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BTS5440GNT

BTS5440GNT

  • 厂商:

    EUPEC(英飞凌)

  • 封装:

    SOIC28

  • 描述:

    IC PWR SWITCH N-CHAN 1:1 DSO-28

  • 数据手册
  • 价格&库存
BTS5440GNT 数据手册
BTS 5440G Smart High-Side Power Switch Four Channels: 4 x 25mΩ IntelliSense Product Summary Operating voltage Package V bb(on) 4,5...28 V ( Loaddump: 40 V ) Active channels one four parallel On-state resistance RON 25 6.5 Nominal load current IL(nom) 6.2 13.9 Current limitation Low IL(SCr) High 10 mΩ P-DSO-28 -19 A A 40 General Description • N channel vertical power MOSFET with charge pump, ground referenced CMOS compatible input and diagnostic feedback, monolithically integrated in Smart SIPMOS technology. • Providing embedded protective functions. • Extern adjustable current limitation. Application • All types of resistive, inductive and capacitive loads • µC compatible high-side power switch with diagnostic feedback for 12 V grounded loads • Due to the adjustable current limitation best suitable for loads with high inrush currents, so as lamps • Replaces electromechanical relays, fuses and discrete circuits Basic Functions Block Diagram • Very low standby current • CMOS compatible input • Improved electromagnetic compatibility (EMC) • Stable behaviour at low battery voltage Vbb IN1 IS1 IS2 IN2 Protection Functions • Reverse battery protection with external resistor • Short circuit protection • Overload protection • Current limitation • Thermal Shutdown • Overvoltage protection with external resistor • Loss of GND and loss of Vbb protection • Electrostatic discharge Protection (ESD) Logic Channel 1 Channel 2 Load 1 CLA 1/2 IN3 IS3 IS4 Load 2 Logic Channel 3 Channel 4 Load 3 IN4 CLA 3/4 GND Load 4 Diagnostic Functions: IntelliSense • Proportional load current sense ( with defined fault signal during thermal shutdown and overload ) • Additional open load detection in OFF - state • Suppressed thermal toggling of fault signal Page 1 2005-06-03 BTS 5440G Functional diagram overvoltage protection internal voltage supply logic gate control + charge pump current limit VBB clamp for inductive load OUT1 IN1 IS1 ESD temperature sensor openload dedection LOAD Current sense CLA 1/2 IN2 IS2 control and protection circuit of channel 2 GND1/2 IN3 IS3 OUT2 control and protection circuit of channel 3 OUT3 CLA 3/4 IN4 IS4 control and protection circuit of channel 4 GND3/4 OUT4 Page 2 2005-06-03 BTS 5440G Pin definition and function Pin Symbol Function 1,14, Vbb Positive power supply voltage. Design the wiring for the 15,28 simultaneous max. short circuit currents from channel 1 to 4 and also for low thermal resistance 3 IN1 Input 1,2,3,4 activates channel 1,2,3,4 in case of logic high signal 6 IN2 9 IN3 12 IN4 25,26,27 OUT1 Output 1,2,3,4 protected high-side power output of channel 1,2,3,4. 22,23,24 OUT2 Design the wiring for the max. short circuit current 19,20,21 OUT3 16,17,18 OUT4 4 IS1 Diagnostic feedback 1...4 of channel 1 to 4 5 IS2 On state: advanced current sense with defined signal in case 10 IS3 of overload or short circuit 11 IS4 Off state: High on failure 7 CLA 1/2 Current limit adjust; the current limit for channels 1/2 and 3/4 can 13 CLA 3/4 be chosen as high ( potential < 2V ) or low ( potential > 4V ). 2 GND 1/2 Ground of chip 1 ( channel 1,2 ) 8 GND 3/4 Ground of chip 2 ( channel 3,4 ) Pin configuration (top view ) V bb GND ½ IN 1 IS 1 IS 2 IN 2 C LA ½ GND ¾ IN 3 IS 3 IS 4 IN 4 C LA ¾ V bb 1 2 3 4 5 6 7 8 9 10 11 12 13 14 • 28 V b b 27 26 25 24 23 22 21 20 19 18 17 16 15 O U T1 O U T1 O U T1 OUT2 OUT2 OUT2 OUT3 OUT3 OUT3 OUT4 O U T4 O U T4 V bb Page 3 2005-06-03 BTS 5440G Maximum Ratings at Tj=25°C, unless otherwise specified Parameter Symbol Value Supply voltage (overvoltage protection see page 6) Vbb 281) Supply voltage for full short circuit protection;Tj = -40...150°C Vbb(SC) 282) Maximum voltage across DMOS VON Load dump protection 3) VLoadDump = V A + VS; VA = 13,5 V VLoaddump Unit V 52 In = low or high; td = 400 ms; RI4) = 2 Ω RL = 2.25 Ω 40 RL = 6.8 Ω 53 IL(lim)5) Load current (Short - circuit current, see page 7) IL Operating temperature range Tj -40...+150 °C Storage temperature range Tstg -55...+150 Dynamical temperature rise at switching dT 60 K Ptot 1,6 W Power dissipation6) (DC), all channels active TA = 85 °C Maximal switchable inductance, single pulse Vbb=12V, T jstart=150°C; mH ZL(s) (see diagrams on page 12) IL = 6 A, EAS = 0.319 J, RL = 0 Ω, IL = 12 A, EAS = 0.679 J, RL = 0 Ω, one channel: 9.8 two parallel channels: 5.2 Electrostatic discharge voltage IN: VESD IS: (Human Body Model) according to ANSI EOS/ESD - S5.1 - 1993 , ESD STM5.1 - 1998 OUT: 1,0 4,0 VIN -10...16 Voltage at current limit adjustment pin VCLA -10...16 Current through current limit adjustment pin I CLA ±5.0 Current through input pin (DC) I IN ±5.0 I IS -5...+10 (see page 11) kV 2,0 Continuous input voltage Current through sense pin (DC) A V mA 118...28 V for 100 hours 2only single pulse, R = 200 mΩ ; L = 8 µH ; R and L are describing the complete circuit impedance including L line, contact and generator impedances. 3Supply voltage higher than V bb(AZ) require an external current limit for the GND (150Ω resistor) and sense pin. 4R = internal resistance of the load dump test pulse generator. I 5Current limit is a protection function. Operation in current limitation is considered as "outside" normal operating range. Protection functions are not designed for continuous repetitive operation. 6Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6 cm2 (one layer, 70µm thick) copper area for V bb connection. PCB is vertical without blown air. Page 4 2005-06-03 BTS 5440G Electrical Characteristics Parameter and Conditions, each of the four channels Symbol at Tj = -40...+150 °C, Vbb = 9...16 V, unless otherwise specified Values Unit min. typ. max. RthJS - - 25 K/W one channel active: RthJA - 40 - K/W Thermal Resistance junction - soldering point1) junction - ambient2) each channel: all channels active: 32 Load Switching Capabilities and Characteristics On-state resistance (Vbb to OUT), (see page 13) RON mΩ Tj = 25 °C, IL = 5 A, each channel: - 21 25 Tj = 150 °C, each channel: - 42 50 Tj = 25 °C, two parallel channels: - 11 13 Tj = 25 °C, four parallel channels: - 5.5 6.5 Nominal load current2) Ta = 85°C, Tj ≤ 150°C , A I L(nom) one channel active: 5.7 6.2 - two channels active, per channel: 4.0 4.4 - four channels active, per channel: 3.1 3.4 - Output voltage drop limitation at small load currents VON(NL) IL = 0.5 A - 40 - mV Output current while GND disconnected 3) - - 2 mA I L(GNDhigh) ( see diagram page 12 ) VIN = 0 V 1Soldering point is measured at Vbb-pin 2Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6 cm2 (one layer, 70µm thick) copper area for V bb connection. PCB is vertical without blown air. 3not subject to production test, specified by design Page 5 2005-06-03 BTS 5440G Electrical Characteristics Parameter and Conditions, each of the four channels Symbol at Tj = -40...+150 °C, Vbb = 9...16 V, unless otherwise specified Values Unit min. typ. max. ton - 90 200 toff - 100 220 dV/dton 0.1 0.25 0.45 V/µs -dV/dtoff 0.09 0.25 0.4 Operating voltage2) Vbb(on) 4.5 - 28 Overvoltage protection3) Vbb(AZ) 41 47 52 Load Switching Capabilities and Characteristics Turn-on time1) to 90% VOUT µs RL = 12 Ω, V bb = 12 V Turn-off time 1) to 10% VOUT RL = 12 Ω, V bb = 12 V Slew rate on 1) 10 to 30% VOUT, RL = 12 Ω, V bb = 12 V Slew rate off 1) 70 to 40% VOUT , RL = 12 Ω, V bb = 12 V Operating Parameters V Ibb = 40 mA Standby current 4) µA I bb(off) (see diagram on page 13) Tj = -40...+25 °C, VIN = 0 V - 10 15 Tj = 150 °C - - 40 1See timing diagram on page 14. 218V...28V for 100 hours 3Supply voltages higher than V bb(AZ) require an external current limit for the status pin and GND pin (e.g. 150Ω). See also VOut(CL) in table of protection functions and circuit diagram on page 11. 4Measured with load; for the whole device; all channels off. Page 6 2005-06-03 BTS 5440G Electrical Characteristics Parameter and Conditions, each of the four channels Symbol at Tj = -40...+150 °C, Vbb = 9...16 V, unless otherwise specified Values Unit min. typ. max. IL(off) - 1.5 8 µA IGND - 1.6 4 mA Operating Parameters Off-State output current (included in Ibb(off) ) VIN = 0 V, each channel Operating current 1) VIN = 5 V, per active channel Protection Functions2) Current limit, ( see timing diagrams, page 15 ) A I L(LIM) Low level; if potential at CLA = high 7 11 14 High level; if potential at CLA = low 40 50 60 VCLA(T-) 2.0 - - VCLA(T+) - - 4.0 Current limit adjustment threshold voltage Repetitive short circuit current limit V A I L(SCr) Tj = Tjt (see timing diagrams on page 15) High level one active channel: - 40 - two active channels 3): - 40 - one active channel: - 7 - two active channels 3): - 7 - - 3.5 - - 0.75 - - -15 - V Low level Initial short circuit shutdown time low level: Tj,start = 25°C ; Vbb = 13,5 V high level: Output clamp (inductive load switch off) 4) t off(SC) VOut(CL) ms IL = 40 mA Thermal overload trip temperature T jt 150 170 - °C Thermal hysteresis ∆Tjt - 10 - K 1Add I , if I > 0 IS IS 2Integrated protection functions are designed to prevent IC destruction under fault conditions described in the data sheet. Fault conditions are considered as "outside" normal operating range. Protection functions are not designed for continuous repetitive operation. 3At the beginning of the short circuit the fourfold current is possible for a short time. 4If channels are connected in parallel, output clamp is usually accomplished by the channel with the lowest VOut(CL) . Page 7 2005-06-03 BTS 5440G Electrical Characteristics Parameter and Conditions, each of the four channels Symbol at Tj = -40...+150 °C, Vbb = 9...16 V, unless otherwise specified Values Unit min. typ. max. Diagnostic Characteristics Open load detection voltage VOUT(OL) 2 3.2 4.4 V Internal output pull down1) ROUT(PD) 11 23 35 kΩ 4640 4900 4900 5800 5400 5350 6960 5900 5800 VOUT = 13.5 V Current sense ratio, static on-condition kILIS = IL :IIS IL = 0.5 A IL = 3 A IL = 6 A kILIS Sense signal in case of fault-conditions 2) Vfault 5 6.2 7.5 Current saturation of sense fault signal I fault 4 - - mA Sense signal delay after thermal shutdown3) t delay(fault) - - 1.2 ms Current sense output voltage limitation VIS(lim) 5.4 6.5 7.3 V I IS(LH) - - 5 µA t son(IS) - - 400 µs t slc(IS) - - 300 V in off-state IIS = 0 , IL = 5 A Current sense leakage/offset current VIN = 5 V, IL = 0 , VIS = 0 Current sense settling time to IIS static ±10% after positive input slope 4) , IL = 0 to 5A Current sense settling time to IIS static ±10% after change of load current4) , IL = 2.5 to 5A 1In case of floating output, the status doesn´t show open load. 2Fault condition means output voltage exceeds open load detection voltageV OUT(OL) 3In the case of thermal shutdown the V fault signal remains for t delay(fault) longer than the restart of the switch ( see diagram on page 16 ). Not subject to production test, specified by design. 4not subject to production test, specified by design Page 8 2005-06-03 BTS 5440G Electrical Characteristics Parameter Symbol at Tj = -40...+150 °C, Vbb = 9...16 V, unless otherwise specified Values Unit min. typ. max. Diagnostic Characteristics Status invalid after negative input slope td(SToff) - - 1.2 ms Status invalid after positive input slope td(STOL) - - 20 µs 2.0 3.5 5.5 kΩ V with open load Input Feedback1) Input resistance (see circuit page 11) RI Input turn-on threshold voltage VIN(T+) - - 2.4 Input turn-off threshold voltage VIN(T-) 1.0 - - Input threshold hysteresis ∆V IN(T) - 0.5 - Off state input current I IN(off) 3 - 40 I IN(on) 20 50 90 Reverse battery voltage -Vbb - - 27 Drain-source diode voltage (VOUT > Vbb) -VON - 330 - µA VIN = 0.4 V On state input current VIN = 5 V Reverse Battery2) V mV Tj = 150 °C, Ibb = -10 mA 1If ground resistors R GND are used, add the voltage drop across these resistor. 2Requires a 150Ω resistor in GND connection. The reverse load current through the intrinsic drain-source diode has to be limited by the connected load. Power dissipation is higher compared to normal operating conditions due to the voltage drop across the drain-source diode. The temperature protection is not active during reverse current operation! Input and status currents have to be limited. (see max. ratings page 4 ) Page 9 2005-06-03 BTS 5440G Truth Table - for each of the four channels Input Output Diagnostic level level output Normal L L Z 1) Operation H Vbb I IS = IL / kilis H Vbb Vfault Short circuit L L Z1) to GND H L Vfault Overtemperature L L Z1) H L Vfault Short circuit L Vbb Vfault to Vbb H Vbb Open load L >Vout(OL) < IIS = IL / kilis3) Vfault H Vbb Z1) Current Limitation 2) L = " Low" Level Z = high impedance, potential depends on external circuit H = "High" Level Vfault = 5V typ., constant voltage independent of external sense resistor. Parallel switching of channels is possible by connecting the inputs and outputs parallel. The current sense ouputs have to be connected with a single sense resistor. Terms Ibb V Leadframe bb I IN1 I IN2 V V IN1 IN2 3 6 I IS1 4 I IS2 5 V V IS2 IS1 7 IN1 V bb OUT1 IN2 IS1 CLA1/2 V CLA1/2 25 26 27 PROFET OUT2 IS2 V ON1 V ON2 22 23 24 I I GND I IN3 L1 I IN4 I IS3 I L2 VIN3 V IN4 V OUT1 GND1/2 2 Leadframe V bb I IS4 V V IS4 IS3 V OUT2 9 12 10 11 13 IN3 Vbb OUT3 IN4 IS3 CLA3/4 V CLA3/4 19 20 21 PROFET OUT4 IS4 V ON3 V ON4 16 17 18 I L3 I L4 V OUT3 GND3/4 8 I GND V OUT4 Leadframe (Vbb ) is connected to pin 1, 14, 15, 28 1L-potential by using a sense resistor 2Current limitation is only possible while the device is switched on. 3Low ohmic short to V may reduce the output current I and therefore also the sense current I . bb L IS Page 10 2005-06-03 BTS 5440G Input circuit ( ESD protection ), IN1...IN4 R IN Inductive and overvoltage output clamp, OUT1...OUT4 I +Vbb V ESD-ZD I I Z I OUT GND V OUT The use of ESD zener diodes as voltage clamp at DC conditions is not recommended. GND Power GND V Out clamped to VOut(CL) = -15 V typ. Sense-Status output, IS1...IS4 ON-State: Normal operation: IS = IL / kILIS V IS = IS * RIS; RIS = 1kΩ nominal Overvolt. Protection of logic part OUT1...OUT4 RIS > 500Ω I IS Sense output logic IS V + V bb V IS IN RI Z2 Logic IS Vf V ESD-ZD R PR O F ET Z1 IS GND R IS GND R GND Sig na l G N D V Z1 = 6,1V typ., V Z2 = 47V typ., R GND = 150Ω , ESD zener diode: VESD = 6,1 V typ., max. 14 mA ; RIS = 1kΩ , R I = 3,5kΩ typ. ON-State: Fault condition so as thermal shut down or current limitation Sense output logic Vfault Vfault Vf ESD-ZD R IS GND Vfault = 6 V typ ; Vfault < VESD under all conditions OFF-State diagnostic condition: Open Load, if VOUT > 3 V typ.; IN low Int. 5V IS - ST RIS GND ESDZD ESD-Zener diode: 6,1V typ., max. 5mA; RST(ON) < 375Ω at 1,6mA.. The use of ESD zener diodes as voltage clamp at DC conditions is not recommended. Page 11 2005-06-03 BTS 5440G Vbb disconnect with energized inductive load Reverse battery protection OUT1...OUT4 - V bb V IN RI Z2 high IN L o g ic Vbb PROFET IS OUT OUT IS V GND Z1 PROFET -I G N D R IS R GND S ig n a l G N D V R Load bb Load G N D V Z1 = 6,1V typ., VZ2 = 47V typ., RGND = 150Ω RIS = 1kΩ, RI = 3,5kΩ typ. In case of reverse battery the load current has to be limited by the load. Protection functions are not active. For inductive load currents up to the limits defined by ZL each switch is protected against loss of Vbb. (max. ratings and diagram on page 12) Consider at your PCB layout that in the case of Vbb disconnection with energized inductive load all the load current flows through the GND connection. Open load detection, OUT1...OUT4 Off-state diagnostic condition: Open load, if VOUT > 3 V typ.; IN = low V R Inductive load switch-off energy dissipation E bb bb E AS E XT IN O FF V PROFET OUT = Lo g ic u n it O p e n lo a d d e tec tio n ELoad Vbb OUT L IS GND ZL { EL ER R L S ig na l G N D Energy stored in load inductance: EL = ½ * L * IL2 GND disconnect While demagnetizing load inductance, the enérgy dissipated in PROFET is EAS = Ebb + EL - ER = VON(CL) * iL(t) dt, Vbb IN PROFET with an approximate solution for RL > 0Ω: OUT IS GND V bb V V IN IS V GND E AS = IL * L IL * R L *(V bb + | V OUT ( CL )| )* ln(1 + ) 2 * RL | V OUT ( CL )| Any kind of load. Page 12 2005-06-03 BTS 5440G Typ. standby current Maximum allowable load inductance I bb(off) = f(T j) ; V bb = 16 V ; V IN1...4 = low for a single switch off (one channel) L =f(IL); Tjstart = 150°C, Vbb = 12V, RL = 0Ω 16 1000 14 12 10 Ibb(off) [µA] ZL(s) [mH] 100 8 6 10 4 2 1 0 -40 -20 0 0,1 0 5 10 15 20 40 60 80 100 120 140 160 Tj [°C] 20 I L [A] Typ. on-state resistance RON = f(V bb,T j); IL = 5 A ; V in = high 30 28 26 Ron [mOhm] 24 22 20 18 16 14 12 0 5 10 15 20 25 30 35 Vbb [V] Page 13 2005-06-03 BTS 5440G Timing diagrams All channels are symmetric and consequently the diagrams are valid for channel 1 to channel 4. Figure 1a: Switching a resistive load, change of load current in on-condition Figure 1c: Behaviour of sense output: Sense current (I S) and sense voltage (V S) as function of load current dependent on the sense resistor. Shown is VS and IS for three different sense resistors. Curve 1 refers to a low resistor, curve 2 to a medium-sized resistor and curve 3 to a big resistor. Note, that the sense resistor may not falls short of a minimum value of 500Ω. IN VOUT t on IL t off tslc(IS) Load 1 t slc(IS) VS Load 2 VESD Vfault IS,VS tson(IS) t d(SToff) 3 2 t 1 The sense signal is not valid during settling time after turn on or change of load current. tslc(IS) = 300 µs max. IL IS 1 2 Figure 1b: V bb turn on 3 IN IL(lim) Vbb IL IS = I L / kILIS V IS = I S * R IS; RIS = 1kΩ nominal RIS > 500Ω IL IS ,V S proper turn on under all conditions Page 14 2005-06-03 BTS 5440G Figure 2a: Switching a lamp Figure 3a: Short circuit: Shut down by overtemperature, reset by cooling IN IN IS V IL(lim) IL OUT I I L(SCr ) L t Figure 2b: Switching a lamp with current limit: The behaviour of IS and VS is shown for a resistor, which refers to curve 1 in figure 1c IN t d(SToff) Vfault VS Heating up may require several milliseconds, depending on external conditions. IL(lim) = 50A typ. increases with decreasing temperature. VOUT Figure 3b: Turn on into short circuit, shut down by overtemperature, restart by cooling ( channel 1 and 2 switched parallel ) IL IN1/2 IS Vfault R IS 2 x I L( lim ) I L1 + I L2 2 x I L( lim ) VS V fault t I t Page 15 t d(SToff) off(SC) V S1 , V S2 L( SCr ) V fault 2005-06-03 BTS 5440G Figure 6a: Current sense ratio 1) Figure 4a: Overtemperature Reset if T j < Tjt 7000 The behaviour of IS and V S is shown for a resistor, which refers to curve 1 in figure 1c. kILIS IN 6000 IL 5000 IS tdelay(fault) [A] IL 4000 TJ 0 1 2 3 4 5 6 7 8 9 10 11 12 13 t Figure 5a:Open-load: detection in OFF-state, turn on/off to open load. Open load of channel 1; other channels normal opertaion. IN1 V OUT1 toff t off td(SToff) td(SToff) I L1 IS Vfault toff = 220µs max.; t d(SToff) = 1,2ms max. with pull up resistor at output 1This range for the current sense ratio refers to all devices. The accuracy of the k ILIS can be raised by calibrating the value of kILIS for every single device. Page 16 2005-06-03 BTS 5440G Package and ordering code all dimensions in mm Published by Infineon Technologies AG, St.-Martin-Strasse 53, D-81669 München © Infineon Technologies AG 2001 All Rights Reserved. P-DSO-28-19 Sales Code BTS 5440G Ordering Code Q67060-S6136 Attention please! The information herein is given to describe certain components and shall not be considered as a guarantee of characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Infineon Technologies is an approved CECC manufacturer. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office in Germany or our Infineon Technologies Representatives worldwide (see address list). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Page 17 2005-06-03
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