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BSZ0911LSATMA1

BSZ0911LSATMA1

  • 厂商:

    EUPEC(英飞凌)

  • 封装:

    TDFN8

  • 描述:

    MOSFET N-CH 30V 12A/40A TSDSON

  • 详情介绍
  • 数据手册
  • 价格&库存
BSZ0911LSATMA1 数据手册
BSZ0911LS MOSFET OptiMOSTM5Power-MOSFET,30V TSDSON-8FL (enlarged source interconnection) Features •Optimizedforchargersandadapters(e.g.USB-PD,wirelesscharging) •Verylowon-resistanceRDS(on)@VGS=4.5V •Superiorthermalresistance •N-channel •Pb-freeleadplating;RoHScompliant •Halogen-freeaccordingtoIEC61249-2-21 Productvalidation QualifiedaccordingtoJEDECStandard Table1KeyPerformanceParameters Parameter Value Unit VDS 30 V RDS(on),max,VGS=10V 7.0 mΩ RDS(on),max,VGS=4.5V 9.0 mΩ ID 40 A S1 8D S2 7D S3 6D G4 5D Type/OrderingCode Package Marking RelatedLinks BSZ0911LS PG-TSDSON-8 FL 0911LS - Final Data Sheet 1 Rev.2.0,2020-05-11 OptiMOSTM5Power-MOSFET,30V BSZ0911LS TableofContents Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Electrical characteristics diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Disclaimer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Final Data Sheet 2 Rev.2.0,2020-05-11 OptiMOSTM5Power-MOSFET,30V BSZ0911LS 1Maximumratings atTj=25°C,unlessotherwisespecified Table2Maximumratings Parameter Symbol Values Unit Note/TestCondition 40 31 40 27 12 A VGS=10V,TC=25°C VGS=10V,TC=100°C VGS=4.5V,TC=25°C VGS=4.5V,TC=100°C VGS=4.5V,TA=25°C,RthJA=60K/W - 160 A TC=25°C - - 20 A TC=25°C EAS - - 16 mJ ID=20A,RGS=25Ω Gate source voltage VGS -20 - 20 V - Operating and storage temperature Tj,Tstg -55 - 150 °C IEC climatic category; DIN IEC 68-1: 55/150/56 Unit Note/TestCondition Min. Typ. Max. ID - - ID,pulse - Avalanche current, single pulse IAS Avalanche energy, single pulse Continuous drain current Pulsed drain current1) 2) 2Thermalcharacteristics Table3Thermalcharacteristics Parameter Symbol Thermal resistance, junction - case Device on PCB, 6 cm2 cooling area3) Values Min. Typ. Max. RthJC - - 4.9 K/W - RthJA - - 60 K/W - 1) See Diagram 3 for more detailed information See Diagram 13 for more detailed information 3) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 µm thick) copper area for drain connection. PCB is vertical in still air. 2) Final Data Sheet 3 Rev.2.0,2020-05-11 OptiMOSTM5Power-MOSFET,30V BSZ0911LS 3Electricalcharacteristics atTj=25°C,unlessotherwisespecified Table4Staticcharacteristics Parameter Symbol Drain-source breakdown voltage Values Unit Note/TestCondition - V VGS=0V,ID=1mA - 2 V VDS=VGS,ID=250µA - 0.1 10 1 100 µA VDS=30V,VGS=0V,Tj=25°C VDS=30V,VGS=0V,Tj=125°C IGSS - 10 100 nA VGS=20V,VDS=0V Drain-source on-state resistance RDS(on) - 7.2 5.5 9.0 7.0 mΩ VGS=4.5V,ID=20A VGS=10V,ID=20A Gate resistance RG - 1.0 - Ω - Transconductance gfs 34 67 - S |VDS|>2|ID|RDS(on)max,ID=30A Unit Note/TestCondition Min. Typ. Max. V(BR)DSS 30 - Gate threshold voltage VGS(th) 1.2 Zero gate voltage drain current IDSS Gate-source leakage current Table5Dynamiccharacteristics Parameter Symbol Input capacitance Values Min. Typ. Max. Ciss - 670 - pF VGS=0V,VDS=15V,f=1MHz Output capacitance Coss - 270 - pF VGS=0V,VDS=15V,f=1MHz Reverse transfer capacitance Crss - 40 - pF VGS=0V,VDS=15V,f=1MHz Turn-on delay time td(on) - 2.5 - ns VDD=15V,VGS=10V,ID=30A, RG,ext=1.6Ω Rise time tr - 3.4 - ns VDD=15V,VGS=10V,ID=30A, RG,ext=1.6Ω Turn-off delay time td(off) - 12 - ns VDD=15V,VGS=10V,ID=30A, RG,ext=1.6Ω Fall time tf - 2.4 - ns VDD=15V,VGS=10V,ID=30A, RG,ext=1.6Ω Unit Note/TestCondition Table6Gatechargecharacteristics1) Parameter Symbol Gate to source charge Values Min. Typ. Max. Qgs - 1.9 - nC VDD=15V,ID=30A,VGS=0to4.5V Gate charge at threshold Qg(th) - 1.1 - nC VDD=15V,ID=30A,VGS=0to4.5V Gate to drain charge Qgd - 1.7 - nC VDD=15V,ID=30A,VGS=0to4.5V Switching charge Qsw - 2.6 - nC VDD=15V,ID=30A,VGS=0to4.5V Gate charge total Qg - 5.2 - nC VDD=15V,ID=30A,VGS=0to4.5V Gate plateau voltage Vplateau - 2.9 - V VDD=15V,ID=30A,VGS=0to4.5V Gate charge total Qg - 10 - nC VDD=15V,ID=30A,VGS=0to10V Gate charge total, sync. FET Qg(sync) - 4.2 - nC VDS=0.1V,VGS=0to4.5V Output charge Qoss - 6.9 - nC VDD=15V,VGS=0V 1) See ″Gate charge waveforms″ for parameter definition Final Data Sheet 4 Rev.2.0,2020-05-11 OptiMOSTM5Power-MOSFET,30V BSZ0911LS Table7Reversediode Parameter Symbol Diode continuous forward current Values Unit Note/TestCondition 26 A TC=25°C - 104 A TC=25°C - 0.89 1 V VGS=0V,IF=20A,Tj=25°C - 10 - nC VR=15V,IF=IS,diF/dt=400A/µs Min. Typ. Max. IS - - Diode pulse current IS,pulse - Diode forward voltage VSD Reverse recovery charge Qrr Final Data Sheet 5 Rev.2.0,2020-05-11 OptiMOSTM5Power-MOSFET,30V BSZ0911LS 4Electricalcharacteristicsdiagrams Diagram1:Powerdissipation Diagram2:Draincurrent 30 45 40 25 35 10 V 20 30 ID[A] Ptot[W] 4.5 V 15 10 25 20 15 10 5 5 0 0 40 80 120 0 160 0 40 80 TC[°C] 120 Ptot=f(TC) ID=f(TC);parameter:VGS Diagram3:Safeoperatingarea Diagram4:Max.transientthermalimpedance 3 101 10 0.5 1 µs 102 10 µs 10 ms 1 ms 101 0.1 ZthJC[K/W] ID[A] DC 0.2 100 100 µs 0.05 0.02 10-1 0.01 single pulse 100 10-1 10-1 100 101 102 10-2 10-6 10-5 10-4 VDS[V] 10-3 10-2 10-1 100 tp[s] ID=f(VDS);TC=25°C;D=0;parameter:tp Final Data Sheet 160 TC[°C] ZthJC=f(tp);parameter:D=tp/T 6 Rev.2.0,2020-05-11 OptiMOSTM5Power-MOSFET,30V BSZ0911LS Diagram5:Typ.outputcharacteristics Diagram6:Typ.drain-sourceonresistance 160 16 10 V 5 V 4.5 V 4V 120 12 80 RDS(on)[mΩ] ID[A] 3.2 V 3.5 V 3.5 V 8 4V 4.5 V 5V 7V 8V 10 V 3.2 V 40 4 3V 2.8 V 0 0 1 2 0 3 0 10 20 VDS[V] 30 40 50 ID[A] ID=f(VDS);Tj=25°C;parameter:VGS RDS(on)=f(ID);Tj=25°C;parameter:VGS Diagram7:Typ.transfercharacteristics Diagram8:Typ.forwardtransconductance 160 120 100 120 gfs[S] ID[A] 80 80 60 40 40 20 150 °C 0 0 1 2 25 °C 3 4 5 0 0 VGS[V] 80 120 ID[A] ID=f(VGS);|VDS|>2|ID|RDS(on)max;parameter:Tj Final Data Sheet 40 gfs=f(ID);Tj=25°C 7 Rev.2.0,2020-05-11 OptiMOSTM5Power-MOSFET,30V BSZ0911LS Diagram9:Drain-sourceon-stateresistance Diagram10:Typ.gatethresholdvoltage 10 2.5 8 2.0 1.5 typ VGS(th)[V] RDS(on)[mΩ] 6 4 2 1.0 0.5 0 -60 -20 20 60 100 140 0.0 -60 180 -20 20 Tj[°C] 60 100 140 180 Tj[°C] RDS(on)=f(Tj);ID=30A;VGS=10V VGS(th)=f(Tj);VGS=VDS;ID=250µA Diagram11:Typ.capacitances Diagram12:Forwardcharacteristicsofreversediode 4 103 10 25 °C 150 °C 103 102 IF[A] C[pF] Ciss Coss 102 101 Crss 101 0 5 10 15 20 25 30 100 0.0 VDS[V] 1.0 1.5 VSD[V] C=f(VDS);VGS=0V;f=1MHz Final Data Sheet 0.5 IF=f(VSD);parameter:Tj 8 Rev.2.0,2020-05-11 OptiMOSTM5Power-MOSFET,30V BSZ0911LS Diagram13:Avalanchecharacteristics Diagram14:Typ.gatecharge 2 10 12 15 V 6V 10 24 V VGS[V] IAV[A] 8 25 °C 101 100 °C 6 125 °C 4 2 100 100 101 102 103 tAV[µs] 0 0 2 4 6 8 10 12 Qgate[nC] IAS=f(tAV);RGS=25Ω;parameter:Tj(start) VGS=f(Qgate);ID=30Apulsed;parameter:VDD Diagram15:Drain-sourcebreakdownvoltage Diagram Gate charge waveforms 34 32 VBR(DSS)[V] 30 28 26 24 22 20 -60 -20 20 60 100 140 180 Tj[°C] VBR(DSS)=f(Tj);ID=1mA Final Data Sheet 9 Rev.2.0,2020-05-11 OptiMOSTM5Power-MOSFET,30V BSZ0911LS 5PackageOutlines TSDSON-8-25/-26 j DIM A b b1 b2 D=D1 D2 D3 D4 E E4 E6 e N L L1 L2 aaa F1 F2 F3 F4 F5 F6 F7 F8 F9 MILLIMETERS MIN 0.90 0.24 0.10 0.24 3.20 2.19 1.54 0.21 3.20 2.01 0.10 0.30 0.40 0.50 m INCHES MAX 1.10 0.44 0.30 0.44 3.40 2.39 1.74 0.41 3.40 2.21 0.30 0.65 (BSC) 8 0.51 0.70 0.70 0.25 3.90 2.29 0.31 0.34 0.80 1.00 2.51 1.64 0.50 MIN 0.035 0.009 0.004 0.009 0.126 0.086 0.061 0.008 0.126 0.079 0.004 0.012 0.016 0.020 MAX 0.043 0.017 0.012 0.017 0.134 0.094 0.069 0.016 0.134 0.087 0.012 0.026 (BSC) 8 0.020 0.028 0.028 0.010 0.154 0.090 0.012 0.013 0.031 0.039 0.099 0.065 0.020 DOCUMENT NO. Z8B00158553 SCALE 0 2.5 0 2.5 5mm EUROPEAN PROJECTION ISSUE DATE 27-12-2010 REVISION 02 Figure1OutlinePG-TSDSON-8FL,dimensionsinmm/inches Final Data Sheet 10 Rev.2.0,2020-05-11 OptiMOSTM5Power-MOSFET,30V BSZ0911LS RevisionHistory BSZ0911LS Revision:2020-05-11,Rev.2.0 Previous Revision Revision Date Subjects (major changes since last revision) 2.0 2020-05-11 Release of final version Trademarks Allreferencedproductorservicenamesandtrademarksarethepropertyoftheirrespectiveowners. WeListentoYourComments Anyinformationwithinthisdocumentthatyoufeeliswrong,unclearormissingatall?Yourfeedbackwillhelpustocontinuously improvethequalityofthisdocument.Pleasesendyourproposal(includingareferencetothisdocument)to: erratum@infineon.com Publishedby InfineonTechnologiesAG 81726München,Germany ©2020InfineonTechnologiesAG AllRightsReserved. LegalDisclaimer Theinformationgiveninthisdocumentshallinnoeventberegardedasaguaranteeofconditionsorcharacteristics (“Beschaffenheitsgarantie”). Withrespecttoanyexamples,hintsoranytypicalvaluesstatedhereinand/oranyinformationregardingtheapplicationofthe product,InfineonTechnologiesherebydisclaimsanyandallwarrantiesandliabilitiesofanykind,includingwithoutlimitation warrantiesofnon-infringementofintellectualpropertyrightsofanythirdparty. Inaddition,anyinformationgiveninthisdocumentissubjecttocustomer’scompliancewithitsobligationsstatedinthis documentandanyapplicablelegalrequirements,normsandstandardsconcerningcustomer’sproductsandanyuseofthe productofInfineonTechnologiesincustomer’sapplications. Thedatacontainedinthisdocumentisexclusivelyintendedfortechnicallytrainedstaff.Itistheresponsibilityofcustomer’s technicaldepartmentstoevaluatethesuitabilityoftheproductfortheintendedapplicationandthecompletenessoftheproduct informationgiveninthisdocumentwithrespecttosuchapplication. Information Forfurtherinformationontechnology,deliverytermsandconditionsandpricespleasecontactyournearestInfineon TechnologiesOffice(www.infineon.com). Warnings Duetotechnicalrequirements,componentsmaycontaindangeroussubstances.Forinformationonthetypesinquestion, pleasecontactthenearestInfineonTechnologiesOffice. TheInfineonTechnologiescomponentdescribedinthisDataSheetmaybeusedinlife-supportdevicesorsystemsand/or automotive,aviationandaerospaceapplicationsorsystemsonlywiththeexpresswrittenapprovalofInfineonTechnologies,ifa failureofsuchcomponentscanreasonablybeexpectedtocausethefailureofthatlife-support,automotive,aviationand aerospacedeviceorsystemortoaffectthesafetyoreffectivenessofthatdeviceorsystem.Lifesupportdevicesorsystemsare intendedtobeimplantedinthehumanbodyortosupportand/ormaintainandsustainand/orprotecthumanlife.Iftheyfail,itis reasonabletoassumethatthehealthoftheuserorotherpersonsmaybeendangered. Final Data Sheet 11 Rev.2.0,2020-05-11
BSZ0911LSATMA1
物料型号:BSZ0911LS

器件简介: - 优化用于充电器和适配器(例如USB-PD,无线充电)。 - N-Channel MOSFET,具有超群的热阻和优化的RDS(on)VGS。 - 无铅引脚镀层,符合RoHS标准。 - 根据IEC61249-2-21无卤素。

引脚分配: - S1, S2, S3: 源极引脚 - D1-D7: 漏极引脚 - G: 栅极引脚 - BB: 背面,用于散热

参数特性: - 漏源击穿电压VDs:30V - 最大漏极导通电阻RDS(on):7.0mΩ(在VGs=10V时) - 最大栅极导通电阻Rps(on):9.0mΩ(在VGs=4.5V时) - 最大漏极电流ID:40A

功能详解: - 该MOSFET设计用于高效率的开关应用,具有低导通电阻和快速开关特性。 - 它还具有内置的体二极管,具有较低的正向电压和快速恢复特性。

应用信息: - 适用于需要高效率和高功率密度的应用,如USB PD充电器、无线充电器等。

封装信息: - 封装类型:PG-TSDSON-8 FL - 封装标记:0911LS