Tj);ID=1mA
Final Data Sheet
9
Rev.2.4,2020-12-21
OptiMOSTMPower-MOSFET,V
BSZ065N03LS
5PackageOutlines
PACKAGE - GROUP
NUMBER:
REVISION: 03
DIMENSIONS
A
b
c
D
D1
D2
E
E1
E2
e
L
L1
L2
aaa
PG-TSDSON-8-U03
DATE: 20.10.2020
MILLIMETERS
MIN.
MAX.
0.90
1.10
0.24
0.44
(0.20)
3.20
3.40
2.19
2.39
1.54
1.74
3.20
3.40
2.01
2.21
0.10
0.30
0.65
0.30
0.50
0.40
0.60
0.50
0.70
0.06
Figure1OutlinePG-TSDSON-8FL,dimensionsinmm
Final Data Sheet
10
Rev.2.4,2020-12-21
OptiMOSTMPower-MOSFET,V
BSZ065N03LS
RevisionHistory
BSZ065N03LS
Revision:2020-12-21,Rev.2.4
Previous Revision
Revision
Date
Subjects (major changes since last revision)
2.3
2020-08-12
Update current rating and footnotes
2.4
2020-12-21
Update package drawing
Trademarks
Allreferencedproductorservicenamesandtrademarksarethepropertyoftheirrespectiveowners.
WeListentoYourComments
Anyinformationwithinthisdocumentthatyoufeeliswrong,unclearormissingatall?Yourfeedbackwillhelpustocontinuously
improvethequalityofthisdocument.Pleasesendyourproposal(includingareferencetothisdocument)to:
erratum@infineon.com
Publishedby
InfineonTechnologiesAG
81726München,Germany
©2020InfineonTechnologiesAG
AllRightsReserved.
LegalDisclaimer
Theinformationgiveninthisdocumentshallinnoeventberegardedasaguaranteeofconditionsorcharacteristics
(“Beschaffenheitsgarantie”).
Withrespecttoanyexamples,hintsoranytypicalvaluesstatedhereinand/oranyinformationregardingtheapplicationofthe
product,InfineonTechnologiesherebydisclaimsanyandallwarrantiesandliabilitiesofanykind,includingwithoutlimitation
warrantiesofnon-infringementofintellectualpropertyrightsofanythirdparty.
Inaddition,anyinformationgiveninthisdocumentissubjecttocustomer’scompliancewithitsobligationsstatedinthis
documentandanyapplicablelegalrequirements,normsandstandardsconcerningcustomer’sproductsandanyuseofthe
productofInfineonTechnologiesincustomer’sapplications.
Thedatacontainedinthisdocumentisexclusivelyintendedfortechnicallytrainedstaff.Itistheresponsibilityofcustomer’s
technicaldepartmentstoevaluatethesuitabilityoftheproductfortheintendedapplicationandthecompletenessoftheproduct
informationgiveninthisdocumentwithrespecttosuchapplication.
Information
Forfurtherinformationontechnology,deliverytermsandconditionsandpricespleasecontactyournearestInfineon
TechnologiesOffice(www.infineon.com).
Warnings
Duetotechnicalrequirements,componentsmaycontaindangeroussubstances.Forinformationonthetypesinquestion,
pleasecontactthenearestInfineonTechnologiesOffice.
TheInfineonTechnologiescomponentdescribedinthisDataSheetmaybeusedinlife-supportdevicesorsystemsand/or
automotive,aviationandaerospaceapplicationsorsystemsonlywiththeexpresswrittenapprovalofInfineonTechnologies,ifa
failureofsuchcomponentscanreasonablybeexpectedtocausethefailureofthatlife-support,automotive,aviationand
aerospacedeviceorsystemortoaffectthesafetyoreffectivenessofthatdeviceorsystem.Lifesupportdevicesorsystemsare
intendedtobeimplantedinthehumanbodyortosupportand/ormaintainandsustainand/orprotecthumanlife.Iftheyfail,itis
reasonabletoassumethatthehealthoftheuserorotherpersonsmaybeendangered.
Final Data Sheet
11
Rev.2.4,2020-12-21