CYBL10X6X Family Datasheet
Programmable Radio-on-Chip With
Bluetooth Low Energy (PRoC BLE)
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General Description
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PRoC BLE is a 32-bit, 48-MHz ARM® Cortex®-M0 BLE solution with CapSense®, 12-bit ADC, four timer, counter, pulse-width
modulators (TCPWM), thirty-six GPIOs, two serial communication blocks (SCBs), LCD, and I2S. PRoC BLE includes a royalty-free
BLE stack compatible with Bluetooth® 4.1 and provides a complete, programmable, and flexible solution for HID, remote controls,
toys, beacons, and wireless chargers. In addition to these applications, PRoC BLE provides a simple, low-cost way to add BLE
connectivity to any system.
Features
■
■
Clock, Reset, and Supply
■
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32-bit processor (0.9 DMIPS/MHz) with single-cycle 32-bit
multiply, operating at up to 48 MHz
■ 128-KB flash memory
■ 16-KB SRAM memory
■ Emulated EEPROM using flash memory
■ Watchdog timer with dedicated internal low-speed oscillator
(ILO)
■
Programmable GPIOs
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■
■
■
36 GPIOs configurable as open drain high/low,
pull-up/pull-down, HI-Z, or strong output
Any GPIO pin can be CapSense, LCD, or analog, with flexible
pin routing
Programming and Debug
Ultra-Low-Power
1.3-µA Deep-Sleep mode with watch crystal oscillator (WCO)
on
■ 150-nA Hibernate mode current with SRAM retention
■ 60-nA Stop mode current with GPIO wakeup
■
CapSense®
■
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■
Touch Sensing with Two-Finger Gestures
Up to 36 capacitive sensors for buttons, sliders, and touchpads
■ Two-finger gestures: scroll, inertial scroll, pinch, stretch, and
edge-swipe
■ Cypress Capacitive Sigma-Delta (CSD) provides best-in-class
SNR (> 5:1) and liquid tolerance
■ Automatic hardware-tuning algorithm (SmartSense™)
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■
Wide supply-voltage range: 1.9 V to 5.5 V
3-MHz to 48-MHz internal main oscillator (IMO) with 2%
accuracy
24-MHz external clock oscillator (ECO) without load capacitance
32-kHz WCO
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■
■
ARM Cortex-M0 CPU Core
Four dedicated 16-bit TCPWMs
❐ Additional four 8-bit or two 16-bit PWMs
Programmable LVD from 1.8 V to 4.5 V
I2S Master interface
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■
Bluetooth 4.1 single-mode device
■ 2.4-GHz BLE radio and baseband with integrated balun
■ TX output power: –18 dBm to +3 dBm
■ Received signal strength indicator (RSSI) with 1-dB resolution
■ RX sensitivity: –89 dBm
■ TX current: 15.6 mA at 0 dBm
■ RX current: 16.4 mA
■
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Bluetooth® Smart Connectivity
Peripherals
■
Temperature and Packaging
■
■
■
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•
Easy-to-use IDE to configure, develop, program, and test a
BLE application
Option to export the design to Keil, IAR, or Eclipse
Bluetooth Low Energy Protocol Stack
■
Cypress Semiconductor Corporation
Document Number: 001-90478 Rev. *L
Operating temperature range: –40 °C to +105 °C
Available in 56-pin QFN (7 mm × 7 mm) and 68-ball WLCSP
(3.52 mm × 3.91 mm) packages
PSoC® Creator™ Design Environment
■
12-bit, 1-Msps SAR ADC with internal reference,
sample-and-hold (S/H), and channel sequencer
■ Ultra-low-power LCD segment drive for 128 segments with
operation in Deep-Sleep mode
2
■ Two serial communication blocks (SCBs) supporting I C
(Master/Slave), SPI (Master/Slave), or UART
2-pin SWD
In-system flash programming support
■
198 Champion Court
Bluetooth Low Energy protocol stack supporting generic
access profile (GAP) Central, Peripheral, Observer, or Broadcaster roles
❐ Switches between Central and Peripheral roles on-the-go
Standard Bluetooth Low Energy profiles and services for
interoperability
❐ Custom profile and service for specific use cases
•
San Jose, CA 95134-1709
•
408-943-2600
Revised March 23, 2017
PRoC BLE: CYBL10X6X
Family Datasheet
Contents
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42
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Digital Peripherals .....................................................
Memory .....................................................................
System Resources ....................................................
Ordering Information......................................................
Part Numbering Conventions ....................................
Packaging........................................................................
Acronyms ........................................................................
Document Conventions .................................................
Units of Measure .......................................................
Revision History .............................................................
Sales, Solutions, and Legal Information ......................
Worldwide Sales and Design Support.......................
Products ....................................................................
PSoC® Solutions ......................................................
Cypress Developer Community.................................
Technical Support .....................................................
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Blocks and Functionality ................................................. 3
CPU Subsystem .......................................................... 4
BLE Subsystem........................................................... 4
System Resources Subsystem ................................... 4
Peripheral Blocks ........................................................ 6
Pinouts .............................................................................. 8
Power............................................................................... 13
Low-Power Modes..................................................... 13
Development Support .................................................... 15
Documentation .......................................................... 15
Online ........................................................................ 15
Tools.......................................................................... 15
Kits ............................................................................ 15
Electrical Specifications ................................................ 16
Absolute Maximum Ratings ...................................... 16
BLE Subsystem......................................................... 16
Device-Level Specifications ...................................... 19
Analog Peripherals .................................................... 24
Document Number: 001-90478 Rev. *L
Page 2 of 42
PRoC BLE: CYBL10X6X
Family Datasheet
Blocks and Functionality
The CYBL10X6X block diagram is shown in Figure 1. There are five major subsystems: CPU subsystem, BLE subsystem, system
resources, peripheral blocks, and I/O subsystem.
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Figure 1. Block Diagram
P0.6
P0.7
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CPU Subsystem
ARM
Cortex-M0
SWD
FLASH
128 kB
SRAM
16 kB
CONFIG
512 B
ROM
8 kB
System Resources
BLE Subsystem
Clock Control
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System Interconnect
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NVIC
XRES
BOD
ILO
WDT
WCO
ECO
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LVD
IMO
XRES
Link Layer
Engine
RF PHY
XTAL32I/P6.1
XTAL32O/P6.0
XTAL24I
XTAL24O
ANT
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GPIOs
4x TCPWM
I2S
SCB0
I2C/UART/SPI
GPIOs
SCB1
I2C/UART/SPI
GPIOs
4x PWM
LCD
GPIOs
GPIOs
High Speed I/O Matrix
The PSoC Creator IDE provides fully integrated programming
and debug support for PRoC BLE devices. The SWD interface
is fully compatible with industry-standard third-party tools.
PRoC BLE also supports disabling the SWD interface and has a
robust flash-protection feature.
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The PRoC BLE family includes extensive support for
programming, testing, debugging, and tracing both hardware
and firmware. The complete debug-on-chip functionality enables
full-device debugging in the final system using the standard
production device. It does not require special interfaces,
debugging pods, simulators, or emulators. Only the standard
programming connections are required to fully support debug.
Peripheral Interconnect
CSD
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GPIOs
12-Bit
SAR ADC
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GPIOs
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Peripherals
GPIOs
Document Number: 001-90478 Rev. *L
Page 3 of 42
PRoC BLE: CYBL10X6X
Family Datasheet
The CYBL10X6X device is based on an energy-efficient
ARM Cortex-M0 32-bit processor, offering low power
consumption, high performance, and reduced code size using
16-bit thumb instructions. The Cortex-M0’s ability to perform
single-cycle 32-bit arithmetic and logic operations, including
single-cycle 32-bit multiplication, helps in better performance.
The inclusion of the tightly-integrated Nested Vectored Interrupt
Controller (NVIC) with 32 interrupt lines enables the Cortex-M0
to achieve a low latency and a deterministic interrupt response.
The CPU also includes a 2-pin interface, the serial wire debug
(SWD), which is a 2-wire form of JTAG. The debug circuits are
enabled by default and can only be disabled in firmware. If
disabled, the only way to re-enable them is to erase the entire
device, clear flash protection, and reprogram the device with the
new firmware that enables debugging. In addition, it is possible
to use the debug pins as GPIO too. The device has four breakpoints and two watchpoints for effective debugging.
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CPU
The physical layer consists of a modem and an RF transceiver
that transmits and receives BLE packets at the rate of 1 Mbps
over the 2.4-GHz ISM band. In the transmit direction, this block
performs GFSK modulation and then converts the digital
baseband signal of these BLE packets into radio frequency
before transmitting them to air through an antenna. In the receive
direction, this block converts an RF signal from the antenna to a
digital bit stream after performing GFSK demodulation.
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CPU Subsystem
The RF transceiver contains an integrated balun, which provides
a single-ended RF port pin to drive a 50-Ω antenna terminal
through a pi-matching network. The output power is programmable from –18 dBm to +3 dBm to optimize the current
consumption for different applications.
BLE Subsystem
System Resources Subsystem
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The device has a 128-KB flash memory with a flash accelerator,
tightly coupled to the CPU to improve average access times from
flash. The flash is designed to deliver 1-wait-state (WS) access
time at 48 MHz and with 0-WS access time at 24 MHz. The flash
accelerator delivers 85% of single-cycle SRAM access performance on average. Part of the flash can be used to emulate
EEPROM operation, if required.
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Flash
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The 8-KB supervisory ROM contains a library of executable
functions for flash programming. These functions are accessed
through supervisory calls (SVC) and enable in-system
programming of the flash memory.
The Bluetooth Low Energy protocol stack uses the BLE
subsystem and provides the following features:
■ Link Layer (LL)
❐ Master and Slave roles
❐ 128-bit AES engine
❐ Encryption
❐ Low-duty-cycle advertising (Bluetooth 4.1 feature)
❐ LE ping (Bluetooth 4.1 feature)
■ Bluetooth Low Energy 4.1 single-mode protocol stack with
logical link control and adaptation protocol (L2CAP), attribute
(ATT), and security manager (SM) protocols
■ Master and slave roles
■ API access to generic attribute profile (GATT), generic access
profile (GAP), and L2CAP
■ L2CAP connection-oriented channel (Bluetooth 4.1 feature)
■ GAP features
❐ Broadcaster, Observer, Peripheral, and Central roles
❐ Security mode 1: Level 1, 2, and 3
❐ Security mode 2: Level 1 and 2
❐ User-defined advertising data
❐ Multiple-bond support
■ GATT features
❐ GATT client and server
❐ Supports GATT subprocedures
❐ 32-bit universally unique identifiers (UUID) (Bluetooth 4.1
feature)
■ Security Manager (SM)
❐ Pairing methods: Just Works, Passkey Entry, and Out of
Band
❐ Authenticated man-in-the-middle (MITM) protection and data
signing
■ Supports all SIG-adopted BLE profiles
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During flash erase and programming operations (the maximum
erase and program time is 20 ms per row), the IMO will be set to
48 MHz for the duration of the operation. This also applies to the
emulated EEPROM. System design must take this into account
because peripherals operating from different IMO frequencies
will be affected. If it is critical that peripherals continue to operate
with no change during flash programming, always set the IMO to
48 MHz and derive the peripheral clocks by dividing down from
this frequency.
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SRAM
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ROM
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The low-power 16-KB SRAM memory retains its contents even
in Hibernate mode.
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The BLE subsystem consists of the link layer engine and
physical layer. The link layer engine supports both master and
slave roles. The link layer engine implements time-critical
functions such as encryption in the hardware to reduce the
power consumption, and provides minimal processor intervention and a high performance. The key protocol elements,
such as host control interface (HCI) and link control, are implemented in firmware. The direct test mode (DTM) is included to
test the radio performance using a standard Bluetooth tester.
Document Number: 001-90478 Rev. *L
Power
The power block includes internal LDOs that supply required
voltage levels for different blocks. The power system also
includes POR, BOD, and LVD circuits. The POR circuit holds the
device in the reset state until the power supplies have stabilized
at appropriate levels and the clock is ready. The BOD circuit
resets the device when the supply voltage is too low for proper
device operation. The LVD circuit generates an interrupt if the
supply voltage drops below a user-selectable level.
Page 4 of 42
PRoC BLE: CYBL10X6X
Family Datasheet
peripherals. The system clock (SYSCLK) driving buses,
registers, and the processor must be higher than all the other
clocks in the system that are divided off HFCLK. The ECO and
WCO are present in the BLE subsystem and the clock outputs
are routed to the system resources.
Clock Control
Internal Main Oscillator (IMO)
The PRoC BLE clock control is responsible for providing clocks
to all subsystems and also for switching between different clock
sources without glitching. The clock control for PRoC BLE
consists of the IMO and the internal low-speed oscillator (ILO). It
uses the 24-MHz external crystal oscillator (ECO) and the
32-kHz WCO. In addition, an external clock may be supplied
from a pin.
The IMO is the primary system clock source, which can be
adjusted in the range of 3 MHz to 48 MHz in steps of 1 MHz. The
IMO accuracy is ±2%.
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Internal Low-Speed Oscillator (ILO)
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The ILO is a very-low-power 32-kHz oscillator, which is primarily
used to generate clocks for peripheral operations in Deep-Sleep
mode. The ILO-driven counters can be calibrated to the IMO to
improve accuracy. Cypress provides a software component,
which does the calibration.
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BLE
Subsystem
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Figure 2. Clock Control
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The device has 12 dividers with 16 divider outputs. Two dividers
have additional fractional division capability. The HFCLK signal
is divided down, as shown in Figure 2, to generate the system
clock (SYSCLK) and peripheral clock (PERx_CLK) for different
ECO
Prescaler
`
Divider 0
(/16)
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Divider
/2n (n=0..3)
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An external active-LOW reset pin (XRES) can be used to reset
the device. The XRES pin has an internal pull-up resistor and, in
most applications, does not require any additional pull-up
resistors. The power system is described in detail in the “Power”
section on page 13.
HFCLK
SYSCLK
PER0_CLK
IMO
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EXTCLK
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WCO
Divider 9
(/16)
Fractional
Divider 0
(/16.5)
Fractional
Divider 1
(/16.5)
LFCLK
ILO
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PER15_CLK
Voltage Reference
The ECO is used as the active clock for the BLE subsystem to
meet the ±50-ppm clock accuracy requirement of the Bluetooth
4.1 specification. The ECO includes a tunable load capacitor to
tune the crystal clock frequency by measuring the actual clock
frequency. The high-accuracy ECO clock can also be used as a
system clock.
The internal bandgap reference circuit with 1% accuracy
provides the voltage reference for the 12-bit SAR ADC. To
enable better SNRs and absolute accuracy, it will be possible to
bypass the internal bandgap reference using a REF pin and to
use an external reference for the SAR.
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External Crystal Oscillator (ECO)
Watch Crystal Oscillator (WCO)
The WCO is used as the sleep clock for the BLE subsystem to
meet the ±500-ppm clock accuracy requirement of the Bluetooth
4.1 specification. The sleep clock provides accurate sleep timing
and enables wakeup at specified advertisement and connection
intervals. With the WCO and firmware, an accurate real-time
clock (within the bounds of the 32.768-kHz crystal accuracy) can
be realized.
Document Number: 001-90478 Rev. *L
Watchdog Timer (WDT)
A watchdog timer is implemented in the system resources
subsystem running from the ILO; this allows watchdog operations during Deep-Sleep mode and generates a watchdog reset
if not serviced before the timeout occurs. The watchdog reset is
recorded in the ‘Reset Cause’ register.
Page 5 of 42
PRoC BLE: CYBL10X6X
Family Datasheet
Peripheral Blocks
Serial Communication Block (SCB0/SCB1)
Control
Configure
Registers
AHB, DSI
VPLUS
SARMUX
SARADC
Data
Sequencer
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VMINUS
When SCB0 is used, Serial Data (SDA) and Serial Clock (SCL)
of I2C can be connected to P0.4 and P0.5, or P1.4 and P1.5, or
P3.0 and P3.1.
SARREF
Vrefs
When SCB1 is used, SDA and SCL can be connected to P0.0
and P0.1, or P3.4 and P3.5, or P5.0 and P5.1.
Ref-bypass
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Analog Mux
Bus A/B
The hardware I2C block implements a full multimaster and slave
interface (it is capable of multimaster arbitration). This block is
capable of operating at speeds of up to 1 Mbps (Fast-Mode Plus)
and has flexible buffering options to reduce the interrupt
overhead and latency for the CPU. The I2C function is implemented using the Cypress-provided software Component
(EzI2C) that creates a mailbox address range in the memory of
PRoC BLE and effectively reduces the I2C communication to
reading from and writing to an array in memory. In addition, the
block supports an 8-byte FIFO for receive and transmit, which,
by increasing the time given for the CPU to read data, greatly
reduces the need for clock stretching caused by the CPU not
having read the data on time.
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P3.0 - P3.7
SARSEQ
I2C mode: The I2C peripheral is compatible with the I2C
Standard-mode, Fast-mode, and Fast-Mode-Plus devices as
defined in the NXP I2C-bus specification and user manual
(UM10204). The I2C bus I/O is implemented with GPIOs in
open-drain modes.
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Figure 3. SAR ADC System Diagram
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Preceding the SAR ADC is the SARMUX, which can route
external pins and internal signals (analog mux bus and temperature sensor output) to the eight internal channels of the SAR
ADC. The sequencer controller (SARSEQ) is used to control the
SARMUX and SAR ADC to do an automatic scan on all enabled
channels without CPU intervention and for preprocessing tasks
such as averaging the output data. A Cypress-supplied software
driver (Component) is used to control the ADC peripheral.
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The ADC is a 12-bit, 1-Msps SAR ADC with a built-in
sample-and-hold (S/H) circuit. The ADC can operate with either
an internal voltage reference or an external voltage reference.
The SCB can be configured as an I2C, UART, or SPI interface. It
supports an 8-byte FIFO for receive and transmit buffers to
reduce CPU intervention. A maximum of two SCBs (SCB0,
SCB1) are available.
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12-Bit SAR ADC
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A diode based, on-chip temperature sensor is used to measure
the die temperature. The temperature sensor is connected to the
ADC, which digitizes the reading and produces a temperature
value using the Cypress-supplied software that includes
calibration and linearization.
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4x Timer Counter PWM (TCPWM)
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The 16-bit TCPWM module can be used to generate the PWM
output or to capture the timing of edges of input signals or to
provide a timer functionality. TCPWM can also be used as a
16-bit counter that supports up, down, and up/down counting
modes.
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Rising edge, falling edge, combined rising/falling edge detection,
or pass-through on all hardware input signals can be used to
derive counter events. Three routed output signals are available
to indicate underflow, overflow, and counter/compare match
events. A maximum of four TCPWMs are available.
4x PWM
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These PWMs are in addition to the TCPWMs. The PWM
peripheral can be configured as 8-bit or 16-bit resolution. The
PWM provides compare outputs to generate single or continuous
timing and control signals in hardware. It also provides an easy
method of generating complex real-time events accurately with
minimal CPU intervention. A maximum of four 8-bit PWMs or two
16-bit PWMs are available.
Document Number: 001-90478 Rev. *L
Configurations for I2C are as follows:
■ SCB1 is fully compliant with the Standard-mode (100 kHz),
Fast-mode (400 kHz), and Fast-Mode-Plus (1 MHz) I2C
signaling specifications when routed to GPIO pins P5.0 and
P5.1, except for hot-swap capability during I2C active communication.
■ SCB1 is compliant only with Standard mode (100 kHz) when
not used with P5.0 and P5.1.
■ SCB0 is compliant with Standard mode (100 kHz) only.
UART mode: This is a full-feature UART operating up to 1 Mbps.
It supports automotive single-wire interface (LIN), infrared
interface (IrDA), and SmartCard (ISO7816) protocols. In
addition, it supports the 9-bit multiprocessor mode, which allows
addressing of peripherals connected over common RX and TX
lines. The UART hardware flow control is supported to allow slow
and fast devices to communicate with each other over UART
without the risk of losing data. Refer to Table 4 on page 11 for
possible UART connections to the GPIOs.
SPI Mode: The SPI mode supports full Motorola® SPI, Texas
Instruments® Secure Simple Pairing (SSP) (essentially adds a
start pulse used to synchronize SPI Codecs), and National
Microwire (half-duplex form of SPI). This block supports an
8-byte FIFO for receive and transmit. Refer to Table 4 on page
11 for the possible SPI connections to the GPIOs.
Inter-IC Sound Bus (I2S)
Inter-IC Sound Bus (I2S) is a serial bus interface standard used
for connecting digital audio devices. The specification is from
Philips® Semiconductor (I2S bus specification; February 1986,
revised June 5, 1996).
Page 6 of 42
PRoC BLE: CYBL10X6X
Family Datasheet
The PWM method drives the panel with PWM signals to effectively use the capacitance of the panel to provide the integration
of the modulated pulse-width to generate the desired LCD
voltage. This method results in higher power consumption but
provides better results in driving TN displays.
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The I/O subsystem, which comprises the GPIO block, implements the following:
■ Eight drive-strength modes:
❐ Analog input mode (input and output buffers disabled)
❐ Input only
❐ Weak pull-up with strong pull-down
❐ Weak pull-up with weak pull-down
❐ Strong pull-up with weak pull-down
❐ Strong pull-up with strong pull-down
❐ Open drain with strong pull-down
❐ Open drain with strong pull-up
■ Port pins: 36
■ Input threshold select (CMOS or LVTTL)
■ Individual control of input and output buffers
(enabling/disabling) in addition to drive-strength modes
■ Hold mode for latching the previous state (used for retaining
the I/O state in Deep Sleep and Hibernate modes)
■ Selectable slew rates for dV/dt to improve EMI
■ The GPIO pins P5.0 and P5.1 are overvoltage-tolerant
■ The GPIO cells, including P5.0 and P5.1, cannot be
hot-swapped or powered up independent of the rest of the
system.
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LCD operation is supported during Deep-Sleep mode by
refreshing a small display buffer (four bits; one 32-bit register per
port).
I/O Subsystem
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The digital correlation method modulates the frequency and
signal levels of the commons and segments to generate the
highest RMS voltage across a segment to light it up or to
maintain the RMS signal as zero. This method is good for STN
displays but may result in reduced contrast in TN (cheaper)
displays.
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The LCD controller can drive up to four commons and up to 32
segments. It uses full digital methods to drive the LCD segments
providing ultra-low power consumption. The two methods used
are referred to as digital correlation and PWM.
The CapSense trackpad/touchpad with gestures has the
following features:
■ Supports 1-finger and 2-finger touch applications
■ Supports up to 35 X/Y sensor inputs
■ Includes a gesture-detection library:
❐ 1-finger touch: tracing, pan, click, double-click
❐ 2-finger touch: pan, click, zoom
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LCD
in phase with the sense electrode keeps the shield capacitance
from attenuating the sensed input.
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I2S operates only in the Master mode, supporting the transmitter
(TX) and the receiver (RX), which have independent data byte
streams. These byte streams are packed with the most significant byte first. The number of bytes used for each sample (a
sample for the left or right channel) is the minimum number of
bytes to hold a sample.
CapSense
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CapSense is supported on all GPIOs through a Capacitive
Sigma-Delta (CSD) block, which can be connected to any GPIO
through an analog mux bus. Any GPIO pin can be connected to
the analog mux bus via an analog switch. The CapSense
function can thus be provided on any pin or group of pins in a
system under software control. A software Component in PSoC
Creator is provided for the CapSense block to make it easy for
the user. The shield voltage can be driven on another mux bus
to provide liquid-tolerance capability. Driving the shield electrode
Document Number: 001-90478 Rev. *L
Page 7 of 42
PRoC BLE: CYBL10X6X
Family Datasheet
Pinouts
Table 1 shows the pin list for the CYBL10X6X device.
1
VDDD
POWER
1.71-V to 5.5-V digital supply
2
XTAL32O/P6.0
CLOCK
32.768-kHz crystal
3
XTAL32I/P6.1
CLOCK
32.768-kHz crystal or external clock input
4
XRES
RESET
Reset, active LOW
5
P4.0
GPIO
Port 4 Pin 0, analog/digital/lcd/csd
6
P4.1
GPIO
Port 4 Pin 1, analog/digital/lcd/csd
7
P5.0
GPIO
Port 5 Pin 0, analog/digital/lcd/csd
8
P5.1
GPIO
Port 5 Pin 1, analog/digital/lcd/csd
9
VSSD
GROUND
10
VDDR
POWER
1.9-V to 5.5-V radio supply
Digital ground
GANT1
GROUND
Antenna shielding ground
ANT
ANTENNA
Antenna pin
13
GANT2
GROUND
Antenna shielding ground
14
VDDR
POWER
1.9-V to 5.5-V radio supply
15
VDDR
POWER
1.9-V to 5.5-V radio supply
16
XTAL24I
CLOCK
24-MHz crystal or external clock input
17
XTAL24O
18
VDDR
19
P0.0
20
P0.1
21
P0.2
22
P0.3
23
VDDD
24
P0.4
25
P0.5
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11
12
24-MHz crystal
1.9-V to 5.5-V radio supply
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CLOCK
POWER
GPIO
Port 0 Pin 0, analog/digital/lcd/csd
GPIO
Port 0 Pin 1, analog/digital/lcd/csd
GPIO
Port 0 Pin 2, analog/digital/lcd/csd
GPIO
Port 0 Pin 3, analog/digital/lcd/csd
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POWER
1.71-V to 5.5-V digital supply
GPIO
Port 0 Pin 4, analog/digital/lcd/csd
Port 0 Pin 5, analog/digital/lcd/csd
GPIO
Port 0 Pin 6, analog/digital/lcd/csd
P0.7
GPIO
Port 0 Pin 7, analog/digital/lcd/csd
P1.0
GPIO
Port 1 Pin 0, analog/digital/lcd/csd
29
P1.1
GPIO
Port 1 Pin 1, analog/digital/lcd/csd
30
P1.2
GPIO
Port 1 Pin 2, analog/digital/lcd/csd
31
P1.3
GPIO
Port 1 Pin 3, analog/digital/lcd/csd
32
P1.4
GPIO
Port 1 Pin 4, analog/digital/lcd/csd
33
P1.5
GPIO
Port 1 Pin 5, analog/digital/lcd/csd
34
P1.6
GPIO
Port 1 Pin 6, analog/digital/lcd/csd
27
ot
R
ec
28
om
GPIO
P0.6
26
N
Description
es
ig
Type
D
Name
ew
Pin
ns
Table 1. CYBL10X6X Pin List (QFN Package)
35
P1.7
GPIO
36
VDDA
POWER
37
P2.0
GPIO
Port 2 Pin 0, analog/digital/lcd/csd
38
P2.1
GPIO
Port 2 Pin 1, analog/digital/lcd/csd
39
P2.2
GPIO
Port 2 Pin 2, analog/digital/lcd/csd
40
P2.3
GPIO
Port 2 Pin 3, analog/digital/lcd/csd
Document Number: 001-90478 Rev. *L
Port 1 Pin 7, analog/digital/lcd/csd
1.71-V to 5.5-V analog supply
Page 8 of 42
PRoC BLE: CYBL10X6X
Family Datasheet
Table 1. CYBL10X6X Pin List (QFN Package) (continued)
Type
41
P2.4
GPIO
Port 2 Pin 4, analog/digital/lcd/csd
42
P2.5
GPIO
Port 2 Pin 5, analog/digital/lcd/csd
43
P2.6
GPIO
Port 2 Pin 6, analog/digital/lcd/csd
44
P2.7
GPIO
Port 2 Pin 7, analog/digital/lcd/csd
VREF
REF
46
VDDA
POWER
1.024-V reference
1.71-V to 5.5-V analog supply
P3.0
GPIO
Port 3 Pin 0, analog/digital/lcd/csd
P3.1
GPIO
Port 3 Pin 1, analog/digital/lcd/csd
49
P3.2
GPIO
Port 3 Pin 2, analog/digital/lcd/csd
50
P3.3
GPIO
Port 3 Pin 3, analog/digital/lcd/csd
51
P3.4
GPIO
Port 3 Pin 4, analog/digital/lcd/csd
52
P3.5
GPIO
Port 3 Pin 5, analog/digital/lcd/csd
53
P3.6
GPIO
Port 3 Pin 6, analog/digital/lcd/csd
54
P3.7
GPIO
Port 3 Pin 7, analog/digital/lcd/csd
55
VSSA
GROUND
56
VCCD
POWER
57
EPAD
GROUND
Analog ground
N
ew
47
48
D
45
Description
ns
Name
es
ig
Pin
fo
r
Regulated 1.8-V supply; connect to 1-µF capacitor
Ground paddle for the QFN package
en
de
d
Table 2 shows the pin list for the CYBL10X6X device (WLCSP package).
Table 2. CYBL10X6X Pin List (WLCSP Package)
Name
A1
VREF
A2
VSSA
A3
P3.3
P3.7
A5
VSSD
A6
VSSA
A7
REF
GROUND
GPIO
GPIO
om
A4
Type
m
Pin
Analog ground
Port 3 Pin 3, analog/digital/lcd/csd
Port 3 Pin 7, analog/digital/lcd/csd
GROUND
Digital ground
GROUND
Analog ground
VCCD
POWER
Regulated 1.8-V supply, connect to 1-μF capacitor
VDDD
POWER
1.71-V to 5.5-V digital supply
P2.3
GPIO
B2
VSSA
GROUND
B3
P2.7
GPIO
Port 2 Pin 7, analog/digital/lcd/csd
B4
P3.4
GPIO
Port 3 Pin 4, analog/digital/lcd/csd
B5
P3.5
GPIO
Port 3 Pin 5, analog/digital/lcd/csd
B6
P3.6
GPIO
Port 3 Pin 6, analog/digital/lcd/csd
B7
XTAL32I/P6.1
CLOCK
A8
ot
R
ec
B1
N
Description
1.024-V reference
Port 2 Pin 3, analog/digital/lcd/csd
Analog ground
32.768-kHz crystal or external clock input
B8
XTAL32O/P6.0
CLOCK
C1
VSSA
GROUND
C2
P2.2
GPIO
Port 2 Pin 2, analog/digital/lcd/csd
C3
P2.6
GPIO
Port 2 Pin 6, analog/digital/lcd/csd
C4
P3.0
GPIO
Port 3 Pin 0, analog/digital/lcd/csd
Document Number: 001-90478 Rev. *L
32.768-kHz crystal
Analog ground
Page 9 of 42
PRoC BLE: CYBL10X6X
Family Datasheet
Table 2. CYBL10X6X Pin List (WLCSP Package) (continued)
Pin
Name
Type
Description
C5
P3.1
GPIO
Port 3 Pin 1, analog/digital/lcd/csd
Port 3 Pin 2, analog/digital/lcd/csd
P3.2
GPIO
C7
XRES
RESET
C8
P4.0
GPIO
Port 4 Pin 0, analog/digital/lcd/csd
D1
P1.7
GPIO
Port 1 Pin 7, analog/digital/lcd/csd
D2
VDDA
POWER
D3
P2.0
GPIO
Port 2 Pin 0, analog/digital/lcd/csd
D4
P2.1
GPIO
Port 2 Pin 1, analog/digital/lcd/csd
D5
P2.5
GPIO
Port 2 Pin 5, analog/digital/lcd/csd
D6
VSSD
GROUND
D7
P4.1
GPIO
Port 4 Pin 1, analog/digital/lcd/csd
D8
P5.0
GPIO
Port 5 Pin 0, analog/digital/lcd/csd, overvoltage-tolerant
E1
P1.2
GPIO
Port 1 Pin 2, analog/digital/lcd/csd
E2
P1.3
GPIO
Port 1 Pin 3, analog/digital/lcd/csd
E3
P1.4
GPIO
Port 1 Pin 4, analog/digital/lcd/csd
E4
P1.5
GPIO
Port 1 Pin 5, analog/digital/lcd/csd
E5
P1.6
GPIO
Port 1 Pin 6, analog/digital/lcd/csd
E8
VSSD
F1
VSSD
F2
P0.7
F3
P0.3
F4
P1.0
F5
P1.1
F6
VSSR
Port 2 Pin 4, analog/digital/lcd/csd
Port 5 Pin 1, analog/digital/lcd/csd, overvoltage-tolerant
GROUND
Digital ground
GROUND
Digital ground
GPIO
Port 0 Pin 7, analog/digital/lcd/csd
GPIO
Port 0 Pin 3, analog/digital/lcd/csd
GPIO
Port 1 Pin 0, analog/digital/lcd/csd
GPIO
Port 1 Pin 1, analog/digital/lcd/csd
Radio ground
GROUND
Radio ground
VDDR
POWER
P0.6
GPIO
G2
VDDD
POWER
G3
P0.2
GPIO
G4
VSSD
GROUND
Digital ground
G5
VSSR
GROUND
Radio ground
N
ot
G1
om
GROUND
F8
es
ig
GPIO
GPIO
VSSR
F7
ew
fo
r
N
Digital ground
D
1.71-V to 5.5-V analog supply
en
de
d
P5.1
m
P2.4
E7
Reset, active LOW
R
ec
E6
ns
C6
1.9-V to 5.5-V radio supply
Port 0 Pin 6, analog/digital/lcd/csd
1.71-V to 5.5-V digital supply
Port 0 Pin 2, analog/digital/lcd/csd
G6
VSSR
GROUND
Radio ground
G7
GANT
GROUND
Antenna shielding ground
G8
VSSR
GROUND
Radio ground
H1
P0.5
GPIO
Port 0 Pin 5, analog/digital/lcd/csd
Port 0 Pin 1, analog/digital/lcd/csd
H2
P0.1
GPIO
H3
XTAL24O
CLOCK
24-MHz crystal
H4
XTAL24I
CLOCK
24-MHz crystal or external clock input
Document Number: 001-90478 Rev. *L
Page 10 of 42
PRoC BLE: CYBL10X6X
Family Datasheet
Table 2. CYBL10X6X Pin List (WLCSP Package) (continued)
Pin
Name
Type
Description
H5
VSSR
GROUND
H6
VSSR
GROUND
Radio ground
H7
ANT
ANTENNA
Antenna pin
J1
P0.4
GPIO
Port 0 Pin 4, analog/digital/lcd/csd
J2
P0.0
GPIO
Port 0 Pin 0, analog/digital/lcd/csd
J3
VDDR
POWER
1.9-V to 5.5-V radio supply
J6
VDDR
POWER
1.9-V to 5.5-V radio supply
J7
NO CONNECT
-
D
es
ig
ns
Radio ground
ew
The I/O subsystem consists of a high-speed I/O matrix (HSIOM), which is a group of high-speed switches that routes GPIOs to the
resources inside the device. These resources include CapSense, TCPWMs, I2C, SPI, UART, and LCD. HSIOM_PORT_SELx are
32-bit-wide registers that control the routing of GPIOs. Each register controls one port; four dedicated bits are assigned to each GPIO
in the port. This provides up to 16 different options for GPIO routing as shown in Table 3.
Value
N
Table 3. HSIOM Port Settings
Description
Firmware-controlled GPIO
1
Reserved
2
Reserved
3
Reserved
4
Pin is a CSD sense pin
5
Pin is a CSD shield pin
6
Pin is connected to AMUXA
7
Pin is connected to AMUXB
8
Pin-specific Active function #0
9
Pin-specific Active function #1
10
Pin-specific Active function #2
11
Reserved
12
Pin is an LCD common pin
13
Pin is an LCD segment pin
14
Pin-specific Deep-Sleep function #0
15
Pin-specific Deep-Sleep function #1
R
ec
om
m
en
de
d
fo
r
0
The selection of peripheral functions for different GPIO pins is given in Table 4.
Table 4. Port Pin Connections[1]
ot
Name
Analog
Digital (HSIOM_PORT_SELx.SELy) ('x' denotes port number and 'y' denotes pin number)
0
8
9
10
Active #2
14
15
Active #0
Active #1
Deep Sleep #0
Deep Sleep #1
GPIO
TCPWM0_P[3]
SCB1_UART_RX[1]
SCB1_I2C_SDA[1]
SCB1_SPI_MOSI[1]
P0.1
GPIO
TCPWM0_N[3]
SCB1_UART_TX[1]
SCB1_I2C_SCL[1]
SCB1_SPI_MISO[1]
P0.2
GPIO
TCPWM1_P[3]
SCB1_UART_RTS[1]
'SCB1_SPI_SS0[1]'
P0.3
GPIO
TCPWM1_N[3]
SCB1_UART_CTS[1]
SCB1_SPI_SCLK[1]
N
GPIO
P0.0
Note
1. For devices with only 1 SCB, use pins corresponding to SCB1.
Document Number: 001-90478 Rev. *L
Page 11 of 42
PRoC BLE: CYBL10X6X
Family Datasheet
Table 4. Port Pin Connections[1] (continued)
Digital (HSIOM_PORT_SELx.SELy) ('x' denotes port number and 'y' denotes pin number)
Analog
0
8
9
10
14
15
ns
Name
GPIO
Active #0
Active #1
Active #2
Deep Sleep #0
P0.4
GPIO
TCPWM1_P[0]
SCB0_UART_RX[1]
EXT_CLK[0]/
ECO_OUT[0]
SCB0_I2C_SDA[1]
P0.5
GPIO
TCPWM1_N[0]
SCB0_UART_TX[1]
SCB0_I2C_SCL[1]
SCB0_SPI_MISO[1]
P0.6
GPIO
TCPWM2_P[0]
SCB0_UART_RTS[1]
SWDIO[0]
SCB0_SPI_SS0[1]
P0.7
GPIO
TCPWM2_N[0]
SCB0_UART_CTS[1]
SWDCLK[0]
SCB0_SPI_SCLK[1]
P1.0
GPIO
TCPWM0_P[1]
P1.1
GPIO
TCPWM0_N[1]
P1.2
GPIO
TCPWM1_P[1]
P1.3
GPIO
TCPWM1_N[1]
P1.4
GPIO
TCPWM2_P[1]
SCB0_UART_RX[0]
P1.5
GPIO
TCPWM2_N[1]
SCB0_UART_TX[0]
P1.6
GPIO
TCPWM3_P[1]
SCB0_UART_RTS[0]
P1.7
GPIO
TCPWM3_N[1]
SCB0_UART_CTS[0]
P2.0
GPIO
P2.1
GPIO
P2.2
GPIO
P2.3
GPIO
P2.4
GPIO
P2.5
GPIO
P2.6
GPIO
P2.7
GPIO
P3.0
SARMUX_0 GPIO
P3.1
SARMUX_1 GPIO
P3.2
es
ig
D
ew
N
SCB1_SPI_SS1
SCB1_SPI_SS2
SCB1_SPI_SS3
SCB0_I2C_SDA[0]
SCB0_SPI_MOSI[1]
SCB0_I2C_SCL[0]
SCB0_SPI_MISO[1]
SCB0_SPI_SS0[1]
SCB0_SPI_SCLK[1]
fo
r
en
de
d
m
WCO_OUT[2]
SCB0_SPI_SS1
SCB0_SPI_SS2
WAKEUP
SCB0_SPI_SS3
WCO_OUT[1]
EXT_CLK[1]/
ECO_OUT[1]
SCB0_I2C_SDA[2]
TCPWM0_N[2]
SCB0_UART_TX[2]
SCB0_I2C_SCL[2]
SARMUX_2 GPIO
TCPWM1_P[2]
SCB0_UART_RTS[2]
P3.3
SARMUX_3 GPIO
TCPWM1_N[2]
SCB0_UART_CTS[2]
P3.4
SARMUX_4 GPIO
TCPWM2_P[2]
SCB1_UART_RX[2]
SCB1_I2C_SDA[2]
P3.5
SARMUX_5 GPIO
TCPWM2_N[2]
SCB1_UART_TX[2]
SCB1_I2C_SCL[2]
P3.6
SARMUX_6 GPIO
TCPWM3_P[2]
SCB1_UART_RTS[2]
P3.7
SARMUX_7 GPIO
TCPWM3_N[2]
SCB1_UART_CTS[2]
WCO_OUT[0]
R
ec
om
SCB0_UART_RX[2]
ot
TCPWM0_P[2]
Deep Sleep #1
SCB0_SPI_MOSI[1]
CMOD
GPIO
TCPWM0_P[0]
SCB1_UART_RTS[0]
SCB1_SPI_MOSI[0]
P4.1
CTANK
GPIO
TCPWM0_N[0]
SCB1_UART_CTS[0]
SCB1_SPI_MISO[0]
P5.0
GPIO
TCPWM3_P[0]
SCB1_UART_RX[0]
EXTPA_EN
SCB1_I2C_SDA[0]
SCB1_SPI_SS0[0]
P5.1
GPIO
TCPWM3_N[0]
SCB1_UART_TX[0]
EXT_CLK[2]/
ECO_OUT[2]
SCB1_I2C_SCL[0]
SCB1_SPI_SCLK[0]
P6.0_XTAL32O
GPIO
P6.1_XTAL32I
GPIO
N
P4.0
Document Number: 001-90478 Rev. *L
Page 12 of 42
PRoC BLE: CYBL10X6X
Family Datasheet
Power
Power Supply
Table 5. Power Modes System Status
850 µA + 260 µA
per MHz[2]
Sleep
1.1 mA at 3 MHz
0.1-µF ceramic at each pin plus bulk
capacitor 1 µF to 10 µF
VDDR
0.1-µF ceramic at each pin plus bulk
capacitor 1 µF to 10 µF
VCCD
1-µF ceramic capacitor at the VCCD pin
VREF (optional)
The internal bandgap may be bypassed
with a 1-µF to 10-µF capacitor
Low-Power Modes
es
ig
ns
VDDA
N
ew
PRoC BLE supports five power modes. Refer to Table 5 for more
details on the system status. The PRoC BLE device consumes
the lowest current in Stop mode; the device wakeup from stop
mode is with a system reset through the XRES or WAKEUP pin.
It can retain the SRAM data in Hibernate mode and is capable of
retaining the complete system status in Deep-Sleep mode.
Table 5 shows the different power modes and the peripherals
that are active.
Code
Execution
Digital
Peripherals
Available
Analog
Peripherals
Available
Clock
Sources
Available
Wake Up
Sources
Wake-Up
Time
Yes
All
All
All
–
–
No
All
All
All
Any interrupt
source
0
No
WDT, LCD,
I2C/SPI,
Link-Layer
POR, BOD
WCO,
ILO
GPIO, WDT,
I2C/SPI Link
Layer
25 μs
1.3 μA
Hibernate
150 nA
No
No
POR, BOD
No
GPIO
2 ms
60 nA
No
No
No
No
Wake-Up pin,
XRES
2 ms
N
ot
R
ec
Stop
om
Deep Sleep
m
Active
0.1-µF ceramic at each pin plus bulk
capacitor 1 µF to 10 µF
en
de
d
Current
Consumption
Power Mode
VDDD
fo
r
Bypass capacitors must be used from VDDx (x = A, D, or R) to
ground. The typical practice for systems in this frequency range
is to use a capacitor in the 1-µF range in parallel with a smaller
capacitor (for example, 0.1 µF). Note that these are simply rules
of thumb and that, for critical applications, the PCB layout, lead
inductance, and the bypass capacitor parasitic should be
simulated to design to obtain optimal bypassing.
Bypass Capacitors
D
PRoC BLE can be supplied from batteries with a voltage range
of 1.9 V to 5.5 V by directly connecting to the digital supply
(VDDD), analog supply (VDDA), and radio supply (VDDR) pins. The
internal LDOs in the device regulate the supply voltage to
required levels for different blocks. The device has one regulator
for the digital circuitry and separate regulators for radio circuitry
for noise isolation. The analog circuits run directly from the
analog supply (VDDA) input. The device uses separate regulators
for Deep Sleep and Hibernate modes to minimize the power
consumption. The radio stops working below 1.9 V, but the rest
of the system continues to function down to 1.71 V without RF.
Note that VDDR must be supplied whenever VDDD is supplied.
Note
2. For CPU subsystem.
Document Number: 001-90478 Rev. *L
Page 13 of 42
PRoC BLE: CYBL10X6X
Family Datasheet
A typical system application connection diagram for the 56-QFN package is shown in Figure 4.
VDDA
C1
1.0 uF
U1
VDDD
1
2
L1
VDDR
42
41
40
39
38
37
36
35
34
33
32
31
30
29
VDDA
15
16
17
18
19
20
21
22
23
24
25
26
27
28
C5
PRoC BLE
56-QFN
N
VDDR
C6
P2.5
P2.4
P2.3
P2.2
P2.1
P2.0
VDDA
P1.7
P1.6
P1.5
P1.4
P1.3
P1.2
P1.1
fo
r
1
2
ANTENNA
VDDD
XTAL32O/P6.0
XTAL32I/P6.1
XRES
P4.0
P4.1
P5.0
P5.1
VSS
VDDR
GANT1
ANT
GANT2
VDDR
VDDR
XTAL24I
XTAL24O
VDDR
P0.0
P0.1
P0.2
P0.3
VDDD
P0.4
P0.5
P0.6
P0.7
P1.0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
32.768KHz
D
1
ew
2
EPAD
VCCD
VSSA
P3.7
P3.6
P3.5
P3.4
P3.3
P3.2
P3.1
P3.0
VDDA
VREF
P2.7
P2.6
Y2
es
ig
C4
18 pF
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
C3
36 pF
C2
1.0 uF
ns
Figure 4. PRoC BLE Applications Diagram
VDDD
SWDIO
SWDCLK
2
N
ot
R
ec
om
m
3
Y1
24MHz
4
1
en
de
d
VDDR
Document Number: 001-90478 Rev. *L
Page 14 of 42
PRoC BLE: CYBL10X6X
Family Datasheet
Component Datasheets: PSoC Creator Components provide
hardware abstraction using APIs to configure and control
peripheral activity. The Component datasheet covers
Component features, its usage and operation details, API
description, and electrical specifications. This is the primary
documentation used during development. These Components
can represent peripherals on the device (such as a timer, I2C, or
UART) or high-level system functions (such as the BLE
Component).
ns
Tools
With industry-standard cores, programming, and debugging
interfaces, the CYBL10X6X family is part of a development tool
ecosystem.
Visit us at www.cypress.com/go/psoccreator for the latest information on the revolutionary, easy-to-use PSoC Creator IDE,
supported third-party compilers, programmers, and debuggers.
Kits
Cypress provides a portfolio of kits to accelerate time-to-market.
Visit us at www.cypress.com/procble.
N
ot
R
ec
om
m
en
de
d
fo
r
Application Notes: Application notes help you to understand
how to use various device features. They also provide guidance
on how to solve a variety of system design challenges.
es
ig
A suite of documentation supports the CYBL10X6X family to
ensure that you find answers to your questions quickly. This
section contains a list of some of the key documents.
In addition to the print documentation, Cypress forums connect
you with fellow users and experts from around the world, 24
hours a day, 7 days a week.
D
Documentation
Online
ew
The CYBL10X6X family has a rich set of documentation, development tools, and online resources to assist you during your
development process. Visit www.cypress.com/procble to find out
more.
Technical Reference Manual (TRM): The TRM describes all
peripheral functionality in detail, with register-level descriptions.
This document is divided into two parts: the Architecture TRM
and the Register TRM.
N
Development Support
Document Number: 001-90478 Rev. *L
Page 15 of 42
PRoC BLE: CYBL10X6X
Family Datasheet
Exposure to absolute maximum conditions for extended periods
of time may affect device reliability.
This section provides detailed electrical characteristics. Absolute
maximum rating for the CYBL10X6X devices is listed in the
following table. Usage above the absolute maximum conditions
may cause permanent damage to the device.
The maximum storage temperature is 150 °C in compliance with
JEDEC Standard JESD22-A103, High Temperature Storage
Life. When used below absolute maximum conditions, but above
normal operating conditions, the device may not operate to the
specification.
Absolute Maximum Ratings
Table 6. Absolute Maximum Ratings
Parameter
Description
Min
Typ
Max
–
6
VDDD_ABS
Analog, digital, or radio supply
relative to VSS (VSSD = VSSA)
–0.5
SID2
VCCD_ABS
Direct digital core voltage input
relative to VSSD
–0.5
SID3
VGPIO_ABS
GPIO voltage
–0.5
SID4
IGPIO_ABS
Maximum current per GPIO
–25
–
SID5
IGPIO_injection
GPIO injection current, Max for VIH
> VDDD, and Min for VIL < VSS
–0.5
–
BID57
ESD_HBM
Electrostatic discharge human body
model
2200[3]
BID58
ESD_CDM
Electrostatic discharge charged
device model
BID61
LU
Pin current for latch up
Parameter
RF Receiver Specifications
SID340
RXS, IDLE
RXS, IDLE
R
ec
SID340A
Absolute max
V
Absolute max
–
VDD +0.5
V
Absolute max
25
mA
Absolute max
0.5
mA
Absolute max,
current injected per
pin
–
–
V
500
–
–
V
–200
–
200
mA
N
1.95
Details/
Conditions
Typ
Max
Units
RX sensitivity with idle transmitter
–
–89
–
dBm
RX sensitivity with idle transmitter
excluding balun loss
–
–91
–
dBm
Guaranteed by design
simulation
RX sensitivity with dirty transmitter
–
–87
–
dBm
RF-PHY Specification
(RCV-LE/CA/01/C)
–
–91
–
dBm
–10
–1
–
dBm
RF-PHY Specification
(RCV-LE/CA/06/C)
–
9
21
dB
RF-PHY Specification
(RCV-LE/CA/03/C)
RXS, DIRTY
SID342
RXS, HIGHGAIN RX sensitivity in high-gain mode
with idle transmitter
SID343
PRXMAX
Maximum input power
SID344
CI1
Co-channel interference,
Wanted signal at –67 dBm and
Interferer at FRX
ot
V
Min
SID341
N
Details/
Conditions
–
fo
r
Description
om
Spec ID#
en
de
d
Table 7. BLE Subsystem
m
BLE Subsystem
ew
SID1
Units
D
Spec ID#
es
ig
ns
Electrical Specifications
Note
3. This does not apply to the RF pins (ANT, XTALI, and XTALO). RF pins (ANT, XTALI, and XTALO) are tested for 500-V HBM.
Document Number: 001-90478 Rev. *L
Page 16 of 42
PRoC BLE: CYBL10X6X
Family Datasheet
Table 7. BLE Subsystem (continued)
Parameter
Description
Min
Typ
Max
Units
Details/
Conditions
CI2
Adjacent channel interference
Wanted signal at –67 dBm and
Interferer at FRX ±1 MHz
–
3
15
dB
RF-PHY Specification
(RCV-LE/CA/03/C)
SID346
CI3
Adjacent channel interference
Wanted signal at –67 dBm and
Interferer at FRX ±2 MHz
–
–29
–
dB
RF-PHY Specification
(RCV-LE/CA/03/C)
SID347
CI4
Adjacent channel interference
Wanted signal at –67 dBm and
Interferer at ≥FRX ±3 MHz
–
–39
–
dB
RF-PHY Specification
(RCV-LE/CA/03/C)
SID348
CI5
Adjacent channel interference
Wanted Signal at –67 dBm and
Interferer at Image frequency
(FIMAGE)
–
–20
–
SID349
CI3
Adjacent channel interference
Wanted signal at –67 dBm and
Interferer at Image frequency
(FIMAGE ± 1 MHz)
–
SID350
OBB1
Out-of-band blocking,
Wanted signal at –67 dBm and
Interferer at F = 30–2000 MHz
–30
SID351
OBB2
Out-of-band blocking,
Wanted signal at –67 dBm and
Interferer at F = 2,003–2,399 MHz
SID352
OBB3
SID353
OBB4
SID354
IMD
SID355
RXSE1
D
es
ig
ns
SID345
ew
Spec ID#
dB
RF-PHY Specification
(RCV-LE/CA/03/C)
–
dB
RF-PHY Specification
(RCV-LE/CA/03/C)
–27
–
dBm
RF-PHY Specification
(RCV-LE/CA/04/C)
–35
–27
–
dBm
RF-PHY Specification
(RCV-LE/CA/04/C)
Out-of-band blocking,
Wanted signal at –67 dBm and
Interferer at F = 2,484–2,997 MHz
–35
–27
–
dBm
RF-PHY Specification
(RCV-LE/CA/04/C)
Out-of-band blocking,
Wanted signal a –67 dBm and Interferer at F = 3,000–12,750 MHz
–30
–27
–
dBm
RF-PHY Specification
(RCV-LE/CA/04/C)
Intermodulation performance
Wanted signal at –64 dBm and
1-Mbps BLE, third, fourth, and fifth
offset channel
–50
–
–
dBm
RF-PHY Specification
(RCV-LE/CA/05/C)
Receiver spurious emission
30 MHz to 1.0 GHz
–
–
–57
dBm
100-kHz
measurement
bandwidth
ETSI EN300 328
V1.8.1
Receiver spurious emission
1.0 GHz to 12.75 GHz
–
–
–47
dBm
1-MHz measurement
bandwidth
ETSI EN300 328
V1.8.1
RF Transmitter Specifications
SID357
TXP, ACC
RF power accuracy
–
±1
–
dB
SID358
TXP, RANGE
RF power control range
–
20
–
dB
SID359
TXP, 0 dBm
Output power, 0-dB gain setting
(PA7)
–
0
–
dBm
N
fo
r
en
de
d
m
om
R
ec
RXSE2
N
ot
SID356
–30
Document Number: 001-90478 Rev. *L
Page 17 of 42
PRoC BLE: CYBL10X6X
Family Datasheet
Table 7. BLE Subsystem (continued)
Parameter
Description
Min
Typ
Max
Units
TXP, MAX
Output power, maximum power
setting (PA10)
–
3
–
dBm
SID361
TXP, MIN
Output power, minimum power
setting (PA1)
–
–18
–
dBm
SID362
F2AVG
Average frequency deviation for
10101010 pattern
185
–
–
SID363
F1AVG
Average frequency deviation for
11110000 pattern
225
250
275
SID364
EO
Eye opening = ∆F2AVG/∆F1AVG
0.8
–
–
SID365
FTX, ACC
Frequency accuracy
–150
–
150
SID366
FTX, MAXDR
Maximum frequency drift
–50
SID367
FTX, INITDR
Initial frequency drift
–20
SID368
FTX,DR
Maximum drift rate
–20
SID369
IBSE1
In-band spurious emission at
2-MHz offset
SID370
IBSE2
In-band spurious emission at
≥3-MHz offset
SID371
TXSE1
SID372
TXSE2
RF-PHY Specification
(TRM-LE/CA/05/C)
kHz
RF-PHY Specification
(TRM-LE/CA/05/C)
ew
D
kHz
kHz
RF-PHY Specification
(TRM-LE/CA/06/C)
50
kHz
RF-PHY Specification
(TRM-LE/CA/06/C)
–
20
kHz
RF-PHY Specification
(TRM-LE/CA/06/C)
–
20
kHz/
50 µs
RF-PHY Specification
(TRM-LE/CA/06/C)
fo
r
N
–
–
–20
dBm
RF-PHY Specification
(TRM-LE/CA/03/C)
–
–
–30
dBm
RF-PHY Specification
(TRM-LE/CA/03/C)
Transmitter spurious emissions
(average), 1.0 GHz
–
–
–41.5
dBm
FCC-15.247
Receive current in normal mode
–
18.7
–
mA
Receive current in normal mode
–
16.4
–
mA
Receive current in high-gain mode
–
21.5
–
mA
IRX
SID373A
IRX_RF
SID374
IRX, HIGHGAIN
SID375
ITX, 3 dBm
TX current at 3-dBm setting (PA10)
–
20
–
mA
SID376
ITX, 0 dBm
TX current at 0-dBm setting (PA7)
–
16.5
–
mA
om
m
SID373
R
ec
RF-PHY Specification
(TRM-LE/CA/05/C)
–
en
de
d
RF Current Specification
es
ig
SID360
Details/
Conditions
ns
Spec ID#
Measured at VDDR
ITX_RF, 0 dBm
TX current at 0-dBm setting (PA7)
–
15.6
–
mA
Measured at VDDR
SID376B
ITX_RF, 0 dBm
TX current at 0 dBm excluding
Balun loss
–
14.2
–
mA
Guaranteed by design
simulation
SID377
ITX, -3 dBm
TX current at –3-dBm setting (PA4)
–
15.5
–
mA
SID378
ITX, -6 dBm
TX current at –6-dBm setting (PA3)
–
14.5
–
mA
SID379
ITX, -12 dBm
TX current at –12-dBm setting
(PA2)
–
13.2
–
mA
SID380
ITX, -18 dBm
TX current at –18-dBm setting
(PA1)
–
12.5
–
mA
SID380A
Iavg_1sec, 0dBm Average current at 1-second BLE
connection interval
–
18.9
–
µA
N
ot
SID376A
Document Number: 001-90478 Rev. *L
TXP: 0 dBm; ±20-ppm
master and slave
clock accuracy.
For empty PDU
exchange
Page 18 of 42
PRoC BLE: CYBL10X6X
Family Datasheet
Table 7. BLE Subsystem (continued)
Min
Typ
Max
Units
Details/
Conditions
–
6.25
–
µA
TXP: 0 dBm; ±20-ppm
master and slave
clock accuracy.
For empty PDU
exchange
2400
–
2482
Description
Iavg_4sec, 0dBm Average current at 4-second BLE
connection interval
SID381
FREQ
RF operating frequency
SID382
CHBW
Channel spacing
–
2
–
SID383
DR
On-air data rate
–
1000
–
SID384
IDLE2TX
BLE Radio Idle to BLE Radio TX
transition time
–
120
140
SID385
IDLE2RX
BLE Radio Idle to BLE Radio RX
transition time
–
ew
General RF Specification
MHz
D
MHz
kbps
µs
120
µs
RSSI, ACC
RSSI accuracy
–
±5
–
dB
SID387
RSSI, RES
RSSI resolution
–
1
–
dB
SID388
RSSI, PER
RSSI sample period
–
6
–
µs
en
de
d
Device-Level Specifications
fo
r
SID386
N
RSSI Specification
75
ns
SID380B
Parameter
es
ig
Spec ID#
All specifications are valid for –40 °C TA 105 °C, except where noted. Specifications are valid for 1.71 V to 5.5 V, except where
noted.
Table 8. DC Specifications
SID6
VDD
SID7
VDD
SID8
VDDR
SID8A
VDDR
SID10
Min
Typ
Max
Units
Power supply input voltage (VDDA =
VDDD = VDD)
1.8
–
5.5
V
Power supply input voltage unregulated (VDDA = VDDD = VDD)
1.71
1.8
1.89
V
Radio supply voltage (Radio on)
1.9
–
5.5
V
Radio supply voltage (Radio off)
1.71
–
5.5
V
Details/
Conditions
With regulator enabled
Internally unregulated
supply
VCCD
Digital regulator output voltage (for
core logic)
–
1.8
–
V
CVCCD
Digital regulator output bypass
capacitor
1
1.3
1.6
µF
Execute from flash; CPU at 3 MHz
–
1.7
–
mA
T = 25 °C,
VDD = 3.3 V
R
ec
SID9
Description
m
Parameter
om
Spec ID#
X5R ceramic or better
Active Mode, VDD = 1.71 V to 5.5 V
IDD3
SID14
IDD4
Execute from flash; CPU at 3 MHz
–
–
–
mA
T = –40 °C to 105 °C
SID15
IDD5
Execute from flash; CPU at 6 MHz
–
2.5
–
mA
T = 25 °C,
VDD = 3.3 V
N
ot
SID13
SID16
IDD6
Execute from flash; CPU at 6 MHz
–
–
–
mA
T = –40 °C to 105 °C
SID17
IDD7
Execute from flash; CPU at 12 MHz
–
4
–
mA
T = 25 °C,
VDD = 3.3 V
SID18
IDD8
Execute from flash; CPU at 12 MHz
–
–
–
mA
T = –40 °C to 105 °C
Document Number: 001-90478 Rev. *L
Page 19 of 42
PRoC BLE: CYBL10X6X
Family Datasheet
Table 8. DC Specifications (continued)
Spec ID#
Parameter
Description
Min
Typ
Max
Units
Details/
Conditions
IDD9
Execute from flash; CPU at 24 MHz
–
7.1
–
mA
T = 25 °C,
VDD = 3.3 V
SID20
IDD10
Execute from flash; CPU at 24 MHz
–
–
–
mA
T = –40 °C to 105 °C
SID21
IDD11
Execute from flash; CPU at 48 MHz
–
13.4
–
mA
T = 25 °C,
VDD = 3.3 V
SID22
IDD12
Execute from flash; CPU at 48 MHz
–
–
–
mA
T = –40 °C to 105 °C
–
–
–
mA
T = 25 °C,
VDD = 3.3 V, SYSCLK
= 3 MHz
–
mA
T = 25 °C,
VDD = 3.3 V, SYSCLK
= 3 MHz
SID24
IDD14
ECO on
–
Deep-Sleep Mode, VDD = 1.8 V to 3.6 V
es
ig
ew
Sleep Mode, VDD and VDDR = 1.9 V to 5.5 V
–
N
IMO on
IDD13
D
Sleep Mode, VDD = 1.8 V to 5.5 V
SID23
ns
SID19
IDD15
WDT with WCO on
–
1.3
–
µA
T = 25 °C,
VDD = 3.3 V
SID26
IDD16
WDT with WCO on
fo
r
SID25
–
SID27
IDD17
WDT with WCO on
–
–
–
µA
T = 25 °C,
VDD = 5 V
SID28
IDD18
WDT with WCO on
–
–
–
µA
T = –40 °C to 105 °C
en
de
d
Deep-Sleep Mode, VDD = 3.6 V to 5.5 V
–
–
µA
T = –40 °C to 105 °C
Deep-Sleep Mode, VDD = 1.71 V to 1.89 V (Regulator Bypassed)
SID29
IDD19
WDT with WCO on
–
–
–
µA
T = 25 °C
SID30
IDD20
WDT with WCO on
–
–
–
µA
T = –40 °C to 105 °C
GPIO and reset active
–
150
–
nA
T = 25 °C,
VDD = 3.3 V
GPIO and reset active
–
–
–
nA
T = –40 °C to 105 °C
GPIO and reset active
–
–
–
nA
T = 25 °C,
VDD = 5 V
GPIO and reset active
–
–
–
nA
T = –40 °C to 105 °C
IDD27
SID38
IDD28
om
SID37
m
Hibernate Mode, VDD = 1.8 V to 3.6 V
Hibernate Mode, VDD = 3.6 V to 5.5 V
IDD29
R
ec
SID39
SID40
IDD30
Hibernate Mode, VDD = 1.71 V to 1.89 V (Regulator Bypassed)
IDD31
GPIO and reset active
–
–
–
nA
T = 25 °C
SID42
IDD32
GPIO and reset active
–
–
–
nA
T = –40 °C to 105 °C
ot
SID41
Stop Mode, VDD = 1.8 V to 3.6 V
IDD33
Stop-mode current (VDD)
–
20
–
nA
T = 25 °C,
VDD = 3.3 V
SID44
IDD34
Stop-mode current (VDDR)
–
40
–-
nA
T = 25 °C,
VDDR = 3.3 V
SID45
IDD35
Stop-mode current (VDD)
–
–
–
nA
T = –40 °C to 105 °C
SID46
IDD36
Stop-mode current (VDDR)
–
–
–
nA
T = –40 °C to 105 °C,
VDDR = 1.9 V to 3.6 V
N
SID43
Document Number: 001-90478 Rev. *L
Page 20 of 42
PRoC BLE: CYBL10X6X
Family Datasheet
Table 8. DC Specifications (continued)
Spec ID#
Parameter
Description
Min
Typ
Max
Units
Details/
Conditions
ns
Stop Mode, VDD = 3.6 V to 5.5 V
IDD37
Stop-mode current (VDD)
–
–
–
nA
T = 25 °C,
VDD = 5 V
SID48
IDD38
Stop-mode current (VDDR)
–
–
–
nA
T = 25 °C,
VDDR = 5 V
SID49
IDD39
Stop-mode current (VDD)
–
–
–
nA
T = –40 °C to 105 °C
SID50
IDD40
Stop-mode current (VDDR)
–
–
–
nA
T = –40 °C to 105 °C
D
Stop Mode, VDD = 1.71 V to 1.89 V (Regulator Bypassed)
es
ig
SID47
IDD41
Stop-mode current (VDD)
–
–
–
nA
T = 25 °C
SID52
IDD42
Stop-mode current (VDD)
–
–
–
nA
T = –40 °C to 105 °C
Table 9. AC Specifications
Parameter
Description
Min
Details/
Conditions
Typ
Max
Units
DC
–
48
MHz
–
0
–
µs
Guaranteed by
characterization
–
–
25
µs
24-MHz IMO.
Guaranteed by
characterization
N
Spec ID#
ew
SID51
1.71 V VDD 5.5 V
FCPU
CPU frequency
SID54
TSLEEP
Wakeup from Sleep mode
SID55
TDEEPSLEEP
Wakeup from Deep-Sleep mode
SID56
THIBERNATE
Wakeup from Hibernate mode
–
–
2
ms
Guaranteed by
characterization
SID57
TSTOP
Wakeup from Stop mode
–
–
2
ms
Guaranteed by
characterization
Min
Typ
Max
Units
Input voltage HIGH threshold
0.7 × VDD
–
–
V
CMOS input
Input voltage LOW threshold
–
–
0.3 × VDD
V
CMOS input
SID58
VIH
SID59
VIL
SID60
m
Parameter
VIH
Description
om
Spec ID#
en
de
d
GPIO
Table 10. GPIO DC Specifications
fo
r
SID53
0.7 × VDD
–
-
V
SID61
VIL
LVTTL input, VDD < 2.7 V
–
–
0.3× VDD
V
SID62
VIH
LVTTL input, VDD ≥ 2.7 V
2.0
–
-
V
SID63
VIL
LVTTL input, VDD ≥ 2.7 V
–
–
0.8
V
SID64
VOH
Output voltage HIGH level
VDD –0.6
–
–
V
IOH = 4 mA at 3.3-V
VDD
ot
R
ec
LVTTL input, VDD < 2.7 V
Details/
Conditions
VOH
Output voltage HIGH level
VDD –0.5
–
–
V
IOH = 1 mA at 1.8-V
VDD
SID66
VOL
Output voltage LOW level
–
–
0.6
V
IOL = 8 mA at 3.3-V
VDD
SID67
VOL
Output voltage LOW level
–
–
0.6
V
IOL = 4 mA at 1.8-V
VDD
N
SID65
Note
4. VIH must not exceed VDD + 0.2 V.
Document Number: 001-90478 Rev. *L
Page 21 of 42
PRoC BLE: CYBL10X6X
Family Datasheet
Table 10. GPIO DC Specifications (continued)
SID68
Parameter
Description
VOL
Output voltage LOW level
Min
Typ
Max
Units
–
–
0.4
V
RPULLUP
Pull-up resistor
3.5
5.6
8.5
kΩ
RPULLDOWN
Pull-down resistor
3.5
5.6
8.5
kΩ
SID71
IIL
Input leakage current (absolute value)
–
–
2
IIL_CTBM
Input leakage on CTBm input pins
–
–
4
CIN
Input capacitance
–
–
7
SID74
VHYSTTL
Input hysteresis LVTTL
25
40
SID75
VHYSCMOS
Input hysteresis CMOS
0.05 ×
VDD
–
SID76
IDIODE
Current through protection diode to
VDD/VSS
–
SID77
ITOT_GPIO
Maximum total source or sink chip
current
–
Parameter
Description
en
de
d
Spec ID#
25 °C,
VDD = 3.3 V
nA
pF
mV
–
ew
N
–
fo
r
Table 11. GPIO AC Specifications
–
nA
D
SID72
SID73
IOL = 3 mA at 3.3-V
VDD
es
ig
SID69
SID70
Details/
Conditions
ns
Spec ID#
VDD > 2.7 V
mV
100
µA
200
mA
Min
Typ
Max
Units
Except for
overvoltage-tolerant
pins (P5.0 and P5.1)
Details/
Conditions
TRISEF
Rise time in Fast-Strong mode
2
–
12
ns
3.3-V VDDD,
CLOAD = 25 pF
SID79
TFALLF
Fall time in Fast-Strong mode
2
–
12
ns
3.3-V VDDD,
CLOAD = 25 pF
SID80
TRISES
Rise time in Slow-Strong mode
10
–
60
ns
3.3-V VDDD,
CLOAD = 25 pF
SID81
TFALLS
Fall time in Slow-Strong mode
10
–
60
ns
3.3-V VDDD,
CLOAD = 25 pF
SID82
FGPIOUT1
GPIO Fout; 3.3 V VDD 5.5 V.
Fast-Strong mode
–
–
33
MHz
90/10%, 25-pF load,
60/40 duty cycle
SID83
FGPIOUT2
GPIO Fout; 1.7 VVDD 3.3 V.
Fast-Strong mode
–
–
16.7
MHz
90/10%, 25-pF load,
60/40 duty cycle
SID84
FGPIOUT3
GPIO Fout; 3.3 V VDD 5.5 V.
Slow-Strong mode
–
–
7
MHz
90/10%, 25-pF load,
60/40 duty cycle
SID85
FGPIOUT4
GPIO Fout; 1.7 V VDD 3.3 V.
Slow-Strong mode
–
–
3.5
MHz
90/10%, 25-pF load,
60/40 duty cycle
SID86
FGPIOIN
GPIO input operating frequency.
1.71 V VDD 5.5 V
–
–
48
MHz
90/10% VIO
Min
Typ
Max
Units
Details/
Conditions
10
µA
25°C, VDD = 0 V, VIH
= 3.0 V
0.4
V
IOL = 20 mA, VDD >
2.9 V
ot
R
ec
om
m
SID78
N
Table 12. OVT GPIO DC Specifications (P5_0 and P5_1 Only)
Spec ID#
Parameter
Description
SID71A
IIL
Input leakage (absolute value).
VIH > VDD
SID66A
VOL
Output voltage LOW level
Document Number: 001-90478 Rev. *L
–
–
Page 22 of 42
PRoC BLE: CYBL10X6X
Family Datasheet
Table 13. OVT GPIO AC Specifications (P5_0 and P5_1 Only)
Parameter
Description
Min
Typ
Max
Units
Details/
Conditions
TRISE_OVFS
Output rise time in Fast-Strong mode
1.5
–
12
ns
25-pF load,
10%–90%,
VDD=3.3 V
SID79A
TFALL_OVFS
Output fall time in Fast-Strong mode
1.5
–
12
ns
25-pF load,
10%–90%,
VDD=3.3 V
SID80A
TRISESS
Output rise time in Slow-Strong mode
10
–
60
ns
25-pF load,
10%-90%,
VDD = 3.3 V
SID81A
TFALLSS
Output fall time in Slow-Strong mode
10
–
25-pF load,
10%-90%,
VDD = 3.3 V
SID82A
FGPIOUT1
GPIO FOUT; 3.3 V ≤ VDD ≤ 5.5 V
Fast-Strong mode
–
SID83A
FGPIOUT2
GPIO FOUT; 1.71 V ≤ VDD ≤ 3.3 V
Fast-Strong mode
–
Table 14. XRES DC Specifications
Description
en
de
d
SID87
Parameter
es
ig
ew
60
ns
24
MHz
90/10%, 25-pF
load, 60/40 duty
cycle
–
16
MHz
90/10%, 25-pF
load, 60/40 duty
cycle
N
–
fo
r
XRES
Spec ID#
ns
SID78A
D
Spec ID#
VIH
Input voltage HIGH threshold
SID88
VIL
Input voltage LOW threshold
SID89
RPULLUP
Pull-up resistor
Typ
Max
Units
0.7 ×
VDDD
–
–
V
CMOS input
–
–
0.3 × VDDD
V
CMOS input
3.5
5.6
8.5
kΩ
CIN
Input capacitance
–
3
–
pF
VHYSXRES
Input voltage hysteresis
–
100
–
mV
SID92
IDIODE
Current through protection diode to
VDD/VSS
–
–
100
µA
m
SID90
SID91
om
Details/
Conditions
Min
Table 15. XRES AC Specifications
Parameter
R
ec
Spec ID#
TRESETWIDTH
Reset pulse width
Min
Typ
Max
Units
1
–
–
µs
Details/
Conditions
N
ot
SID93
Description
Document Number: 001-90478 Rev. *L
Page 23 of 42
PRoC BLE: CYBL10X6X
Family Datasheet
Analog Peripherals
Temperature Sensor
Parameter
TSENSACC
Description
Temperature sensor accuracy
Min
Typ
Max
Units
Details/Conditions
–5
±1
5
°C
–40 to +85 °C
SAR ADC
Table 17. SAR ADC DC Specifications
Parameter
Description
Min
Typ
Max
Units
D
Spec ID#
es
ig
Spec ID#
SID155
A_RES
Resolution
–
–
12
SID157
A_CHNIS_S
Number of channels – single-ended
–
–
8
SID158
A-CHNKS_D
Number of channels – differential
–
SID159
A-MONO
Monotonicity
–
SID160
A_GAINERR
Gain error
–
–
±0.1
%
SID161
A_OFFSET
Input offset voltage
–
–
2
mV
4
Differential inputs use
neighboring I/O
–
–
Yes
N
Input voltage range – single-ended
SID164
A_VIND
Input voltage range – differential
SID165
A_INRES
Input resistance
SID166
A_INCAP
SID312
VREFSAR
8 full-speed
–
fo
r
Current consumption
A_VINS
–
–
1
mA
VSS
–
VDDA
V
VSS
–
VDDA
V
–
–
2.2
kΩ
Input capacitance
–
–
10
pF
Trimmed internal reference to SAR
–1
–
1
%
Min
Typ
Max
Units
70
–
–
dB
–
dB
With external
reference
Measured with 1-V
VREF
Percentage of Vbg
(1.024 V)
m
en
de
d
A_ISAR
SID163
Details/Conditions
bits
ew
SID156
SID162
ns
Table 16. Temperature Sensor Specifications
Spec ID#
Parameter
A_PSRR
Description
Power supply rejection ratio
R
ec
SID167
om
Table 18. SAR ADC AC Specifications
Measured at 1-V
reference
A_CMRR
Common-mode rejection ratio
66
–
SID169
A_SAMP
Sample rate
–
–
1
Msps
SID313
Fsarintref
SAR operating speed without external
reference bypass
–
–
100
Ksps
SID170
A_SNR
Signal-to-noise ratio (SNR)
65
–
–
dB
SID171
A_BW
Input bandwidth without aliasing
–
–
A_SAMP/
2
kHz
SID172
A_INL
Integral nonlinearity (INL). VDD = 1.71 V
to 5.5 V, 1 Msps
–1.7
–
2
LSB
VREF = 1 V to VDD
SID173
A_INL
Integral nonlinearity. VDDD = 1.71 V to
3.6 V, 1 Msps
–1.5
–
1.7
LSB
VREF = 1.71 V to
VDD
SID174
A_INL
Integral nonlinearity. VDD = 1.71 V to
5.5 V, 500 Ksps
–1.5
–
1.7
LSB
VREF = 1 V to VDD
N
ot
SID168
Details/
Conditions
Document Number: 001-90478 Rev. *L
12-bit resolution
FIN = 10 kHz
Page 24 of 42
PRoC BLE: CYBL10X6X
Family Datasheet
Table 18. SAR ADC AC Specifications (continued)
Spec ID#
Parameter
Description
Min
Typ
Max
Units
Details/
Conditions
A_DNL
Differential nonlinearity (DNL). VDD =
1.71 V to 5.5 V, 1 Msps
–1
–
2.2
LSB
VREF = 1 V to VDD
SID176
A_DNL
Differential nonlinearity. VDD = 1.71 V to
3.6 V, 1 Msps
–1
–
2
LSB
VREF = 1.71 V to
VDD
SID177
A_DNL
Differential nonlinearity. VDD = 1.71 V to
5.5 V, 500 Ksps
–1
–
2.2
SID178
A_THD
Total harmonic distortion
–
–
–65
Description
Min
Typ
Max
Units
VCSD
Voltage range of operation
1.71
–
5.5
V
IDAC1
DNL for 8-bit resolution
–1
–
1
LSB
SID181
IDAC1
INL for 8-bit resolution
–3
–
3
LSB
SID182
IDAC2
DNL for 7-bit resolution
–1
–
1
LSB
SID183
IDAC2
INL for 7-bit resolution
–3
–
3
LSB
SID184
SNR
Ratio of counts of finger to noise
5
–
–
Ratio
SID185
IDAC1_CRT1
Output current of IDAC1 (8 bits) in HIGH
range
–
612
–
µA
SID186
IDAC1_CRT2
Output current of IDAC1 (8 bits) in LOW
range
–
306
–
µA
SID187
IDAC2_CRT1
Output current of IDAC2 (7 bits) in HIGH
range
–
305
–
µA
SID188
IDAC2_CRT2
Output current of IDAC2 (7 bits) in LOW
range
–
153
–
µA
es
ig
dB
VREF = 1 V to VDD
FIN = 10 kHz
N
fo
r
en
de
d
m
Details/
Conditions
Capacitance range
of 9 pF to 35 pF;
0.1-pF sensitivity.
Radio is not
operating during the
scan
N
ot
R
ec
SID180
om
SID179
Parameter
ew
Table 19. CSD Block Specifications
Spec ID#
LSB
D
CSD
ns
SID175
Document Number: 001-90478 Rev. *L
Page 25 of 42
PRoC BLE: CYBL10X6X
Family Datasheet
Digital Peripherals
4x TCPWM
Table 20. Timer DC Specifications
Description
Block current consumption at 3 MHz
SID189A
SID190
ITIM2
Block current consumption at 12 MHz
ITIM3
Block current consumption at 48 MHz
SID190A
SID191
Typ
–
Max
42
Units
µA
Details/Conditions
16-bit timer, 85 °C
–
–
46
µA
16-bit timer, 105 °C
–
–
130
µA
16-bit timer, 85 °C
–
–
137
µA
16-bit timer, 105 °C
–
–
535
µA
16-bit timer, 85 °C
–
–
560
µA
16-bit timer, 105 °C
Min
FCLK
Typ
–
Max
48
Units
MHz
–
–
ns
D
SID191A
Min
–
Spec ID
SID192
Parameter
TTIMFREQ
Description
Operating frequency
SID193
TCAPWINT
Capture pulse width (internal)
2 × TCLK
SID194
TCAPWEXT
Capture pulse width (external)
2 × TCLK
SID195
TTIMRES
Timer resolution
SID196
TTENWIDINT
Enable pulse width (internal)
SID197
TTENWIDEXT
Enable pulse width (external)
SID198
TTIMRESWINT
Reset pulse width (internal)
SID199
TTIMRESEXT
Reset pulse width (external)
ew
Table 21. Timer AC Specifications
–
ns
–
–
ns
2 × TCLK
–
–
ns
fo
r
N
–
TCLK
Details/Conditions
2 × TCLK
–
–
ns
2 × TCLK
–
–
ns
2 × TCLK
–
–
ns
Min
–
Typ
–
Max
42
–
–
46
µA
16-bit timer, 105 °C
–
–
130
µA
16-bit timer, 85 °C
–
–
137
µA
16-bit timer, 105 °C
–
–
535
µA
16-bit timer, 85 °C
–
–
560
µA
16-bit timer, 105 °C
Min
FCLK
Typ
–
Max
48
Units
MHz
en
de
d
Counter
ns
Parameter
ITIM1
es
ig
Spec ID
SID189
Table 22. Counter DC Specifications
Spec ID
SID200
Parameter
ICTR1
Description
Block current consumption at 3 MHz
SID200A
ICTR2
Block current consumption at 12 MHz
ICTR3
Block current consumption at 48 MHz
m
SID201
SID202
SID202A
om
SID201A
Units
Details/Conditions
µA
16-bit timer, 85 °C
R
ec
Table 23. Counter AC Specifications
Parameter
TCTRFREQ
Description
Operating frequency
SID204
TCTRPWINT
Capture pulse width (internal)
2 × TCLK
–
–
ns
SID205
TCTRPWEXT
Capture pulse width (external)
2 × TCLK
–
–
ns
SID206
TCTRES
Counter resolution
TCLK
–
–
ns
ot
Spec ID
SID203
TCENWIDINT
Enable pulse width (internal)
2 × TCLK
–
–
ns
SID208
TCENWIDEXT
Enable pulse width (external)
2 × TCLK
–
–
ns
N
SID207
SID209
TCTRRESWINT Reset pulse width (internal)
2 × TCLK
–
–
ns
SID210
TCTRRESWEXT Reset pulse width (external)
2 × TCLK
–
–
ns
Document Number: 001-90478 Rev. *L
Details/Conditions
Page 26 of 42
PRoC BLE: CYBL10X6X
Family Datasheet
Pulse Width Modulation (PWM)
Table 24. PWM DC Specifications
Block current consumption at 3 MHz
SID211A
SID212
IPWM2
Block current consumption at 12 MHz
SID212A
SID213
IPWM3
Block current consumption at 48 MHz
SID213A
Min
Typ
Max
–
–
42
µA
16-bit timer, 85 °C
–
–
46
µA
16-bit timer, 105 °C
Parameter
Description
µA
16-bit timer, 85 °C
16-bit timer, 105 °C
µA
16-bit timer, 85 °C
µA
16-bit timer, 105 °C
–
130
–
137
–
–
535
–
–
560
Min
Typ
Max
Units
–
48
MHz
–
–
ns
–
–
ns
–
–
ns
TPWMFREQ
Operating frequency
FCLK
TPWMPWINT
Pulse width (internal)
2 × TCLK
SID216
TPWMEXT
Pulse width (external)
2 × TCLK
SID217
TPWMKILLINT
Kill pulse width (internal)
2 × TCLK
SID218
TPWMKILLEXT
Kill pulse width (external)
2 × TCLK
–
–
ns
SID219
TPWMEINT
Enable pulse width (internal)
2 × TCLK
–
–
ns
SID220
TPWMENEXT
Enable pulse width (external)
SID221
TPWMRESWINT
Reset pulse width (internal)
SID222
TPWMRESWEXT Reset pulse width (external)
Spec ID
Parameter
N
fo
r
2 × TCLK
–
–
ns
2 × TCLK
–
–
ns
2 × TCLK
–
–
ns
Min
Typ
Max
Units
en
de
d
Table 26. I2C DC Specifications
ew
SID214
SID215
I2C
Description
II2C1
Block current consumption at 100 kHz
–
–
50
µA
II2C2
Block current consumption at 400 kHz
–
–
155
µA
SID225
II2C3
Block current consumption at 1 Mbps
–
–
390
µA
SID226
II2C4
I2C enabled in Deep-Sleep mode
–
–
1.4
µA
Min
–
Typ
–
Max
1
Units
Mbps
Min
–
Typ
17.5
Max
–
LCD capacitance per segment/common
driver
Long-term segment offset
–
500
5000
–
20
–
mV
LCD system operating current.
Vbias = 5 V
LCD system operating current.
Vbias = 3.3 V
–
2
–
mA
–
2
–
mA
m
SID223
SID224
om
Details/Conditions
µA
–
–
Table 25. PWM AC Specifications
Spec ID
Units
ns
IPWM1
Description
es
ig
SID211
Parameter
D
Spec ID
Details/Conditions
Details/Conditions
Table 27. Fixed I2C AC Specifications
Parameter
FI2C1
Description
Bit rate
R
ec
Spec ID
SID227
Details/Conditions
LCD Direct Drive
Table 28. LCD Direct Drive DC Specifications
Parameter
ILCDLOW
SID229
CLCDCAP
N
ot
Spec ID
SID228
SID230
LCDOFFSET
SID231
ILCDOP1
SID232
ILCDOP2
Description
Operating current in low-power mode
Document Number: 001-90478 Rev. *L
Units Details/Conditions
µA 16 × 4 small-segment
display at 50 Hz
pF
32 × 4 segments.
50 Hz. 25 °C
32 × 4 segments.
50 Hz. 25 °C
Page 27 of 42
PRoC BLE: CYBL10X6X
Family Datasheet
Table 29. LCD Direct Drive AC Specifications
Parameter
FLCD
Description
LCD frame rate
Min
10
Typ
50
Max
150
Units
Hz
Details/Conditions
ns
Spec ID
SID233
Table 30. Fixed UART DC Specifications
Parameter
Description
Min
Typ
Max
Units
µA
SID234
IUART1
Block current consumption at 100 kbps
–
–
55
SID235
IUART2
Block current consumption at
1000 kbps
–
–
312
Min
Typ
Max
Units
–
–
1
Mbps
Parameter
FUART
Description
Bit rate
Min
Typ
Max
Units
–
–
360
fo
r
Spec ID
Parameter
Description
N
SPI Specifications
Table 32. Fixed SPI DC Specifications
Details/Conditions
ew
Spec ID
SID236
µA
D
Table 31. Fixed UART AC Specifications
Details/Conditions
es
ig
Spec ID
µA
–
560
µA
–
600
µA
Min
Typ
Max
Units
–
–
8
MHz
Min
Typ
Max
Units
MOSI valid after SCLK driving edge
–
–
18
ns
MISO valid before SCLK capturing
edge. Full clock, late MISO sampling
used
20
–
–
ns
Full clock, late MISO
sampling
Previous MOSI data hold time
0
–
–
ns
Referred to Slave
capturing edge
ISPI1
Block current consumption at 1 Mbps
SID238
ISPI2
Block current consumption at 4 Mbps
–
SID239
ISPI3
Block current consumption at 8 Mbps
–
en
de
d
SID237
Details/Conditions
Table 33. Fixed SPI AC Specifications
Spec ID
SID240
Parameter
FSPI
Description
SPI operating frequency (master; 6x
oversampling)
Details/Conditions
Table 34. Fixed SPI Master Mode AC Specifications
TDMO
SID242
TDSI
SID243
THMO
R
ec
SID241
Description
m
Parameter
om
Spec ID
Details/Conditions
Table 35. Fixed SPI Slave Mode AC Specifications
Spec ID
Parameter
TDMI
ot
SID244
Min
Typ
Max
Units
MOSI valid before SCLK capturing
edge
Description
40
–
–
ns
TDSO
MISO valid after SCLK driving edge
–
–
42 + 3 × TSCB
ns
SID246
TDSO_ext
MISO Valid after SCLK driving edge in
external clock mode. VDD < 3.0 V
–
–
50
ns
SID247
THSO
Previous MISO data hold time
0
–
–
ns
SID248
TSSELSCK
SSEL valid to first SCK valid edge
100
–
–
ns
N
SID245
Document Number: 001-90478 Rev. *L
Page 28 of 42
PRoC BLE: CYBL10X6X
Family Datasheet
Memory
Table 36. Flash DC Specifications
Description
Min
Typ
Max
Units
1.71
–
5.5
V
Number of Wait states at
32–48 MHz
2
–
–
TWS32
Number of Wait states at
16–32 MHz
1
–
–
TWS16
Number of Wait states for
0–16 MHz
0
–
–
SID309
TWS48
SID310
SID311
CPU execution from
flash
CPU execution from
flash
CPU execution from
flash
Min
Typ
Max
Units
Details/Conditions
TROWWRITE[5]
Row (block) write time (erase and
program)
–
–
20
ms
Row (block) = 128 bytes
SID251
TROWERASE[5]
Row erase time
–
–
13
ms
SID252
Row program time after erase
–
–
7
ms
Bulk erase time (128 KB)
–
–
35
ms
SID254
TROWPROGRAM[5]
TBULKERASE[5]
TDEVPROG[5]
SID255
FEND
Flash endurance
SID256
FRET
SID257
SID257A
fo
r
–
–
25
seconds
100 K
–
–
cycles
Flash retention. TA 55 °C, 100-K
P/E cycles
20
–
–
years
FRET2
Flash retention. TA 85 °C, 10-K
P/E cycles
10
–
–
years
FRET3
Flash retention. TA 105 °C, 10-K
P/E cycles
3
–
–
years
en
de
d
Total device program time
N
Description
SID250
SID253
Parameter
ew
Table 37. Flash AC Specifications
Spec ID
Details/Conditions
D
Erase and program voltage
ns
Parameter
VPE
es
ig
Spec ID
SID249
Power-on-Reset (POR)
m
System Resources
For TA ≥ 85 °C
Spec ID
om
Table 38. POR DC Specifications
Parameter
Description
Min
Typ
Max
Units
VRISEIPOR
Rising trip voltage
0.80
–
1.45
V
SID259
VFALLIPOR
Falling trip voltage
0.75
–
1.40
V
SID260
VIPORHYST
Hysteresis
15
–
200
mV
Description
Min
Typ
Max
Units
Precision power-on reset (PPOR)
response time in Active and Sleep
modes
–
–
1
µs
R
ec
SID258
Details/Conditions
Table 39. POR AC Specifications
Spec ID
Parameter
TPPOR_TR
Details/Conditions
N
ot
SID264
Note
5. It can take as much as 20 ms to write to flash. During this time, the device should not be reset, or flash operations will be interrupted and cannot be relied on to have
completed. Reset sources include the XRES pin, software resets, CPU lockup states and privilege violations, improper power supply levels, and watchdogs. Make
certain that these are not inadvertently activated.
Document Number: 001-90478 Rev. *L
Page 29 of 42
PRoC BLE: CYBL10X6X
Family Datasheet
Table 40. Brown-Out Detect
Parameter
Description
Min
Typ
Max
Units
VFALLPPOR
BOD trip voltage in Active and Sleep
modes
1.64
–
–
V
SID262
VFALLDPSLP
BOD trip voltage in Deep Sleep
1.4
–
–
V
Min
Typ
Max
Units
1.1
–
–
V
SID263
Parameter
VHBRTRIP
Description
BOD trip voltage in Hibernate
ew
Spec ID#
Voltage Monitors (LVD)
Parameter
N
Table 42. Voltage Monitor DC Specifications
Spec ID
D
Table 41. Hibernate Reset
es
ig
SID261
Description
Min
Typ
Max
Units
1.71
VLVI1
LVI_A/D_SEL[3:0] = 0000b
SID266
VLVI2
LVI_A/D_SEL[3:0] = 0001b
SID267
VLVI3
LVI_A/D_SEL[3:0] = 0010b
SID268
VLVI4
LVI_A/D_SEL[3:0] = 0011b
1.95
2.00
2.05
V
SID269
VLVI5
LVI_A/D_SEL[3:0] = 0100b
2.05
2.10
2.15
V
SID270
VLVI6
LVI_A/D_SEL[3:0] = 0101b
2.15
2.20
2.26
V
SID271
VLVI7
LVI_A/D_SEL[3:0] = 0110b
2.24
2.30
2.36
V
SID272
VLVI8
LVI_A/D_SEL[3:0] = 0111b
2.34
2.40
2.46
V
SID273
VLVI9
LVI_A/D_SEL[3:0] = 1000b
2.44
2.50
2.56
V
SID274
VLVI10
LVI_A/D_SEL[3:0] = 1001b
2.54
2.60
2.67
V
SID275
VLVI11
LVI_A/D_SEL[3:0] = 1010b
2.63
2.70
2.77
V
SID276
VLVI12
LVI_A/D_SEL[3:0] = 1011b
2.73
2.80
2.87
V
SID277
VLVI13
LVI_A/D_SEL[3:0] = 1100b
2.83
2.90
2.97
V
SID278
VLVI14
LVI_A/D_SEL[3:0] = 1101b
2.93
3.00
3.08
V
SID279
VLVI15
LVI_A/D_SEL[3:0] = 1110b
3.12
3.20
3.28
V
SID280
VLVI16
LVI_A/D_SEL[3:0] = 1111b
4.39
4.50
4.61
V
–
–
100
µA
Min
Typ
Max
Units
–
–
1
µs
en
de
d
m
om
R
ec
LVI_IDD
Block current
1.75
1.79
V
1.76
1.80
1.85
V
1.85
1.90
1.95
V
fo
r
SID265
SID281
Details/
Conditions
ns
Spec ID#
Details/
Conditions
Details/
Conditions
Table 43. Voltage Monitor AC Specifications
Spec ID
TMONTRIP
Description
Voltage monitor trip time
Details/
Conditions
N
ot
SID282
Parameter
Document Number: 001-90478 Rev. *L
Page 30 of 42
PRoC BLE: CYBL10X6X
Family Datasheet
SWD Interface
Table 44. SWD Interface Specifications
Spec ID
Parameter
Description
Min
Typ
Max
Units
Details/Conditions
F_SWDCLK1
3.3 V VDD 5.5 V
–
–
14
MHz
SWDCLK ≤ 1/3 CPU
clock frequency
SID284
F_SWDCLK2
1.71 V VDD 3.3 V
–
–
7
MHz
SWDCLK ≤ 1/3 CPU
clock frequency
SID285
T_SWDI_SETUP T = 1/f SWDCLK
0.25 × T
–
–
SID286
T_SWDI_HOLD
0.25 × T
–
–
SID287
T_SWDO_VALID T = 1/f SWDCLK
–
–
0.5 × T
SID288
T_SWDO_HOLD T = 1/f SWDCLK
1
–
–
Table 45. IMO DC Specifications
es
ig
Min
Typ
Max
Units
IMO operating current at 48 MHz
–
–
1000
µA
SID290
IIMO2
IMO operating current at 24 MHz
–
SID291
IIMO3
IMO operating current at 12 MHz
–
SID292
IIMO4
IMO operating current at 6 MHz
SID293
IIMO5
IMO operating current at 3 MHz
Table 46. IMO AC Specifications
Spec ID
Parameter
N
Description
ns
IIMO1
–
325
µA
–
225
µA
–
–
180
µA
–
–
150
µA
fo
r
Parameter
ns
SID289
en
de
d
Spec ID
ns
ew
Internal Main Oscillator
ns
D
T = 1/f SWDCLK
Description
ns
SID283
Min
Typ
Max
Units
Details/Conditions
Details/Conditions
SID296
FIMOTOL3
Frequency variation from 3 to
48 MHz
–
–
±2
%
SID297
FIMOTOL3
IMO startup time
–
12
–
µs
Min
Typ
Max
Units
Details/Conditions
–
0.3
1.05
µA
Guaranteed by design
m
Internal Low-Speed Oscillator
With API-called
calibration
Table 47. ILO DC Specifications
SID298
Parameter
IILO2
om
Spec ID
Description
ILO operating current at 32 kHz
R
ec
Table 48. ILO AC Specifications
Min
Typ
Max
Units
SID299
Spec ID
TSTARTILO1
Parameter
ILO startup time
Description
–
–
2
ms
Details/Conditions
SID300
FILOTRIM1
32-kHz trimmed frequency
15
32
50
kHz
Min
Typ
Max
Units
Details/Conditions
ot
Table 49. External Clock Specifications
Spec ID
Parameter
Description
ExtClkFreq
External clock input frequency
0
–
48
MHz
CMOS input level only.
TTL input is not
supported
SID302
ExtClkDuty
Duty cycle; measured at VDD/2
45
–
55
%
CMOS input level only.
TTL input is not
supported
N
SID301
Document Number: 001-90478 Rev. *L
Page 31 of 42
PRoC BLE: CYBL10X6X
Family Datasheet
Table 50. ECO Specifications
Parameter
Description
–
24
–
MHz
–50
–
50
ppm
SID391
ESR
Equivalent series resistance
–
–
60
SID392
PD
Drive level
–
–
100
SID393
TSTART1
Startup time (Fast Charge on)
–
–
850
SID394
TSTART2
Startup time (Fast Charge off)
–
–
3
SID395
CL
Load capacitance
–
8
–
SID396
C0
Shunt capacitance
–
1.1
–
pF
SID397
IECO
Operating current
–
1400
–
µA
Ω
µW
µs
ms
pF
Parameter
Description
Typ
Max
Units
–
32.768
–
kHz
–
50
–
ppm
fo
r
Min
en
de
d
Table 51. WCO Specifications
Spec ID#
Details/
Conditions
es
ig
Frequency tolerance
Units
D
Crystal frequency
FTOL
Max
ew
FECO
SID390
Typ
Includes LDO+BG
current
N
SID389
Min
ns
Spec ID#
Details/
Conditions
FWCO
Crystal frequency
SID399
FTOL
Frequency tolerance
SID400
ESR
Equivalent series resistance
–
50
–
kΩ
SID401
PD
Drive level
–
–
1
µW
SID402
TSTART
Startup time
–
–
500
ms
SID403
CL
Crystal load capacitance
6
–
12.5
pF
SID404
C0
Crystal shunt capacitance
–
1.35
–
pF
SID405
IWCO1
Operating current (high-power
mode)
–
–
8
µA
SID406
IWCO2
Operating current (low-power
mode)
–
–
1
µA
85 °C
–
–
2.6
µA
105 °C
om
N
ot
R
ec
SID406A
m
SID398
Document Number: 001-90478 Rev. *L
Page 32 of 42
PRoC BLE: CYBL10X6X
Family Datasheet
Ordering Information
The CYBL10X6X part numbers and features are listed in the following table.
Flash
Size
(KB)
CapSense
SCB
TCPWM
12-Bit
SAR
ADC
I2S
PWM
LCD
Package
CYBL10161-56LQXI
48
128
No
1
2
1 Msps
No
No
No
56-QFN
CYBL10162-56LQXI
48
128
No
2
4
1 Msps
No
CYBL10163-56LQXI
48
128
No
2
4
1 Msps
Yes
CYBL10461-56LQXI
48
128
Yes
2
4
1 Msps
No
CYBL10462-56LQXI
48
128
Yes
2
4
1 Msps
Yes
CYBL10463-56LQXI
48
128
Yes
2
4
1 Msps
CYBL10561-56LQXI
48
128
Yes
(Gestures)
2
4
1 Msps
CYBL10562-56LQXI
48
128
Yes
(Gestures)
2
4
1 Msps
CYBL10563-56LQXI
48
128
Yes
(Gestures)
2
4
CYBL10563-68FNXIT
48
128
Yes
(Gestures)
2
CYBL10563-56LQXQ[6]
48
128
Yes
(Gestures)
2
CYBL10563-68FLXIT[7]
48
128
56-QFN
No
56-QFN
No
No
56-QFN
No
D
No
56-QFN
No
No
Yes
56-QFN
No
No
No
56-QFN
Yes
1
No
56-QFN
1 Msps
Yes
1
Yes
56-QFN
4
1 Msps
Yes
1
Yes
68-WLCSP
4
1 Msps
Yes
1
Yes
56-QFN
4
1 Msps
Yes
1
Yes
68-Thin
WLCSP
N
fo
r
en
de
d
2
es
ig
No
ew
4
No
Contact Sales
N
ot
R
ec
om
m
CYBL10999-56LQXI
Yes
(Gestures)
ns
CPU
Speed
(MHz)
Part Number
Note
6. This part is available as Engineering Sample.
7. This part is available as Engineering Sample (CYBL10563-68FLXIEST).
Document Number: 001-90478 Rev. *L
Page 33 of 42
PRoC BLE: CYBL10X6X
Family Datasheet
Part Numbering Conventions
The part numbers are of the form CYBL10ABC-DEFGHIT where the fields are defined as follows.
CY BL 10 A
B
C - DE
FG
H
I
T
CYBL: PRoC- Smart Family
ns
Example
10 : CYBL10 XXX
es
ig
Cypress Prefix
Sub - family
1: Embedded only
4: CapSense
5: Touch
D
Product Type
Flash Capacity
6: 128 KB
3: Part Identifier
LQ: QFN
FN : WLCSP
FL : Thin WLCSP
Package Code
Pb
X : Pb - free
I: Industrial
Q: Extended Industrial
Temperature Range
N
Package Pins
fo
r
56/ 70: Number of Pins
ew
Feature Set
Tape and Reel
en
de
d
T: Tape and Reel
Blank : Tray / Tube
Description
Values
Cypress PRoC BLE Family
CYBL
10
Subfamily
10
CYBL10X6X
1
Embedded Only
A
Product Type
4
CapSense
om
Field
CYBL
m
The Field Values are listed in the following table:
B
Flash Capacity
Package Pins
FG
Package code
ot
DE
N
H
I
5
Touch
6
128 KB
Feature set
R
ec
C
Meaning
Pb
Temperature Range
Document Number: 001-90478 Rev. *L
56
68
LQ
QFN
FN
WLCSP
FL
Thin WLCSP
X
Pb-free
C
Commercial 0 °C to 70 °C
X Absent (with Pb)
I
Industrial –40 °C to 85 °C
Q
Extended Industrial –40 °C to 105 °C
Page 34 of 42
PRoC BLE: CYBL10X6X
Family Datasheet
Packaging
Table 52. Package Characteristics
Conditions
Operating ambient temperature
TJ
Operating junction temperature
TJA
Package JA (56-pin QFN)
Min
Typ
Industrial
–40
25
Extended industrial
–40
25
Industrial
–40
–
Extended industrial
–40
–
TJC
Package JC (56-pin QFN)
–
TJA
Package JA (68-ball WLCSP)
–
TJC
Package JC (68-ball WLCSP)
TJA
Package JA (68-ball Thin WLCSP)
TJC
Package JC (68-ball Thin WLCSP)
56-pin QFN
260 °C
260 °C
260 °C
°C
100
°C
–
125
°C
16.9
–
°C/watt
–
°C/watt
–
°C/watt
–
0.19
–
°C/watt
–
16.6
–
°C/watt
0.19
–
°C/watt
ew
D
9.7
Maximum Time at Peak
Temperature
30 seconds
30 seconds
30 seconds
en
de
d
68-ball WLCSP
68-ball Thin WLCSP
105
N
Maximum Peak
Temperature
°C
fo
r
Package
Units
85
16.6
–
Table 53. Solder Reflow Peak Temperature
Max
ns
TA
Description
es
ig
Parameter
Table 54. Package Moisture Sensitivity Level (MSL), IPC/JEDEC J-STD-2
Package
MSL
56-pin QFN
MSL 3
68-ball WLCSP
MSL 1
MSL 1
m
68-ball Thin WLCSP
Spec ID
om
Table 55. Package Details
001-58740 Rev. *C
Description
7 mm × 7 mm × 0.6 mm
68-ball WLCSP
3.52 mm × 3.91 mm × 0.55 mm
R
ec
001-92343 Rev. *A
Package
56-pin QFN
68-ball Thin WLCSP
3.52 mm X 3.91 mm X 0.4 mm
N
ot
001-99408 Rev **
Document Number: 001-90478 Rev. *L
Page 35 of 42
PRoC BLE: CYBL10X6X
Family Datasheet
Figure 5. 56-Pin QFN 7 mm × 7 mm × 0.6 mm
TOP VIEW
SIDE VIEW
NOTES:
1.
HATCH AREA IS SOLDERABLE EXPOSED PAD
2. BASED ON REF JEDEC # MO-248
fo
r
N
ew
D
es
ig
ns
BOTTOM VIEW
001-58740 *C
en
de
d
3. ALL DIMENSIONS ARE IN MILLIMETERS
The center pad on the QFN package must be connected to ground (VSS) for the proper operation of the device.
N
ot
R
ec
om
m
Figure 6. 68-Ball WLCSP Package Outline
Document Number: 001-90478 Rev. *L
001-92343 *A
Page 36 of 42
PRoC BLE: CYBL10X6X
Family Datasheet
Figure 7. 68-Ball Thin WLCSP
SIDE VIEW
1
2
3
4
5
6
7
BOTTOM VIEW
8
8
7
6
5
4
3
2
ns
TOP VIEW
1
A
A
B
es
ig
B
C
C
D
D
E
E
F
F
G
G
H
D
H
J
NOTES:
1. REFERENCE JEDEC PUBLICATION 95, DESIGN GUIDE 4.18
001-99408 **
N
ot
R
ec
om
m
en
de
d
2. ALL DIMENSIONS ARE IN MILLIMETERS
fo
r
N
ew
J
Document Number: 001-90478 Rev. *L
Page 37 of 42
PRoC BLE: CYBL10X6X
Family Datasheet
Acronyms
Description
ABUS
analog local bus
ADC
analog-to-digital converter
AG
analog global
AHB
AMBA (advanced microcontroller bus architecture) high-performance bus, an ARM data
transfer bus
Acronym
Description
ns
Acronym
Table 56. Acronyms Used in This Document (continued)
ETM
embedded trace macrocell
FET
field-effect transistor
FIR
finite impulse response, see also IIR
FPB
flash patch and breakpoint
es
ig
Table 56. Acronyms Used in This Document
FS
full-speed
GPIO
general-purpose input/output, applies to a PSoC
pin
arithmetic logic unit
AMUXBUS
analog multiplexer bus
HCI
host controller interface
API
application programming interface
HVI
high-voltage interrupt, see also LVI, LVD
APSR
application program status register
IC
ARM®
advanced RISC machine, a CPU architecture
IDAC
ATM
automatic thump mode
IDE
ew
D
ALU
integrated circuit
current DAC, see also DAC, VDAC
N
BW
bandwidth
CAN
Controller Area Network, a communications
protocol
integrated development environment
Inter-Integrated Circuit, a communications
protocol
fo
r
I2C, or IIC
I2S
Inter-IC Sound
IIR
infinite impulse response, see also FIR
ILO
internal low-speed oscillator, see also IMO
internal main oscillator, see also ILO
common-mode rejection ratio
CPU
central processing unit
CRC
cyclic redundancy check, an error-checking
protocol
IMO
INL
integral nonlinearity, see also DNL
DAC
digital-to-analog converter, see also IDAC, VDAC
I/O
input/output, see also GPIO, DIO, SIO, USBIO
DFB
digital filter block
IPOR
initial power-on reset
DIO
digital input/output, GPIO with only digital
capabilities, no analog. See GPIO.
IPSR
interrupt program status register
DMIPS
Dhrystone million instructions per second
DMA
direct memory access, see also TD
DNL
differential nonlinearity, see also INL
DNU
do not use
DR
DWT
ECC
instrumentation trace macrocell
LCD
liquid crystal display
LIN
Local Interconnect Network, a communications
protocol.
port write data registers
LR
link register
digital system interconnect
LUT
lookup table
data watchpoint and trace
LVD
low-voltage detect, see also LVI
error correcting code
LVI
low-voltage interrupt, see also HVI
om
m
interrupt request
ITM
external crystal oscillator
LVTTL
low-voltage transistor-transistor logic
EEPROM
electrically erasable programmable read-only
memory
MAC
multiply-accumulate
EMI
electromagnetic interference
MCU
microcontroller unit
EMIF
external memory interface
MISO
master-in slave-out
EOC
end of conversion
NC
no connect
EOF
end of frame
NMI
nonmaskable interrupt
EPSR
execution program status register
ESD
electrostatic discharge
N
ot
ECO
IRQ
R
ec
DSI
en
de
d
CMRR
Document Number: 001-90478 Rev. *L
NRZ
non-return-to-zero
NVIC
nested vectored interrupt controller
Page 38 of 42
PRoC BLE: CYBL10X6X
Family Datasheet
Table 56. Acronyms Used in This Document (continued)
Acronym
Description
Table 56. Acronyms Used in This Document (continued)
Acronym
Description
nonvolatile latch, see also WOL
SRAM
static random access memory
Opamp
operational amplifier
SRES
software reset
PAL
programmable array logic, see also PLD
STN
super twisted nematic
PC
program counter
SWD
serial wire debug, a test protocol
PCB
printed circuit board
SWV
single-wire viewer
PGA
programmable gain amplifier
TD
transaction descriptor, see also DMA
PHUB
peripheral hub
THD
total harmonic distortion
PHY
physical layer
TIA
transimpedance amplifier
PICU
port interrupt control unit
TN
twisted nematic
PLA
programmable logic array
TRM
technical reference manual
PLD
programmable logic device, see also PAL
TTL
PLL
phase-locked loop
TX
PMDD
package material declaration data sheet
UART
POR
power-on reset
PRES
precise power-on reset
port read data register
PSoC®
Programmable System-on-Chip™
PSRR
power supply rejection ratio
PWM
pulse-width modulator
RAM
random-access memory
RISC
reduced-instruction-set computing
RMS
root-mean-square
real-time clock
RTL
register transfer language
RTR
remote transmission request
RX
receive
SAR
successive approximation register
es
ig
D
ew
N
VDAC
voltage DAC, see also DAC, IDAC
WDT
watchdog timer
WOL
write once latch, see also NVL
WRES
watchdog timer reset
XRES
external reset I/O pin
XTAL
crystal
om
switched capacitor/continuous time
SCL
I2C serial clock
S/H
USB input/output, PSoC pins used to connect to
a USB port
R
ec
SC/CT
SDA
Universal Serial Bus
USBIO
m
RTC
transmit
Universal Asynchronous Transmitter Receiver, a
communications protocol
fo
r
pseudo random sequence
PS
transistor-transistor logic
USB
en
de
d
PRS
ns
NVL
I2C serial data
sample and hold
signal to noise and distortion ratio
SIO
special input/output, GPIO with advanced
features. See GPIO.
N
ot
SINAD
SOC
start of conversion
SOF
start of frame
SPI
Serial Peripheral Interface, a communications
protocol
SR
slew rate
Document Number: 001-90478 Rev. *L
Page 39 of 42
PRoC BLE: CYBL10X6X
Family Datasheet
Document Conventions
Units of Measure
Table 57. Units of Measure (continued)
Unit of Measure
Unit of Measure
µH
microhenry
microsecond
degrees Celsius
dB
decibel
µV
microvolt
dBm
decibel-milliwatts
µW
microwatt
fF
femtofarads
mA
milliampere
Hz
hertz
ms
millisecond
KB
1024 bytes
mV
millivolt
kbps
kilobits per second
nA
nanoampere
Khr
kilohour
ns
nanosecond
kHz
kilohertz
nV
k
kilo ohm
ksps
kilosamples per second
pF
LSB
least significant bit
ppm
ew
D
°C
µs
ns
Symbol
Symbol
es
ig
Table 57. Units of Measure
nanovolt
N
ohm
picofarad
picosecond
s
second
sps
samples per second
en
de
d
fo
r
parts per million
ps
megabits per second
MHz
megahertz
M
mega-ohm
Msps
megasamples per second
sqrtHz
square root of hertz
µA
microampere
V
volt
µF
microfarad
W
watt
N
ot
R
ec
om
m
Mbps
Document Number: 001-90478 Rev. *L
Page 40 of 42
PRoC BLE: CYBL10X6X
Family Datasheet
Revision History
es
ig
ns
Description Title: CYBL10X6X Family Datasheet Programmable Radio-on-Chip With Bluetooth Low Energy (PRoC BLE)
Document Number: 001-90478
Orig. of Submission
Revision
ECN
Description of Change
Change
Date
*F
4567076
CSAI
11/11/2014 Initial release
*G
4600081
SKAR
12/19/2014 Revision to 16-bit Timer Counter PWM, block current consumption at 3, 12, and
48 MHz to align with CHAR data
Revision of I2C/ UART block current consumption to align with CHAR data
D
Revision of LCD Direct Drive - operating current in low-power mode to align with
CHAR data
ew
Revision of BLE RF Average Current Spec for 4-sec BLE connection interval to
6.25 µA to align with CHAR data
N
Revision of RXS with idle transmitter, with balun loss and in high-gain mode to
align with CHAR data
fo
r
Clarified the IECO operating current to reflect crystal current - LDO and Bandgap
current as well
Corrected Typo for SID#245 (CPU -> SCB)
Corrected Typo for SID#275
4651104
CSAI
Removed errata
02/11/2015 Updated Figure 5
en
de
d
*H
Updated CapSense column for CYBL10563-56LQXI and CYBL10563-68FNXIT
parts to "Yes (Gestures)" in Ordering Information table and updated part number
4779453
HXR
*J
4810822
GCG
*K
4865942
om
ot
R
ec
SASD/
SDUR/
UTSV
N
*L
Updated Part Numbering Conventions
05/28/2015 Removed min and max values for SID359 and SID360.
Removed max value and added typ value for SID357.
06/29/2015 Updated Figure 1 for clarity
Updated Figure 2 and Figure 3 for uniformity
Updated Figure 4 with a higher resolution image
Removed EZSPI reference.
Updated 56-pin QFN package diagram to correct the orientation of text.
08/19/2015 Changed temperature range from –40 °C to 85 °C to –40 °C to 105 °C.
Added ‘overvoltage-tolerant’ description to pins P5.0 and P5.1 in CYBL10X6X
Pin List (WLCSP Package).
Added clarifying note on overvoltage-tolerant pins for SID76.
Updated max values in Timer, Counter, and PWM DC specifications for 105 °C.
Added SID257A in Flash AC Specifications.
Added Guaranteed by Design note to SID 298.
Added SID406A for 105 °C.
Added extended industrial temperature range in the Field Values table.
Added TA and TJ for extended industrial in Package Characteristics.
Added extended industrial temperature parts in Ordering Information.
Added thin WLCSP (CYBL10563-68FLXIT) details in Ordering Information and
Packaging sections.
03/23/2017 Updated the template.
Added NRND watermark.
m
*I
5669710
DEJO
Document Number: 001-90478 Rev. *L
Page 41 of 42
PRoC BLE: CYBL10X6X
Family Datasheet
Sales, Solutions, and Legal Information
Worldwide Sales and Design Support
PSoC® Solutions
cypress.com/arm
cypress.com/automotive
Clocks & Buffers
cypress.com/clocks
Interface
cypress.com/interface
Internet of Things
cypress.com/iot
Memory
cypress.com/memory
Microcontrollers
cypress.com/mcu
PSoC
cypress.com/psoc
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PSoC 1 | PSoC 3 | PSoC 4 | PSoC 5LP
Cypress Developer Community
Forums | WICED IOT Forums | Projects | Video | Blogs |
Training | Components
Technical Support
cypress.com/support
cypress.com/pmic
cypress.com/touch
USB Controllers
N
Touch Sensing
cypress.com/usb
cypress.com/wireless
om
m
en
de
d
fo
r
Wireless Connectivity
es
ig
Automotive
D
ARM® Cortex® Microcontrollers
ew
Products
ns
Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office
closest to you, visit us at Cypress Locations.
R
ec
© Cypress Semiconductor Corporation, 2013-2017. This document is the property of Cypress Semiconductor Corporation and its subsidiaries, including Spansion LLC ("Cypress"). This document,
including any software or firmware included or referenced in this document ("Software"), is owned by Cypress under the intellectual property laws and treaties of the United States and other countries
worldwide. Cypress reserves all rights under such laws and treaties and does not, except as specifically stated in this paragraph, grant any license under its patents, copyrights, trademarks, or other
intellectual property rights. If the Software is not accompanied by a license agreement and you do not otherwise have a written agreement with Cypress governing the use of the Software, then Cypress
hereby grants you a personal, non-exclusive, nontransferable license (without the right to sublicense) (1) under its copyright rights in the Software (a) for Software provided in source code form, to
modify and reproduce the Software solely for use with Cypress hardware products, only internally within your organization, and (b) to distribute the Software in binary code form externally to end users
(either directly or indirectly through resellers and distributors), solely for use on Cypress hardware product units, and (2) under those claims of Cypress's patents that are infringed by the Software (as
provided by Cypress, unmodified) to make, use, distribute, and import the Software solely for use with Cypress hardware products. Any other use, reproduction, modification, translation, or compilation
of the Software is prohibited.
N
ot
TO THE EXTENT PERMITTED BY APPLICABLE LAW, CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS DOCUMENT OR ANY SOFTWARE
OR ACCOMPANYING HARDWARE, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. To the extent
permitted by applicable law, Cypress reserves the right to make changes to this document without further notice. Cypress does not assume any liability arising out of the application or use of any
product or circuit described in this document. Any information provided in this document, including any sample design information or programming code, is provided only for reference purposes. It is
the responsibility of the user of this document to properly design, program, and test the functionality and safety of any application made of this information and any resulting product. Cypress products
are not designed, intended, or authorized for use as critical components in systems designed or intended for the operation of weapons, weapons systems, nuclear installations, life-support devices or
systems, other medical devices or systems (including resuscitation equipment and surgical implants), pollution control or hazardous substances management, or other uses where the failure of the
device or system could cause personal injury, death, or property damage ("Unintended Uses"). A critical component is any component of a device or system whose failure to perform can be reasonably
expected to cause the failure of the device or system, or to affect its safety or effectiveness. Cypress is not liable, in whole or in part, and you shall and hereby do release Cypress from any claim,
damage, or other liability arising from or related to all Unintended Uses of Cypress products. You shall indemnify and hold Cypress harmless from and against all claims, costs, damages, and other
liabilities, including claims for personal injury or death, arising from or related to any Unintended Uses of Cypress products.
Cypress, the Cypress logo, Spansion, the Spansion logo, and combinations thereof, WICED, PSoC, CapSense, EZ-USB, F-RAM, and Traveo are trademarks or registered trademarks of Cypress in
the United States and other countries. For a more complete list of Cypress trademarks, visit cypress.com. Other names and brands may be claimed as property of their respective owners.
Document Number: 001-90478 Rev. *L
Revised March 23, 2017
Page 42 of 42
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