CY8C24094/CY8C24794
CY8C24894/CY8C24994
PSoC® Programmable System-on-Chip™
PSoC® Programmable System-on-Chip
1. Features
■
■
■
XRES pin to support in-system serial programming (ISSP) and
external reset control in CY8C24894
Powerful Harvard-architecture processor
❐ M8C processor speeds up to 24 MHz
❐ Two 8 × 8 multiply, 32-bit accumulate
❐ Low power at high speed
❐ Operating voltage: 3 V to 5.25 V
❐ Industrial temperature range: –40 °C to +85 °C
❐ USB temperature range: –10 °C to +85 °C
Up to 48 analog inputs on GPIOs
Two 33 mA analog outputs on GPIOs
❐ Configurable interrupt on all GPIOs
❐
❐
■
■
Advanced peripherals (PSoC® Blocks)
❐ Six rail-to-rail analog PSoC blocks provide:
• Up to 14-bit analog-to-digital converters (ADCs)
• Up to 9-bit digital-to-analog converters (DACs)
• Programmable gain amplifiers (PGAs)
• Programmable filters and comparators
❐ Four digital PSoC blocks provide:
• 8- to 32-bit timers, counters, and pulse width modulators
(PWMs)
• Cyclical redundancy check (CRC) and pseudo random
sequence (PRS) modules
• Full-duplex universal asynchronous receiver transmitter
(UART)
• Multiple serial peripheral interface (SPI) masters or slaves
• Connectable to all general-purpose I/O (GPIO) pins
❐ Complex peripherals by combining blocks
❐ Capacitive sensing application (CSA) capability
Precision, programmable clocking
❐ Internal ±4% 24- / 48-MHz main oscillator
❐ Internal oscillator for watchdog and sleep
❐ 0.25% accuracy for USB with no external components
Additional system resources
2
❐ I C slave, master, and multi-master to 400 kHz
❐ Watchdog and sleep timers
❐ User-configurable low-voltage detection (LVD)
2. Logic Block Diagram
Port 5 Port 4 Port 3
Port 7
System Bus
■
Global Digital Interconnect
Port 2 Port 1 Port 0 Analog
Drivers
Global Analog Interconnect
PSoC CORE
SRAM
1K
SROM
Sleep and
Watchdog
CPU Core (M8C)
Interrupt
Controller
Full speed USB (12 Mbps)
❐ Four unidirectional endpoints
❐ One bidirectional control endpoint
❐ USB 2.0 compliant
❐ Dedicated 256 byte buffer
❐ No external crystal required
Flash16 KB
Clock Sources
(Includes IMO and ILO)
DIGITAL SYSTEM
ANALOG SYSTEM
Analog
Ref.
■
Flexible on-chip memory
❐ 16 KB flash program storage 50,000 erase and write cycles
❐ 1 KB static random access memory (SRAM) data storage
❐ ISSP
❐ Partial flash updates
❐ Flexible protection modes
❐ Electrically erasable programmable read-only memory
(EEPROM) emulation in flash
■
Programmable pin configurations
❐ 25-mA sink, 10-mA source on all GPIOs
❐ Pull-up, pull-down, high Z, strong, or open-drain drive modes
on all GPIOs
Digital
Block
Array
Analog
Block
Array
Digital
2
Decimator
Clocks MACs Type 2
I2C
POR and LVD Internal
Voltage
System Resets
Ref.
USB
Analog
Input
Muxing
SYSTEM RESOURCES
Errata: For information on silicon errata, see “Errata” on page 66. Details include trigger conditions, devices affected, and proposed workaround.
Cypress Semiconductor Corporation
Document Number: 38-12018 Rev. AL
•
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Revised April 20, 2017
CY8C24094/CY8C24794
CY8C24894/CY8C24994
3. More Information
Cypress provides a wealth of data at www.cypress.com to help you to select the right PSoC device for your design, and to help you
to quickly and effectively integrate the device into your design. For a comprehensive list of resources, see the knowledge base article
KBA92181, Resources Available for CapSense® Controllers. Following is an abbreviated list for CapSense devices:
■
■
■
■
Overview: CapSense Portfolio, CapSense Roadmap
Product Selectors: CapSense, CapSense Plus, CapSense
Express, PSoC3 with CapSense, PSoC5 with CapSense,
PSoC4. In addition, PSoC Designer offers a device selection
tool at the time of creating a new project.
Application notes: Cypress offers CapSense application notes
covering a broad range of topics, from basic to advanced level.
Recommended application notes for getting started with
CapSense are:
❐ AN64846: Getting Started With CapSense
❐ AN2397: CapSense® Data Viewing Tools
Technical Reference Manual (TRM):
❐ CY8CPLC20, CY8CLED16P01, CY8C29x66, CY8C27x43,
CY8C24x94, CY8C24x23, CY8C24x23A, CY8C22x13,
CY8C21x34, CY8C21x34B, CY8C21x23, CY7C64215,
CY7C603xx, CY8CNP1xx, and CYWUSB6953 PSoC® Programmable System-on-Chip TRM
Development Kits:
❐ CY3280-24x94 Universal CapSense Controller Board
features a predefined control circuitry and plug-in hardware
to make prototyping and debugging easy. Programming and
I2C-to-USB Bridge hardware are included for tuning and data
acquisition.
❐ CY3280-BMM Matrix Button Module Kit consists of eight
CapSense sensors organized in a 4x4 matrix format to form
16 physical buttons and eight LEDs. This module connects
to any CY3280 Universal CapSense Controller Board,
including CY3280-20x66 Universal CapSense Controller.
❐ CY3280-BSM Simple Button Module Kit consists of ten CapSense buttons and ten LEDs. This module connects to any
CY3280 Universal CapSense Controller Board, including
CY3280-20x66 Universal CapSense Controller.
The CY3217-MiniProg1 and CY8CKIT-002 PSoC® MiniProg3
device provides an interface for flash programming.
■
3.1 PSoC Designer
PSoC Designer is a free Windows-based Integrated Design Environment (IDE). It enables concurrent hardware and firmware design
of systems based on CapSense (see Figure 1). With PSoC Designer, you can:
3. Configure User Module
1. Drag and drop User Modules to build your hardware system
design in the main design workspace
4. Explore the library of user modules
2. Codesign your application firmware with the PSoC hardware,
5. Review user module datasheets
using the PSoC Designer IDE C compiler
Figure 1. PSoC Designer Features
1
2
3
5
Document Number: 38-12018 Rev. AL
4
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4. Contents
PSOC FUNCTIONAL OVERVIEW ................................................................................................................4
The PSoC Core ........................................................................................................................................4
The Digital System ...................................................................................................................................4
The Analog System ..................................................................................................................................5
Additional System Resources ..................................................................................................................6
PSoC Device Characteristics ...................................................................................................................6
GETTING STARTED .....................................................................................................................................7
Application Notes .....................................................................................................................................7
Development Kits .....................................................................................................................................7
Training ....................................................................................................................................................7
CYPros Consultants .................................................................................................................................7
Solutions Library ......................................................................................................................................7
Technical Support ....................................................................................................................................7
DEVELOPMENT TOOLS ..............................................................................................................................7
PSoC Designer Software Subsystems ....................................................................................................7
DESIGNING WITH PSOC DESIGNER .........................................................................................................8
Select User Modules ................................................................................................................................8
Configure User Modules ..........................................................................................................................8
Organize and Connect .............................................................................................................................8
Generate, Verify, and Debug ...................................................................................................................8
PIN INFORMATION ......................................................................................................................................9
56-Pin Part Pinout ...................................................................................................................................9
56-Pin Part Pinout (with XRES) ............................................................................................................10
68-Pin Part Pinout ..................................................................................................................................11
68-Pin Part Pinout (On-Chip Debug) .....................................................................................................12
100-Ball VFBGA Part Pinout ..................................................................................................................13
100-Ball VFBGA Part Pinout (On-Chip Debug) .....................................................................................15
100-Pin Part Pinout (On-Chip Debug) ...................................................................................................17
REGISTER REFERENCE ...........................................................................................................................19
Register Conventions .............................................................................................................................19
Register Mapping Tables .......................................................................................................................19
Register Map Bank 0 Table: User Space ..............................................................................................20
Register Map Bank 1 Table: Configuration Space ................................................................................21
ELECTRICAL SPECIFICATIONS ...............................................................................................................22
Absolute Maximum Ratings ...................................................................................................................22
Operating Temperature ..........................................................................................................................23
DC Electrical Characteristics .................................................................................................................23
AC Electrical Characteristics ..................................................................................................................37
Thermal Impedance ...............................................................................................................................45
Solder Reflow Peak Specifications ........................................................................................................45
DEVELOPMENT TOOL SELECTION .........................................................................................................46
Software .................................................................................................................................................46
Development Kits ...................................................................................................................................46
Evaluation Tools ....................................................................................................................................46
Document Number: 38-12018 Rev. AL
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Device Programmers .............................................................................................................................46
Accessories (Emulation and Programming) ...........................................................................................47
ORDERING INFORMATION .......................................................................................................................48
Ordering Code Definitions ......................................................................................................................48
PACKAGING DIMENSIONS .......................................................................................................................49
ACRONYMS ................................................................................................................................................54
Acronyms Used ......................................................................................................................................54
DOCUMENT CONVENTIONS .....................................................................................................................55
Units of Measure ....................................................................................................................................55
Numeric Conventions .............................................................................................................................55
GLOSSARY .................................................................................................................................................55
ERRATA ......................................................................................................................................................60
Part Numbers Affected .............................................. 60
CY8C24x94 Errata Summary .................................... 60
DOCUMENT HISTORY PAGE ....................................................................................................................64
SALES, SOLUTIONS, AND LEGAL INFORMATION .................................................................................67
Worldwide Sales and Design Support ....................... 67
Products .................................................................... 67
PSoC® Solutions ....................................................... 67
Document Number: 38-12018 Rev. AL
Cypress Developer Community ................................. 67
Technical Support ..................................................... 67
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5. PSoC Functional Overview
The PSoC family consists of many devices with on-chip
controllers. These devices are designed to replace multiple
traditional MCU-based system components with one low-cost
single-chip programmable component. A PSoC device includes
configurable blocks of analog and digital logic, and
programmable interconnect. This architecture makes it possible
for you to create customized peripheral configurations, to match
the requirements of each individual application. Additionally, a
fast central processing unit (CPU), flash program memory,
SRAM data memory, and configurable I/O are included in a
range of convenient pinouts.
The PSoC architecture, shown in “Logic Block Diagram” on
page 1, consists of four main areas: the core, the system
resources, the digital system, and the analog system.
Configurable global bus resources allow combining all of the
device resources into a complete custom system. Each
CY8C24x94 PSoC device includes four digital blocks and six
analog blocks. Depending on the PSoC package, up to 56
GPIOs are also included. The GPIOs provide access to the
global digital and analog interconnects.
5.1 The PSoC Core
The PSoC core is a powerful engine that supports a rich
instruction set. It encompasses SRAM for data storage, an
interrupt controller, sleep and watchdog timers, and internal main
oscillator (IMO) and internal low-speed oscillator (ILO). The CPU
core, called the M8C, is a powerful processor with speeds up to
24 MHz. The M8C is a four-million instructions per second
(MIPS) 8-bit Harvard-architecture microprocessor.
5.2 The Digital System
The digital system consists of four digital PSoC blocks. Each
block is an 8-bit resource that is used alone or combined with
other blocks to form 8-, 16-, 24-, and 32-bit peripherals, which
are called user modules. Digital peripheral configurations
include:
■
PWMs (8- to 32-bit)
■
PWMs with dead band (8- to 32-bit)
■
Counters (8- to 32-bit)
■
Timers (8- to 32-bit)
■
UART 8-bit with selectable parity
■
SPI master and slave
■
I2C slave and multi-master
■
CRC/generator (8-bit)
■
IrDA
■
PRS generators (8- to 32-bit)
The digital blocks are connected to any GPIO through a series
of global buses that can route any signal to any pin. The buses
also allow for signal multiplexing and for performing logic
operations. This configurability frees your designs from the
constraints of a fixed peripheral controller.
■
Digital clocks for increased flexibility
Digital blocks are provided in rows of four, where the number of
blocks varies by PSoC device family. This allows the optimum
choice of system resources for your application. Family
resources are shown in Table 1 on page 7.
■
I2C functionality to implement an I2C master and slave
Figure 2. Digital System Block Diagram
■
An internal voltage reference, multi-master, that provides an
absolute value of 1.3 V to a number of PSoC subsystems
■
A switch-mode pump (SMP) that generates normal operating
voltages from a single battery cell
■
Various system resets supported by the M8C
The analog system consists of six analog PSoC blocks,
supporting comparators, and analog-to-digital conversion up to
10-bits of precision.
Port 5
Port 3
Port 4
To System Bus
Digital Clocks
From Core
Port 0
To Analog
System
DIGITAL SYSTEM
Digital PSoC Block Array
8
8
Row 0
DBB00
DBB01
DCB02
4
DCB03
4
GIE[7:0]
GIO[7:0]
Document Number: 38-12018 Rev. AL
Port 1
Port 2
Global Digital
Interconnect
Row Output
Configuration
The digital system consists of an array of digital PSoC blocks that
may be configured into any number of digital peripherals. The
digital blocks are connected to the GPIOs through a series of
global buses. These buses can route any signal to any pin,
freeing designs from the constraints of a fixed peripheral
controller.
Port 7
Row Input
Configuration
System resources provide these additional capabilities:
8
8
GOE[7:0]
GOO[7:0]
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5.3 The Analog System
The analog system is composed of six configurable blocks, each
comprised of an opamp circuit allowing the creation of complex
analog signal flows. Analog peripherals are very flexible and can
be customized to support specific application requirements.
Some of the more common PSoC analog functions (most
available as user modules) are as follows.
Figure 3. Analog System Block Diagram
A ll IO
(E x c e p t P o r t 7 )
P 0 [5 ]
P 0 [4 ]
ADCs (up to two, with 6- to 14-bit resolution, selectable as
incremental, delta sigma, and successive approximation
register (SAR))
P 0 [3 ]
P 0 [2 ]
P 0 [1 ]
P 0 [0 ]
■
Filters (2 and 4 pole band-pass, low-pass, and notch)
P 2 [3 ]
■
Amplifiers (up to two, with selectable gain to 48x)
■
Instrumentation amplifiers (one with selectable gain to 93x)
■
Comparators (up to two, with 16 selectable thresholds)
■
DACs (up to two, with 6- to 9-bit resolution)
■
Multiplying DACs (up to two, with 6- to 9-bit resolution)
■
High current output drivers (two with 30 mA drive as a PSoC
core resource)
■
1.3-V reference (as a system resource)
■
DTMF dialer
■
Modulators
■
Correlators
■
Peak detectors
■
Many other topologies possible
Mux Bus
■
AGNDIn RefIn
P 0 [6 ]
Analog
P 0 [7 ]
P 2 [6 ]
P 2 [4 ]
P 2 [1 ]
P 2 [2 ]
P 2 [0 ]
A C I 0 [1 :0 ]
A C I 1 [1 :0 ]
A r r a y In p u t
C o n f ig u r a t io n
B lo c k
A rray
AC B00
A C B 01
A SC 10
A SD 11
ASD20
A SC 21
A n a lo g R e f e r e n c e
Analog blocks are arranged in a column of three, which includes
one continuous time (CT) and two switched capacitor (SC)
blocks, as shown in Figure 3.
In t e r f a c e t o
D ig it a l S y s t e m
R e fH i
R e fL o
AGND
R e fe r e n c e
G e n e ra to rs
A G N D In
R e fIn
B andgap
M 8 C In t e r f a c e ( A d d r e s s B u s , D a t a B u s , E t c .)
5.3.1 The Analog Multiplexer System
The analog mux bus can connect to every GPIO pin in ports 0–
5. Pins are connected to the bus individually or in any combination. The bus also connects to the analog system for analysis
with comparators and analog-to-digital converters. It is split into
two sections for simultaneous dual-channel processing. An
additional 8:1 analog input multiplexer provides a second path to
bring Port 0 pins to the analog array.
Switch-control logic enables selected pins to precharge continuously under hardware control. This enables capacitive
measurement for applications such as touch sensing. Other
multiplexer applications include:
Document Number: 38-12018 Rev. AL
■
Track pad, finger sensing
■
Chip-wide mux that enables analog input from up to 48 I/O pins
■
Crosspoint connection between any I/O pin combinations
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5.4 Additional System Resources
System resources provide additional capability useful to
complete systems. Additional resources include a multiplier,
decimator, low-voltage detection, and power-on reset (POR).
Brief statements describing the merits of each resource follow.
■
■
■
Full speed USB (12 Mbps) with five configurable endpoints and
256 bytes of RAM. No external components required except
for two series resistors. Wider than commercial temperature
USB operation (–10 °C to +85 °C).
Digital clock dividers provide three customizable clock
frequencies for use in applications. The clocks can be routed
to both the digital and analog systems. Additional clocks are
generated using digital PSoC blocks as clock dividers.
■
■
Decimator provides a custom hardware filter for digital signal
processing applications including creation of Delta Sigma
ADCs.
The I2C module provides 100- and 400-kHz communication
over two wires. Slave, master, multi-master are supported.
■
Low-voltage detection interrupts signal the application of falling
voltage levels, while the advanced POR circuit eliminates the
need for a system supervisor.
■
An internal 1.3-V reference provides an absolute reference for
the analog system, including ADCs and DACs.
■
Versatile analog multiplexer system.
Two multiply accumulates (MACs) provide fast 8-bit multipliers
with 32-bit accumulate, to assist in both general math and
digital filters.
5.5 PSoC Device Characteristics
Depending on your PSoC device characteristics, the digital and analog systems can have 16, 8, or 4 digital blocks and 12, 6, or 4
analog blocks. The following table lists the resources available for specific PSoC device groups. The device covered by this datasheet
is shown in the highlighted row of the table.
Table 1. PSoC Device Characteristics
PSoC Part
Number
Digital
I/O
CY8C29x66
up to 64
CY8C28xxx
up to 44
CY8C27x43
up to 44
Digital
Rows
Digital
Blocks
Analog
Inputs
Analog
Analog
Outputs Columns
4
16
up to 12
4
up to 3
up to 12
up to 44
up to 4
2
8
up to 12
4
Analog
Blocks
SRAM
Size
Flash
Size
4
12
2K
32 K
up to 6
up to
12 + 4[1]
1K
16 K
4
12
256
16 K
CY8C24x94
up to 56
1
4
up to 48
2
2
6
1K
16 K
CY8C24x23A
up to 24
1
4
up to 12
2
2
6
256
4K
CY8C23x33
up to 26
1
4
up to 12
2
2
4
256
8K
CY8C22x45
up to 38
2
8
up to 38
0
4
6[1]
1K
16 K
CY8C21x45
up to 24
1
4
up to 24
0
4
6[1]
512
8K
CY8C21x34
up to 28
1
4
up to 28
0
2
4[1]
512
8K
CY8C21x23
up to 16
1
4
up to 8
0
2
4[1]
256
4K
CY8C20x34
up to 28
0
0
up to 28
0
0
3[1,2]
512
8K
0
3[1,2]
up to
2K
up to
32 K
CY8C20xx6
up to 36
0
0
up to 36
0
Notes
1. Limited analog functionality.
2. Two analog blocks and one CapSense®.
Document Number: 38-12018 Rev. AL
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6. Getting Started
For in-depth information, along with detailed programming information, see the Technical Reference Manual for this PSoC
device.
For up-to-date ordering, packaging, and electrical specification
information, see the latest PSoC device datasheets on the web
at http://www.cypress.com.
6.1 Application Notes
Cypress application notes are an excellent introduction to the
wide variety of possible PSoC designs.
6.2 Development Kits
PSoC Development Kits are available online from and through a
growing number of regional and global distributors, which
include Arrow, Avnet, Digi-Key, Farnell, Future Electronics, and
Newark.
6.3 Training
Free PSoC technical training (on demand, webinars, and
workshops), which is available online via www.cypress.com,
covers a wide variety of topics and skill levels to assist you in
your designs.
6.4 CYPros Consultants
Certified PSoC consultants offer everything from technical assistance to completed PSoC designs. To contact or become a PSoC
consultant go to the CYPros Consultants web site.
6.5 Solutions Library
Visit our growing library of solution-focused designs. Here you
can find various application designs that include firmware and
hardware design files that enable you to complete your designs
quickly.
6.6 Technical Support
Technical support – including a searchable Knowledge Base
articles and technical forums – is also available online. If you
cannot find an answer to your question, call our Technical
Support hotline at 1-800-541-4736.
7. Development Tools
PSoC Designer™ is the revolutionary Integrated Design
Environment (IDE) that you can use to customize PSoC to meet
your specific application requirements. PSoC Designer software
accelerates system design and time to market. Develop your
applications using a library of precharacterized analog and digital
peripherals (called user modules) in a drag-and-drop design
environment. Then, customize your design by leveraging the
dynamically generated application programming interface (API)
libraries of code. Finally, debug and test your designs with the
integrated debug environment, including in-circuit emulation and
standard software debug features. PSoC Designer includes:
■
Application editor graphical user interface (GUI) for device and
user module configuration and dynamic reconfiguration
■
Extensive user module catalog
■
Integrated source-code editor (C and assembly)
■
Free C compiler with no size restrictions or time limits
■
Built-in debugger
■
In-circuit emulation
Built-in support for communication interfaces:
2
❐ Hardware and software I C slaves and masters
❐ Full speed USB 2.0
❐ Up to four full-duplex universal asynchronous receiver/transmitters (UARTs), SPI master and slave, and wireless
PSoC Designer supports the entire library of PSoC 1 devices and
runs on Windows XP, Windows Vista, and Windows 7.
■
7.1 PSoC Designer Software Subsystems
7.1.1 Design Entry
In the chip-level view, choose a base device to work with. Then
select different onboard analog and digital components that use
Document Number: 38-12018 Rev. AL
the PSoC blocks, which are called user modules. Examples of
user modules are analog-to-digital converters (ADCs),
digital-to-analog converters (DACs), amplifiers, and filters.
Configure the user modules for your chosen application and
connect them to each other and to the proper pins. Then
generate your project. This prepopulates your project with APIs
and libraries that you can use to program your application.
The tool also supports easy development of multiple configurations and dynamic reconfiguration. Dynamic reconfiguration
makes it possible to change configurations at run time. In
essence, this allows you to use more than 100 percent of PSoC's
resources for an application.
7.1.2 Code Generation Tools
The code generation tools work seamlessly within the
PSoC Designer interface and have been tested with a full range
of debugging tools. You can develop your design in C, assembly,
or a combination of the two.
Assemblers. The assemblers allow you to merge assembly
code seamlessly with C code. Link libraries automatically use
absolute addressing or are compiled in relative mode, and are
linked with other software modules to get absolute addressing.
C Language Compilers. C language compilers are available
that support the PSoC family of devices. The products allow you
to create complete C programs for the PSoC family devices. The
optimizing C compilers provide all of the features of C, tailored
to the PSoC architecture. They come complete with embedded
libraries providing port and bus operations, standard keypad and
display support, and extended math functionality.
7.1.3 Debugger
PSoC Designer has a debug environment that provides
hardware in-circuit emulation, allowing you to test the program in
a physical system while providing an internal view of the PSoC
device. Debugger commands allow you to read and program and
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read and write data memory, and read and write I/O registers.
You can read and write CPU registers, set and clear breakpoints,
and provide program run, halt, and step control. The debugger
also allows you to create a trace buffer of registers and memory
locations of interest.
7.1.4 Online Help System
The online help system displays online, context-sensitive help.
Designed for procedural and quick reference, each functional
subsystem has its own context-sensitive help. This system also
provides tutorials and links to FAQs and an online support forum
to aid the designer.
7.1.5 In-Circuit Emulator
A low-cost, high-functionality In-Circuit Emulator (ICE) is
available for development support. This hardware can program
single devices.
The emulator consists of a base unit that connects to the PC
using a USB port. The base unit is universal and operates with
all PSoC devices. Emulation pods for each device family are
available separately. The emulation pod takes the place of the
PSoC device in the target board and performs full speed
(24-MHz) operation.
8. Designing with PSoC Designer
The development process for the PSoC® device differs from that
of a traditional fixed function microprocessor. The configurable
analog and digital hardware blocks give the PSoC architecture a
unique flexibility that pays dividends in managing specification
change during development and by lowering inventory costs.
These configurable resources, called PSoC Blocks, have the
ability to implement a wide variety of user-selectable functions.
The PSoC development process is summarized in four steps:
1. Select User Modules
2. Configure User Modules
3. Organize and Connect
4. Generate, Verify, and Debug
8.1 Select User Modules
PSoC Designer provides a library of prebuilt, pretested hardware
peripheral components called “user modules.” User modules
make selecting and implementing peripheral devices, both
analog and digital, simple.
8.2 Configure User Modules
Each user module that you select establishes the basic register
settings that implement the selected function. They also provide
parameters and properties that allow you to tailor their precise
configuration to your particular application. For example, a PWM
User Module configures one or more digital PSoC blocks, one
for each 8 bits of resolution. The user module parameters permit
you to establish the pulse width and duty cycle. Configure the
parameters and properties to correspond to your chosen application. Enter values directly or by selecting values from
drop-down menus. All the user modules are documented in
datasheets that may be viewed directly in PSoC Designer or on
the Cypress website. These user module datasheets explain the
internal operation of the user module and provide performance
specifications. Each datasheet describes the use of each user
module parameter, and other information you may need to
successfully implement your design.
Document Number: 38-12018 Rev. AL
8.3 Organize and Connect
You build signal chains at the chip level by interconnecting user
modules to each other and the I/O pins. You perform the
selection, configuration, and routing so that you have complete
control over all on-chip resources.
8.4 Generate, Verify, and Debug
When you are ready to test the hardware configuration or move
on to developing code for the project, you perform the “Generate
Configuration Files” step. This causes PSoC Designer to
generate source code that automatically configures the device to
your specification and provides the software for the system. The
generated code provides application programming interfaces
(APIs) with high-level functions to control and respond to
hardware events at run time and interrupt service routines that
you can adapt as needed.
A complete code development environment allows you to
develop and customize your applications in either C, assembly
language, or both.
The last step in the development process takes place inside
PSoC Designer’s debugger (access by clicking the Connect
icon). PSoC Designer downloads the HEX image to the ICE
where it runs at full speed. PSoC Designer debugging capabilities rival those of systems costing many times more. In addition
to traditional single-step, run-to-breakpoint, and watch-variable
features, the debug interface provides a large trace buffer and
allows you to define complex breakpoint events. These include
monitoring address and data bus values, memory locations and
external signals.
Page 9 of 73
CY8C24094/CY8C24794
CY8C24894/CY8C24994
9. Pin Information
This section describes, lists, and illustrates the CY8C24x94 PSoC device family pins and pinout configuration.
The CY8C24x94 PSoC devices are available in the following packages, all of which are shown on the following pages. Every port pin
(labeled with a “P”) is capable of Digital I/O. However, VSS, VDD, and XRES are not capable of Digital I/O.
9.1 56-Pin Part Pinout
Table 2. 56-Pin Part Pinout (QFN[6]) See LEGEND details and footnotes in Table 3 on page 11.
44
P2[4],M
25
26
27
28
42
41
40
39
38
37
36
35
34
33
32
31
30
29
P2[2], A, I, M
P2[0], A, I, M
P4[6], M
P4[4], M
P4[2], M
P4[0], M
P3[6], M
P3[4], M
P3[2 ], M
P3[0 ], M
P5[6 ], M
P5[4 ], M
P5[2 ], M
P5[0 ], M
M, I2C SDA, P1[0]
M,P1[2]
EXTCLK, M,P1[4]
M, P1[6]
P7[0]
46
45
Vdd
P0[6], A, I, M
P0[4], A, I, M
P0[2], A, I, M
P0[0], A, I, M
P2[6],M
P0[7], A, I, M
Vss
P0[5], A, IO, M
M,P1[3]
M, I2C SCL, P1[1]
Vss
D+
DVdd
P7[7]
21
22
23
24
51
50
49
48
47
P2[5],M
P2[7],M
P0[1], A, I, M
P0[3], A, IO, M
56
55
54
53
52
15
16
17
18
19
20
M, I2C SCL, P1[7]
M, I2C SDA, P1[5]
Device[3]
43
Type
Figure 4. CY8C24794 56-Pin PSoC
Name
Description
No. Digital Analog
1
I/O
I, M
P2[3] Direct switched capacitor block input
2
I/O
I, M
P2[1] Direct switched capacitor block input
3
I/O
M
P4[7]
4
I/O
M
P4[5]
5
I/O
M
P4[3]
A, I, M , P2[3]
1
6
I/O
M
P4[1]
A, I, M , P2[1]
2
7
I/O
M
P3[7]
M , P4[7]
3
M , P4[5]
4
8
I/O
M
P3[5]
M , P4[3]
5
9
I/O
M
P3[3]
M , P4[1]
6
10
I/O
M
P3[1]
M , P3[7]
7
QFN
11
I/O
M
P5[7]
M , P3[5]
8
(Top V ie w )
M
,
P3[3]
9
12
I/O
M
P5[5]
10
M , P3[1]
13
I/O
M
P5[3]
11
M , P5[7]
14
I/O
M
P5[1]
12
M , P5[5]
M , P5[3]
15
I/O
M
P1[7] I2C serial clock (SCL)
13
M , P5[1]
14
16
I/O
M
P1[5] I2C serial data (SDA)
17
I/O
M
P1[3]
18
I/O
M
P1[1] I2C SCL, ISSP SCLK [4]
19
Power
VSS Ground connection [5]
20
USB
D+
21
USB
D–
22
Power
VDD Supply voltage
23
I/O
P7[7]
24
I/O
P7[0]
25
I/O
M
P1[0] I2C SDA, ISSP SDATA[4]
26
I/O
M
P1[2]
27
I/O
M
P1[4] Optional external clock input (EXTCLK)
28
I/O
M
P1[6]
29
I/O
M
P5[0]
Type
Pin
Name
Description
30
I/O
M
P5[2]
No. Digital Analog
Pin
31
I/O
M
P5[4]
44
I/O
M
P2[6]
32
I/O
M
P5[6]
45
I/O
I, M
P0[0]
External voltage reference (VREF) input
Analog column mux input
33
I/O
M
P3[0]
46
I/O
I, M
P0[2]
Analog column mux input
34
I/O
M
P3[2]
47
I/O
I, M
P0[4]
Analog column mux input VREF
35
I/O
M
P3[4]
48
I/O
I, M
P0[6]
Analog column mux input
36
I/O
M
P3[6]
49
Power
VDD
Supply voltage
37
I/O
M
P4[0]
50
Power
VSS
Ground connection [5]
38
I/O
M
P4[2]
51
I/O
I, M
P0[7]
Analog column mux input
39
I/O
M
P4[4]
52
I/O
I/O, M
P0[5]
Analog column mux input and column output
40
I/O
M
P4[6]
53
I/O
I/O, M
P0[3]
Analog column mux input and column output
41
I/O
I, M
P2[0]
Direct switched capacitor block input
54
I/O
I, M
P0[1]
Analog column mux input
42
I/O
I, M
P2[2]
Direct switched capacitor block input
55
I/O
M
P2[7]
43
I/O
M
P2[4]
External analog ground (AGND) input
56
I/O
M
P2[5]
Notes
3. This part cannot be programmed with Reset mode; use Power Cycle mode when programming.
4. These are the ISSP pins, which are not High Z at POR. See the PSoC Technical Reference Manual for details.
5. All VSS pins should be brought out to one common GND plane.
Document Number: 38-12018 Rev. AL
Page 10 of 73
CY8C24094/CY8C24794
CY8C24894/CY8C24994
9.2 56-Pin Part Pinout (with XRES)
Table 3. 56-Pin Part Pinout (QFN[6])
Figure 5. CY8C24894 56-Pin PSoC Device
I/O
M
P5[2]
No. Digital Analog
31
I/O
M
P5[4]
44
I/O
M
P2[6]
32
I/O
M
P5[6]
45
I/O
I, M
P0[0]
Analog column mux input
33
I/O
M
P3[0]
46
I/O
I, M
P0[2]
Analog column mux input
34
I/O
M
P3[2]
47
I/O
I, M
P0[4]
Analog column mux input VREF
35
I/O
M
P3[4]
48
I/O
I, M
P0[6]
Analog column mux input
VDD
Supply voltage
36
Input
XRES Active high external reset with internal
I,
I,
I,
I,
A,
A,
A,
A,
M
M
48
47
46
45
44
43
1
2
3
4
5
6
7
8
9
10
11
12
13
14
QFN
(Top Vie w)
15
16
17
18
19
20
21
22
23
24
25
26
27
28
P2[3]
P2[1]
P4[7]
P4[5]
P4[3]
P4[1]
P3[7]
P3[5]
P3[3]
P3[1]
P5[7]
P5[5]
P5[3]
P5[1]
42
41
40
39
38
37
36
35
34
33
32
31
30
29
P2[2],
P2[0],
P4[6],
P4[4],
P4[2],
P4[0],
XRES
P3[4],
P3[2],
P3[0],
P5[6],
P5[4],
P5[2],
P5[0],
A, I, M
A, I, M
M
M
M
M
M
M
M
M
M
M
M
M, I2C SCL,
M, I2C SDA,
M,
M, I2C SCL,
P1[7]
P1[5]
P1[3]
P1[1]
Vss
D+
DVdd
P7[7]
P7[0]
M, I2C SDA, P1[0]
M, P1[2]
EXTCLK, M, P1[4]
M, P1[6]
A, I, M,
A, I, M,
M,
M,
M,
M,
M,
M,
M,
M,
M,
M,
M,
M,
56
55
54
53
52
51
50
49
P2[5],
P2[7],
P0[1],
P0[3],
P0[5],
P0[7],
Vss
Vdd
P0[6],
P0[4],
P0[2],
P0[0],
P2[6],
P2[4],
M
M
A,
A,
A,
A,
M
M
M
M
Pin
30
I, M
IO, M
IO, M
I, M
Pin
Type
Name
Description
No. Digital Analog
1
I/O
I, M
P2[3] Direct switched capacitor block input
2
I/O
I, M
P2[1] Direct switched capacitor block input
3
I/O
M
P4[7]
4
I/O
M
P4[5]
5
I/O
M
P4[3]
6
I/O
M
P4[1]
7
I/O
M
P3[7]
8
I/O
M
P3[5]
9
I/O
M
P3[3]
10
I/O
M
P3[1]
11
I/O
M
P5[7]
12
I/O
M
P5[5]
13
I/O
M
P5[3]
14
I/O
M
P5[1]
15
I/O
M
P1[7] I2C SCL
16
I/O
M
P1[5] I2C SDA
17
I/O
M
P1[3]
18
I/O
M
P1[1] I2C SCL, ISSP SCLK [7]
19
Power
VSS Ground connection [8]
20
USB
D+
21
USB
D–
22
Power
VDD Supply voltage
23
I/O
P7[7]
24
I/O
P7[0]
25
I/O
M
P1[0] I2C SDA, ISSP SDATA[7]
26
I/O
M
P1[2]
27
I/O
M
P1[4] Optional EXTCLK
28
I/O
M
P1[6]
29
I/O
M
P5[0]
49
Type
Power
Name
Description
External VREF input
pull-down
Power
VSS
Ground connection [8]
37
I/O
M
P4[0]
50
38
I/O
M
P4[2]
51
I/O
I, M
P0[7]
Analog column mux input
39
I/O
M
P4[4]
52
I/O
I/O, M
P0[5]
Analog column mux input and column output
40
I/O
M
P4[6]
53
I/O
I/O, M
P0[3]
Analog column mux input and column output
41
I/O
I, M
P2[0]
Direct switched capacitor block input
54
I/O
I, M
P0[1]
Analog column mux input
42
I/O
I, M
P2[2]
Direct switched capacitor block input
55
I/O
M
P2[7]
43
I/O
M
P2[4]
External AGND input
56
I/O
M
P2[5]
LEGEND A = Analog, I = Input, O = Output, and M = Analog Mux Input.
Notes
6. The center pad on the QFN package should be connected to ground (VSS) for best mechanical, thermal, and electrical performance. If not connected to ground, it
should be electrically floated and not connected to any other signal.
7. These are the ISSP pins, which are not High Z at POR. See the PSoC Technical Reference Manual for details.
8. All VSS pins should be brought out to one common GND plane.
Document Number: 38-12018 Rev. AL
Page 11 of 73
CY8C24094/CY8C24794
CY8C24894/CY8C24994
9.3 68-Pin Part Pinout
The following 68-pin QFN part table and drawing is for the CY8C24994 PSoC device.
Table 4. 68-Pin Part Pinout (QFN[9])
44
45
46
Input
M
M
M
M
M
M
M
M
M
M
M
M
P7[0]
P1[0]
P1[2]
P1[4]
P1[6]
P5[0]
P5[2]
P5[4]
P5[6]
P3[0]
P3[2]
P3[4]
P3[6]
NC
NC
XRES
Pin
I2C SDA, ISSP SDATA[11]
Optional EXTCLK
No connection. Pin must be left floating.
No connection. Pin must be left floating.
Active high pin reset with internal
Type
Digital Analog
I/O
M
I/O
I, M
I/O
I, M
I/O
M
I/O
M
I/O
I, M
I/O
I, M
I/O
I, M
I/O
I, M
Power
Power
I/O
I, M
I/O
I/O, M
P4[6]
P2[0]
P2[2]
P2[4]
P2[6]
P0[0]
P0[2]
P0[4]
P0[6]
VDD
VSS
P0[7]
P0[5]
63
64
65
I/O
I/O
I/O
P0[3]
P0[1]
P2[7]
I/O, M
I, M
M
P2[6], M, Ext. VREF
P2[4], M, Ext. AGND
P2[2], M, AI
53
52
P0[2], M, AI
P0[0], M, AI
55
54
58
57
56
P0[7], M, AI
Vss
Vdd
P0[6], M, AI
P0[4], M, AI
P0[1], M, AI
P0[3], M, AIO
P0[5], M, AIO
63
62
61
60
59
64
P2[3], M, AI
P2[5], M
P2[7], M
No.
50
51
52
53
54
55
56
57
58
59
60
61
62
Name
38
37
36
35
P2[0], M, AI
P4[6], M
P4[4], M
P4[2], M
P4[0], M
XRES
NC
NC
P3[6], M
P3[4], M
P3[2], M
P3[0], M
P5[6], M
P5[4], M
P5[2], M
P5[0], M
P1[6], M
EXTCLK, M, P1[4]
31
32
33
34
I2C SDA, M, P1[0]
M, P1[2]
Supply voltage
28
29
30
I2C SCL ISSP SCLK[11]
Ground connection [10]
QFN
(Top View)
P7[3]
P7[2]
P7[1]
P7[0]
I2C SCL
I2C SDA
49
48
47
46
45
44
43
42
41
40
39
24
25
26
27
M, P3[3]
M, P3[1]
M, P5[7]
M, P5[5]
M, P5[3]
M, P5[1]
I2C SCL, M, P1[7]
I2C SDA, M, P1[5]
51
50
P7[7]
P7[6]
P7[5]
P7[4]
M, P4[1]
NC
NC
Vss
M, P3[7]
M, P3[5]
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
20
21
22
23
M, P4[7]
M, P4[5]
M, P4[3]
66
65
P2[1], M, AI
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
No connection. Pin must be left floating
No connection. Pin must be left floating
Ground connection [10]
68
67
31
32
33
34
35
36
37
38
39
40
41
42
43
M
M
M
M
M
M
M
M
M
M
M
M
P4[7]
P4[5]
P4[3]
P4[1]
NC
NC
VSS
P3[7]
P3[5]
P3[3]
P3[1]
P5[7]
P5[5]
P5[3]
P5[1]
P1[7]
P1[5]
P1[3]
P1[1]
VSS
D+
D–
VDD
P7[7]
P7[6]
P7[5]
P7[4]
P7[3]
P7[2]
P7[1]
Figure 6. CY8C24994 68-Pin PSoC Device
Description
18
19
Power
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
Power
USB
USB
Power
I/O
I/O
I/O
I/O
I/O
I/O
I/O
Name
M, P1[3]
Type
Digital Analog
I/O
M
I/O
M
I/O
M
I/O
M
I2C SCL, M, P1[1]
Vss
D+
DVdd
Pin
No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
Description
Direct switched capacitor block input
Direct switched capacitor block input
External AGND input
External VREF input
Analog column mux input
Analog column mux input and column output
Analog column mux input and column output
Analog column mux input
Supply voltage
Ground connection [10]
Analog column mux input, integration input #1
Analog column mux input and column output, integration
input #2
Analog column mux input and column output
Analog column mux input
pull-down.
47 I/O
M
P4[0]
66 I/O
M
P2[5]
48 I/O
M
P4[2]
67 I/O
I, M
P2[3] Direct switched capacitor block input
M
P4[4]
68 I/O
I, M
P2[1] Direct switched capacitor block input
49 I/O
LEGEND A = Analog, I = Input, O = Output, NC = No connection. Pin must be left floating, M = Analog Mux Input.
Notes
9. The center pad on the QFN package should be connected to ground (VSS) for best mechanical, thermal, and electrical performance. If not connected to ground, it
should be electrically floated and not connected to any other signal.
10. All VSS pins should be brought out to one common GND plane.
11. These are the ISSP pins, which are not High Z at POR. See the PSoC Technical Reference Manual for details.
Document Number: 38-12018 Rev. AL
Page 12 of 73
CY8C24094/CY8C24794
CY8C24894/CY8C24994
9.4 68-Pin Part Pinout (On-Chip Debug)
The following 68-pin QFN part table and drawing is for the CY8C24094 OCD PSoC device.
Note This part is only used for in-circuit debugging. It is NOT available for production.
Table 5. 68-Pin Part Pinout (QFN[12])
M
M
M
M
M
M
M
M
M
M
M
M
P7[0]
P1[0]
P1[2]
P1[4]
P1[6]
P5[0]
P5[2]
P5[4]
P5[6]
P3[0]
P3[2]
P3[4]
P3[6]
Pin
Optional EXTCLK
No.
50
51
52
53
54
55
56
57
58
59
60
61
62
Type
Digital Analog
I/O
M
I/O
I, M
I/O
I, M
I/O
M
I/O
M
I/O
I, M
I/O
I, M
I/O
I, M
I/O
I, M
Power
Power
I/O
I, M
I/O
I/O, M
44
HCLK OCD high speed clock output
63 I/O
I/O, M
45
CCLK OCD CPU clock output
64 I/O
I, M
46
Input
XRES Active high pin reset with internal pull-down 65 I/O
M
47
I/O
M
P4[0]
66 I/O
M
48
I/O
M
P4[2]
67 I/O
I, M
49
I/O
M
P4[4]
68 I/O
I, M
LEGEND A = Analog, I = Input, O = Output, M = Analog Mux Input, OCD = On-Chip Debugger.
P2[6], M, Ext. VREF
P2[4], M, Ext. AGND
P2[2], M, AI
P4[6]
P2[0]
P2[2]
P2[4]
P2[6]
P0[0]
P0[2]
P0[4]
P0[6]
VDD
VSS
P0[7]
P0[5]
P0[3]
P0[1]
P2[7]
P2[5]
P2[3]
P2[1]
I2C SDA, M, P1[0]
M, P1[2]
EXTCLK M, P1[4]
28
29
30
31
32
33
34
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
P2[0], M, AI
P4[6], M
P4[4], M
P4[2], M
P4[0], M
XRES
CCLK
HCLK
P3[6], M
P3[4], M
P3[2], M
P3[0], M
P5[6], M
P5[4], M
P5[2], M
P5[0], M
P1[6], M
,
55
54
53
52
58
57
56
P0[7], M, AI
Vss
Vdd
P0[6], M, AI
P0[4], M, AI
P0[2], M, AI
P0[0], M, AI
64
63
62
61
60
59
66
65
P2[3], M, AI
P2[5], M
P2[7], M
P0[1], M, AI
P0[3], M, AIO
P0[5], M, AIO
Name
P7[3]
P7[2]
P7[1]
P7[0]
Supply voltage
I2C SDA, ISSP SDATA[14]
QFN
(Top View)
P7[7]
P7[6]
P7[5]
P7[4]
I2C SCL, ISSP SCLK [14]
Ground connection [13]
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
23
24
25
26
27
I2C SCL
I2C SDA
M, P4[7]
M, P4[5]
M, P4[3]
M, P4[1]
OCDE
OCDO
Vss
M, P3[7]
M, P3[5]
M, P3[3]
M, P3[1]
M, P5[7]
M, P5[5]
M, P5[3]
M, P5[1]
I2C SCL, M, P1[7]
I2C SDA, M, P1[5]
20
21
22
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
OCD even data I/O
OCD odd data output
Ground connection [13]
P2[1], M, AI
31
32
33
34
35
36
37
38
39
40
41
42
43
M
M
M
M
M
M
M
M
M
M
M
M
P4[7]
P4[5]
P4[3]
P4[1]
OCDE
OCDO
VSS
P3[7]
P3[5]
P3[3]
P3[1]
P5[7]
P5[5]
P5[3]
P5[1]
P1[7]
P1[5]
P1[3]
P1[1]
VSS
D+
D–
VDD
P7[7]
P7[6]
P7[5]
P7[4]
P7[3]
P7[2]
P7[1]
Figure 7. CY8C24094 68-Pin OCD PSoC Device
Description
68
67
Power
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
Power
USB
USB
Power
I/O
I/O
I/O
I/O
I/O
I/O
I/O
Name
18
19
Type
Digital Analog
I/O
M
I/O
M
I/O
M
I/O
M
M, P1[3]
I2C SCL, M, P1[1]
Vss
D+
DVdd
Pin
No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
Description
Direct switched capacitor block input
Direct switched capacitor block input
External AGND input
External VREF input
Analog column mux input
Analog column mux input and column output
Analog column mux input and column output
Analog column mux input
Supply voltage
Ground connection [13]
Analog column mux input, integration input #1
Analog column mux input and column output, integration
input #2
Analog column mux input and column output
Analog column mux input
Direct switched capacitor block input
Direct switched capacitor block input
Notes
12. The center pad on the QFN package should be connected to ground (VSS) for best mechanical, thermal, and electrical performance. If not connected to ground, it
should be electrically floated and not connected to any other signal.
13. All VSS pins should be brought out to one common GND plane.
14. These are the ISSP pins, which are not High Z at POR. See the PSoC Technical Reference Manual for details.
Document Number: 38-12018 Rev. AL
Page 13 of 73
CY8C24094/CY8C24794
CY8C24894/CY8C24994
9.5 100-Ball VFBGA Part Pinout
The 100-ball VFBGA part is for the CY8C24994 PSoC device.
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
B1
B2
B3
B4
B5
B6
B7
B8
B9
B10
C1
C2
C3
C4
C5
C6
C7
C8
C9
C10
D1
D2
D3
D4
D5
D6
D7
D8
D9
D10
E1
E2
E3
E4
E5
E6
E7
E8
E9
E10
Power
Power
Power
Power
Power
Power
Power
I/O
I, M
I/O
I, M
I/O
I, M
Power
I/O
I, M
I/O
I, M
Power
Power
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
M
M
M
I/O, M
I, M
I, M
I, M
M
M
M
M
I/O, M
I,M
M
M
M
I/O
M
I/O
I, M
Power
Power
I/O
M
I/O
M
I/O
M
VSS
VSS
NC
NC
NC
VDD
NC
NC
VSS
VSS
VSS
VSS
P2[1]
P0[1]
P0[7]
VDD
P0[2]
P2[2]
VSS
VSS
NC
P4[1]
P4[7]
P2[7]
P0[5]
P0[6]
P0[0]
P2[0]
P4[2]
NC
NC
P3[7]
P4[5]
P2[5]
P0[3]
P0[4]
P2[6]
P4[6]
P4[0]
NC
NC
NC
P4[3]
P2[3]
VSS
VSS
P2[4]
P4[4]
P3[6]
NC
Description
Ground connection
Ground connection
No connection. Pin must be left floating
No connection. Pin must be left floating
No connection. Pin must be left floating
Supply voltage
No connection. Pin must be left floating
No connection. Pin must be left floating
Ground connection
Ground connection
Ground connection
Ground connection
Direct switched capacitor block input
Analog column mux input
Analog column mux input
Supply voltage
Analog column mux input
Direct switched capacitor block input
Ground connection
Ground connection
No connection. Pin must be left floating
Analog column mux input and column output
Analog column mux input
Analog column mux input
Direct switched capacitor block input
No connection. Pin must be left floating
No connection. Pin must be left floating
Analog column mux input and column output
Analog column mux input
External VREF input
No connection. Pin must be left floating
No connection. Pin must be left floating
No connection. Pin must be left floating
Direct switched capacitor block input
Ground connection
Ground connection
External AGND input
No connection. Pin must be left floating
Pin
No.
F1
F2
F3
F4
F5
F6
F7
F8
F9
F10
G1
G2
G3
G4
G5
G6
G7
G8
G9
G10
H1
H2
H3
H4
H5
H6
H7
H8
H9
H10
J1
J2
J3
J4
J5
J6
J7
J8
J9
J10
K1
K2
K3
K4
K5
K6
K7
K8
K9
K10
Analog
Name
Digital
Analog
Pin
No.
Digital
Table 6. 100-Ball Part Pinout (VFBGA[15])
I/O
M
I/O
M
I/O
M
Power
Power
I/O
M
I/O
M
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
M
M
M
M
M
M
M
M
I/O
M
I/O
M
I/O
M
I/O
M
I/O
M
I/O
M
I/O
M
I/O
M
I/O
Power
Power
USB
USB
Power
I/O
I/O
I/O
M
Power
Power
Power
Power
Power
I/O
I/O
I/O
Power
Power
Name
NC
P5[7]
P3[5]
P5[1]
VSS
VSS
P5[0]
P3[0]
XRES
P7[1]
NC
P5[5]
P3[3]
P1[7]
P1[1]
P1[0]
P1[6]
P3[4]
P5[6]
P7[2]
NC
P5[3]
P3[1]
P1[5]
P1[3]
P1[2]
P1[4]
P3[2]
P5[4]
P7[3]
VSS
VSS
D+
D–
VDD
P7[7]
P7[0]
P5[2]
VSS
VSS
VSS
VSS
NC
NC
VDD
P7[6]
P7[5]
P7[4]
VSS
VSS
Description
No connection. Pin must be left floating
Ground connection
Ground connection
Active high pin reset with internal pull-down
No connection. Pin must be left floating
I2C SCL
I2C SCL, ISSP SCLK[16]
I2C SDA, ISSP SDATA[16]
No connection. Pin must be left floating
I2C SDA
Optional EXTCLK
Ground connection
Ground connection
Supply voltage
Ground connection
Ground connection
Ground connection
Ground connection
No connection. Pin must be left floating
No connection. Pin must be left floating
Supply voltage
Ground connection
Ground connection
LEGEND A = Analog, I = Input, O = Output, M = Analog Mux Input, NC = No connection. Pin must be left floating.
Document Number: 38-12018 Rev. AL
Page 14 of 73
CY8C24094/CY8C24794
CY8C24894/CY8C24994
Figure 8. CY8C24094 OCD (Not for Production)
1
2
3
4
5
6
7
8
9
10
A
Vss
Vss
NC
NC
NC
Vdd
NC
NC
Vss
Vss
B
Vss
Vss
P2[1]
P0[1]
P0[7]
Vdd
P0[2]
P2[2]
Vss
Vss
C
NC
P4[1]
P4[7]
P2[7]
P0[5]
P0[6]
P0[0]
P2[0]
P4[2]
NC
D
NC
P3[7]
P4[5]
P2[5]
P0[3]
P0[4]
P2[6]
P4[6]
P4[0]
NC
E
NC
NC
P4[3]
P2[3]
Vss
Vss
P2[4]
P4[4]
P3[6]
NC
F
NC
P5[7]
P3[5]
P5[1]
Vss
Vss
P5[0]
P3[0]
XRES
P7[1]
G
NC
P5[5]
P3[3]
P1[7]
P1[1]
P1[0]
P1[6]
P3[4]
P5[6]
P7[2]
H
NC
P5[3]
P3[1]
P1[5]
P1[3]
P1[2]
P1[4]
P3[2]
P5[4]
P7[3]
J
Vss
Vss
D+
D-
Vdd
P7[7]
P7[0]
P5[2]
Vss
Vss
K
Vss
Vss
NC
NC
Vdd
P7[6]
P7[5]
P7[4]
Vss
Vss
BGA (Top View)
Notes
15. All VSS pins should be brought out to one common GND plane.
16. These are the ISSP pins, which are not High Z at POR. See the PSoC Technical Reference Manual for details.
Document Number: 38-12018 Rev. AL
Page 15 of 73
CY8C24094/CY8C24794
CY8C24894/CY8C24994
9.6 100-Ball VFBGA Part Pinout (On-Chip Debug)
Description
Pin
No.
Analog
Name
Digital
Analog
Pin
No.
Digital
The following 100-pin VFBGA part table and drawing is for the CY8C24094 OCD PSoC device.
Note This part is only used for in-circuit debugging. It is NOT available for production.
Table 7. 100-Ball Part Pinout (VFBGA[17])
Name
Description
A1
Power
VSS
Ground connection
F1
OCDE OCD even data I/O
A2
Power
VSS
Ground connection
F2
I/O
M
P5[7]
A3
NC
No connection. Pin must be left floating
F3
I/O
M
P3[5]
A4
NC
No connection. Pin must be left floating
F4
I/O
M
P5[1]
A5
NC
No connection. Pin must be left floating.
F5
Power
VSS
Ground connection
A6
Power
VDD
Supply voltage.
F6
Power
VSS
Ground connection
A7
NC
No connection. Pin must be left floating.
F7
I/O
M
P5[0]
A8
NC
No connection. Pin must be left floating.
F8
I/O
M
P3[0]
A9
Power
VSS
Ground connection
F9
XRES
Active high pin reset with internal pull-down
A10 Power
VSS
Ground connection
F10 I/O
P7[1]
B1
Power
VSS
Ground connection
G1
OCDO OCD odd data output
B2
Power
VSS
Ground connection
G2
I/O
M
P5[5]
B3
I/O
I, M
P2[1]
Direct switched capacitor block input
G3
I/O
M
P3[3]
B4
I/O
I, M
P0[1]
Analog column mux input
G4
I/O
M
P1[7]
I2C SCL
B5
I/O
I, M
P0[7]
Analog column mux input
G5
I/O
M
P1[1]
I2C SCL, ISSP SCLK[18]
B6
Power
VDD
Supply voltage
G6
I/O
M
P1[0]
I2C SDA, ISSP SDATA[18]
B7
I/O
I, M
P0[2]
Analog column mux input
G7
I/O
M
P1[6]
B8
I/O
I, M
P2[2]
Direct switched capacitor block input
G8
I/O
M
P3[4]
B9
Power
VSS
Ground connection
G9
I/O
M
P5[6]
B10 Power
VSS
Ground connection
G10 I/O
P7[2]
C1
NC
No connection. Pin must be left floating
H1
NC
No connection. Pin must be left floating
C2
I/O
M
P4[1]
H2
I/O
M
P5[3]
C3
I/O
M
P4[7]
H3
I/O
M
P3[1]
C4
I/O
M
P2[7]
H4
I/O
M
P1[5]
I2C SDA
C5
I/O
I/O,M P0[5]
Analog column mux input and column output
H5
I/O
M
P1[3]
C6
I/O
I, M
P0[6]
Analog column mux input
H6
I/O
M
P1[2]
C7
I/O
I, M
P0[0]
Analog column mux input
H7
I/O
M
P1[4]
Optional EXTCLK
C8
I/O
I, M
P2[0]
Direct switched capacitor block input
H8
I/O
M
P3[2]
C9
I/O
M
P4[2]
H9
I/O
M
P5[4]
C10
NC
No connection. Pin must be left floating
H10 I/O
P7[3]
D1
NC
No connection. Pin must be left floating
J1
Power
VSS
Ground connection
D2
I/O
M
P3[7]
J2
Power
VSS
Ground connection
D3
I/O
M
P4[5]
J3
USB
D+
D4
I/O
M
P2[5]
J4
USB
DD5
I/O
I/O, M P0[3]
Analog column mux input and column output
J5
Power
VDD
Supply voltage
D6
I/O
I, M
P0[4]
Analog column mux input
J6
I/O
P7[7]
D7
I/O
M
P2[6]
External VREF input
J7
I/O
P7[0]
D8
I/O
M
P4[6]
J8
I/O
M
P5[2]
D9
I/O
M
P4[0]
J9
Power
VSS
Ground connection
D10
CCLK
OCD CPU clock output
J10 Power
VSS
Ground connection
E1
NC
No connection. Pin must be left floating
K1
Power
VSS
Ground connection
E2
NC
No connection. Pin must be left floating
K2
Power
VSS
Ground connection
E3
I/O
M
P4[3]
K3
NC
No connection. Pin must be left floating
E4
I/O
I, M
P2[3]
Direct switched capacitor block input
K4
NC
No connection. Pin must be left floating
E5
Power
VSS
Ground connection
K5
Power
VDD
Supply voltage
E6
Power
VSS
Ground connection
K6
I/O
P7[6]
E7
I/O
M
P2[4]
External AGND input
K7
I/O
P7[5]
E8
I/O
M
P4[4]
K8
I/O
P7[4]
E9
I/O
M
P3[6]
K9
Power
VSS
Ground connection
E10
HCLK
OCD high speed clock output
K10 Power
VSS
Ground connection
LEGEND A = Analog, I = Input, O = Output, M = Analog Mux Input, NC = No connection. Pin must be left floating, OCD = On-Chip Debugger.
Notes
17. All VSS pins should be brought out to one common GND plane.
18. These are the ISSP pins, which are not High Z at POR. See the PSoC Technical Reference Manual for details.
Document Number: 38-12018 Rev. AL
Page 16 of 73
CY8C24094/CY8C24794
CY8C24894/CY8C24994
Figure 9. CY8C24094 OCD (Not for Production)
1
2
3
4
5
6
7
8
9
10
A
Vss
Vss
NC
NC
NC
Vdd
NC
NC
Vss
Vss
B
Vss
Vss
P2[1]
P0[1]
P0[7]
Vdd
P0[2]
P2[2]
Vss
Vss
C
NC
P4[1]
P4[7]
P2[7]
P0[5]
P0[6]
P0[0]
P2[0]
P4[2]
NC
D
NC
P3[7]
P4[5]
P2[5]
P0[3]
P0[4]
P2[6]
P4[6]
P4[0]
CClk
E
NC
NC
P4[3]
P2[3]
Vss
Vss
P2[4]
P4[4]
P3[6]
HClk
F
ocde
P5[7]
P3[5]
P5[1]
Vss
Vss
P5[0]
P3[0]
XRES
P7[1]
G
ocdo
P5[5]
P3[3]
P1[7]
P1[1]
P1[0]
P1[6]
P3[4]
P5[6]
P7[2]
H
NC
P5[3]
P3[1]
P1[5]
P1[3]
P1[2]
P1[4]
P3[2]
P5[4]
P7[3]
J
Vss
Vss
D+
D-
Vdd
P7[7]
P7[0]
P5[2]
Vss
Vss
K
Vss
Vss
NC
NC
Vdd
P7[6]
P7[5]
P7[4]
Vss
Vss
BGA (Top View)
Document Number: 38-12018 Rev. AL
Page 17 of 73
CY8C24094/CY8C24794
CY8C24894/CY8C24994
9.7 100-Pin Part Pinout (On-Chip Debug)
The 100-pin TQFP part is for the CY8C24094 OCD PSoC device.
Description
Pin
No.
Analog
Name
Digital
Analog
Pin
No.
Digital
Note This part is only used for in-circuit debugging. It is NOT available for production.
Table 8. 100-Pin Part Pinout (TQFP[19])
Name
Description
1
NC
No connection. Pin must be left floating
51
I/O
M
P1[6]
2
NC
No connection. Pin must be left floating
52
I/O
M
P5[0]
3
I/O
I, M P0[1]
Analog column mux input
53
I/O
M
P5[2]
4
I/O
M
P2[7]
54
I/O
M
P5[4]
5
I/O
M
P2[5]
55
I/O
M
P5[6]
6
I/O
I, M P2[3]
Direct switched capacitor block input
56
I/O
M
P3[0]
7
I/O
I, M P2[1]
Direct switched capacitor block input
57
I/O
M
P3[2]
8
I/O
M
P4[7]
58
I/O
M
P3[4]
9
I/O
M
P4[5]
59
I/O
M
P3[6]
10
I/O
M
P4[3]
60
HCLK
OCD high speed clock output
11
I/O
M
P4[1]
61
CCLK
OCD CPU clock output
12
OCDE OCD even data I/O
62
Input
XRES
Active high pin reset with internal pull-down
13
OCDO OCD odd data output
63
I/O
M
P4[0]
14
NC
No connection. Pin must be left floating
64
I/O
M
P4[2]
15
Power
VSS
Ground connection
65
Power
VSS
Ground connection
16
I/O
M
P3[7]
66
I/O
M
P4[4]
17
I/O
M
P3[5]
67
I/O
M
P4[6]
18
I/O
M
P3[3]
68
I/O
I, M
P2[0]
Direct switched capacitor block input
19
I/O
M
P3[1]
69
I/O
I, M
P2[2]
Direct switched capacitor block input
20
I/O
M
P5[7]
70
I/O
P2[4]
External AGND input
21
I/O
M
P5[5]
71
NC
No connection. Pin must be left floating
22
I/O
M
P5[3]
72
I/O
P2[6]
External VREF input
23
I/O
M
P5[1]
73
NC
No connection. Pin must be left floating
24
I/O
M
P1[7]
I2C SCL
74
I/O
I
P0[0]
Analog column mux input
25
NC
No connection. Pin must be left floating
75
NC
No connection. Pin must be left floating
26
NC
No connection. Pin must be left floating
76
NC
No connection. Pin must be left floating
27
NC
No connection. Pin must be left floating
77
I/O
I, M
P0[2]
Analog column mux input and column output
28
I/O
P1[5]
I2C SDA
78
NC
No connection. Pin must be left floating
29
I/O
P1[3]
79
I/O
I, M
P0[4]
Analog column mux input and column output
30
I/O
P1[1]
Crystal (XTALin), I2C SCL, ISSP SCLK[20]
80
NC
No connection. Pin must be left floating
31
NC
No connection. Pin must be left floating
81
I/O
I, M
P0[6]
Analog column mux input
32
Power
VSS
Ground connection
82
Power
VDD
Supply voltage
33
USB
D+
83
NC
No connection. Pin must be left floating
34
USB
D84
Power
VSS
Ground connection
35
Power
VDD
Supply voltage
85
NC
No connection. Pin must be left floating
36
I/O
P7[7]
86
NC
No connection. Pin must be left floating
37
I/O
P7[6]
87
NC
No connection. Pin must be left floating
38
I/O
P7[5]
88
NC
No connection. Pin must be left floating
39
I/O
P7[4]
89
NC
No connection. Pin must be left floating
40
I/O
P7[3]
90
NC
No connection. Pin must be left floating
41
I/O
P7[2]
91
NC
No connection. Pin must be left floating
42
I/O
P7[1]
92
NC
No connection. Pin must be left floating
43
I/O
P7[0]
93
NC
No connection. Pin must be left floating
44
NC
No connection. Pin must be left floating
94
NC
No connection. Pin must be left floating
45
NC
No connection. Pin must be left floating
95
I/O
I, M
P0[7]
Analog column mux input
46
NC
No connection. Pin must be left floating
96
NC
No connection. Pin must be left floating
47
NC
No connection. Pin must be left floating
97
I/O
I/O, M P0[5]
Analog column mux input and column output
48
I/O
P1[0]
Crystal (XTALout), I2C SDA, ISSP SDATA[20]
98
NC
No connection. Pin must be left floating
49
I/O
P1[2]
99
I/O
I/O, M P0[3]
Analog column mux input and column output
50
I/O
P1[4]
Optional EXTCLK
100
NC
No connection. Pin must be left floating
LEGEND A = Analog, I = Input, O = Output, NC = No connection. Pin must be left floating, M = Analog Mux Input, OCD = On-Chip Debugger.
Notes
19. All VSS pins should be brought out to one common GND plane.
20. These are the ISSP pins, which are not High Z at POR. See the PSoC Technical Reference Manual for details.
Document Number: 38-12018 Rev. AL
Page 18 of 73
CY8C24094/CY8C24794
CY8C24894/CY8C24994
Document Number: 38-12018 Rev. AL
NC
P0[2], M, AI
NC
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
NC
P0[0], M , AI
NC
P2[6], M , External VREF
NC
P2[4], M , External AGND
P2[2], M , AI
P2[0], M , AI
P4[6], M
P4[4], M
Vss
P4[2], M
P4[0], M
XRES
CCLK
HCLK
P3[6], M
P3[4], M
P3[2], M
P3[0], M
P5[6], M
P5[4], M
P5[2], M
P5[0], M
P1[6], M
M, P1[2]
EXTCLK, M, P1[4]
46
47
48
49
50
P7[1]
P7[0]
NC
NC
NC
NC
I2C SDA, M, P1[0]
P7[3]
P7[2]
36
37
38
39
40
41
42
43
44
45
P7[7]
P7[6]
P7[5]
P7[4]
31
32
33
34
35
77
76
80
79
78
NC
Vdd
P0[6], M, AI
NC
P0[4], M, AI
NC
NC
Vss
87
86
85
84
83
82
81
90
89
88
NC
NC
NC
NC
NC
NC
NC
NC
P0[7], M, AI
NC
95
94
93
92
91
P0[3], M, AI
NC
P0[5], M, AI
98
97
96
28
29
30
26
27
TQFP
NC
I2C SDA, M, P1[5]
M, P1[3]
I2C SCL, M, P1[1]
NC
Vss
D+
DVdd
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
NC
NC
NC
AI, M , P0[1]
M , P2[7]
M , P2[5]
AI, M , P2[3]
AI, M , P2[1]
M , P4[7]
M , P4[5]
M , P4[3]
M , P4[1]
OCDE
OCDO
NC
Vss
M , P3[7]
M , P3[5]
M , P3[3]
M , P3[1]
M , P5[7]
M , P5[5]
M , P5[3]
M , P5[1]
I2C SCL, P1[7]
NC
100
99
NC
Figure 10. CY8C24094 OCD (Not for Production)
Page 19 of 73
CY8C24094/CY8C24794
CY8C24894/CY8C24994
10. Register Reference
This section lists the registers of the CY8C24x94 PSoC device family. For detailed register information, see the
PSoC Technical Reference Manual.
10.1 Register Conventions
10.2 Register Mapping Tables
The register conventions specific to this section are listed in the
following table.
The PSoC device has a total register address space of
512 bytes. The register space is referred to as I/O space and is
divided into two banks, Bank 0 and Bank 1. The XOI bit in the
Flag register (CPU_F) determines which bank the user is
currently in. When the XOI bit is set to 1, the user is in Bank 1.
Convention
Description
R
Read register or bit(s)
W
Write register or bit(s)
L
Logical register or bit(s)
C
Clearable register or bit(s)
#
Access is bit specific
Document Number: 38-12018 Rev. AL
Note In the following register mapping tables, blank fields are
Reserved and should not be accessed.
Page 20 of 73
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CY8C24894/CY8C24994
10.3 Register Map Bank 0 Table: User Space
Name
PRT0DR
PRT0IE
PRT0GS
PRT0DM2
PRT1DR
PRT1IE
PRT1GS
PRT1DM2
PRT2DR
PRT2IE
PRT2GS
PRT2DM2
PRT3DR
PRT3IE
PRT3GS
PRT3DM2
PRT4DR
PRT4IE
PRT4GS
PRT4DM2
PRT5DR
PRT5IE
PRT5GS
PRT5DM2
Addr (0, Hex) Access
Name
00
RW
PMA0_DR
01
RW
PMA1_DR
02
RW
PMA2_DR
03
RW
PMA3_DR
04
RW
PMA4_DR
05
RW
PMA5_DR
06
RW
PMA6_DR
07
RW
PMA7_DR
08
RW
USB_SOF0
09
RW
USB_SOF1
0A
RW
USB_CR0
0B
RW
USBI/O_CR0
0C
RW
USBI/O_CR1
0D
RW
0E
RW
EP1_CNT1
0F
RW
EP1_CNT
10
RW
EP2_CNT1
11
RW
EP2_CNT
12
RW
EP3_CNT1
13
RW
EP3_CNT
14
RW
EP4_CNT1
15
RW
EP4_CNT
16
RW
EP0_CR
17
RW
EP0_CNT
18
EP0_DR0
19
EP0_DR1
1A
EP0_DR2
1B
EP0_DR3
PRT7DR
1C
RW
EP0_DR4
PRT7IE
1D
RW
EP0_DR5
PRT7GS
1E
RW
EP0_DR6
PRT7DM2
1F
RW
EP0_DR7
DBB00DR0
20
#
AMX_IN
DBB00DR1
21
W
AMUXCFG
DBB00DR2
22
RW
DBB00CR0
23
#
ARF_CR
DBB01DR0
24
#
CMP_CR0
DBB01DR1
25
W
ASY_CR
DBB01DR2
26
RW
CMP_CR1
DBB01CR0
27
#
DCB02DR0
28
#
DCB02DR1
29
W
DCB02DR2
2A
RW
DCB02CR0
2B
#
DCB03DR0
2C
#
TMP_DR0
DCB03DR1
2D
W
TMP_DR1
DCB03DR2
2E
RW
TMP_DR2
DCB03CR0
2F
#
TMP_DR3
30
ACB00CR3
31
ACB00CR0
32
ACB00CR1
33
ACB00CR2
34
ACB01CR3
35
ACB01CR0
36
ACB01CR1
37
ACB01CR2
38
39
3A
3B
3C
3D
3E
3F
Blank fields are reserved and should not be accessed.
Document Number: 38-12018 Rev. AL
Addr (0, Hex)
40
41
42
43
44
45
46
47
48
49
4A
4B
4C
4D
4E
4F
50
51
52
53
54
55
56
57
58
59
5A
5B
5C
5D
5E
5F
60
61
62
63
64
65
66
67
68
69
6A
6B
6C
6D
6E
6F
70
71
72
73
74
75
76
77
78
79
7A
7B
7C
7D
7E
7F
Access
RW
RW
RW
RW
RW
RW
RW
RW
R
R
RW
#
RW
#
RW
#
RW
#
RW
#
RW
#
#
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
#
#
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
Name
ASC10CR0
ASC10CR1
ASC10CR2
ASC10CR3
ASD11CR0
ASD11CR1
ASD11CR2
ASD11CR3
Addr (0, Hex)
80
81
82
83
84
85
86
87
88
89
8A
8B
8C
8D
8E
8F
ASD20CR0
90
ASD20CR1
91
ASD20CR2
92
ASD20CR3
93
ASC21CR0
94
ASC21CR1
95
ASC21CR2
96
ASC21CR3
97
98
99
9A
9B
9C
9D
9E
9F
A0
A1
A2
A3
A4
A5
A6
A7
MUL1_X
A8
MUL1_Y
A9
MUL1_DH
AA
MUL1_DL
AB
ACC1_DR1
AC
ACC1_DR0
AD
ACC1_DR3
AE
ACC1_DR2
AF
RDI0RI
B0
RDI0SYN
B1
RDI0IS
B2
RDI0LT0
B3
RDI0LT1
B4
RDI0RO0
B5
RDI0RO1
B6
B7
B8
B9
BA
BB
BC
BD
BE
BF
# Access is bit specific.
Access
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
W
W
R
R
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
Name
CUR_PP
STK_PP
IDX_PP
MVR_PP
MVW_PP
I2C_CFG
I2C_SCR
I2C_DR
I2C_MSCR
INT_CLR0
INT_CLR1
INT_CLR2
INT_CLR3
INT_MSK3
INT_MSK2
INT_MSK0
INT_MSK1
INT_VC
RES_WDT
DEC_DH
DEC_DL
DEC_CR0
DEC_CR1
MUL0_X
MUL0_Y
MUL0_DH
MUL0_DL
ACC0_DR1
ACC0_DR0
ACC0_DR3
ACC0_DR2
CPU_F
DAC_D
CPU_SCR1
CPU_SCR0
Addr (0, Hex)
C0
C1
C2
C3
C4
C5
C6
C7
C8
C9
CA
CB
CC
CD
CE
CF
D0
D1
D2
D3
D4
D5
D6
D7
D8
D9
DA
DB
DC
DD
DE
DF
E0
E1
E2
E3
E4
E5
E6
E7
E8
E9
EA
EB
EC
ED
EE
EF
F0
F1
F2
F3
F4
F5
F6
F7
F8
F9
FA
FB
FC
FD
FE
FF
Access
RW
RW
RW
RW
RW
RW
#
RW
#
RW
RW
RW
RW
RW
RW
RW
RW
RC
W
RC
RC
RW
RW
W
W
R
R
RW
RW
RW
RW
RL
RW
#
#
Page 21 of 73
CY8C24094/CY8C24794
CY8C24894/CY8C24994
10.4 Register Map Bank 1 Table: Configuration Space
Name
PRT0DM0
PRT0DM1
PRT0IC0
PRT0IC1
PRT1DM0
PRT1DM1
PRT1IC0
PRT1IC1
PRT2DM0
PRT2DM1
PRT2IC0
PRT2IC1
PRT3DM0
PRT3DM1
PRT3IC0
PRT3IC1
PRT4DM0
PRT4DM1
PRT4IC0
PRT4IC1
PRT5DM0
PRT5DM1
PRT5IC0
PRT5IC1
Addr (1, Hex) Access
Name
00
RW
PMA0_WA
01
RW
PMA1_WA
02
RW
PMA2_WA
03
RW
PMA3_WA
04
RW
PMA4_WA
05
RW
PMA5_WA
06
RW
PMA6_WA
07
RW
PMA7_WA
08
RW
09
RW
0A
RW
0B
RW
0C
RW
0D
RW
0E
RW
0F
RW
10
RW
PMA0_RA
11
RW
PMA1_RA
12
RW
PMA2_RA
13
RW
PMA3_RA
14
RW
PMA4_RA
15
RW
PMA5_RA
16
RW
PMA6_RA
17
RW
PMA7_RA
18
19
1A
1B
PRT7DM0
1C
RW
PRT7DM1
1D
RW
PRT7IC0
1E
RW
PRT7IC1
1F
RW
DBB00FN
20
RW
CLK_CR0
DBB00IN
21
RW
CLK_CR1
DBB00OU
22
RW
ABF_CR0
23
AMD_CR0
DBB01FN
24
RW
CMP_GO_EN
DBB01IN
25
RW
DBB01OU
26
RW
AMD_CR1
27
ALT_CR0
DCB02FN
28
RW
DCB02IN
29
RW
DCB02OU
2A
RW
2B
DCB03FN
2C
RW
TMP_DR0
DCB03IN
2D
RW
TMP_DR1
DCB03OU
2E
RW
TMP_DR2
2F
TMP_DR3
30
ACB00CR3
31
ACB00CR0
32
ACB00CR1
33
ACB00CR2
34
ACB01CR3
35
ACB01CR0
36
ACB01CR1
37
ACB01CR2
38
39
3A
3B
3C
3D
3E
3F
Blank fields are reserved and should not be accessed.
Document Number: 38-12018 Rev. AL
Addr (1, Hex)
40
41
42
43
44
45
46
47
48
49
4A
4B
4C
4D
4E
4F
50
51
52
53
54
55
56
57
58
59
5A
5B
5C
5D
5E
5F
60
61
62
63
64
65
66
67
68
69
6A
6B
6C
6D
6E
6F
70
71
72
73
74
75
76
77
78
79
7A
7B
7C
7D
7E
7F
Access
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
Name
ASC10CR0
ASC10CR1
ASC10CR2
ASC10CR3
ASD11CR0
ASD11CR1
ASD11CR2
ASD11CR3
Addr (1, Hex)
80
81
82
83
84
85
86
87
88
89
8A
8B
8C
8D
8E
8F
90
ASD20CR1
91
ASD20CR2
92
ASD20CR3
93
ASC21CR0
94
ASC21CR1
95
ASC21CR2
96
ASC21CR3
97
98
99
9A
9B
9C
9D
9E
9F
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
AA
AB
AC
AD
AE
AF
RDI0RI
B0
RDI0SYN
B1
RDI0IS
B2
RDI0LT0
B3
RDI0LT1
B4
RDI0RO0
B5
RDI0RO1
B6
B7
B8
B9
BA
BB
BC
BD
BE
BF
# Access is bit specific.
Access
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
Name
USBI/O_CR2
USB_CR1
Addr (1, Hex) Access
C0
RW
C1
#
EP1_CR0
EP2_CR0
EP3_CR0
EP4_CR0
C4
C5
C6
C7
C8
C9
CA
CB
CC
CD
CE
CF
D0
D1
D2
D3
D4
D5
D6
D7
D8
D9
DA
DB
DC
DD
DE
DF
E0
E1
E2
E3
E4
E5
E6
E7
E8
E9
EA
EB
EC
ED
EE
EF
F0
F1
F2
F3
F4
F5
F6
F7
F8
F9
FA
FB
FC
FD
FE
FF
GDI_O_IN
GDI_E_IN
GDI_O_OU
GDI_E_OU
MUX_CR0
MUX_CR1
MUX_CR2
MUX_CR3
OSC_GO_EN
OSC_CR4
OSC_CR3
OSC_CR0
OSC_CR1
OSC_CR2
VLT_CR
VLT_CMP
IMO_TR
ILO_TR
BDG_TR
ECO_TR
MUX_CR4
MUX_CR5
RW
RW
RW
RW
RW
RW
RW
CPU_F
DAC_CR
CPU_SCR1
CPU_SCR0
#
#
#
#
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
R
W
W
RW
W
RW
RW
RL
RW
#
#
Page 22 of 73
CY8C24094/CY8C24794
CY8C24894/CY8C24994
11. Electrical Specifications
This section presents the DC and AC electrical specifications of the CY8C24x94 PSoC device family. For the most up-to-date electrical
specifications, confirm that you have the most recent datasheet by visiting http://www.cypress.com.
Specifications are valid for –40 °C TA 85 °C and TJ 100 °C, except where noted. Specifications for devices running at greater
than 12 MHz are valid for –40 °C TA 70 °C and TJ 82 °C.
Figure 11. Voltage Versus CPU Frequency
5.25
Vdd Voltage
lid ng
Va rati n
e io
Op Reg
4.75
3.00
93 kHz
12 MHz
24 MHz
CPU Frequency
11.1 Absolute Maximum Ratings
Table 9. Absolute Maximum Ratings
TSTG
Symbol
Description
Storage temperature
TBAKETEMP
Bake temperature
tBAKETIME
Bake time
TA
VDD
VI/O
VI/O2
IMI/O
IMAI/O
ESD
LU
Min
–55
Typ
25
Max
+100
Units
°C
–
125
°C
–
See
package
label
72
Hours
–
–
–
–
–
–
+85
+6.0
VDD + 0.5
VDD + 0.5
+50
+50
°C
V
V
V
mA
mA
–
–
–
200
V
mA
See
package
label
Ambient temperature with power applied
–40
Supply voltage on VDD relative to VSS
–0.5
DC input voltage
VSS – 0.5
DC voltage applied to tristate
VSS – 0.5
Maximum current into any port pin
–25
Maximum current into any port pin configured
–50
as analog driver
Electrostatic discharge voltage
2000
Latch-up current
–
Document Number: 38-12018 Rev. AL
Notes
Higher storage temperatures
reduces data retention time.
Recommended storage
temperature is +25 °C ± 25 °C.
Extended duration storage
temperatures higher than 65
°C degrades reliability.
Human body model ESD.
Page 23 of 73
CY8C24094/CY8C24794
CY8C24894/CY8C24994
11.2 Operating Temperature
Table 10. Operating Temperature
Symbol
TA
TAUSB
TJ
Description
Ambient temperature
Ambient temperature using USB
Junction temperature
Min
–40
–10
–40
Typ
–
–
–
Max
+85
+85
+100
Units
°C
°C
°C
Notes
The temperature rise from
ambient to junction is package
specific. See Thermal
Impedance on page 51. The
user must limit the power
consumption to comply with
this requirement.
11.3 DC Electrical Characteristics
11.3.1 DC Chip-Level Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to 5.25 V
and –40 °C TA 85 °C, or 3.0 V to 3.6 V and –40 °C TA 85 °C, respectively. Typical parameters are measured at 5 V and 3.3 V
at 25 °C and are for design guidance only.
Table 11. DC Chip-Level Specifications
Symbol
VDD
Supply voltage
Description
Min
3.0
Typ Max
–
5.25
IDD5
Supply current, IMO = 24 MHz (5 V)
–
14
27
IDD3
Supply current, IMO = 24 MHz (3.3 V)
–
8
14
ISB
Sleep [21] (mode) current with POR, LVD,
sleep timer, and WDT.[22]
–
3
6.5
ISBH
Sleep (mode) current with POR, LVD, Sleep
Timer, and WDT at high temperature.[22]
–
4
25
Units
Notes
V
See DC POR and LVD specifications,
Table 22 on page 39.
mA Conditions are VDD = 5.0 V, TA = 25 °C,
CPU = 3 MHz, SYSCLK doubler
disabled,
VC1 = 1.5 MHz, VC2 = 93.75 kHz,
VC3 = 93.75 kHz, analog power = off.
mA Conditions are VDD = 3.3 V, TA = 25 °C,
CPU = 3 MHz, SYSCLK doubler
disabled,
VC1 = 1.5 MHz, VC2 = 93.75 kHz,
VC3 = 0.367 kHz, analog power = off.
µA
Conditions are with internal slow speed
oscillator, VDD = 3.3 V, –40 C TA 55
°C,
analog power = off.
µA
Conditions are with internal slow speed
oscillator, VDD = 3.3 V, 55 °C < TA
85 °C, analog power = off.
Notes
21. Errata: When the device is operating at 4.75 V to 5.25 V and the 3.3 V regulator is enabled, a short low pulse may be created on the DP signal line during device
wake-up. The 15-20 μs low pulse of the DP line may be interpreted by the host computer as a deattach or the beginning of a wake-up. More details in “Errata” on page 66.
22. Standby current includes all functions (POR, LVD, WDT, Sleep Time) needed for reliable system operation. This should be compared with devices that have similar
functions enabled.
Document Number: 38-12018 Rev. AL
Page 24 of 73
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11.3.2 DC GPIO Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to 5.25 V
and –40 °C TA 85 °C, or 3.0 V to 3.6 V and –40 °C TA 85 °C, respectively. Typical parameters are measured at 5 V and 3.3 V
at 25 °C and are for design guidance only.
Table 12. DC GPIO Specifications
Symbol
Description
RPU
Pull-up resistor
Pull-down resistor
RPD
High output level
VOH
Min
4
4
VDD – 1.0
Typ
5.6
5.6
–
Max
8
8
–
Units
k
k
V
VOL
Low output level
–
–
0.75
V
IOH
High level source current
10
–
–
mA
IOL
Low level sink current
25
–
–
mA
VIL
VIH
VH
IIL
CIN
Input low level
Input high level
Input hysterisis
Input leakage (absolute value)
Capacitive load on pins as input
–
2.1
–
–
–
–
–
60
1
3.5
0.8
–
–
10
V
V
mV
nA
pF
COUT
Capacitive load on pins as output
–
3.5
10
pF
Document Number: 38-12018 Rev. AL
Notes
IOH = 10 mA, VDD = 4.75 V to 5.25 V and
–40 °C TA 85 °C, or
VDD = 3.0 V to 3.6 V and
–40 °C TA 85 °C
(8 total loads, 4 on even port pins (for
example, P0[2], P1[4]), 4 on odd port
pins (for example, P0[3], P1[5])). 80 mA
maximum combined IOH budget.
IOL = 25 mA, VDD = 4.75 V to 5.25 V
and –40 °C TA 85 °C, or
VDD = 3.0 V to 3.6 V and
–40 °C TA 85 °C
(8 total loads, 4 on even port pins (for
example, P0[2], P1[4]), 4 on odd port
pins (for example, P0[3], P1[5])). 200 mA
maximum combined IOL budget.
VOH = VDD – 1.0 V, see the limitations of
the total current in the note for VOH
VOL = 0.75 V, see the limitations of the
total current in the note for VOL
VDD = 3.0 to 5.25.
VDD = 3.0 to 5.25.
Gross tested to 1 µA.
Package and pin dependent.
Temp = 25 C.
Package and pin dependent.
Temp = 25 C.
Page 25 of 73
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11.3.3 DC Full Speed USB Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to 5.25 V
and –10 C TA 85 °C, or 3.0 V to 3.6 V and –10 °C TA 85 °C, respectively. Typical parameters are measured at 5 V and 3.3 V
at 25 °C and are for design guidance only.
Table 13. DC Full Speed (12 Mbps) USB Specifications
Symbol
Description
USB Interface
Differential input sensitivity
VDI
Differential input common mode range
VCM
VSE
Single ended receiver threshold
Transceiver capacitance
CIN
High Z state data line leakage
II/O
REXT
External USB series resistor
Static output high, driven
VUOH
Min
Typ
Max
Units
0.2
0.8
0.8
–
–10
23
2.8
–
–
–
–
–
–
–
–
2.5
2.0
20
10
25
3.6
V
V
V
pF
µA
V
VUOHI
Static output high, idle
2.7
–
3.6
V
VUOL
Static output low
–
–
0.3
V
ZO
VCRS
USB driver output impedance
D+/D– crossover voltage
28
1.3
–
–
44
2.0
V
Document Number: 38-12018 Rev. AL
Notes
| (D+) – (D–) |
0 V < VIN < 3.3 V.
In series with each USB pin.
15 k ± 5% to ground. Internal pull-up
enabled.
15 k ± 5% to ground. Internal pull-up
enabled.
15 k ± 5% to ground. Internal pull-up
enabled.
Including REXT resistor.
Page 26 of 73
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11.3.4 DC Operational Amplifier Specifications
The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to 5.25 V
and –40 °C TA 85 °C, or 3.0 V to 3.6 V and –40 °C TA 85 °C, respectively. Typical parameters are measured at 5 V and 3.3 V
at 25 °C and are for design guidance only.
The operational amplifier is a component of both the analog continuous time PSoC blocks and the analog switched capacitor PSoC
blocks. The guaranteed specifications are measured in the analog continuous time PSoC block.
Table 14. 5-V DC Operational Amplifier Specifications
Symbol
VOSOA
Description
Input offset voltage (absolute value)
Power = low, Opamp bias = high
Power = medium, Opamp bias = high
Power = high, Opamp bias = high
TCVOSOA Average input offset voltage drift
Input leakage current (Port 0 analog pins)
IEBOA
Input capacitance (Port 0 analog pins)
CINOA
VCMOA
Common mode voltage range
Common mode voltage range
(high power or high Opamp bias)
GOLOA
Open loop gain
Power = low, Opamp bias = high
Power = medium, Opamp bias = high
Power = high, Opamp bias = high
VOHIGHOA High output voltage swing (internal signals)
Power = low, Opamp bias = high
Power = medium, Opamp bias = high
Power = high, Opamp bias = high
VOLOWOA Low output voltage swing (internal signals)
Power = low, Opamp bias = high
Power = medium, Opamp bias = high
Power = high, Opamp bias = high
ISOA
Supply current (including associated AGND
buffer)
Power = low, Opamp bias = low
Power = low, Opamp bias = high
Power = medium, Opamp bias = low
Power = medium, Opamp bias = high
Power = high, Opamp bias = low
Power = high, Opamp bias = high
PSRROA Supply voltage rejection ratio
Document Number: 38-12018 Rev. AL
Min
Typ
Max
Units
–
–
–
–
–
–
1.6
1.3
1.2
7.0
20
4.5
10
8
7.5
35.0
–
9.5
mV
mV
mV
µV/°C
pA
pF
0.0
0.5
–
–
VDD
VDD – 0.5
V
V
60
60
80
–
–
–
–
–
–
dB
dB
dB
VDD – 0.2
VDD – 0.2
VDD – 0.5
–
–
–
–
–
–
V
V
V
–
–
–
–
–
–
0.2
0.2
0.5
V
V
V
–
–
–
–
–
–
65
400
500
800
1200
2400
4600
80
800
900
1000
1600
3200
6400
–
µA
µA
µA
µA
µA
µA
dB
Notes
Gross tested to 1 µA.
Package and pin dependent.
Temp = 25 C.
The common-mode input
voltage range is measured
through an analog output
buffer. The specification
includes the limitations
imposed by the characteristics
of the analog output buffer.
VSS VIN (VDD – 2.25) or
(VDD – 1.25 V) VIN VDD.
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Table 15. 3.3-V DC Operational Amplifier Specifications
Symbol
VOSOA
Description
Input offset voltage (absolute value)
Power = low, Opamp bias = high
Power = medium, Opamp bias = high
Power = high, Opamp bias = high
TCVOSOA Average input offset voltage drift
IEBOA
Input leakage current (port 0 analog pins)
Input capacitance (port 0 analog pins)
CINOA
Min
Typ
–
–
–
–
–
–
1.65
1.32
–
7.0
20
4.5
VCMOA
Common mode voltage range
0.2
–
GOLOA
Open loop gain
Power = low, Opamp bias = low
Power = medium, Opamp bias = low
Power = high, Opamp bias = low
60
60
80
–
–
–
VDD – 0.2
VDD – 0.2
VDD – 0.2
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
65
400
500
800
1200
2400
–
80
VOHIGHO
High output voltage swing (internal signals)
Power = low, Opamp bias = low
Power = medium, Opamp bias = low
Power = high, Opamp bias = low
VOLOWOA Low output voltage swing (internal signals)
Power = low, Opamp bias = low
Power = medium, Opamp bias = low
Power = high, Opamp bias = low
ISOA
Supply current
(including associated AGND buffer)
Power = low, Opamp bias = low
Power = low, Opamp bias = high
Power = medium, Opamp bias = low
Power = medium, Opamp bias = high
Power = high, Opamp bias = low
Power = high, Opamp bias = high
PSRROA Supply voltage rejection ratio
A
Max
Units
Notes
Power = high, Opamp bias =
high setting is not allowed for
3.3 V VDD operation
mV
mV
mV
µV/°C
pA
Gross tested to 1 µA.
pF
Package and pin dependent.
Temp = 25 °C.
VDD – 0.2
V
The common-mode input
voltage range is measured
through an analog output
buffer. The specification
includes the limitations
imposed by the characteristics
of the analog output buffer.
Specification is applicable at
–
dB
Low opamp bias. For high
–
dB
opamp bias mode (except high
–
dB
power, High opamp bias),
minimum is 60 dB.
Power = high, Opamp bias =
–
V
high setting is not allowed for
–
V
3.3 V VDD operation
–
V
Power = high, Opamp bias =
0.2
V
high setting is not allowed for
0.2
V
3.3 V VDD operation
0.2
V
Power = high, Opamp bias =
high setting is not allowed for
800
µA
3.3 V VDD operation
900
µA
1000
µA
1600
µA
3200
µA
–
µA
–
dB
VSS VIN (VDD – 2.25) or
(VDD – 1.25 V) VIN VDD
10
8
–
35.0
–
9.5
11.3.5 DC Low Power Comparator Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to 5.25 V
and –40 °C TA 85 °C or 3.0 V to 3.6 V and –40 °C TA 85 °C, respectively. Typical parameters are measured at 5 V at 25 °C
and are for design guidance only.
Table 16. DC Low Power Comparator Specifications
Symbol
VREFLPC
ISLPC
VOSLPC
Description
Low power comparator (LPC) reference
voltage range
LPC supply current
LPC voltage offset
Document Number: 38-12018 Rev. AL
Min
0.2
Typ
–
Max
VDD – 1
Units
V
–
–
10
2.5
40
30
µA
mV
Notes
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11.3.6 DC Analog Output Buffer Specifications
The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to 5.25 V
and –40 °C TA 85 °C, or 3.0 V to 3.6 V and –40 °C TA 85 °C, respectively. Typical parameters are measured at 5 V and 3.3 V
at 25 °C and are for design guidance only.
Table 17. 5-V DC Analog Output Buffer Specifications
Symbol
CL
Description
Load Capacitance
VOSOB
TCVOSOB
VCMOB
ROUTOB
Min
–
Input offset voltage (absolute value)
–
Average input offset voltage drift
–
Common mode input voltage range
0.5
Output resistance
Power = low
–
Power = high
–
VOHIGHOB High output voltage swing
(Load = 32 ohms to VDD/2)
0.5 × VDD + 1.1
Power = low
0.5 × VDD + 1.1
Power = high
VOLOWOB Low output voltage swing
(Load = 32 ohms to VDD/2)
Power = low
–
Power = high
–
ISOB
Supply current including opamp bias
cell
(No Load)
–
Power = low
–
Power = high
PSRROB Supply voltage rejection ratio
53
Document Number: 38-12018 Rev. AL
Typ
–
Max
200
Units
Notes
pF
This specification applies to the
external circuit that is being
driven by the analog output
buffer.
mV
µV/°C
V
3
+6
–
12
–
VDD – 1.0
0.6
0.6
–
–
–
–
–
–
V
V
–
–
0.5 × VDD – 1.3
0.5 × VDD – 1.3
V
V
1.1
2.6
5.1
8.8
mA
mA
64
–
dB
(0.5 × VDD – 1.3) VOUT
(VDD – 2.3).
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Table 18. 3.3-V DC Analog Output Buffer Specifications
Symbol
CL
Description
Load Capacitance
VOSOB
TCVOSOB
VCMOB
ROUTOB
Min
–
Input offset voltage (absolute value)
–
Average input offset voltage drift
–
Common mode input voltage range
0.5
Output resistance
Power = low
–
Power = high
–
VOHIGHOB High output voltage swing
(Load = 1 K ohms to VDD/2)
Power = low
0.5 × VDD + 1.0
Power = high
0.5 × VDD + 1.0
VOLOWOB Low output voltage swing
(Load = 1 K ohms to VDD/2)
–
Power = low
–
Power = high
ISOB
Supply current including opamp bias
cell (No load)
–
Power = low
–
Power = high
PSRROB Supply voltage rejection ratio
34
Document Number: 38-12018 Rev. AL
Typ
–
Max
200
Units
Notes
pF This specification applies to the
external circuit that is being
driven by the analog output
buffer.
mV
µV/°C
V
3
+6
–
12
–
VDD – 1.0
1
1
–
–
W
W
–
–
–
–
V
V
–
–
0.5 × VDD – 1.0
0.5 × VDD – 1.0
V
V
0.8
2.0
64
2.0
4.3
–
mA
mA
dB
(0.5 × VDD – 1.0) VOUT
(0.5 × VDD + 0.9).
Page 30 of 73
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11.3.7 DC Analog Reference Specifications
The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to 5.25 V
and –40 °C TA 85 °C, or 3.0 V to 3.6 V and –40 °C TA 85 °C, respectively. Typical parameters apply to 5 V and 3.3 V at 25 °C
and are for design guidance only.
The guaranteed specifications for RefHI and RefLo are measured through the Analog Continuous Time PSoC blocks. The power
levels for RefHi and RefLo refer to the Analog Reference Control register. AGND is measured at P2[4] in AGND bypass mode. Each
Analog Continuous Time PSoC block adds a maximum of 10mV additional offset error to guaranteed AGND specifications from the
local AGND buffer. Reference control power can be set to medium or high unless otherwise noted.
Note Avoid using P2[4] for digital signaling when using an analog resource that depends on the Analog Reference. Some coupling
of the digital signal may appear on the AGND.
Table 19. 5-V DC Analog Reference Specifications
Reference
ARF_CR
[5:3]
0b000
Reference Power
Settings
Symbol Reference
Description
Min
Typ
Max
Unit
s
Ref High
VDD/2 + Bandgap
VDD/2 + 1.229
VDD/2 +
1.290
VDD/2 +
1.346
V
VAGND
AGND
VDD/2
VDD/2 – 0.038
VDD/2
VDD/2 +
0.040
V
VREFLO
Ref Low
VDD/2 – Bandgap
VDD/2 – 1.356
VDD/2 –
1.295
VDD/2 –
1.218
V
VREFHI
Ref High
VDD/2 + Bandgap
VDD/2 + 1.220
VDD/2 +
1.292
VDD/2 +
1.348
V
VAGND
AGND
VDD/2
VDD/2 – 0.036
VDD/2
VDD/2 +
0.036
V
VREFLO
Ref Low
VDD/2 – Bandgap
VDD/2 – 1.357
VDD/2 –
1.297
VDD/2 –
1.225
V
RefPower =
VREFHI
medium
Opamp bias = high V
AGND
Ref High
VDD/2 + Bandgap
VDD/2 + 1.221
VDD/2 +
1.293
VDD/2 +
1.351
V
AGND
VDD/2
VDD/2 – 0.036
VDD/2
VDD/2 +
0.036
V
VREFLO
Ref Low
VDD/2 – Bandgap
VDD/2 – 1.357
VDD/2 –
1.298
VDD/2 –
1.228
V
VREFHI
Ref High
VDD/2 + Bandgap
VDD/2 + 1.219
VDD/2 +
1.293
VDD/2 +
1.353
V
VAGND
AGND
VDD/2
VDD/2 – 0.037
VDD/2 –
0.001
VDD/2 +
0.036
V
VREFLO
Ref Low
VDD/2 – Bandgap
VDD/2 – 1.359
VDD/2 –
1.299
VDD/2 –
1.229
V
RefPower = high
VREFHI
Opamp bias = high
RefPower = high
Opamp bias = low
RefPower =
medium
Opamp bias = low
Document Number: 38-12018 Rev. AL
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Table 19. 5-V DC Analog Reference Specifications (continued)
Reference
ARF_CR
[5:3]
0b001
Reference Power
Settings
RefPower = high
VREFHI
Opamp bias = high
Description
Min
Unit
s
Typ
Max
P2[4] + P2[6]
– 0.011
P2[4] + P2[6]
+ 0.064
V
P2[4]
P2[4]
–
Ref High
P2[4]+P2[6] (P2[4] = P2[4] + P2[6]
VDD/2, P2[6] = 1.3 V)
– 0.092
VAGND
AGND
P2[4]
VREFLO
Ref Low
P2[4]–P2[6] (P2[4] = P2[4] – P2[6]
– 0.031
VDD/2, P2[6] = 1.3 V)
P2[4] – P2[6]
+ 0.007
P2[4] – P2[6]
+ 0.056
V
VREFHI
Ref High
P2[4]+P2[6] (P2[4] = P2[4] + P2[6]
– 0.078
VDD/2, P2[6] = 1.3 V)
P2[4] + P2[6]
– 0.008
P2[4] + P2[6]
+ 0.063
V
VAGND
AGND
P2[4]
P2[4]
P2[4]
–
VREFLO
Ref Low
P2[4]–P2[6] (P2[4] = P2[4] – P2[6]
VDD/2, P2[6] = 1.3 V)
– 0.031
P2[4] – P2[6]
+ 0.004
P2[4] – P2[6]
+ 0.043
V
RefPower =
VREFHI
medium
Opamp bias = high V
AGND
Ref High
P2[4]+P2[6] (P2[4] = P2[4] + P2[6]
VDD/2, P2[6] = 1.3 V)
– 0.073
P2[4] + P2[6]
– 0.006
P2[4] + P2[6]
+ 0.062
V
AGND
P2[4]
P2[4]
P2[4]
–
VREFLO
Ref Low
P2[4]–P2[6] (P2[4] = P2[4] – P2[6]
VDD/2, P2[6] = 1.3 V)
– 0.032
P2[4] – P2[6]
+ 0.003
P2[4] – P2[6]
+ 0.038
V
VREFHI
Ref High
P2[4]+P2[6] (P2[4] = P2[4] + P2[6]
VDD/2, P2[6] = 1.3 V)
– 0.073
P2[4] + P2[6]
– 0.006
P2[4] + P2[6]
+ 0.062
V
VAGND
AGND
P2[4]
P2[4]
P2[4]
–
VREFLO
Ref Low
P2[4]–P2[6] (P2[4] = P2[4] – P2[6]
– 0.034
VDD/2, P2[6] = 1.3 V)
P2[4] – P2[6]
+ 0.002
P2[4] – P2[6]
+ 0.037
V
RefPower = high
VREFHI
Opamp bias = high V
AGND
Ref High
VDD
VDD – 0.037
VDD – 0.007
VDD
V
AGND
VDD/2
VDD/2 – 0.036
VDD/2 –
0.001
VDD/2 +
0.036
V
RefPower = high
Opamp bias = low
RefPower =
medium
Opamp bias = low
0b010
Symbol Reference
RefPower = high
Opamp bias = low
P2[4]
P2[4]
P2[4]
P2[4]
VREFLO
Ref Low
VSS
VSS
VSS + 0.005
VSS + 0.029
V
VREFHI
Ref High
VDD
VDD – 0.034
VDD – 0.006
VDD
V
VAGND
AGND
VDD/2
VDD/2 – 0.036
VDD/2 –
0.001
VDD/2 +
0.035
V
VREFLO
Ref Low
VSS
VSS
VSS + 0.004
VSS + 0.024
V
RefPower =
VREFHI
medium
V
Opamp bias = high AGND
Ref High
VDD
VDD – 0.032
VDD – 0.005
VDD
V
AGND
VDD/2
VDD/2 – 0.036
VDD/2 –
0.001
VDD/2 +
0.035
V
RefPower =
medium
Opamp bias = low
VREFLO
Ref Low
VSS
VSS
VSS + 0.003
VSS + 0.022
V
VREFHI
Ref High
VDD
VDD – 0.031
VDD – 0.005
VDD
V
VAGND
AGND
VDD/2
VDD/2 – 0.037
VDD/2 –
0.001
VDD/2 +
0.035
V
VREFLO
Ref Low
VSS
VSS
VSS + 0.003
VSS + 0.020
V
Document Number: 38-12018 Rev. AL
Page 32 of 73
CY8C24094/CY8C24794
CY8C24894/CY8C24994
Table 19. 5-V DC Analog Reference Specifications (continued)
Reference
ARF_CR
[5:3]
0b011
Reference Power
Settings
Description
Min
Typ
Max
Unit
s
3.760
3.884
4.006
V
RefPower = high
VREFHI
Opamp bias = high V
AGND
Ref High
3 × Bandgap
AGND
2 × Bandgap
2.522
2.593
2.669
V
VREFLO
Ref Low
Bandgap
1.252
1.299
1.342
V
VREFHI
Ref High
3 × Bandgap
3.766
3.887
4.010
V
VAGND
AGND
2 × Bandgap
2.523
2.594
2.670
V
RefPower = high
Opamp bias = low
VREFLO
Ref Low
Bandgap
1.252
1.297
1.342
V
VREFHI
RefPower =
medium
V
Opamp bias = high AGND
VREFLO
Ref High
3 × Bandgap
3.769
3.888
4.013
V
AGND
2 × Bandgap
2.523
2.594
2.671
V
Ref Low
Bandgap
1.251
1.296
1.343
V
VREFHI
Ref High
3 × Bandgap
3.769
3.889
4.015
V
VAGND
AGND
2 × Bandgap
2.523
2.595
2.671
V
VREFLO
Ref Low
Bandgap
1.251
1.296
1.344
RefPower = high
VREFHI
Opamp bias = high
Ref High
2 × Bandgap + P2[6]
(P2[6] = 1.3 V)
VAGND
AGND
2 × Bandgap
VREFLO
Ref Low
2 × Bandgap – P2[6]
(P2[6] = 1.3 V)
2.524 – P2[6] 2.600 – P2[6] 2.676 – P2[6]
V
VREFHI
Ref High
2 × Bandgap + P2[6]
(P2[6] = 1.3 V)
2.490 + P2[6] 2.586 + P2[6] 2.679 + P2[6]
V
VAGND
AGND
2 × Bandgap
VREFLO
Ref Low
2 × Bandgap – P2[6]
(P2[6] = 1.3 V)
2.523 – P2[6] 2.598 – P2[6] 2.675 – P2[6]
V
RefPower =
VREFHI
medium
Opamp bias = high V
AGND
Ref High
2 × Bandgap + P2[6]
(P2[6] = 1.3 V)
2.493 + P2[6] 2.588 + P2[6] 2.682 +P2[6]
V
AGND
2 × Bandgap
VREFLO
Ref Low
2 × Bandgap – P2[6]
(P2[6] = 1.3 V)
2.523 – P2[6] 2.597 – P2[6] 2.675 – P2[6]
V
VREFHI
Ref High
2 × Bandgap + P2[6]
(P2[6] = 1.3 V)
2.494 + P2[6] 2.589 + P2[6] 2.685 + P2[6]
V
VAGND
AGND
2 × Bandgap
VREFLO
Ref Low
2 × Bandgap – P2[6]
(P2[6] = 1.3 V)
RefPower =
medium
Opamp bias = low
0b100
Symbol Reference
RefPower = high
Opamp bias = low
RefPower =
medium
Opamp bias = low
Document Number: 38-12018 Rev. AL
2.483 + P2[6] 2.582 + P2[6] 2.674 + P2[6]
2.522
2.523
2.523
2.523
2.593
2.594
2.594
2.595
2.669
2.669
2.670
2.671
2.522 – P2[6] 2.596 – P2[6] 2.676 – P2[6]
V
V
V
V
V
V
V
Page 33 of 73
CY8C24094/CY8C24794
CY8C24894/CY8C24994
Table 19. 5-V DC Analog Reference Specifications (continued)
Reference
ARF_CR
[5:3]
0b101
Reference Power
Settings
RefPower = high
VREFHI
Opamp bias = high
Description
Min
Typ
Max
Unit
s
Ref High
P2[4] + Bandgap
(P2[4] = VDD/2)
VAGND
AGND
P2[4]
VREFLO
Ref Low
P2[4] – Bandgap
(P2[4] = VDD/2)
P2[4] – 1.335 P2[4] – 1.294 P2[4] – 1.237
V
VREFHI
Ref High
P2[4] + Bandgap
(P2[4] = VDD/2)
P2[4] + 1.221 P2[4] + 1.293 P2[4] + 1.358
V
VAGND
AGND
P2[4]
VREFLO
Ref Low
P2[4] – Bandgap
(P2[4] = VDD/2)
P2[4] – 1.337 P2[4] – 1.297 P2[4] – 1.243
V
RefPower =
VREFHI
medium
Opamp bias = high V
AGND
Ref High
P2[4] + Bandgap
(P2[4] = VDD/2)
P2[4] + 1.222 P2[4] + 1.294 P2[4] + 1.360
V
AGND
P2[4]
VREFLO
Ref Low
P2[4] – Bandgap
(P2[4] = VDD/2)
P2[4] – 1.338 P2[4] – 1.298 P2[4] – 1.245
V
VREFHI
Ref High
P2[4] + Bandgap
(P2[4] = VDD/2)
P2[4] + 1.221 P2[4] + 1.294 P2[4] + 1.362
V
VAGND
AGND
P2[4]
VREFLO
Ref Low
P2[4] – Bandgap
(P2[4] = VDD/2)
RefPower = high
VREFHI
Opamp bias = high V
AGND
Ref High
2 × Bandgap
2.513
AGND
Bandgap
1.264
VREFLO
Ref Low
VSS
VSS
VREFHI
Ref High
2 × Bandgap
2.514
VAGND
AGND
Bandgap
1.264
RefPower = high
Opamp bias = low
RefPower =
medium
Opamp bias = low
0b110
Symbol Reference
RefPower = high
Opamp bias = low
P2[4] + 1.218 P2[4] + 1.291 P2[4] + 1.354
P2[4]
P2[4]
P2[4]
P2[4]
P2[4]
P2[4]
P2[4]
P2[4]
P2[4]
P2[4]
P2[4]
P2[4]
P2[4] – 1.340 P2[4] – 1.298 P2[4] – 1.245
2.593
V
–
–
–
–
V
2.672
V
1.302
1.340
V
VSS + 0.008
VSS + 0.038
V
2.593
2.674
V
1.301
1.340
V
VREFLO
Ref Low
VSS
VSS
VSS + 0.005
VSS + 0.028
V
RefPower =
VREFHI
medium
V
Opamp bias = high AGND
VREFLO
Ref High
2 × Bandgap
2.514
2.593
2.676
V
AGND
Bandgap
1.264
1.301
1.340
V
Ref Low
VSS
VSS
VSS + 0.004
VSS + 0.024
V
RefPower =
medium
Opamp bias = low
VREFHI
Ref High
2 × Bandgap
2.514
2.593
2.677
V
VAGND
AGND
Bandgap
1.264
1.300
1.340
V
VREFLO
Ref Low
VSS
VSS
VSS + 0.003
VSS + 0.021
V
Document Number: 38-12018 Rev. AL
Page 34 of 73
CY8C24094/CY8C24794
CY8C24894/CY8C24994
Table 19. 5-V DC Analog Reference Specifications (continued)
Reference
ARF_CR
[5:3]
0b111
Reference Power
Settings
Min
Typ
Max
Unit
s
3.2 × Bandgap
4.028
4.144
4.242
V
2.028
2.076
2.125
V
VSS
VSS + 0.008
VSS + 0.034
V
Symbol Reference
Description
RefPower = high
VREFHI
Opamp bias = high V
AGND
Ref High
AGND
1.6 × Bandgap
VREFLO
Ref Low
VSS
VREFHI
Ref High
3.2 × Bandgap
4.032
4.142
4.245
V
VAGND
AGND
1.6 × Bandgap
2.029
2.076
2.126
V
RefPower = high
Opamp bias = low
VREFLO
Ref Low
VSS
VSS
VSS + 0.005
VSS + 0.025
V
VREFHI
RefPower =
medium
V
Opamp bias = high AGND
VREFLO
Ref High
3.2 × Bandgap
4.034
4.143
4.247
V
AGND
1.6 × Bandgap
2.029
2.076
2.126
V
Ref Low
VSS
VSS
VSS + 0.004
VSS + 0.021
V
VREFHI
Ref High
3.2 × Bandgap
4.036
4.144
4.249
V
VAGND
AGND
1.6 × Bandgap
2.029
2.076
2.126
V
VREFLO
Ref Low
VSS
VSS
VSS + 0.003
VSS + 0.019
V
RefPower =
medium
Opamp bias = low
Document Number: 38-12018 Rev. AL
Page 35 of 73
CY8C24094/CY8C24794
CY8C24894/CY8C24994
Table 20. 3.3-V DC Analog Reference Specifications
Reference
ARF_CR
[5:3]
0b000
Reference Power
Settings
Description
Min
Typ
Max
Unit
s
Ref High
VDD/2 + Bandgap
VDD/2 + 1.200
VDD/2 +
1.290
VDD/2 +
1.365
V
VAGND
AGND
VDD/2
VDD/2 – 0.030
VDD/2
VDD/2 +
0.034
V
VREFLO
Ref Low
VDD/2 – Bandgap
VDD/2 – 1.346
VDD/2 –
1.292
VDD/2 –
1.208
V
VREFHI
Ref High
VDD/2 + Bandgap
VDD/2 + 1.196
VDD/2 +
1.292
VDD/2 +
1.374
V
VAGND
AGND
VDD/2
VDD/2 – 0.029
VDD/2
VDD/2 +
0.031
V
VREFLO
Ref Low
VDD/2 – Bandgap
VDD/2 – 1.349
VDD/2 –
1.295
VDD/2 –
1.227
V
RefPower =
VREFHI
medium
Opamp bias = high V
AGND
Ref High
VDD/2 + Bandgap
VDD/2 + 1.204
VDD/2 +
1.293
VDD/2 +
1.369
V
AGND
VDD/2
VDD/2 – 0.030
VDD/2
VDD/2 +
0.030
V
VREFLO
Ref Low
VDD/2 – Bandgap
VDD/2 – 1.351
VDD/2 –
1.297
VDD/2 –
1.229
V
VREFHI
Ref High
VDD/2 + Bandgap
VDD/2 + 1.189
VDD/2 +
1.294
VDD/2 +
1.384
V
VAGND
AGND
VDD/2
VDD/2 – 0.032
VDD/2
VDD/2 +
0.029
V
VREFLO
Ref Low
VDD/2 – Bandgap
VDD/2 – 1.353
VDD/2 –
1.297
VDD/2 –
1.230
V
RefPower = high
VREFHI
Opamp bias = high
Ref High
P2[4]+P2[6] (P2[4] = P2[4] + P2[6]
VDD/2, P2[6] = 0.5 V)
– 0.105
P2[4] + P2[6]
– 0.008
P2[4] + P2[6]
+ 0.095
V
VAGND
AGND
P2[4]
P2[4]
P2[4]
–
VREFLO
Ref Low
P2[4]–P2[6] (P2[4] = P2[4] – P2[6]
VDD/2, P2[6] = 0.5 V)
– 0.035
P2[4] – P2[6]
+ 0.006
P2[4] – P2[6]
+ 0.053
V
VREFHI
Ref High
P2[4]+P2[6] (P2[4] = P2[4] + P2[6]
VDD/2, P2[6] = 0.5 V)
– 0.094
P2[4] + P2[6]
– 0.005
P2[4] + P2[6]
+ 0.073
V
VAGND
AGND
P2[4]
P2[4]
P2[4]
–
VREFLO
Ref Low
P2[4]–P2[6] (P2[4] = P2[4] – P2[6]
– 0.033
VDD/2, P2[6] = 0.5 V)
P2[4] – P2[6]
+ 0.002
P2[4] – P2[6]
+ 0.042
V
RefPower =
VREFHI
medium
Opamp bias = high V
AGND
Ref High
P2[4]+P2[6] (P2[4] = P2[4] + P2[6]
– 0.094
VDD/2, P2[6] = 0.5 V)
P2[4] + P2[6]
– 0.003
P2[4] + P2[6]
+ 0.075
V
AGND
P2[4]
P2[4]
P2[4]
–
VREFLO
Ref Low
P2[4]–P2[6] (P2[4] = P2[4] – P2[6]
VDD/2, P2[6] = 0.5 V)
– 0.035
P2[4] – P2[6] P2[4] – P2[6]
+ 0.038
V
VREFHI
Ref High
P2[4]+P2[6] (P2[4] = P2[4] + P2[6]
VDD/2, P2[6] = 0.5 V)
– 0.095
P2[4] + P2[6]
– 0.003
V
VAGND
AGND
P2[4]
VREFLO
Ref Low
P2[4]–P2[6] (P2[4] = P2[4] – P2[6]
– 0.038
VDD/2, P2[6] = 0.5 V)
RefPower = high
VREFHI
Opamp bias = high
RefPower = high
Opamp bias = low
RefPower =
medium
Opamp bias = low
0b001
Symbol Reference
RefPower = high
Opamp bias = low
RefPower =
medium
Opamp bias = low
Document Number: 38-12018 Rev. AL
P2[4]
P2[4]
P2[4]
P2[4]
P2[4] + P2[6]
+ 0.080
P2[4]
P2[4]
–
P2[4] – P2[6]
P2[4] – P2[6]
+ 0.038
V
Page 36 of 73
CY8C24094/CY8C24794
CY8C24894/CY8C24994
Table 20. 3.3-V DC Analog Reference Specifications (continued)
Reference
ARF_CR
[5:3]
0b010
Reference Power
Settings
Symbol Reference
Description
RefPower = high
VREFHI
Opamp bias = high V
AGND
Ref High
VDD
AGND
VDD/2
RefPower = high
Opamp bias = low
Min
Typ
Max
Unit
s
VDD – 0.119
VDD – 0.005
VDD
V
VDD/2 – 0.028
VDD/2
VDD/2 +
0.029
V
VREFLO
Ref Low
VSS
VSS
VSS + 0.004
VSS + 0.022
V
VREFHI
Ref High
VDD
VDD – 0.131
VDD – 0.004
VDD
V
VAGND
AGND
VDD/2
VDD/2 – 0.028
VDD/2
VDD/2 +
0.028
V
VREFLO
Ref Low
VSS
VSS
VSS + 0.003
VSS + 0.021
V
RefPower =
VREFHI
medium
VAGND
Opamp bias = high
Ref High
VDD
VDD – 0.111
VDD – 0.003
VDD
V
AGND
VDD/2
VDD/2 – 0.029
VDD/2
VDD/2 +
0.028
V
RefPower =
medium
Opamp bias = low
VREFLO
Ref Low
VSS
VSS
VSS + 0.002
VSS + 0.017
V
VREFHI
Ref High
VDD
VDD – 0.128
VDD – 0.003
VDD
V
VAGND
AGND
VDD/2
VDD/2 – 0.029
VDD/2
VDD/2 +
0.029
V
Ref Low
VSS
VSS
VSS + 0.002
VSS + 0.019
V
0b011
All power settings. –
Not allowed for 3.3
V.
–
–
–
–
–
–
0b100
All power settings. –
Not allowed for 3.3
V.
–
–
–
–
–
–
0b101
RefPower = high
VREFHI
Opamp bias = high
Ref High
P2[4] + Bandgap
(P2[4] = VDD/2)
VAGND
AGND
P2[4]
VREFLO
Ref Low
P2[4] – Bandgap
(P2[4] = VDD/2)
P2[4] – 1.335 P2[4] – 1.292 P2[4] – 1.200
V
VREFHI
Ref High
P2[4] + Bandgap
(P2[4] = VDD/2)
P2[4] + 1.219 P2[4] + 1.293 P2[4] + 1.357
V
VAGND
AGND
P2[4]
VREFLO
Ref Low
P2[4] – Bandgap
(P2[4] = VDD/2)
P2[4] – 1.335 P2[4] – 1.295 P2[4] – 1.243
V
RefPower =
VREFHI
medium
Opamp bias = high V
AGND
Ref High
P2[4] + Bandgap
(P2[4] = VDD/2)
P2[4] + 1.222 P2[4] + 1.294 P2[4] + 1.356
V
AGND
P2[4]
VREFLO
Ref Low
P2[4] – Bandgap
(P2[4] = VDD/2)
P2[4] – 1.337 P2[4] – 1.296 P2[4] – 1.244
V
VREFHI
Ref High
P2[4] + Bandgap
(P2[4] = VDD/2)
P2[4] + 1.224 P2[4] + 1.295 P2[4] + 1.355
V
VAGND
AGND
P2[4]
VREFLO
Ref Low
P2[4] – Bandgap
(P2[4] = VDD/2)
VREFLO
RefPower = high
Opamp bias = low
RefPower =
medium
Opamp bias = low
Document Number: 38-12018 Rev. AL
P2[4] + 1.214 P2[4] + 1.291 P2[4] + 1.359
P2[4]
P2[4]
P2[4]
P2[4]
P2[4]
P2[4]
P2[4]
P2[4]
P2[4]
P2[4]
P2[4]
P2[4]
P2[4] – 1.339 P2[4] – 1.297 P2[4] – 1.244
V
–
–
–
–
V
Page 37 of 73
CY8C24094/CY8C24794
CY8C24894/CY8C24994
Table 20. 3.3-V DC Analog Reference Specifications (continued)
Reference
ARF_CR
[5:3]
0b110
Reference Power
Settings
Description
Min
Typ
Max
Unit
s
2.595
2.655
V
RefPower = high
VREFHI
Opamp bias = high V
AGND
Ref High
2 × Bandgap
2.510
AGND
Bandgap
1.276
1.301
1.332
V
VREFLO
Ref Low
VSS
VSS
VSS + 0.006
VSS + 0.031
V
VREFHI
Ref High
2 × Bandgap
2.513
2.594
2.656
V
VAGND
AGND
Bandgap
1.275
1.301
1.331
V
RefPower = high
Opamp bias = low
VREFLO
Ref Low
VSS
VSS
VSS + 0.004
VSS + 0.021
V
VREFHI
RefPower =
medium
VAGND
Opamp bias = high
VREFLO
Ref High
2 × Bandgap
2.516
2.595
2.657
V
AGND
Bandgap
1.275
1.301
1.331
V
Ref Low
VSS
VSS
VSS + 0.003
VSS + 0.017
V
VREFHI
Ref High
2 × Bandgap
2.520
2.595
2.658
V
VAGND
AGND
Bandgap
1.275
1.300
1.331
V
VSS
VSS + 0.002
VSS + 0.015
V
–
–
–
–
RefPower =
medium
Opamp bias = low
0b111
Symbol Reference
VREFLO
All power settings. –
Not allowed for 3.3
V.
Ref Low
VSS
–
–
11.3.8 DC Analog PSoC Block Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to 5.25 V
and –40 °C TA 85 °C, or 3.0 V to 3.6 V and –40 °C TA 85 °C, respectively. Typical parameters are measured at 5 V and 3.3 V
at 25 °C and are for design guidance only.
Table 21. DC Analog PSoC Block Specifications
Symbol
Description
RCT
Resistor unit value (continuous time)
CSC
Capacitor unit value (switched capacitor)
Min
–
–
Typ
12.2
80
Max
–
–
Units
k
fF
Notes
11.3.9 DC POR and LVD Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to 5.25 V
and –40 °C TA 85 °C, or 3.0 V to 3.6 V and –40 °C TA 85 °C, respectively. Typical parameters are measured at 5 V or 3.3 V
at 25 °C and are for design guidance only.
Document Number: 38-12018 Rev. AL
Page 38 of 73
CY8C24094/CY8C24794
CY8C24894/CY8C24994
Note The bits PORLEV and VM in the following table refer to bits in the VLT_CR register. See the PSoC Technical Reference Manual
for more information on the VLT_CR register.
Table 22. DC POR and LVD Specifications
Symbol
Description
VPPOR0R
VPPOR1R
VPPOR2R
VDD value for PPOR trip (positive ramp)
PORLEV[1:0] = 00b
PORLEV[1:0] = 01b
PORLEV[1:0] = 10b
VPPOR0 [23]
VPPOR1 [23]
VPPOR2 [23]
VDD value for PPOR trip (negative ramp)
PORLEV[1:0] = 00b
PORLEV[1:0] = 01b
PORLEV[1:0] = 10b
VPH0
VPH1
VPH2
PPOR hysteresis
PORLEV[1:0] = 00b
PORLEV[1:0] = 01b
PORLEV[1:0] = 10b
VLVD0
VLVD1
VLVD2
VLVD3
VLVD4
VLVD5
VLVD6
VLVD7
VDD value for LVD trip
VM[2:0] = 000b
VM[2:0] = 001b
VM[2:0] = 010b
VM[2:0] = 011b
VM[2:0] = 100b
VM[2:0] = 101b
VM[2:0] = 110b
VM[2:0] = 111b
Min
Typ
Max
Units
–
2.91
4.39
4.55
–
V
V
V
–
2.82
4.39
4.55
–
V
V
V
–
–
–
92
0
0
–
–
–
mV
mV
mV
2.86
2.96
3.07
3.92
4.39
4.55
4.63
4.72
2.92
3.02
3.13
4.00
4.48
4.64
4.73
4.81
2.98[24]
3.08
3.20
4.08
4.57
4.74[25]
4.82
4.91
V
V
V
V
V
V
V
V
Notes
Notes
23. Errata: When VDD of the device is pulled below ground just before power on, the first read from each 8K Flash page may be corrupted. This issue does not affect Flash
page 0 because it is the selected page upon reset. More details in “Errata” on page 66.
24. Always greater than 50 mV above PPOR (PORLEV = 00) for falling supply.
25. Always greater than 50 mV above PPOR (PORLEV = 10) for falling supply.
Document Number: 38-12018 Rev. AL
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11.3.10 DC Programming Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to 5.25 V
and –40 °C TA 85 °C, or 3.0 V to 3.6 V and –40 °C TA 85 °C, respectively. Typical parameters are measured at 5 V and 3.3 V
at 25 °C and are for design guidance only.
Table 23. DC Programming Specifications
Symbol
VDDP
Description
VDD for programming and erase
Min
4.5
Typ
5
Max
5.5
Units
V
VDDLV
Low VDD for verify
3
3.1
3.2
V
VDDHV
High VDD for verify
5.1
5.2
5.3
V
5.25
V
VDDIWRITE Supply voltage for flash write operation
IDDP
VILP
VIHP
IILP
Supply current during programming or verify
Input low voltage during programming or verify
Input high voltage during programming or verify
Input current when applying VILP to P1[0] or
P1[1] during programming or verify
IIHP
Input current when applying VIHP to P1[0] or
P1[1] during programming or verify
VOLV
Output low voltage during programming or
verify
VOHV
Output high voltage during programming or
verify
FlashENPB Flash endurance (per block)[26]
FlashENT
FlashDR
Flash endurance (total)[27]
Flash data retention
3
–
–
2.1
–
15
–
–
–
30
0.8
–
0.2
mA
V
V
mA
–
–
1.5
mA
–
–
VSS + 0.75
V
VDD – 1.0
–
VDD
V
50,000
–
–
–
1,800,000
10
–
–
–
–
–
Years
Notes
This specification applies
to the functional requirements of external
programmer tools
This specification applies
to the functional requirements of external
programmer tools
This specification applies
to the functional requirements of external
programmer tools
This specification applies
to this device when it is
executing internal flash
writes
Driving internal pull-down
resistor.
Driving internal pull-down
resistor.
Erase/write cycles per
block.
Erase/write cycles.
11.3.11 DC I2C Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to 5.25 V
and –40 °C TA 85 °C, or 3.0 V to 3.6 V and –40 °C TA 85 °C, respectively. Typical parameters are measured at 5 V and 3.3 V
at 25 °C and are for design guidance only.
Table 24. DC I2C Specifications[28]
Symbol
VILI2C
Description
Input low level
VIHI2C
Input high level
Document Number: 38-12018 Rev. AL
Min
–
–
0.7 × VDD
Typ
–
–
–
Max
0.3 × VDD
0.25 × VDD
–
Units
V
V
V
Notes
3.0 V VDD 3.6 V
4.75 V VDD 5.25 V
3.0 V VDD 5.25 V
Page 40 of 73
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11.4 AC Electrical Characteristics
11.4.1 AC Chip-Level Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to 5.25 V
and –40 C TA 85 C, or 3.0 V to 3.6 V and –40 C TA 85 C, respectively. Typical parameters are measured at 5 V and
3.3 V at 25 C and are for design guidance only.
Table 25. AC Chip Level Specifications
Symbol
FIMO245V
FIMO243V
FIMOUSB5V
FIMOUSB3V
FCPU1
FCPU2
FBLK5
FBLK3
F32K1
F32K_U
Description
Internal main oscillator frequency for 24 MHz
(5 V)
Internal main oscillator frequency for 24 MHz
(3.3 V)
Internal main oscillator frequency with USB
(5 V)
Frequency locking enabled and USB traffic
present.
Internal main oscillator frequency with USB
(3.3 V)
Frequency locking enabled and USB traffic
present.
CPU frequency (5 V nominal)
CPU frequency (3.3 V nominal)
Digital PSoC block frequency (5 V nominal)
Digital PSoC block frequency (3.3 V
nominal)
Internal low speed oscillator frequency
Internal low speed oscillator untrimmed
frequency
tXRST
DC24M
DCILO
Step24M
Fout48M
External reset pulse width
24 MHz duty cycle
Internal low speed oscillator duty cycle
24 MHz trim step size
48 MHz output frequency
FMAX
Maximum frequency of signal on row input
or row output.
Power supply slew rate
SRPOW-
Min
23.04
Typ
24
Max
24.96[29]
Units
Notes
MHz Trimmed for 5 V operation using
factory trim values.
MHz Trimmed for 3.3 V operation using
factory trim values.
MHz –10 °C TA 85 °C
4.35 VDD 5.15
22.08
24
25.92[30]
23.94
24
24.06
23.94
24
24.06
0.093
0.086
0
24
12
48
24.96[29]
12.96[30]
49.92[29,31]
0
24
25.92[31]
15
5
32
–
64
100
10
40
20
–
46.08
–
50
50
50
48.0
–
60
80
–
49.92[29,30]
–
–
12.96
µs
%
%
kHz
MHz Trimmed. Utilizing factory trim
values.
MHz
–
–
250
V/ms VDD slew rate during power-up.
MHz –0 °C TA 70 °C
3.15 VDD 3.45
MHz SLIMO Mode = 0.
MHz SLIMO Mode = 0.
MHz Refer to the AC digital block
Specifications.
MHz
kHz
kHz
After a reset and before the M8C
starts to run, the ILO is not
trimmed. See the System Resets
section of the PSoC Technical
Reference Manual for details on
this timing
ER_UP
Notes
26. The 50,000 cycle flash endurance per block is only guaranteed if the flash is operating within one voltage range. Voltage ranges are 3.0 V to 3.6 V and 4.75 V to 5.25 V.
27. A maximum of 36 × 50,000 block endurance cycles is allowed. This may be balanced between operations on 36 × 1 blocks of 50,000 maximum cycles each,
36 × 2 blocks of 25,000 maximum cycles each, or 36 × 4 blocks of 12,500 maximum cycles each (to limit the total number of cycles to 36 × 50,000 and ensure that
no single block ever sees more than 50,000 cycles).
For the full industrial range, the user must employ a temperature sensor user module (FlashTemp) and feed the result to the temperature argument before writing.
See the Flash APIs application note Design Aids – Reading and Writing PSoC® Flash – AN2015 for more information.
28. All GPIOs meet the DC GPIO VIL and VIH specifications found in the DC GPIO Specifications sections. The I2C GPIO pins also meet the mentioned specifications.
Document Number: 38-12018 Rev. AL
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Table 25. AC Chip Level Specifications (continued)
Symbol
tPOWERUP
Description
Time from end of POR to CPU executing
code
tjit_IMO[32]
24 MHz IMO cycle-to-cycle jitter (RMS)
24 MHz IMO long term N cycle-to-cycle jitter
(RMS)
24 MHz IMO period jitter (RMS)
Min
–
Typ
16
Max
100
–
–
200
900
1200
6000
–
200
900
Units
Notes
ms Power-up from 0 V. See the
System Resets section of the
PSoC Technical Reference
Manual.
ps
ps N=32
ps
11.4.2 AC GPIO Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to 5.25 V
and –40 °C TA 85 °C, or 3.0 V to 3.6 V and –40 °C TA 85 °C, respectively. Typical parameters are measured at 5 V and
3.3 V at 25 °C and are for design guidance only.
Table 26. AC GPIO Specifications
Symbol
FGPIO
tRiseF
Description
GPIO operating frequency
Rise time, normal strong mode, Cload = 50 pF
Min
0
3
Typ
–
–
Max
12
18
Units
MHz
ns
tFallF
Fall time, normal strong mode, Cload = 50 pF
2
–
18
ns
tRiseS
Rise time, slow strong mode, Cload = 50 pF
10
27
–
ns
tFallS
Fall time, slow strong mode, Cload = 50 pF
10
22
–
ns
Notes
Normal strong mode
VDD = 4.5 to 5.25 V,
10% to 90%
VDD = 4.5 to 5.25 V,
10% to 90%
VDD = 3 to 5.25 V,
10% to 90%
VDD = 3 to 5.25 V,
10% to 90%
Figure 12. GPIO Timing Diagram
90%
G PIO
Pin
O utput
Voltage
10%
TRiseF
TRiseS
TFallF
TFallS
Notes
29. 4.75 V < VDD < 5.25 V.
30. 3.0 V < VDD < 3.6 V. See application note Adjusting PSoC® Trims for 3.3 V and 2.7 V Operation – AN2012 for information on trimming for operation at 3.3 V.
31. See the individual user module datasheets for information on maximum frequencies for user modules.
32. Refer to Cypress Jitter Specifications application note, Understanding Datasheet Jitter Specifications for Cypress Timing Products – AN5054 for more information.
Document Number: 38-12018 Rev. AL
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11.4.3 AC Full Speed USB Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to 5.25 V
and –10 °C TA 85 °C, or 3.0 V to 3.6 V and –10 °C TA 85 °C, respectively. Typical parameters are measured at 5 V and
3.3 V at 25 °C and are for design guidance only.
Table 27. AC Full Speed (12 Mbps) USB Specifications
Symbol
tRFS
tFSS
tRFMFS
tDRATEFS
Description
Transition rise time
Transition fall time
Rise/fall time matching: (tR/tF)
Full speed data rate
Document Number: 38-12018 Rev. AL
Min
4
4
90
12 – 0.25%
Typ
–
–
–
12
Max
20
20
111
12 + 0.25%
Units
ns
ns
%
Mbps
Notes
For 50 pF load
For 50 pF load
For 50 pF load
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11.4.4 AC Operational Amplifier Specifications
The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to 5.25 V
and –40 °C TA 85 °C, or 3.0 V to 3.6 V and –40 °C TA 85 °C, respectively. Typical parameters are measured at 5 V and
3.3 V at 25 °C and are for design guidance only.
Settling times, slew rates, and gain bandwidth are based on the analog continuous time PSoC block.
Power = high and Opamp bias = high is not supported at 3.3 V.
Table 28. 5-V AC Operational Amplifier Specifications
Symbol
tROA
tSOA
SRROA
SRFOA
BWOA
ENOA
Description
Rising settling time from 80% of V to 0.1% of V
(10 pF load, unity gain)
Power = low, Opamp bias = low
Power = medium, Opamp bias = high
Power = high, Opamp bias = high
Falling settling time from 20% of V to 0.1% of V
(10 pF load, unity gain)
Power = low, Opamp bias = low
Power = medium, Opamp bias = high
Power = high, Opamp bias = high
Rising slew rate (20% to 80%)(10 pF load, unity gain)
Power = low, Opamp bias = low
Power = medium, Opamp bias = high
Power = high, Opamp bias = high
Falling slew rate (20% to 80%)(10 pF load, unity gain)
Power = low, Opamp bias = low
Power = medium, Opamp bias = high
Power = high, Opamp bias = high
Gain bandwidth product
Power = low, Opamp bias = low
Power = medium, Opamp bias = high
Power = high, Opamp bias = high
Noise at 1 kHz (Power = medium, Opamp bias = high)
Min
Typ
Max
Units
–
–
–
–
–
–
3.9
0.72
0.62
µs
µs
µs
–
–
–
–
–
–
5.9
0.92
0.72
µs
µs
µs
0.15
1.7
6.5
–
–
–
–
–
–
V/µs
V/µs
V/µs
0.01
0.5
4.0
–
–
–
–
–
–
V/µs
V/µs
V/µs
0.75
3.1
5.4
–
–
–
–
100
–
–
–
–
MHz
MHz
MHz
nV/rt-Hz
Min
Typ
Max
Units
–
–
–
–
3.92
0.72
µs
µs
–
–
–
–
5.41
0.72
µs
µs
0.31
2.7
–
–
–
–
V/µs
V/µs
0.24
1.8
–
–
–
–
V/µs
V/µs
0.67
2.8
–
–
–
100
–
–
–
MHz
MHz
nV/rt-Hz
Table 29. 3.3-V AC Operational Amplifier Specifications
Symbol
tROA
tSOA
SRROA
SRFOA
BWOA
ENOA
Description
Rising settling time from 80% of V to 0.1% of V
(10 pF load, unity gain)
Power = low, Opamp bias = low
Power = medium, Opamp bias = high
Falling settling time from 20% of V to 0.1% of V
(10 pF load, unity gain)
Power = low, Opamp bias = low
Power = medium, Opamp bias = high
Rising slew rate (20% to 80%)(10 pF load, unity gain)
Power = low, Opamp bias = low
Power = medium, Opamp bias = high
Falling slew rate (20% to 80%)(10 pF load, Unity Gain)
Power = low, Opamp bias = low
Power = medium, Opamp bias = high
Gain bandwidth product
Power = low, Opamp bias = low
Power = medium, Opamp bias = high
Noise at 1 kHz (Power = medium, Opamp bias = high)
Document Number: 38-12018 Rev. AL
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When bypassed by a capacitor on P2[4], the noise of the analog ground signal distributed to each block is reduced by a factor of up
to 5 (14 dB). This is at frequencies above the corner frequency defined by the on-chip 8.1 K resistance and the external capacitor.
Figure 13. Typical AGND Noise with P2[4] Bypass
nV/rtHz
10000
0
0.01
0.1
1.0
10
1000
100
0.001
0.01
0.1 Freq (kHz)
1
10
100
At low frequencies, the opamp noise is proportional to 1/f, power independent, and determined by device geometry. At high
frequencies, increased power level reduces the noise spectrum level.
Figure 14. Typical Opamp Noise
nV/rtHz
10000
PH_BH
PH_BL
PM_BL
PL_BL
1000
100
10
0.001
Document Number: 38-12018 Rev. AL
0.01
0.1
Freq ( k Hz )
1
10
100
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11.4.5 AC Low Power Comparator Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to 5.25 V
and –40 °C TA 85 °C or 3.0 V to 3.6 V and –40 °C TA 85 °C, respectively. Typical parameters are measured at 5 V at 25 °C
and are for design guidance only.
Table 30. AC Low Power Comparator Specifications
Symbol
tRLPC
Description
LPC response time
Min
–
Typ
–
Max
50
Units
µs
Notes
50 mV overdrive comparator
reference set within VREFLPC.
11.4.6 AC Digital Block Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to 5.25 V
and –40 °C TA 85 °C, or 3.0 V to 3.6 V and –40 °C TA 85 °C, respectively. Typical parameters apply to 5 V and 3.3 V at 25 °C
and are for design guidance only.
Table 31. AC Digital Block Specifications
Function
All
functions
Description
Block input clock frequency
VDD 4.75 V
Min
Typ
Max
Unit
–
–
MHz
–
–
49.9
2
25.9
2
Input clock frequency
No capture, VDD 4.75 V
–
–
MHz
No capture, VDD < 4.75 V
–
–
With capture
–
–
Capture pulse width
Input clock frequency
No enable input, VDD 4.75
V
No enable input, VDD < 4.75
V
With enable input
50[33]
–
49.9
2
25.9
2
25.9
2
–
–
–
MHz
–
–
–
–
Enable input pulse width
Kill pulse width
50[33]
–
49.9
2
25.9
2
25.9
2
–
Asynchronous restart mode
Synchronous restart mode
Disable mode
Input clock frequency
VDD 4.75 V
20
50[33]
50[33]
–
–
–
–
–
–
ns
ns
ns
–
–
MHz
–
–
49.9
2
25.9
2
VDD < 4.75 V
Timer
Counter
VDD < 4.75 V
Notes
MHz
MHz
MHz
ns
MHz
MHz
ns
MHz
Note
33. 50 ns minimum input pulse width is based on the input synchronizers running at 24 MHz (42 ns nominal period).
Document Number: 38-12018 Rev. AL
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Table 31. AC Digital Block Specifications (continued)
Function
CRCPRS
(PRS
Mode)
Description
Input clock frequency
VDD 4.75 V
Min
Typ
Max
Unit
–
–
MHz
–
–
Input clock frequency
–
–
49.9
2
25.9
2
24.6
MHz
Input clock frequency
–
–
8.2
MHz
–
50[33]
–
–
4.1
–
MHz
ns
–
–
MHz
–
–
–
–
49.9
2
24.6
24.6
VDD < 4.75 V
CRCPRS
(CRC
Mode)
SPIM
SPIS
Transmitter
Receiver
Input clock (SCLK) frequency
Width of SS_negated between
transmissions
Input clock frequency
VDD 4.75 V, 2 stop bits
VDD 4.75 V, 1 stop bit
VDD < 4.75 V
Input clock frequency
VDD 4.75 V, 2 stop bits
VDD 4.75 V, 1 stop bit
VDD < 4.75 V
–
–
–
–
–
–
Notes
MHz
The SPI serial clock (SCLK) frequency is equal
to the input clock frequency divided by 2.
The input clock is the SPI SCLK in SPIS mode.
The baud rate is equal to the input clock
frequency divided by 8.
MHz
MHz
49.9
2
24.6
24.6
The baud rate is equal to the input clock
frequency divided by 8.
MHz
MHz
MHz
11.4.7 AC External Clock Specifications
The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to 5.25 V
and –40 °C TA 85 °C, or 3.0 V to 3.6 V and –40 °C TA 85 °C, respectively. Typical parameters are measured at 5 V and 3.3 V
at 25 °C and are for design guidance only.
Table 32. AC External Clock Specifications
Symbol
Description
FOSCEXT Frequency for USB applications
Min
Typ
Max
Units
23.94
24
24.06
MHz
–
Duty cycle
47
50
53
%
–
Power-up to IMO switch
150
–
–
µs
Document Number: 38-12018 Rev. AL
Notes
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11.4.8 AC Analog Output Buffer Specifications
The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to 5.25 V
and –40 °C TA 85 °C, or 3.0 V to 3.6 V and –40 °C TA 85 °C, respectively. Typical parameters are measured at 5 V and 3.3 V
at 25 °C and are for design guidance only.
Table 33. 5-V AC Analog Output Buffer Specifications
Symbol
Description
tROB
Rising settling time to 0.1%, 1 V Step, 100 pF load
Power = low
Power = high
tSOB
Falling settling time to 0.1%, 1 V Step, 100 pF load
Power = low
Power = high
SRROB
Rising slew rate (20% to 80%), 1 V Step, 100 pF load
Power = low
Power = high
SRFOB
Falling slew rate (80% to 20%), 1 V Step, 100 pF load
Power = low
Power = high
BWOBSS Small signal bandwidth, 20 mVpp, 3 dB BW, 100 pF load
Power = low
Power = high
BWOBLS Large signal bandwidth, 1 Vpp, 3 dB BW, 100 pF load
Power = low
Power = high
Min
Typ
Max
Units
–
–
–
–
2.5
2.5
µs
µs
–
–
–
–
2.2
2.2
µs
µs
0.65
0.65
–
–
–
–
V/µs
V/µs
0.65
0.65
–
–
–
–
V/µs
V/µs
0.8
0.8
–
–
–
–
MHz
MHz
300
300
–
–
–
–
kHz
kHz
Min
Typ
Max
Units
–
–
–
–
3.8
3.8
µs
µs
–
–
–
–
2.6
2.6
µs
µs
0.5
0.5
–
–
–
–
V/µs
V/µs
0.5
0.5
–
–
–
–
V/µs
V/µs
0.7
0.7
–
–
–
–
MHz
MHz
200
200
–
–
–
–
kHz
kHz
Notes
Table 34. 3.3-V AC Analog Output Buffer Specifications
Symbol
Description
tROB
Rising settling time to 0.1%, 1 V Step, 100 pF load
Power = low
Power = high
tSOB
Falling settling time to 0.1%, 1 V Step, 100 pF load
Power = low
Power = high
SRROB
Rising slew rate (20% to 80%), 1 V Step, 100 pF load
Power = low
Power = high
SRFOB
Falling slew rate (80% to 20%), 1 V Step, 100 pF load
Power = low
Power = high
BWOBSS Small signal bandwidth, 20 mVpp, 3dB BW, 100 pF load
Power = low
Power = high
BWOBLS Large signal bandwidth, 1 Vpp, 3dB BW, 100 pF load
Power = low
Power = high
Document Number: 38-12018 Rev. AL
Notes
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11.4.9 AC Programming Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to 5.25 V
and –40 °C TA 85 °C, or 3.0 V to 3.6 V and –40 °C TA 85 °C, respectively. Typical parameters are measured at to 5 V and
3.3 V at 25 °C and are for design guidance only.
Table 35. AC Programming Specifications
Symbol
Description
Min
Typ
Max
Units
Notes
tRSCLK
Rise time of SCLK
1
–
20
ns
tFSCLK
Fall time of SCLK
1
–
20
ns
tSSCLK
Data setup time to falling edge of SCLK
40
–
–
ns
tHSCLK
Data hold time from falling edge of SCLK
40
–
–
ns
FSCLK
Frequency of SCLK
0
–
8
MHz
tERASEB
Flash erase time (block)
–
10
–
ms
tWRITE
Flash block write time
–
40
–
ms
tDSCLK
Data out delay from falling edge of SCLK
–
–
45
ns
VDD 3.6
tDSCLK3
Data out delay from falling edge of SCLK
–
–
50
ns
3.0 VDD 3.6
tERASEALL
Flash erase time (bulk)
–
40
–
ms
Erase all blocks and
protection fields at once
tPROGRAM_HOT
Flash block erase + flash block write time
–
–
100[34]
ms
0 °C Tj 100 C
–
200[34]
ms
–40 °C Tj 0 C
tPROGRAM_COLD Flash block erase + flash block write time
–
Note
34. For the full industrial range, the user must employ a temperature sensor user module (FlashTemp) and feed the result to the temperature argument before writing.
See the Flash APIs application note Design Aids – Reading and Writing PSoC® Flash – AN2015 for more information.
Document Number: 38-12018 Rev. AL
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11.4.10 AC I2C Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to 5.25 V
and –40 °C TA 85 °C, or 3.0 V to 3.6 V and –40 °C TA 85 °C, respectively. Typical parameters are measured at 5 V and 3.3 V
at 25 °C and are for design guidance only.
Table 36. AC Characteristics of the I2C SDA and SCL Pins for VDD
Symbol
Description
FSCLI2C
tHDSTAI2C
SCL clock frequency
Hold time (repeated) start condition. After this
period, the first clock pulse is generated
Low period of the SCL clock
High period of the SCL clock
Setup time for a repeated start condition
Data hold time
Data setup time
Setup time for stop condition
Bus free time between a stop and start
condition
Pulse width of spikes suppressed by the input
filter
tLOWI2C
tHIGHI2C
tSUSTAI2C
tHDDATI2C
tSUDATI2C
tSUSTOI2C
tBUFI2C
tSPI2C
Standard Mode
Min
Max
0
100
4.0
–
Fast Mode
Min
Max
0
400
0.6
–
Units
Notes
kHz
µs
4.7
4.0
4.7
0
250
4.0
4.7
–
–
–
–
–
–
–
1.3
0.6
0.6
0
100[35]
0.6
1.3
–
–
–
–
–
–
–
µs
µs
µs
µs
ns
µs
µs
–
–
0
50
ns
Figure 15. Definition for Timing for Fast/Standard Mode on the I2C Bus
I2C_SDA
TSUDATI2C
THDSTAI2C
TSPI2C
THDDATI2CTSUSTAI2C
TBUFI2C
I2C_SCL
THIGHI2C TLOWI2C
S
START Condition
TSUSTOI2C
Sr
Repeated START Condition
P
S
STOP Condition
Note
35. A fast-mode I2C-bus device can be used in a standard-mode I2C-bus system, but the requirement tSU;DAT 250 ns it must meet. This automatically is the case if the
device does not stretch the LOW period of the SCL signal. If the device does stretch the LOW period of the SCL signal, it must output the next data bit to the SDA line
trmax + tSU;DAT = 1000 + 250 = 1250 ns (according to the Standard-Mode I2C-bus specification) before the SCL line is released.
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11.5 Thermal Impedance
Table 37. Thermal Impedances per Package
Package
56-Pin QFN[37]
68-Pin QFN[37]
100-Ball VFBGA
100-Pin TQFP
Typical JA [36]
12.93 °C/W
13.05 °C/W
65 °C/W
51 °C/W
11.6 Solder Reflow Peak Specifications
Table 38 shows the solder reflow temperature limits that must not be exceeded.
Table 38. Solder Reflow Specifications
Package
56-Pin QFN
68-Pin QFN
100-Ball VFBGA
100-Pin TQFP
Maximum Peak
Temperature (TC)
260 °C
260 °C
260 °C
260 °C
Maximum Time
above TC – 5 °C
30 seconds
30 seconds
30 seconds
30 seconds
Notes
36. TJ = TA + POWER × JA.
37. To achieve the thermal impedance specified for the QFN package, see the Application Notes for Surface Mount Assembly of Amkor's MicroLeadFrame (MLF) Packages
available at http://www.amkor.com.
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12. Development Tool Selection
12.1 Software
■
28-Pin CY8C27443-24PXI PDIP PSoC device sample
12.1.1 PSoC Designer
■
PSoC Designer software CD
At the core of the PSoC development software suite is
PSoC Designer, used to generate PSoC firmware applications.
PSoC Designer is available free of charge at
http://www.cypress.com and includes a free C compiler.
■
Getting Started guide
■
USB 2.0 cable
12.1.2 PSoC Programmer
Flexible enough to be used on the bench in development, yet
suitable for factory programming, PSoC Programmer works
either as a standalone programming application or it can operate
directly from PSoC Designer. PSoC Programmer software is
compatible with both PSoC ICE-Cube in-circuit emulator and
PSoC MiniProg. PSoC programmer is available free of charge at
http://www.cypress.com.
12.3.2 CY3210-PSoCEval1
The CY3210-PSoCEval1 kit features an evaluation board and
the MiniProg1 programming unit. The evaluation board includes
an LCD module, potentiometer, LEDs, and plenty of breadboarding space to meet all of your evaluation needs. The kit
includes:
■
Evaluation board with LCD module
■
MiniProg programming unit
12.2 Development Kits
■
28-Pin CY8C29466-24PXI PDIP PSoC device sample (2)
All development kits can be purchased from the Cypress Online
Store.
■
PSoC Designer software CD
■
Getting Started guide
12.2.1 CY3215-DK Basic Development Kit
■
USB 2.0 cable
The CY3215-DK is for prototyping and development with
PSoC Designer. This kit supports in-circuit emulation, and the
software interface enables you to run, halt, and single step the
processor, and view the content of specific memory locations.
Advance emulation features are also supported through PSoC
Designer. The kit includes:
12.3.3 CY3214-PSoCEvalUSB
The CY3214-PSoCEvalUSB evaluation kit features a development board for the CY8C24794-24LTXI PSoC device. The
board supports both USB and capacitive sensing development
and debugging support. This evaluation board also includes an
LCD module, potentiometer, LEDs, an enunciator and plenty of
breadboarding space to meet all of your evaluation needs. The
kit includes:
■
PSoC Designer software CD
■
ICE-Cube in-circuit Emulator
■
ICE Flex-Pod for CY8C29x66 family
■
PSoCEvalUSB board
■
Cat-5 adapter
■
LCD module
■
MiniEval programming board
■
MIniProg programming unit
■
110 ~ 240 V power supply, Euro-Plug adapter
■
Mini USB cable
■
iMAGEcraft C compiler (registration required)
■
PSoC Designer and Example Projects CD
■
ISSP cable
■
Getting Started guide
■
USB 2.0 cable and Blue Cat-5 cable
■
Wire pack
■
Two CY8C29466-24PXI 28-PDIP chip samples
12.4 Device Programmers
12.3 Evaluation Tools
All evaluation tools can be purchased from the Cypress Online
Store.
12.3.1 CY3210-MiniProg1
The CY3210-MiniProg1 kit enables you to program PSoC
devices via the MiniProg1 programming unit. The MiniProg is a
small, compact prototyping programmer that connects to the PC
via a provided USB 2.0 cable. The kit includes:
All device programmers can be purchased from the Cypress
Online Store.
12.4.1 CY3216 Modular Programmer
The CY3216 Modular Programmer kit features a modular
programmer and the MiniProg1 programming unit. The modular
programmer includes three programming module cards and
supports multiple Cypress products. The kit includes:
■
Modular programmer base
■
MiniProg programming unit
■
Three programming module cards
■
MiniEval socket programming and evaluation board
■
MiniProg programming unit
■
28-Pin CY8C29466-24PXI PDIP PSoC device sample
■
PSoC Designer software CD
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■
Getting Started guide
■
CY3207 programmer unit
■
USB 2.0 cable
■
PSoC ISSP software CD
12.4.2 CY3207ISSP In-System Serial Programmer (ISSP)
■
110 ~ 240 V power supply, Euro-Plug adapter
The CY3207ISSP is a production programmer. It includes
protection circuitry and an industrial case that is more robust than
the MiniProg in a production-programming environment.
■
USB 2.0 cable
Note: CY3207ISSP needs special software and is not
compatible with PSoC Programmer. The kit includes:
12.5 Accessories (Emulation and Programming)
Table 39. Emulation and Programming Accessories
Part #
CY8C24794-24LQXI
Pin Package
56-pin QFN
Flex-Pod Kit[38]
CY3250-24X94QFN
Foot Kit[39]
None
Adapter[40]
Adapters can be found at
http://www.emulation.com.
Notes
38. Flex-Pod kit includes a practice flex-pod and a practice PCB, in addition to two flex-pods.
39. Foot kit includes surface mount feet that are soldered to the target PCB.
40. Programming adapter converts non-DIP package to DIP footprint. Specific details and ordering information for each of the adapters are found at
http://www.emulation.com.
Document Number: 38-12018 Rev. AL
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13. Ordering Information
Analog Blocks
Digital I/O Pins
Analog Inputs
Analog Outputs
XRES Pin
–40 C to +85 C 4
–40 °C to +85 °C 4
–40 °C to +85 °C 4
6
6
6
56
50
50
48
48
48
2
2
2
Yes
No
No
001-53450 CY8C24794-24LTXI
16 K
1K
–40 C to +85 C 4
6
50
48
2
No
16 K
1K
–40 C to +85 C 4
6
50
48
2
No
16 K
1K
–40 C to +85 C 4
6
49
47
2
Yes
16 K
1K
–40 C to +85 C 4
6
49
47
2
Yes
16 K
1K
–40 C to +85 C 4
6
56
48
2
Yes
16 K
1K
–40 C to +85 C 4
6
56
48
2
Yes
CY8C24794-24LTXIT
001-53450 CY8C24894-24LTXI
CY8C24894-24LTXIT
001-09618 CY8C24994-24LTXI
CY8C24994-24LTXIT
Digital Blocks
1K
1K
1K
Temperature
Range
SRAM
(Bytes)
16 K
16 K
16 K
Package
100-pin OCD TQFP[41]
56-pin (7 × 7 mm) QFN
56-pin (7 × 7 mm) QFN
(Tape and Reel)
56-pin (8 × 8 mm) QFN
(Sawn)
56-pin (8 × 8 mm) QFN
(Sawn) (Tape and Reel)
56-pin (8 × 8 mm) QFN
(Sawn)
56-pin (8 × 8 mm) QFN
(Sawn) (Tape and Reel)
68-pin (8 × 8 mm) QFN
(Sawn)
68-pin QFN (8 × 8 mm)
(Sawn) (Tape and Reel)
Ordering
Code
51-85048 CY8C24094-24AXI
001-58740 CY8C24794-24LQXI
CY8C24794-24LQXIT
Package
diagram
Flash
(Bytes)
Table 40. CY8C24x94 PSoC Device’s Key Features and Ordering Information
Note For die sales information, contact a local Cypress sales office or Field Applications Engineer (FAE).
13.1 Ordering Code Definitions
CY 8 C 24 XXX SP XXT
Package Type: T = Tape and Reel
PX = PDIP Pb-free
SX = SOIC Pb-free
PVX = SSOP Pb-free
LFX = QFN (punched, 8 × 8 mm), Pb-free
LTX = QFN (sawn, 8 × 8 mm), Pb-free
LQX = QFN (sawn, 7 × 7 mm), Pb-free
AX = TQFP Pb-free
BVX = VFBGA Pb-free
Speed: 24 MHz
Thermal Rating:
C = Commercial
I = Industrial
E = Extended
Part Number
Family Code
Technology Code: C = CMOS
Marketing Code: 8 = PSoC
Company ID: CY = Cypress
Note
41. This part may be used for in-circuit debugging. It is NOT available for production.
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14. Packaging Dimensions
This section illustrates the package specification for the CY8C24x94 PSoC devices, along with the thermal impedance for the package
and solder reflow peak temperatures.
Important Note Emulation tools may require a larger area on the target PCB than the chip's footprint. For a detailed description of
the emulation tools' dimensions, refer to the emulator pod dimension drawings at http://www.cypress.com/design/MR10161.
Figure 16. 56-pin QFN (7 × 7 × 0.6 mm) LR56A/LQ56A 5.6 × 5.6 E-Pad (Sawn) Package Outline, 001-58740
TOP VIEW
SIDE VIEW
BOTTOM VIEW
NOTES:
1.
HATCH AREA IS SOLDERABLE EXPOSED PAD
2. BASED ON REF JEDEC # MO-248
3. ALL DIMENSIONS ARE IN MILLIMETERS
001-58740 *C
001-58740 *B
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Figure 17. 56-pin QFN (8 × 8 × 1.0 mm) LF56A/LY56A 4.5 × 5.21 E-Pad (Subcon Punch Type Pkg.) Package Outline, 001-12921
001-12921 *C
Figure 18. 56-pin QFN (8 × 8 × 1.0 mm) LT56B 4.5 × 5.2 E-Pad (Sawn) Package Outline, 001-53450
001-53450 *D
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Figure 19. 68-pin QFN (8 × 8 × 1.0 mm) LT68 5.7 × 5.7 E-Pad (Sawn Type) Package Outline, 001-09618
001-09618 *E
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Figure 20. 100-ball VFBGA (6 × 6 × 1.0 mm) BZ100 Package Outline, 51-85209
51-85209 *F
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Figure 21. 100-pin TQFP (14 × 14 × 1.4 mm) A100SA Package Outline, 51-85048
51-85048 *J
Important Note
■
For information on the preferred dimensions for mounting QFN packages, see the Application Note, Application Notes for Surface
Mount Assembly of Amkor's MicroLeadFrame (MLF) Packages available at http://www.amkor.com.
■
Pinned vias for thermal conduction are not required for the low power PSoC device.
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15. Acronyms
15.1 Acronyms Used
The following table lists the acronyms that are used in this document.
Acronym
Description
Acronym
Description
AC
alternating current
MIPS
million instructions per second
ADC
analog-to-digital converter
OCD
on-chip debug
API
application programming interface
PCB
printed circuit board
CMOS
complementary metal oxide semiconductor
PDIP
plastic dual-in-line package
CPU
central processing unit
PGA
programmable gain amplifier
CRC
cyclic redundancy check
POR
power-on reset
CT
continuous time
PPOR
precision power-on reset
DAC
digital-to-analog converter
PRS
pseudo-random sequence
DC
direct current
PSoC®
Programmable System-on-Chip™
DTMF
dual-tone multi-frequency
PWM
pulse-width modulator
EEPROM electrically erasable programmable read-only
memory
QFN
quad flat no leads
GPIO
general purpose I/O
SAR
successive approximation register
ICE
in-circuit emulator
SC
switched capacitor
IDE
integrated development environment
SLIMO
slow IMO
ILO
internal low-speed oscillator
SOIC
small-outline integrated circuit
IMO
internal main oscillator
SPI™
serial peripheral interface
I/O
input/output
SRAM
static random-access memory
IrDA
infrared data association
SROM
supervisory read-only memory
ISSP
In-System Serial Programming
TQFP
thin quad flat pack
LCD
liquid crystal display
UART
universal asynchronous receiver / transmitter
LED
light-emitting diode
USB
universal serial bus
LPC
low power comparator
VFBGA
very fine-pitch ball grid array
LVD
low-voltage detect
WDT
watchdog timer
MAC
multiply-accumulate
XRES
external reset
MCU
microcontroller unit
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16. Document Conventions
16.1 Units of Measure
Symbol
°C
dB
fF
kHz
k
MHz
A
s
V
mA
mm
ms
Unit of Measure
degree Celsius
decibels
femtofarad
kilohertz
kilohms
megahertz
microampere
microsecond
microvolt
milliampere
millimeter
millisecond
Symbol
mV
nA
ns
nV
pA
pF
ps
%
rt-Hz
V
W
Unit of Measure
millivolt
nanoampere
nanosecond
nanovolt
ohms
picoampere
picofarad
picosecond
percent
root hertz
volt
watt
16.2 Numeric Conventions
Hexadecimal numbers are represented with all letters in uppercase with an appended lowercase ‘h’ (for example, ‘14h’ or ‘3Ah’).
Hexadecimal numbers may also be represented by a ‘0x’ prefix, the C coding convention. Binary numbers have an appended
lowercase ‘b’ (for example, ‘01010100b’ or ‘01000011b’). Numbers not indicated by an ‘h’ or ‘b’ are decimal.
17. Glossary
active high
6. A logic signal having its asserted state as the logic 1 state.
7. A logic signal having the logic 1 state as the higher voltage of the two states.
analog blocks
The basic programmable opamp circuits. These are SC (switched capacitor) and CT (continuous time) blocks.
These blocks can be interconnected to provide ADCs, DACs, multi-pole filters, gain stages, and much more.
analog-to-digital
(ADC)
A device that changes an analog signal to a digital signal of corresponding magnitude. Typically, an ADC converts
a voltage to a digital number. The digital-to-analog (DAC) converter performs the reverse operation.
API (Application
Programming
Interface)
A series of software routines that comprise an interface between a computer application and lower level services
and functions (for example, user modules and libraries). APIs serve as building blocks for programmers that create
software applications.
asynchronous
A signal whose data is acknowledged or acted upon immediately, irrespective of any clock signal.
Bandgap
reference
A stable voltage reference design that matches the positive temperature coefficient of VT with the negative
temperature coefficient of VBE, to produce a zero temperature coefficient (ideally) reference.
bandwidth
1. The frequency range of a message or information processing system measured in hertz.
2. The width of the spectral region over which an amplifier (or absorber) has substantial gain (or loss); it is
sometimes represented more specifically as, for example, full width at half maximum.
bias
1. A systematic deviation of a value from a reference value.
2. The amount by which the average of a set of values departs from a reference value.
3. The electrical, mechanical, magnetic, or other force (field) applied to a device to establish a reference level to
operate the device.
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17. Glossary
(continued)
block
1. A functional unit that performs a single function, such as an oscillator.
2. A functional unit that may be configured to perform one of several functions, such as a digital PSoC block or
an analog PSoC block.
buffer
1. A storage area for data that is used to compensate for a speed difference, when transferring data from one
device to another. Usually refers to an area reserved for IO operations, into which data is read, or from which
data is written.
2. A portion of memory set aside to store data, often before it is sent to an external device or as it is received
from an external device.
3. An amplifier used to lower the output impedance of a system.
bus
1. A named connection of nets. Bundling nets together in a bus makes it easier to route nets with similar routing
patterns.
2. A set of signals performing a common function and carrying similar data. Typically represented using vector
notation; for example, address[7:0].
3. One or more conductors that serve as a common connection for a group of related devices.
clock
The device that generates a periodic signal with a fixed frequency and duty cycle. A clock is sometimes used to
synchronize different logic blocks.
comparator
An electronic circuit that produces an output voltage or current whenever two input levels simultaneously satisfy
predetermined amplitude requirements.
compiler
A program that translates a high level language, such as C, into machine language.
configuration
space
In PSoC devices, the register space accessed when the XIO bit, in the CPU_F register, is set to ‘1’.
crystal oscillator
An oscillator in which the frequency is controlled by a piezoelectric crystal. Typically a piezoelectric crystal is less
sensitive to ambient temperature than other circuit components.
cyclic redundancy A calculation used to detect errors in data communications, typically performed using a linear feedback shift
check (CRC)
register. Similar calculations may be used for a variety of other purposes such as data compression.
data bus
A bi-directional set of signals used by a computer to convey information from a memory location to the central
processing unit and vice versa. More generally, a set of signals used to convey data between digital functions.
debugger
A hardware and software system that allows the user to analyze the operation of the system under development.
A debugger usually allows the developer to step through the firmware one step at a time, set break points, and
analyze memory.
dead band
A period of time when neither of two or more signals are in their active state or in transition.
digital blocks
The 8-bit logic blocks that can act as a counter, timer, serial receiver, serial transmitter, CRC generator,
pseudo-random number generator, or SPI.
digital-to-analog
(DAC)
A device that changes a digital signal to an analog signal of corresponding magnitude. The analog-to-digital (ADC)
converter performs the reverse operation.
duty cycle
The relationship of a clock period high time to its low time, expressed as a percent.
emulator
Duplicates (provides an emulation of) the functions of one system with a different system, so that the second
system appears to behave like the first system.
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17. Glossary
(continued)
external reset
(XRES)
An active high signal that is driven into the PSoC device. It causes all operation of the CPU and blocks to stop
and return to a pre-defined state.
flash
An electrically programmable and erasable, non-volatile technology that provides users with the programmability
and data storage of EPROMs, plus in-system erasability. Non-volatile means that the data is retained when power
is off.
Flash block
The smallest amount of Flash ROM space that may be programmed at one time and the smallest amount of Flash
space that may be protected. A Flash block holds 64 bytes.
frequency
The number of cycles or events per unit of time, for a periodic function.
gain
The ratio of output current, voltage, or power to input current, voltage, or power, respectively. Gain is usually
expressed in dB.
I2C
A two-wire serial computer bus by Philips Semiconductors (now NXP Semiconductors). I2C is an Inter-Integrated
Circuit. It is used to connect low-speed peripherals in an embedded system. The original system was created in
the early 1980s as a battery control interface, but it was later used as a simple internal bus system for building
control electronics. I2C uses only two bi-directional pins, clock and data, both running at +5V and pulled high with
resistors. The bus operates at 100 kbits/second in standard mode and 400 kbits/second in fast mode.
ICE
The in-circuit emulator that allows users to test the project in a hardware environment, while viewing the debugging
device activity in a software environment (PSoC Designer).
input/output (I/O) A device that introduces data into or extracts data from a system.
interrupt
A suspension of a process, such as the execution of a computer program, caused by an event external to that
process, and performed in such a way that the process can be resumed.
interrupt service
routine (ISR)
A block of code that normal code execution is diverted to when the M8C receives a hardware interrupt. Many
interrupt sources may each exist with its own priority and individual ISR code block. Each ISR code block ends
with the RETI instruction, returning the device to the point in the program where it left normal program execution.
jitter
1. A misplacement of the timing of a transition from its ideal position. A typical form of corruption that occurs on
serial data streams.
2. The abrupt and unwanted variations of one or more signal characteristics, such as the interval between
successive pulses, the amplitude of successive cycles, or the frequency or phase of successive cycles.
low-voltage detect A circuit that senses VDD and provides an interrupt to the system when VDD falls lower than a selected threshold.
(LVD)
M8C
An 8-bit Harvard-architecture microprocessor. The microprocessor coordinates all activity inside a PSoC by
interfacing to the Flash, SRAM, and register space.
master device
A device that controls the timing for data exchanges between two devices. Or when devices are cascaded in
width, the master device is the one that controls the timing for data exchanges between the cascaded devices
and an external interface. The controlled device is called the slave device.
microcontroller
An integrated circuit chip that is designed primarily for control systems and products. In addition to a CPU, a
microcontroller typically includes memory, timing circuits, and IO circuitry. The reason for this is to permit the
realization of a controller with a minimal quantity of chips, thus achieving maximal possible miniaturization. This
in turn, reduces the volume and the cost of the controller. The microcontroller is normally not used for
general-purpose computation as is a microprocessor.
mixed-signal
The reference to a circuit containing both analog and digital techniques and components.
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17. Glossary
(continued)
modulator
A device that imposes a signal on a carrier.
noise
1. A disturbance that affects a signal and that may distort the information carried by the signal.
2. The random variations of one or more characteristics of any entity such as voltage, current, or data.
oscillator
A circuit that may be crystal controlled and is used to generate a clock frequency.
parity
A technique for testing transmitting data. Typically, a binary digit is added to the data to make the sum of all the
digits of the binary data either always even (even parity) or always odd (odd parity).
phase-locked
loop (PLL)
An electronic circuit that controls an oscillator so that it maintains a constant phase angle relative to a reference
signal.
pinouts
The pin number assignment: the relation between the logical inputs and outputs of the PSoC device and their
physical counterparts in the printed circuit board (PCB) package. Pinouts involve pin numbers as a link between
schematic and PCB design (both being computer generated files) and may also involve pin names.
port
A group of pins, usually eight.
power on reset
(POR)
A circuit that forces the PSoC device to reset when the voltage is lower than a pre-set level. This is one type of
hardware reset.
PSoC®
Cypress Semiconductor’s PSoC® is a registered trademark and Programmable System-on-Chip™ is a trademark
of Cypress.
PSoC Designer™ The software for Cypress’ Programmable System-on-Chip technology.
pulse width
An output in the form of duty cycle which varies as a function of the applied measurand
modulator (PWM)
RAM
An acronym for random access memory. A data-storage device from which data can be read out and new data
can be written in.
register
A storage device with a specific capacity, such as a bit or byte.
reset
A means of bringing a system back to a know state. See hardware reset and software reset.
ROM
An acronym for read only memory. A data-storage device from which data can be read out, but new data cannot
be written in.
serial
1. Pertaining to a process in which all events occur one after the other.
2. Pertaining to the sequential or consecutive occurrence of two or more related activities in a single device or
channel.
settling time
The time it takes for an output signal or value to stabilize after the input has changed from one value to another.
shift register
A memory storage device that sequentially shifts a word either left or right to output a stream of serial data.
slave device
A device that allows another device to control the timing for data exchanges between two devices. Or when
devices are cascaded in width, the slave device is the one that allows another device to control the timing of data
exchanges between the cascaded devices and an external interface. The controlling device is called the master
device.
Document Number: 38-12018 Rev. AL
Page 64 of 73
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CY8C24894/CY8C24994
17. Glossary
(continued)
SRAM
An acronym for static random access memory. A memory device allowing users to store and retrieve data at a
high rate of speed. The term static is used because, after a value has been loaded into an SRAM cell, it remains
unchanged until it is explicitly altered or until power is removed from the device.
SROM
An acronym for supervisory read only memory. The SROM holds code that is used to boot the device, calibrate
circuitry, and perform Flash operations. The functions of the SROM may be accessed in normal user code,
operating from Flash.
stop bit
A signal following a character or block that prepares the receiving device to receive the next character or block.
synchronous
1. A signal whose data is not acknowledged or acted upon until the next active edge of a clock signal.
2. A system whose operation is synchronized by a clock signal.
tristate
A function whose output can adopt three states: 0, 1, and Z (high-impedance). The function does not drive any
value in the Z state and, in many respects, may be considered to be disconnected from the rest of the circuit,
allowing another output to drive the same net.
UART
A UART or universal asynchronous receiver-transmitter translates between parallel bits of data and serial bits.
user modules
Pre-build, pre-tested hardware/firmware peripheral functions that take care of managing and configuring the lower
level Analog and Digital PSoC Blocks. User Modules also provide high level API (Application Programming
Interface) for the peripheral function.
user space
The bank 0 space of the register map. The registers in this bank are more likely to be modified during normal
program execution and not just during initialization. Registers in bank 1 are most likely to be modified only during
the initialization phase of the program.
VDD
A name for a power net meaning "voltage drain." The most positive power supply signal. Usually 5 V or 3.3 V.
VSS
A name for a power net meaning "voltage source." The most negative power supply signal.
watchdog timer
A timer that must be serviced periodically. If it is not serviced, the CPU resets after a specified period of time.
Document Number: 38-12018 Rev. AL
Page 65 of 73
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CY8C24894/CY8C24994
18. Errata
This section describes the errata for the CY8C24x94 device. Details include errata trigger conditions, scope of impact, available
workaround, and silicon revision applicability. Contact your local Cypress Sales Representative if you have questions.
Part Numbers Affected
Part Number
CY8C24x94
CY8C24x94 Errata Summary
The following table defines the errata applicability to available devices.
Items
Part Number
1. The DP line of the USB interface may pulse low when the PSoC device wakes from sleep causing an
unexpected wake-up of the host computer.
CY8C24x94
2. Invalid Flash reads may occur if Vdd is pulled to -0.5 V just before power on.
CY8C24x94
3. PMA Index Register fails to auto-increment with CPU_Clock set to SysClk/1 (24 MHz).
CY8C24x94
4. The Internal Main Oscillator (IMO) frequency parameter (FIMO245V) may increase over a period of time during
usage in the field and exceed the maximum spec limit of 24.96 MHz.
CY8C24x94
1. The DP line of the USB interface may pulse low when the PSoC device wakes from sleep causing an unexpected wake-up
of the host computer.
■
PROBLEM DEFINITION
When the device is operating at 4.75 V to 5.25 V and the 3.3 V regulator is enabled, a short low pulse may be created on the DP
signal line during device wake-up. The 15-20 µs low pulse of the DP line may be interpreted by the host computer as a deattach
or the beginning of a wake-up.
■
TRIGGER CONDITION(S)
The bandgap reference voltage used by the 3.3 V regulator decreases during sleep due to leakage. Upon device wake up, the
bandgap is reenabled and after a delay for settling, the 3.3 V regulator is enabled. On some devices the 3.3 V regulator that is
used to generate the USB DP signal may be enabled before the bandgap is fully stabilized. This can cause a low pulse on the
regulator output and DP signal line until the bandgap stabilizes. In applications where Vdd is 3.3 V, the regulator is not used and
therefore the DP low pulse is not generated.
■
WORKAROUND
To prevent the DP signal from pulsing low, keep the bandgap enabled during sleep. The most efficient method is to set the No Buzz
bit in the OSC_CR0 register. The No Buzz bit keeps the bandgap powered and output stable during sleep. Setting the No Buzz bit
results in nominal 100 µA increase to sleep current. Leaving the analog reference block enabled during sleep also resolves this
issue because it forces the bandgap to remain enabled. An example for disabling the No Buzz bit is listed below.
Assembly
M8C_SetBank1
or
reg[OSC_CR0], 0x20
M8C_SetBank0
C
OSC_CR0 |= 0x20;
2. Invalid Flash reads may occur if Vdd is pulled to -0.5 V just before power on.
■
PROBLEM DEFINITION
When Vdd of the device is pulled below ground just before power on, the first read from each 8K Flash page may be corrupted.
This issue does not affect Flash page 0 because it is the selected page upon reset.
■
TRIGGER CONDITION(S)
Document Number: 38-12018 Rev. AL
Page 66 of 73
CY8C24094/CY8C24794
CY8C24894/CY8C24994
When Vdd is pulled below ground before power on, an internal Flash reference may deviate from its nominal voltage. The reference
deviation tends to result in the first Flash read from that page returning 0xFF. During the first read from each page, the reference
is reset resulting in all future reads returning the correct value. A short delay of 5 µs before the first real read provides time for the
reference voltage to stabilize.
■
WORKAROUND
To prevent an invalid Flash read, a dummy read from each Flash page must occur before use of the pages. A delay of 5 µs must
occur after the dummy read and before a real read. The dummy reads occurs as soon as possible and must be located in Flash
page 0 before a read from any other Flash page. An example for reading a byte of memory from each Flash page is listed below.
Placed it in boot.tpl and boot.asm immediately after the ‘start:’ label.
// dummy read from each 8K Flash page
// page 1
mov A, 0x20
// MSB
mov X, 0x00
// LSB
romx
// wait at least 5 µs
mov X, 14
loop1:
dec X
jnz loop1
Document Number: 38-12018 Rev. AL
Page 67 of 73
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CY8C24894/CY8C24994
3. PMA Index Register fails to auto-increment with CPU_Clock set to SysClk/1 (24 MHz).
■
PROBLEM DEFINITION
When the device is operating at 4.75 to 5.25 V and the CPU_Clock is set to SysClk/1 (24 MHz), the USB PMA Index Register may
fail to increment automatically when used in an OUT endpoint configuration at Full-Speed. When the application program attempts
to use the bReadOutEP() function the first byte in the PMA buffer is always returned.
■
TRIGGER CONDITION(S)
An internal flip-flop hold problem associated with Index Register increment function. All reads of the associated RAM originate from
the first byte. The hold problem has no impact on other circuits or functions within the device.
■
WORKAROUND
To make certain that the index register properly increments, set the CPU_Clock to SysClk/2 (12 MHz) during the read of the PMA
buffer. An example for the clock adjustment method is listed below.
PSoC Designer™ 4.3 User Module workaround: PSoC Designer Release 4.3 and subsequent releases includes a revised
full-speed USB User Module with the revised firmware work-around included (see example below).
;;
;; 24 MHz read PMA workaround
;;
M8C_SetBank1
mov A, reg[OSC_CR0]
push A
and A, 0xf8 ;clear the clock bits (briefly chg the cpu_clk to 3 MHz)
or A, 0x02 ;will set clk to 12Mhz
mov reg[OSC_CR0],A ;clk is now set at 12 MHz
M8C_SetBank0
.loop:
mov A, reg[PMA0_DR] ; Get the data from the PMA space
mov [X], A ; save it in data array
inc X ; increment the pointer
dec [USB_APITemp+1] ; decrement the counter
jnz .loop ; wait for count to zero out
;;
;; 24MHz read PMA workaround (back to previous clock speed)
;;
pop A ;recover previous reg[OSC_CR0] value
M8C_SetBank1
mov reg[OSC_CR0],A ;clk is now set at previous value
M8C_SetBank0
;;
;;
end 24Mhz read PMA workaround
Document Number: 38-12018 Rev. AL
Page 68 of 73
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CY8C24894/CY8C24994
4. The Internal Main Oscillator (IMO) frequency parameter (FIMO245V) may increase over a period of time during usage in
the field and exceed the maximum spec limit of 24.96 MHz.
■
PROBLEM DEFINITION
When the device has been operating at 4.75 V to 5.25 V for a cumulatively long duration in the field, the IMO Frequency may slowly
increase over the duration of usage in the field and eventually exceed the maximum spec limit of 24.96 MHz. This may affect
applications that are sensitive to the max value of IMO frequency, such as those using UART communication and result in a
functional failure.
■
TRIGGER CONDITION(S)
Very long (cumulative) usage of the device in the operating voltage range of 4.75V to 5.25V, with the IMO clock running
continuously, could lead to the degradation. Higher power supply voltage and lower ambient temperature are worst-case conditions
for the degradation.
■
WORKAROUND
Operating the device with the power supply voltage range of 3.0 V to 3.6 V, would avoid the degradation of IMO Frequency beyond
the max spec limit of 24.96 MHz.
■
FIX STATUS
A new revision of the silicon, with a fix for this issue, is expected to be available from August 1st 2015.
Document Number: 38-12018 Rev. AL
Page 69 of 73
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CY8C24894/CY8C24994
19. Document History Page
Document Title: CY8C24094/CY8C24794/CY8C24894/CY8C24994, PSoC® Programmable System-on-Chip™
Document Number: 38-12018
Revision
ECN
Orig. of
Change
Submission
Date
Description of Change
**
133189
NWJ
01/27/2004
*A
251672
SFV
See ECN
First Preliminary datasheet. Changed title to encompass only the CY8C24794
because the CY8C24494 and CY8C24694 are not being offered by Cypress.
*B
289742
HMT
See ECN
Add standard DS items from SFV memo. Add Analog Input Mux on pinouts. 2
MACs. Change 512 bytes of SRAM to 1 K. Add dimension key to package.
Remove HAPI. Update diagrams, registers and specs.
*C
335236
HMT
See ECN
Add CY logo. Update CY copyright. Update new CY.com URLs. Re-add ISSP
programming pinout notation. Add Reflow Temp. table. Update features (MAC,
Oscillator, and voltage range), registers (INT_CLR2/MSK2, second MAC), and
specs. (Rext, IMO, analog output buffer...).
*D
344318
HMT
See ECN
Add new color and logo. Expand analog arch. diagram. Fix I/O #. Update
Electrical Specifications.
*E
346774
HMT
See ECN
Add USB temperature specifications. Make datasheet Final.
*F
349566
HMT
See ECN
Remove USB logo. Add URL to preferred dimensions for mounting MLF
packages.
*G
393164
HMT
See ECN
Add new device, CY8C24894 56-pin MLF with XRES pin. Add Fimousb3v char.
to specs. Upgrade to CY Perform logo and update corporate address and
copyright.
*H
469243
HMT
See ECN
Add ISSP note to pinout tables. Update typical and recommended Storage
Temperature per industrial specs. Update Low Output Level maximum I/OL
budget. Add FLS_PR1 to Register Map Bank 1 for users to specify which Flash
bank should be used for SROM operations. Add two new devices for a 68-pin
QFN and 100-ball VFBGA under RPNs: CY8C24094 and CY8C24994. Add two
packages for 68-pin QFN. Add OCD non-production pinouts and package
diagrams. Update CY branding and QFN convention. Add new Dev. Tool
section. Update copyright and trademarks.
*I
561158
HMT
See ECN
Add Low Power Comparator (LPC) AC/DC electrical spec. tables. Add
CY8C20x34 to PSoC Device Characteristics table. Add detailed dimensions to
56-pin QFN package diagram and update revision. Secure one package
diagram/manufacturing per QFN. Update emulation pod/feet kit part numbers.
Fix pinout type-o per TestTrack.
*J
728238
HMT
See ECN
Add CapSense SNR requirement reference. Update figure standards. Update
Technical Training paragraphs. Add QFN package clarifications and dimensions. Update ECN-ed Amkor dimensioned QFN package diagram revisions.
Reword SNR reference. Add new 56-pin QFN spec.
*K
2552459
AZIE /
PYRS
08/14/08
Add footnote on AGND descriptions to avoid using P2[4] for digital signaling as
it may add noise to AGND. Remove reference to CMP_GO_EN1 in Map Bank
1 Table on Address 65; this register has no functionality on 24xxx. Add footnote
on die sales. Add description 'Optional External Clock Input’ on P1[4] to match
description of P1[4].
*L
2616550
OGNE /
PYRS
12/05/08
Updated Programmable Pin Configuration detail.
Changed title from PSoC® Mixed-Signal Array to PSoC® Programmable
System-on-Chip™
*M
2657956
DPT /
PYRS
02/11/09
Added package diagram 001-09618 and updated Ordering Information table
Document Number: 38-12018 Rev. AL
New silicon and new document – Advance datasheet.
Page 70 of 73
CY8C24094/CY8C24794
CY8C24894/CY8C24994
19. Document History Page (continued)
Document Title: CY8C24094/CY8C24794/CY8C24894/CY8C24994, PSoC® Programmable System-on-Chip™
Document Number: 38-12018
*N
2708135
BRW
05/18/2009
Added Note in the Pin Information section on page 8.
Removed reference to Hi-Tech Lite Compiler in the section Development Tools
Selection on page 42.
*O
2718162
*P
2762161
DPT
06/11/2009
Added 56-Pin QFN (Sawn) package diagram and updated ordering information
RLRM
09/10/2009
Updated the following parameters:
DCILO, F32K_U, FIMO6, TPOWERUP, TERASE_ALL, TPROGRAM_HOT, and
TPROGRAM_COLD. Added SRPOWER_UP parameter in AC specs table.
*Q
2768530
RLRM
09/24/09
Ordering Information table: Changed XRES Pin value for CY8C24894-24LTXI
and CY8C24894-24LTXIT to ‘Yes’.
*R
2817938
KRIS
11/30/09
Ordering Information: Updated CY8C24894-24LTXI and CY8C24894-24LTXIT
parts as Sawn and updated the Digital I/O and Analog Pin values
Added Contents page. Updated 68 QFN package diagram (51-85124)
*S
2846641
RLRM
1/12/10
Added package diagram 001-58740 and updated Development Tools section.
*T
2867363
ANUP
01/27/10
Modified Note 9 to remove voltage range 2.4 V to 3.0 V
*U
2901653
NJF
03/30/2010
Updated Cypress website links
Added TXRST, DC24M, TBAKETEMP and TBAKETIME parameters
Removed reference to 2.4 V
Removed sections ‘Third Party Tools’ ‘Build a PSoC Emulator into your Board’
Updated package diagrams
Removed inactive parts from ordering information table.
*V
2938528
VMAD
05/28/2010
Updated content to match current style guide and datasheet template.
No technical updates
*W
3028596
NJF
09/20/10
*X
3082244
NXZ
11/09/2010
*Y
3111357
BTK / NJF /
ARVM
12/15/10
Updated solder reflow specifications.
Removed FIMO6 spec from AC chip-level specifications table.
Removed the following pruned parts from the ordering information table and
their references in the datasheet.
1) CY8C24794-24LFXI
2) CY8C24794-24LFXIT
3) CY8C24894-24LFXI
4) CY8C24894-24LFXIT
*Z
3126167
BTK /
ANBA /
PKS
01/03/11
Updated ordering information.
Removed the package diagram spec 51-85214 since there are no MPNs in the
ordering information table that corresponds with this package.
Updated ordering code definitions for clearer understanding.
AA
3367463
BTK / GIR
09/22/11
Updated VREFHI values for parameter ‘0b100’ under Table 19 on page 31.
Updated text under Table 19 on page 31.
The text “Pin must be left floating” is included under Description of NC pin in
Table 4 on page 12, Table 6 on page 14, Table 7 on page 16, and Table 8 on
page 18.
Updated Table 38 on page 51 to give more clarity.
AB
3404970
MATT
10/13/11
Removed prune device CY8C24994-24BVXI from Ordering Information.
AC
3461872
CSAI
12/13/2011
Document Number: 38-12018 Rev. AL
Added PSoC Device Characteristics table.
Added DC I2C Specifications table.
Added F32K_U max limit.
Added Tjit_IMO specification, removed existing jitter specifications.
Updated Analog reference tables.
Updated Units of Measure, Acronyms, Glossary, and References sections.
Updated solder reflow specifications.
No specific changes were made to AC Digital Block Specifications table and
I2C Timing Diagram. They were updated for clearer understanding.
Updated Figure 12 since the labelling for y-axis was incorrect.
Template and styles update.
Sunset review; no updates.
Sunset review; no content update
Page 71 of 73
CY8C24094/CY8C24794
CY8C24894/CY8C24994
19. Document History Page (continued)
Document Title: CY8C24094/CY8C24794/CY8C24894/CY8C24994, PSoC® Programmable System-on-Chip™
Document Number: 38-12018
AD
3503402
PMAD
01/20/2012
Updated VOH and VOL section in Table 12.
AE
3545509
PSAI
03/08/2012
Updated link to 'Technical reference Manual'.
AF
3862667
CSAI
01/09/2013
Updated Ordering Information (Updated part numbers).
Updated Packaging Dimensions:
spec 001-53450 – Changed revision from *B to *C.
spec 001-09618 – Changed revision from *D to *E.
spec 51-85048 – Changed revision from *E to *G.
AG
3979302
CSAI
04/23/2013
Updated Packaging Dimensions:
spec 001-58740 – Changed revision from ** to *A.
Added Errata.
AH
4074544
CSAI
07/23/2013
Added Errata Footnotes (Note 21, 23)
Updated Electrical Specifications:
Updated DC Electrical Characteristics:
Updated DC Chip-Level Specifications:
Added Note 21 and referred the same note in “Sleep Mode” in description of
ISB parameter in Table 11.
Updated DC POR and LVD Specifications:
Added Note 23 and referred the same note in VPPOR0, VPPOR1, VPPOR2
parameters in Table 22.
Updated to new template.
AI
4596835
DIMA
12/15/2014
Updated Pin Information:
Updated 56-Pin Part Pinout:
Updated Table 2:
Added Note 5 and referred the same note in description of pin 19 and pin 50.
Updated 56-Pin Part Pinout (with XRES):
Updated Table 3:
Added Note 8 and referred the same note in description of pin 19 and pin 50.
Updated 68-Pin Part Pinout:
Updated Table 4:
Added Note 10 and referred the same note in description of pin 7, pin 20 and
pin 60.
Updated 68-Pin Part Pinout (On-Chip Debug):
Updated Table 5:
Added Note 13 and referred the same note in description of pin 7, pin 20 and
pin 60.
Updated 100-Ball VFBGA Part Pinout:
Updated Table 6:
Added Note 15 and referred the same note in caption of Table 6.
Updated 100-Ball VFBGA Part Pinout (On-Chip Debug):
Updated Table 7:
Added Note 17 and referred the same note in caption of Table 7.
Updated 100-Pin Part Pinout (On-Chip Debug):
Updated Table 8:
Added Note 19 and referred the same note in caption of Table 8.
Updated Packaging Dimensions:
spec 001-12921 – Changed revision from *B to *C.
spec 001-53450 – Changed revision from *C to *D.
spec 51-85209 – Changed revision from *D to *E.
spec 51-85048 – Changed revision from *G to *I.
Completing Sunset Review.
AJ
4622083
SLAN
01/13/2015
Added More Information section.
AK
4684565
PSI
03/12/2015
Updated Packaging Dimensions:
spec 001-58740 – Changed revision from *A to *B.
Updated Errata.
AL
5699855
AESATP12
04/20/2017
Updated logo and copyright.
Document Number: 38-12018 Rev. AL
Page 72 of 73
CY8C24094/CY8C24794
CY8C24894/CY8C24994
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including any software or firmware included or referenced in this document (“Software”), is owned by Cypress under the intellectual property laws and treaties of the United States and other countries
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Document Number: 38-12018 Rev. AL
Revised April 20, 2017
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