The following document contains information on Cypress products. Although the document is marked with the name
“Broadcom”, the company that originally developed the specification, Cypress will continue to offer these products to
new and existing customers.
CONTINUITY OF SPECIFICATIONS
There is no change to this document as a result of offering the device as a Cypress product. Any changes that have
been made are the result of normal document improvements and are noted in the document history page, where
supported. Future revisions will occur when appropriate, and changes will be noted in a document history page.
CONTINUITY OF ORDERING PART NUMBERS
Cypress continues to support existing part numbers. To order these products, please use only the Ordering Part
Numbers listed in this document.
FOR MORE INFORMATION
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Cypress products and services.
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Cypress Semiconductor Corporation
Document Number: 002-15052 Rev. *I
198 Champion Court
San Jose, CA 95134-1709
408-943-2600
Revised July 1, 2016
Advance Data Sheet
BCM43569
Single-Chip 5G WiFi IEEE 802.11ac 2 × 2 MAC/Baseband/
Radio with Integrated Bluetooth 4.1 + EDR
GE NE R AL DE S C RI PT ION
F E A T U RE S
®
The Broadcom BCM43569 is a complete dual-band
(2.4 GHz and 5 GHz) 5G WiFi 2 × 2 MIMO MAC/PHY/
radio system-on-a-chip. This 5G WiFi single-chip
device provides a high level of integration with a dualstream IEEE 802.11ac MAC/baseband/radio and
Bluetooth 4.1 + EDR. In IEEE 802.11ac mode, the
WLAN operation supports rates of MCS0–MCS9 (up
to 256 QAM) in 20 MHz, 40 MHz, and 80 MHz channels for data rates up to 867 Mbps in 5 GHz band. In
addition, all the IEEE 802.11a/b/g/n rates are supported. Included on-chip are 2.4 GHz and 5 GHz
transmitter power amplifiers and receiver low-noise
amplifiers.
The BCM43569 integrates several peripheral interfaces including USB 2.0 coexistence, serial Flash,
SPROM, JTAG, UART, and GPIO. For the Bluetooth
section, the host interface options are a high-speed 4wire UART and USB 2.0 full-speed (12 Mbps).
The BCM43569 uses advanced design techniques
and process technology to reduce active and idle
power, and includes an embedded power management unit that simplifies the system power topology.
The BCM43569 implements highly sophisticated
enhanced collaborative coexistence hardware mechanisms and algorithms that ensure that WLAN and
Bluetooth collaboration is optimized.
IEEE 802.11X Key Features
• IEEE 802.11ac Draft compliant.
• Dual-stream spatial multiplexing up to
867 Mbps data rate.
• Supports 20, 40, and 80 MHz channels with
optional SGI (256 QAM modulation in 5 GHz).
• Full IEEE 802.11a/b/g/n legacy compatibility with
enhanced performance.
• TX and RX low-density parity check (LDPC)
support for improved range and power efficiency.
• Supports IEEE 802.11ac/n beamforming.
• On-chip power amplifiers and low-noise amplifiers
for both bands.
• Supports various RF front-end architectures
including:
– Three-antennas design: WLAN Core0, WLAN
Core1, and BT antenna
– Two antennas with WLAN diversity and a
shared Bluetooth antenna.
• An internal fractional nPLL allows support for a
wide range of reference clock frequencies.
Figure 1: Functional Block Diagram
VIO
VBAT*
XTAL
WLAN
Host I/F
USB 2.0
WL_HOST_WAKE
5 GHz WLAN
WL_REG_ON
UART
USB 2.0
I2S
Bluetooth
Host I/F
T/R Switch
2.4 GHz
WLAN
T/R Switch
5 GHz WLAN
T/R Switch
BCM43569
BT_DEV_WAKE
Ant0
Diplexer
PCM
BT_HOST_WAKE
Ant1
Diplexer
2.4 GHz
WLAN
T/R Switch
BT_REG_ON
BT_VSYNC_IN
BT
*VBAT is the main power supply of the chip(ranges from 3.0 to 3.6V).
43569-DS109-R
5300 California Avenue • Irvine, CA 92617 • Phone: 949-926-5000 • Fax: 949-926-5203
January 19, 2016
BCM43569 Advance Data Sheet
Revision History
F E A T U RE S
F E A T U RE S
IEEE 802.11X Key Features (cont.)
• Integrated ARMCR4 processor with tightly
coupled memory for complete WLAN
subsystem functionality, minimizing the need
to wake up the applications processor for
standard WLAN functions. This allows for
further minimization of power consumption,
while maintaining the ability to field upgrade
with future features. On-chip memory
includes 768 KB SRAM and 640 KB ROM.
Bluetooth Key Features (cont.)
• Low power mode improves power consumption of media
devices
• Supports multiple simultaneous Advanced Audio
Distribution Profiles (A2DP) for stereo sound.
• Automatic frequency detection for standard crystal and
TCXO values.
• Supports serial flash interfaces.
•
OneDriver™ software architecture for easy
migration from existing embedded WLAN
and Bluetooth devices as well as future
devices.
Bluetooth Key Features
• Complies with Bluetooth Core Specification
Version 4.1 + EDR with provisions for
supporting future specifications.
• Bluetooth class 1 or class 2 transmitter
operation.
• Supports extended synchronous
connections (eSCO) for enhanced voice
quality by allowing for retransmission of
dropped packets.
• Adaptive frequency hopping (AFH) for
reducing radio frequency interference.
• Interface support: host controller interface
(HCI) using a USB or high-speed UART
interface and PCM for audio data.
• Supports USB 2.0 full-speed (12 Mbps).
General Features
• Supports device voltages from 3.0V to 3.6V by using an
internal switching regulator.
• Programmable dynamic power management.
• 484 bytes of user-accessible OTP memory for storing
board parameters.
• Supports 16 GPIOs.
• Package: 254-ball FCBGA
(10 mm × 10 mm, 0.4 mm pitch)
• Security:
– WPA and WPA2 (Personal) support for powerful
encryption and authentication.
– AES and TKIP in hardware for faster data encryption
and IEEE 802.11i compatibility.
– Reference WLAN subsystem provides Cisco
Compatible Extensions (CCX, CCX 2.0, CCX 3.0,
CCX 4.0, CCX 5.0).
– Reference WLAN subsystem provides Wi-Fi
Protected Setup (WPS).
• Worldwide regulatory support: Global products
supported with worldwide homologated design.
Broadcom®
January 19, 2016 • 43569-DS109-R
Page 2
BROADCOM CONFIDENTIAL
Revision History
Revision
Date
Change Description
43569-DS109-R
01/19/16
43569-DS108-R
07/23/15
Updated:
• Cover page, General Description
• “IEEE 802.11ac Draft MAC” on page 57
• Table 17: “Pin List,” on page 66
• Table 18: “Signal Descriptions,” on page 70
Updated:
• External Coexistence Interface (deleted)
• Table 41: “Typical WLAN Power Consumption,” on page 108
• SPI references deleted throughout the document
Broadcom Corporation
5300 California Avenue
Irvine, CA 92617
© 2016 by Broadcom Corporation
All rights reserved
Printed in the U.S.A.
Broadcom®, the pulse logo, Connecting everything®, the Connecting everything logo, OneDriver™, and
SmartAudio® are among the trademarks of Broadcom Corporation and/or its affiliates in the United States,
certain other countries and/or the EU. Any other trademarks or trade names mentioned are the property of
their respective owners.
This data sheet (including, without limitation, the Broadcom component(s) identified herein) is not designed,
intended, or certified for use in any military, nuclear, medical, mass transportation, aviation, navigations,
pollution control, hazardous substances management, or other high-risk application. BROADCOM
PROVIDES THIS DATA SHEET “AS-IS,” WITHOUT WARRANTY OF ANY KIND. BROADCOM DISCLAIMS
ALL WARRANTIES, EXPRESSED AND IMPLIED, INCLUDING, WITHOUT LIMITATION, THE IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NONINFRINGEMENT.
BCM43569 Advance Data Sheet
Revision History
Revision
Date
Change Description
43569-DS107-R
05/13/15
Updated:
• Features and General Description on page 1 and 2.
• Table 1: “Device Interface Support,” on page 13.
• Figure 2: “BCM43569 Block Diagram,” on page 14.
• “Power Supply Topology” on page 17.
• “Power Amplifier” and “Receiver” on page 27.
• “Features” on page 46.
• “IEEE 802.11ac Draft PHY” on page 63.
• Figure 27: “FCBGA Ball Map, 10 mm × 10 mm Array, 254 Balls, A12–
AC23 (Top View, Balls Facing Down),” on page 67.
• Table 18: “Pin List,” on page 68.
• Table 19: “Signal Descriptions,” on page 72.
• Table 22: “GPIO_[10, 9, 8] Host Interface Selection,” on page 79.
• Table 28: “Bluetooth Receiver RF Specifications,” on page 88.
• Table 33: “WLAN 2.4 GHz Receiver Performance Specifications,” on
page 92.
• Table 35: “WLAN 2.4 GHz Transmitter Performance Specifications,”
on page 100.
• Table 36: “WLAN 5 GHz Receiver Performance Specifications,” on
page 101.
• Table 37: “WLAN 5 GHz Transmitter Performance Specifications,” on
page 106.
• “Description of Control Signals” on page 116.
• Figure 30: “WLAN = ON, Bluetooth = ON,” on page 117.
• Figure 32: “WLAN = ON, Bluetooth = OFF,” on page 118.
• Figure 33: “WLAN = OFF, Bluetooth = ON,” on page 118.
Added:
• “WLAN USB 2.0 Interface” on page 56.
• Figure 35: “Bluetooth Boot-Up Sequence,” on page 120.
43569-DS106-R
10/7/14
43569-DS105-R
08/29/14
Removed:
• HSIC Interface information.
Updated:
• Figure 36: “254-Ball Package Mechanical Information,” on page 123.
For earlier revision history, refer to the released document.
Broadcom®
January 19, 2016 • 43569-DS109-R
Page 4
BROADCOM CONFIDENTIAL
BCM43569 Advance Data Sheet
Table of Contents
Table of Contents
About This Document ................................................................................................................................ 12
Purpose and Audience .......................................................................................................................... 12
Acronyms and Abbreviations................................................................................................................. 12
References ............................................................................................................................................ 12
Technical Support ...................................................................................................................................... 12
Section 1: Overview .......................................................................................................... 14
Overview...................................................................................................................................................... 14
Features....................................................................................................................................................... 16
Standards Compliance............................................................................................................................... 17
Section 2: Power Supplies and Power Management ..................................................... 18
Power Supply Topology............................................................................................................................. 18
BCM43569 PMU Features .......................................................................................................................... 18
WLAN Power Management ........................................................................................................................ 20
PMU Sequencing ........................................................................................................................................ 21
Power-Off Shutdown .................................................................................................................................. 22
Power-Up/Power-Down/Reset Circuits..................................................................................................... 22
Section 3: Frequency References.................................................................................... 23
Crystal Interface and Clock Generation ................................................................................................... 23
External Frequency Reference.................................................................................................................. 24
Section 4: Bluetooth Overview......................................................................................... 26
Features....................................................................................................................................................... 26
Bluetooth Radio.......................................................................................................................................... 27
Transmit ................................................................................................................................................ 27
Digital Modulator ................................................................................................................................... 27
Digital Demodulator and Bit Synchronizer............................................................................................. 27
Power Amplifier ..................................................................................................................................... 28
Receiver ................................................................................................................................................ 28
Digital Demodulator and Bit Synchronizer............................................................................................. 28
Receiver Signal Strength Indicator........................................................................................................ 28
Local Oscillator Generation ................................................................................................................... 28
Calibration ............................................................................................................................................. 28
Section 5: Bluetooth Baseband Core .............................................................................. 29
Bluetooth 4.1 Features............................................................................................................................... 29
Bluetooth Low Energy ............................................................................................................................... 29
Link Control Layer...................................................................................................................................... 30
Test Mode Support ..................................................................................................................................... 30
Broadcom®
January 19, 2016 • 43569-DS109-R
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BROADCOM CONFIDENTIAL
BCM43569 Advance Data Sheet
Table of Contents
Bluetooth Power Management Unit .......................................................................................................... 31
RF Power Management ........................................................................................................................ 31
Host Controller Power Management ..................................................................................................... 31
BBC Power Management...................................................................................................................... 33
Wideband Speech ................................................................................................................................. 33
Packet Loss Concealment..................................................................................................................... 34
Audio Rate-Matching Algorithms........................................................................................................... 34
Codec Encoding .................................................................................................................................... 35
Multiple Simultaneous A2DP Audio Stream .......................................................................................... 35
Burst Buffer Operation........................................................................................................................... 35
Adaptive Frequency Hopping.................................................................................................................... 35
Advanced Bluetooth/WLAN Coexistence................................................................................................. 36
Fast Connection (Interlaced Page and Inquiry Scans) ........................................................................... 36
Section 6: Microprocessor and Memory Unit for Bluetooth.......................................... 37
RAM, ROM, and Patch Memory ................................................................................................................. 37
Reset............................................................................................................................................................ 37
Section 7: BT Peripheral Transport Unit ......................................................................... 38
UART Transport Detection ........................................................................................................................ 38
PCM Interface.............................................................................................................................................. 38
Slot Mapping ......................................................................................................................................... 38
Frame Synchronization ......................................................................................................................... 39
Data Formatting..................................................................................................................................... 39
Wideband Speech Support ................................................................................................................... 39
Burst PCM Mode ................................................................................................................................... 39
PCM Interface Timing............................................................................................................................ 40
Short Frame Sync, Master Mode ................................................................................................... 40
Short Frame Sync, Slave Mode ..................................................................................................... 41
Long Frame Sync, Master Mode.................................................................................................... 42
Long Frame Sync, Slave Mode...................................................................................................... 43
Short Frame Sync, Burst Mode...................................................................................................... 44
Long Frame Sync, Burst Mode ...................................................................................................... 45
Bluetooth USB Interface ............................................................................................................................ 46
Features ................................................................................................................................................ 46
Operation............................................................................................................................................... 46
USB Full-Speed Timing......................................................................................................................... 48
UART Interface............................................................................................................................................ 49
I2S Interface................................................................................................................................................. 51
I2S Timing.............................................................................................................................................. 52
Broadcom®
January 19, 2016 • 43569-DS109-R
Page 6
BROADCOM CONFIDENTIAL
BCM43569 Advance Data Sheet
Table of Contents
Section 8: WLAN Global Functions ................................................................................. 54
WLAN CPU and Memory Subsystem........................................................................................................ 54
One-Time Programmable Memory ............................................................................................................ 54
GPIO Interface............................................................................................................................................. 54
WLAN USB 2.0 Interface ............................................................................................................................ 55
UART Interface............................................................................................................................................ 56
JTAG Interface ............................................................................................................................................ 56
SPROM Interface ........................................................................................................................................ 57
SFLASH Interface ....................................................................................................................................... 57
Section 9: Wireless LAN MAC and PHY .......................................................................... 58
IEEE 802.11ac Draft MAC........................................................................................................................... 58
PSM ............................................................................................................................................... 59
WEP ............................................................................................................................................... 59
TXE ................................................................................................................................................ 60
RXE................................................................................................................................................ 60
IFS.................................................................................................................................................. 60
TSF ................................................................................................................................................ 61
NAV................................................................................................................................................ 61
MAC-PHY Interface........................................................................................................................ 61
IEEE 802.11ac Draft PHY............................................................................................................................ 62
Section 10: WLAN Radio Subsystem ............................................................................. 64
Receiver Path.............................................................................................................................................. 64
Transmitter Path ......................................................................................................................................... 64
Calibration................................................................................................................................................... 64
Section 11: Ball Map and Signal Descriptions................................................................ 65
Ball Map....................................................................................................................................................... 65
Pin List......................................................................................................................................................... 67
Signal Descriptions .................................................................................................................................... 71
WLAN/BT GPIO Signals and Strapping Options ..................................................................................... 78
GPIO Alternative Signal Functions ........................................................................................................... 79
I/O States ..................................................................................................................................................... 80
Section 12: DC Characteristics ........................................................................................ 83
Absolute Maximum Ratings ...................................................................................................................... 83
Environmental Ratings .............................................................................................................................. 84
Recommended Operating Conditions and DC Characteristics ............................................................. 85
Broadcom®
January 19, 2016 • 43569-DS109-R
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BROADCOM CONFIDENTIAL
BCM43569 Advance Data Sheet
Table of Contents
Section 13: Bluetooth RF Specifications ........................................................................ 86
Section 14: WLAN RF Specifications .............................................................................. 90
Introduction................................................................................................................................................. 90
2.4 GHz Band General RF Specifications................................................................................................. 90
WLAN 2.4 GHz Receiver Performance Specifications ............................................................................ 91
WLAN 2.4 GHz Transmitter Performance Specifications ....................................................................... 96
WLAN 5 GHz Receiver Performance Specifications ............................................................................... 97
WLAN 5 GHz Transmitter Performance Specifications ........................................................................ 102
Section 15: Internal Regulator Electrical Specifications ............................................. 103
Core Buck Switching Regulator.............................................................................................................. 103
2.5V LDO (BTLDO2P5) ............................................................................................................................. 104
CLDO ......................................................................................................................................................... 105
LNLDO ....................................................................................................................................................... 106
Section 16: System Power Consumption...................................................................... 107
WLAN Current Consumption................................................................................................................... 107
Bluetooth Current Consumption............................................................................................................. 110
Section 17: Interface Timing and AC Characteristics .................................................. 111
JTAG Timing ............................................................................................................................................. 111
Section 18: Power-Up Sequence and Timing ............................................................... 112
Sequencing of Reset and Regulator Control Signals ........................................................................... 112
Description of Control Signals ............................................................................................................. 112
Control Signal Timing Diagrams.......................................................................................................... 113
Section 19: Package Information ................................................................................... 117
Package Thermal Characteristics ........................................................................................................... 117
Junction Temperature Estimation and PSIJT Versus ThetaJC.............................................................. 117
Environmental Characteristics................................................................................................................ 117
Section 20: Mechanical Information .............................................................................. 118
Section 21: Ordering Information .................................................................................. 119
Broadcom®
January 19, 2016 • 43569-DS109-R
Page 8
BROADCOM CONFIDENTIAL
BCM43569 Advance Data Sheet
List of Figures
List of Figures
Figure 1: Functional Block Diagram................................................................................................................... 1
Figure 2: BCM43569 Block Diagram ............................................................................................................... 15
Figure 3: Typical Power Topology for the BCM43569 ..................................................................................... 19
Figure 4: Recommended Oscillator Configuration ........................................................................................... 23
Figure 5: Recommended Circuit to Use with an External Reference Clock..................................................... 24
Figure 6: Startup Signaling Sequence ............................................................................................................. 32
Figure 7: CVSD Decoder Output Waveform Without PLC ............................................................................... 34
Figure 8: CVSD Decoder Output Waveform After Applying PLC..................................................................... 34
Figure 9: PCM Timing Diagram (Short Frame Sync, Master Mode) ................................................................ 40
Figure 10: PCM Timing Diagram (Short Frame Sync, Slave Mode) ................................................................ 41
Figure 11: PCM Timing Diagram (Long Frame Sync, Master Mode)............................................................... 42
Figure 12: PCM Timing Diagram (Long Frame Sync, Slave Mode)................................................................. 43
Figure 13: PCM Burst Mode Timing (Receive Only, Short Frame Sync) ......................................................... 44
Figure 14: PCM Burst Mode Timing (Receive Only, Long Frame Sync) ......................................................... 45
Figure 15: USB Compounded Device Configuration ....................................................................................... 46
Figure 16: USB Full-Speed Timing .................................................................................................................. 48
Figure 17: UART Timing .................................................................................................................................. 50
Figure 18: I2S Transmitter Timing .................................................................................................................... 53
Figure 19: I2S Receiver Timing........................................................................................................................ 53
Figure 20: WLAN USB 2.0 Host Interface Block Diagram ............................................................................... 55
Figure 21: WLAN USB Timing ......................................................................................................................... 56
Figure 22: WLAN MAC Architecture ................................................................................................................ 58
Figure 23: WLAN PHY Block Diagram............................................................................................................. 63
Figure 24: FCBGA Ball Map, 10 mm × 10 mm Array, 254 Balls, A1–AC12 (Top View, Balls Facing Down).. 65
Figure 25: FCBGA Ball Map, 10 mm × 10 mm Array, 254 Balls, A12–AC23 (Top View, Balls Facing Down) 66
Figure 26: RF Port Location for Bluetooth Testing........................................................................................... 86
Figure 27: Port Locations (Applies to 2.4 GHz and 5 GHz) ............................................................................. 90
Figure 28: WLAN = ON, Bluetooth = ON ....................................................................................................... 113
Figure 29: WLAN = OFF, Bluetooth = OFF.................................................................................................... 113
Figure 30: WLAN = ON, Bluetooth = OFF ..................................................................................................... 114
Figure 31: WLAN = OFF, Bluetooth = ON ..................................................................................................... 114
Figure 32: WLAN Boot-Up Sequence ............................................................................................................ 115
Figure 33: Bluetooth Boot-Up Sequence ....................................................................................................... 116
Figure 34: 254-Ball Package Mechanical Information ................................................................................... 118
Broadcom®
January 19, 2016 • 43569-DS109-R
Page 9
BROADCOM CONFIDENTIAL
BCM43569 Advance Data Sheet
List of Tables
List of Tables
Table 1: Device Interface Support ................................................................................................................... 14
Table 2: Power-Up/Power-Down/Reset Control Signals.................................................................................. 22
Table 3: Crystal Oscillator and External Clock—Requirements and Performance ......................................... 24
Table 4: Power Control Pin Description ........................................................................................................... 31
Table 5: PCM-to-Serial Flash Interface Mapping............................................................................................. 38
Table 6: PCM Interface Timing Specifications (Short Frame Sync, Master Mode).......................................... 40
Table 7: PCM Interface Timing Specifications (Short Frame Sync, Slave Mode)............................................ 41
Table 8: PCM Interface Timing Specifications (Long Frame Sync, Master Mode) .......................................... 42
Table 9: PCM Interface Timing Specifications (Long Frame Sync, Slave Mode) ............................................ 43
Table 10: PCM Burst Mode (Receive Only, Short Frame Sync) ...................................................................... 44
Table 11: PCM Burst Mode (Receive Only, Long Frame Sync) ...................................................................... 45
Table 12: USB Full-Speed Timing Specifications ............................................................................................ 48
Table 13: Example of Common Baud Rates.................................................................................................... 49
Table 14: UART Timing Specifications ............................................................................................................ 50
Table 15: Timing for I2S Transmitters and Receivers ...................................................................................... 52
Table 16: USB2.0 Electrical Parameters ......................................................................................................... 56
Table 17: Pin List ............................................................................................................................................. 67
Table 18: Signal Descriptions .......................................................................................................................... 71
Table 19: WLAN GPIO Functions and Strapping Options ............................................................................... 78
Table 20: BT GPIO Functions and Strapping Options ..................................................................................... 78
Table 21: GPIO_[10, 9, 8] Host Interface Selection......................................................................................... 78
Table 22: GPIO Alternative Signal Functions .................................................................................................. 79
Table 23: I/O States ......................................................................................................................................... 81
Table 24: Absolute Maximum Ratings ............................................................................................................. 83
Table 25: Environmental Ratings ..................................................................................................................... 84
Table 26: Recommended Operating Conditions and DC Characteristics ........................................................ 85
Table 27: Bluetooth Receiver RF Specifications.............................................................................................. 87
Table 28: Bluetooth Transmitter RF Specifications.......................................................................................... 88
Table 29: Local Oscillator Performance........................................................................................................... 89
Table 30: BLE RF Specifications ..................................................................................................................... 89
Table 31: 2.4 GHz Band General RF Specifications........................................................................................ 90
Table 32: WLAN 2.4 GHz Receiver Performance Specifications .................................................................... 91
Table 33: WLAN 2.4 GHz Transmitter Performance Specifications ................................................................ 96
Table 34: WLAN 5 GHz Receiver Performance Specifications ....................................................................... 97
Table 35: WLAN 5 GHz Transmitter Performance Specifications ................................................................. 102
Broadcom®
January 19, 2016 • 43569-DS109-R
Page 10
BROADCOM CONFIDENTIAL
BCM43569 Advance Data Sheet
List of Tables
Table 36: Core Buck Switching Regulator (CBUCK) Specifications .............................................................. 103
Table 37: BTLDO2P5 Specifications ............................................................................................................. 104
Table 38: CLDO Specifications ...................................................................................................................... 105
Table 39: LNLDO Specifications .................................................................................................................... 106
Table 40: Typical WLAN Power Consumption ............................................................................................... 107
Table 41: Bluetooth Current Consumption..................................................................................................... 110
Table 42: JTAG Timing Characteristics ......................................................................................................... 111
Table 43: Package Thermal Characteristics .................................................................................................. 117
Broadcom®
January 19, 2016 • 43569-DS109-R
Page 11
BROADCOM CONFIDENTIAL
BCM43569 Advance Data Sheet
About This Document
About This Document
Purpose and Audience
This data sheet provides details on the functional, operational, and electrical characteristics for the
Broadcom® BCM43569. It is intended for hardware design, application, and OEM engineers.
Acronyms and Abbreviations
In most cases, acronyms and abbreviations are defined on first use.
For a comprehensive list of acronyms and other terms used in Broadcom documents, go to:
http://www.broadcom.com/press/glossary.php.
References
The references in this section may be used in conjunction with this document.
Note: Broadcom provides customer access to technical documentation and software through its
Customer Support Portal (CSP) and Downloads & Support site (see Technical Support).
For Broadcom documents, replace the “xx” in the document number with the largest number available in the
repository to ensure that you have the most current version of the document.
Document (or Item) Name
Number
[1]
Bluetooth MWS Coexistence 2–wire Transport Interface –
Specification
[2]
USB 2.0 Standard Specification
–
Source
www.bluetooth.com
www.usb.org
Technical Support
Broadcom provides customer access to a wide range of information, including technical documentation,
schematic diagrams, product bill of materials, PCB layout information, and software updates through its
customer support portal (https://support.broadcom.com). For a CSP account, contact your Sales or Engineering
support representative.
In addition, Broadcom provides other product support through its Downloads & Support site
(http://www.broadcom.com/support/).
Broadcom®
January 19, 2016 • 43569-DS109-R
Page 12
BROADCOM CONFIDENTIAL
BCM43569 Advance Data Sheet
Technical Support
Broadcom®
January 19, 2016 • 43569-DS109-R
Page 13
BROADCOM CONFIDENTIAL
BCM43569 Advance Data Sheet
Overview
Section 1: Overview
Overview
The Broadcom® BCM43569 single-chip device provides the highest level of integration for a mobile or handheld
wireless system, with integrated IEEE 802.11 a/b/g/n/ac MAC/baseband/radio and Bluetooth 4.1 + EDR
(enhanced data rate). It provides a small form-factor solution with minimal external components to drive down
cost for mass volumes and allows for handheld device flexibility in size, form, and function. Comprehensive
power management circuitry and software ensure the system can meet the needs of highly mobile devices that
require minimal power consumption and reliable operation.
Table 1 summarizes the device interface support.
Table 1: Device Interface Support
Feature
Interface Capable
Interface Support
USB 2.0 (Wi-Fi)
Yes
Yes
USB 2.0 (Bluetooth)
Yes
Yes
I2S
Yes
No
GPIO
16
No
PCM
Yes
No
I2S (Bluetooth)
Yes
No
GPIO (Wi-Fi)
Yes
Yes
BT GPIO (Bluetooth)
Yes
Yes
PCM (Bluetooth)
Yes
No
UART (Bluetooth)
Yes
No
UART (Wi-Fi)
Yes
No
JTAG (Wi-Fi)
Yes
No
Figure 2 on page 15 shows the interconnect of all the major physical blocks in the BCM43569 and their
associated external interfaces, which are described in greater detail in the following sections.
Broadcom®
January 19, 2016 • 43569-DS109-R
Page 14
BROADCOM CONFIDENTIAL
Overview
BCM43569 Advance Data Sheet
Figure 2: BCM43569 Block Diagram
BCM43569
BT USB
WLAN
Debug
USB 2.0
PMU
Controller
USB
ETM
JTAG
SDP
ARMCR4
SW REG
LPO
Inter Ctrl
SW Timer
DMA
GPIO Ctrl
Bus Arb
ARM
AHB
RAM
I2S
CLB
GPIO
BT Control Clock
Sleep
Clock
Timer Management PMU
LPO
XO
Buffer
PMU
Controller
POR
BT-WLAN
ECI
CORE1
Radio
3DG VSYNC OUT
2X2 LCNXNPHY
3DG VSYNC IN
SMPS Control
WLAN HOST WAKE
UART
OTP
LNA
BT DEV WAKE
GPIO
UART
IEEE 802.11abgn/ac
IO Port Control
BT HOST WAKE
BT Digital
IO
ROM
PA
BT RF
BT PHY
JTAG
GPIO
GPIO
USB
PCM
JTAG
5 GHz
WD Timer
5 GHz iPA
LNA
2.4 GHz
Patch
5 GHz
ROM
APB
CORE0
AHB2 APB
Bridge
XTAL
WL REG ON
POR
AXI BACKPLANE
UART
XTAL OSC
RAM
JTAG
AHB Bus Matrix
AHB
PTU
Power Supply
LDO
2.4 GHz
Bluetooth
Diplexer
2.4 GHz iPA
LNA
5 GHz iPA
LNA
2.4 GHz iPA
Diplexer
LNA
BT
*VBAT is the main power supply of
the chip(ranges from 3.0 to 3.6V).
XTAL
VBAT* VREG BT REG ON
Broadcom®
January 19, 2016 • 43569-DS109-R
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BROADCOM CONFIDENTIAL
BCM43569 Advance Data Sheet
Features
Features
The BCM43569 supports the following features:
•
An IEEE 802.11a/b/g/n/ac dual-band 2 × 2 MIMO radio with virtual-simultaneous dual-band operation.
•
Bluetooth 4.1 + EDR with an integrated class 1 PA.
•
Concurrent Bluetooth and WLAN operation.
•
On-chip WLAN driver execution capable of supporting IEEE 802.11 functionality.
•
WLAN host interface option: USB 2.0.
•
BT host digital interface (can be used concurrently with the above interface): UART (up to 4 Mbps).
•
A full-speed USB 2.0-compliant interface for Bluetooth.
•
ECI—enhanced coexistence support for coordinating BT SCO transmissions around WLAN receptions.
•
Host controller interface (HCI) high-speed UART (H4, H4+, H5) transport support.
•
Wideband speech (WBS) support (16-bit linear data, MSB first, left-justified at 4K samples/s for transparent
AIR coding, both through I2S and PCM interface)
•
Bluetooth SmartAudio® technology improves voice and music quality to headsets.
•
Bluetooth low-power inquiry and page scan.
•
Bluetooth low energy (BLE) support.
•
Bluetooth packet loss concealment (PLC).
•
Bluetooth wideband speech.
Broadcom®
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BROADCOM CONFIDENTIAL
BCM43569 Advance Data Sheet
Standards Compliance
Standards Compliance
The BCM43569 supports the following standards:
•
Bluetooth 2.1 + EDR
•
Bluetooth 3.0 + HS
•
Bluetooth 4.1 (Bluetooth low energy)
•
IEEE802.11ac mandatory and optional requirements for 20 MHz, 40 MHz, and 80 MHz channels
•
IEEE 802.11n (Handheld Device Class, Section 11)
•
IEEE 802.11a
•
IEEE 802.11b
•
IEEE 802.11g
•
IEEE 802.11d
•
IEEE 802.11h
•
IEEE 802.11i
•
Security:
– WEP
– WPA Personal
– WPA2 Personal
– WMM
– WMM-PS (U-APSD)
– WMM-SA
– AES (hardware accelerator)
– TKIP (hardware accelerator)
– CKIP (software support)
•
Proprietary protocols:
– CCXv2
– CCXv3
– CCXv4
– CCXv5
•
IEEE 802.15.2 (coexistence compliance on-silicon solution compliant with IEEE three-wire requirements)
The BCM43569 will support the following future drafts/standards:
•
IEEE 802.11r (fast roaming between APs)
•
IEEE 802.11w (secure management frames)
•
IEEE 802.11 extensions:
– IEEE 802.11e QoS enhancements (In accordance with the WMM specification, QoS is already
supported.)
– IEEE 802.11h 5 GHz extensions
– IEEE 802.11i MAC enhancements
– IEEE 802.11k radio resource measurement
Broadcom®
January 19, 2016 • 43569-DS109-R
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BROADCOM CONFIDENTIAL
BCM43569 Advance Data Sheet
Power Supplies and Power Management
Section 2: Power Supplies and Power
Management
Power Supply Topology
One buck regulator, multiple LDO regulators, and a power management unit (PMU) are integrated into the
BCM43569. All regulators are programmable via the PMU. These blocks simplify power supply design for
Bluetooth and WLAN functions in embedded designs.
A single VBAT (3.0V to 3.6V maximum) and VIO supply (1.8V to 3.6V) can be used, with all additional voltages
being provided by the regulators in the BCM43569.
Two control signals, BT_REG_ON and WL_REG_ON, are used to power-up the regulators and take the
respective section out of reset. The Core-Buck (CBUCK), CLDO, and LNLDO power up when any of the reset
signals are deasserted. All regulators are powered down only when both BT_REG_ON and WL_REG_ON are
deasserted. The CLDO and LNLDO may be turned off/on based on the dynamic demands of the digital
baseband.
The BCM43569 allows for an extremely low power-consumption mode by completely shutting down the
CBUCK, CLDO, and LNLDO regulators. When in this state, LPLDO1 (which is a low-power linear regulators that
is supplied by the system VIO supply), provides the BCM43569 with all the voltages it requires, further reducing
leakage currents.
BCM43569 PMU Features
•
VBAT to 1.35Vout (550 mA nominal, 870 mA maximum) CBUCK switching regulator
•
VBAT to 2.5V out (15 mA nominal, 70 mA maximum) BTLDO2P5
•
1.35V to 1.2Vout (100 mA nominal, 150 mA maximum) LNLDO
•
1.35V to 1.2Vout (350 mA nominal, 500 mA maximum) CLDO with bypass mode for deep-sleep
•
Additional internal LDOs (not externally accessible)
Note: VBAT is the main power supply of the chip (ranges from 3.0 to 3.6V).
Broadcom®
January 19, 2016 • 43569-DS109-R
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BROADCOM CONFIDENTIAL
BCM43569 PMU Features
BCM43569 Advance Data Sheet
Figure 3: Typical Power Topology for the BCM43569
Internal
LNLDO
Internal
LNLDO
Internal
VCOLDO
Internal
LNLDO
1.2V
XTAL LDO
1.2V
WL RF – AFE
1.2V
WL RF – TX (2.4 GHz, 5 GHz)
1.2V
WL RF – LOGEN (2.4 GHz, 5 GHz)
1.2V
WL RF – RX/LNA (2.4 GHz, 5 GHz)
WL RF – XTAL
WL RF – RFPLL PFD/MMD
1.2V
LNLDO
Max 150 mA
BT RF/FM
DFE/DFLL
WL_REG_ON
PCIE PLL/RXTX
BT_REG_ON
VBAT*
Core Buck
Regulator
CBUCK
WLAN BBPLL/DFLL
1.35V
WLAN/BT/CLB/Top, always-on
WL OTP
VDDIO
LPLDO1
1.1V
CLDO
Max 300 mA
(Bypass in
deep sleep)
WL PHY
1.2V– 1.1V
WL DIGITAL
BT DIGITAL
WL/BT SRAMs
BTLDO2P5
Max 70 mA
2.5V
BT CLASS 1 PA
WL RF-PA (2.4 GHz, 5 GHz)
WL PAD (2.4 GHz, 5 GHz)
VDDIO_RF
Internal
LNLDO
*VBAT is the main power supply of the chip (ranges from 3.0 to 3.6V).
Broadcom®
January 19, 2016 • 43569-DS109-R
2.5V
Internal
LNLDO
2.5V
WL OTP 3.3V
WL RF – VCO
WL RF – CP
Page 19
BROADCOM CONFIDENTIAL
BCM43569 Advance Data Sheet
WLAN Power Management
WLAN Power Management
The BCM43569 has been designed with the stringent power consumption requirements of DTV, OTT, and STB
mobile devices in mind. All areas of the chip design are optimized to minimize power consumption. Silicon
processes and cell libraries were chosen to reduce leakage current and supply voltages. Additionally, the
BCM43569 integrated RAM is a high Vt memory with dynamic clock control. The dominant supply current
consumed by the RAM is leakage current only. Additionally, the BCM43569 includes an advanced WLAN power
management unit sequencer. The PMU sequencer provides significant power savings by putting the BCM43569
into various power management states appropriate to the current environment and activities that are being
performed. The power management unit enables and disables internal regulators, switches, and other blocks
based on a computation of the required resources and a table that describes the relationship between resources
and the time needed to enable and disable them. Power up sequences are fully programmable. Configurable,
free-running counters (running at 32.768 kHz LPO clock) in the PMU sequencer are used to turn on/turn off
individual regulators and power switches. Clock speeds are dynamically changed (or gated altogether) for the
current mode. Slower clock speeds are used wherever possible.
The BCM43569 WLAN power states are described as follows:
•
Active mode: All WLAN blocks in the BCM43569 are powered up and fully functional with active carrier
sensing and frame transmission and receiving. All required regulators are enabled and put in the most
efficient mode based on the load current. Clock speeds are dynamically adjusted by the PMU sequencer.
•
Doze mode: The radio, analog domains, and most of the linear regulators are powered down. The rest of
the BCM43569 remains powered up in an IDLE state. All main clocks (PLL, crystal oscillator, or TCXO) are
shut down to reduce active power to the minimum. The 32.768 kHz LPO clock is available only for the PMU
sequencer. This condition is necessary to allow the PMU sequencer to wake up the chip and transition to
Active mode. In Doze mode, the primary power consumed is due to leakage current.
•
Deep-sleep mode: Most of the chip including both analog and digital domains and most of the regulators
are powered off. Logic states in the digital core are saved and preserved into a retention memory in the
always-ON domain before the digital core is powered off. Upon a wake-up event triggered by the PMU
timers, an external interrupt or a host resume through the USB 2.0 bus, logic states in the digital core are
restored to their pre-deep-sleep settings to avoid lengthy HW reinitialization.
•
Power-down mode: The BCM43569 is effectively powered off by shutting down all internal regulators. The
chip is brought out of this mode by external logic re-enabling the internal regulators.
Broadcom®
January 19, 2016 • 43569-DS109-R
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BCM43569 Advance Data Sheet
PMU Sequencing
PMU Sequencing
The PMU sequencer is responsible for minimizing system power consumption. It enables and disables various
system resources based on a computation of the required resources and a table that describes the relationship
between resources and the time needed to enable and disable them.
Resource requests may come from several sources: clock requests from cores, the minimum resources defined
in the ResourceMin register, and the resources requested by any active resource request timers. The PMU
sequencer maps clock requests into a set of resources required to produce the requested clocks.
Each resource is in one of four states: enabled, disabled, transition_on, and transition_off and has a timer that
contains 0 when the resource is enabled or disabled and a non-zero value in the transition states. The timer is
loaded with the time_on or time_off value of the resource when the PMU determines that the resource must be
enabled or disabled. That timer decrements on each 32.768 kHz PMU clock. When it reaches 0, the state
changes from transition_off to disabled or transition_on to enabled. If the time_on value is 0, the resource can
go immediately from disabled to enabled. Similarly, a time_off value of 0 indicates that the resource can go
immediately from enabled to disabled. The terms enable sequence and disable sequence refer to either the
immediate transition or the timer load-decrement sequence.
During each clock cycle, the PMU sequencer performs the following actions:
•
Computes the required resource set based on requests and the resource dependency table.
•
Decrements all timers whose values are non zero. If a timer reaches 0, the PMU clears the
ResourcePending bit for the resource and inverts the ResourceState bit.
•
Compares the request with the current resource status and determines which resources must be enabled
or disabled.
•
Initiates a disable sequence for each resource that is enabled, no longer being requested, and has no
powered up dependents.
•
Initiates an enable sequence for each resource that is disabled, is being requested, and has all of its
dependencies enabled.
Broadcom®
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BROADCOM CONFIDENTIAL
BCM43569 Advance Data Sheet
Power-Off Shutdown
Power-Off Shutdown
The BCM43569 provides a low-power shutdown feature that allows the device to be turned off while the host,
and any other devices in the system, remain operational. When the BCM43569 is not needed in the system,
VDDIO_RF and VDDC are shut down while VDDIO remains powered. This allows the BCM43569 to be
effectively off, while keeping the I/O pins powered so that they do not draw extra current from any other devices
connected to the I/O.
During a low-power shut-down state, provided VDDIO remains applied to the BCM43569, all outputs are
tristated, and most inputs signals are disabled. Input voltages must remain within the limits defined for normal
operation. This is done to prevent current paths or create loading on any digital signals in the system, and
enables the BCM43569 to be fully integrated in an embedded device and take full advantage of the lowest
power-savings modes.
When the BCM43569 is powered on from this state, it is the same as a normal power-up and the device does
not retain any information about its state from before it was powered down.
Power-Up/Power-Down/Reset Circuits
The BCM43569 has two signals (see Table 2) that enable or disable the Bluetooth and WLAN circuits and the
internal regulator blocks, allowing the host to control power consumption. For timing diagrams of these signals
and the required power-up sequences, see Section 18: “Power-Up Sequence and Timing,” on page 112.
Table 2: Power-Up/Power-Down/Reset Control Signals
Signal
Description
WL_REG_ON
This signal is used by the PMU (with BT_REG_ON) to power up the WLAN section. It is also
OR-gated with the BT_REG_ON input to control the internal BCM43569 regulators. When
this pin is high, the regulators are enabled and the WLAN section is out of reset. When this
pin is low, the WLAN section is in reset. If BT_REG_ON and WL_REG_ON are both low, the
regulators are disabled. This pin has an internal 200 kΩ pull-down resistor that is enabled by
default. It can be disabled through programming.
BT_REG_ON
This signal is used by the PMU (with WL_REG_ON) to decide whether or not to power down
the internal BCM43569 regulators. If BT_REG_ON and WL_REG_ON are low, the
regulators will be disabled. This pin has an internal 200 kΩ pull-down resistor that is enabled
by default. It can be disabled through programming.
Broadcom®
January 19, 2016 • 43569-DS109-R
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BROADCOM CONFIDENTIAL
BCM43569 Advance Data Sheet
Frequency References
S e c t i o n 3 : F re q u e n c y R e f e r e n c e s
An external crystal is used for generating all radio frequencies and normal operation clocking. As an alternative,
an external frequency reference may be used. In addition, a low-power oscillator (LPO) is provided for lower
power mode timing.
Crystal Interface and Clock Generation
The BCM43569 can use an external crystal to provide a frequency reference. The recommended configuration
for the crystal oscillator including all external components is shown in Figure 4. Consult the reference
schematics for the latest configuration.
Figure 4: Recommended Oscillator Configuration
C*
WRF_XTAL_IN
40.0 MHz
C*
X ohms*
WRF_XTAL_OUT
* Values determined by crystal drive level.
See reference schematics for details.
A fractional-N synthesizer in the BCM43569 generates the radio frequencies, clocks, and data/packet timing,
enabling it to operate using a wide selection of frequency references.
The recommended default frequency reference is a 40.0 MHz crystal. For USB applications, see Table 3 on
page 24 for details. The signal characteristics for the crystal interface are listed in Table 3 on page 24.
Note: Although the fractional-N synthesizer can support alternative reference frequencies,
frequencies other than the default require support to be added in the driver, plus additional extensive
system testing. Contact Broadcom for further details.
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January 19, 2016 • 43569-DS109-R
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BROADCOM CONFIDENTIAL
BCM43569 Advance Data Sheet
External Frequency Reference
External Frequency Reference
As an alternative to a crystal, an external precision frequency reference can be used. The recommended default
frequency is 52 MHz ±10 ppm, and it must meet the phase noise requirements listed in Table 3.
If used, the external clock should be connected to the WRF_XTAL_IN pin through an external 1000 pF coupling
capacitor, as shown in Figure 5. The internal clock buffer connected to this pin will be turned off when the
BCM43569 goes into sleep mode. When the clock buffer turns on and off there will be a small impedance
variation. Power must be supplied to the WRF_XTAL_VDD1P5 pin.
Figure 5: Recommended Circuit to Use with an External Reference Clock
1000 pF
Reference
Clock
WRF_XTAL_IN
NC
WRF_XTAL_OUT
Table 3: Crystal Oscillator and External Clock—Requirements and Performance
Crystala
External Frequency
Referenceb c
Parameter
Conditions/Notes
Min.
Typ.
Max.
Min.
Typ.
Max.
Units
Frequency
2.4G and 5G bands:
IEEE 802.11ac operation
–
40
–
–
–
–
MHz
Frequency tolerance Without trimming
over the lifetime of the
equipment, including
temperatured
–20
–
20
–20
–
20
ppm
Crystal load
capacitance
–
–
12
–
–
–
–
pF
ESR
–
–
–
60
–
–
–
Ω
Drive level
External crystal must be able to 200
tolerate this drive level.
–
–
–
–
–
µW
Input impedance
(WRF_XTAL_IN)
Resistive
–
–
–
30
100
–
kΩ
Capacitive
–
–
7.5
–
–
7.5
pF
WRF_XTAL_IN
Input low level
DC-coupled digital signal
–
–
–
0
–
0.2
V
WRF_XTAL_IN
Input high level
DC-coupled digital signal
–
–
–
1.0
–
1.26
V
WRF_XTAL_IN
input voltage
(see Figure 5)
AC-coupled analog signal
–
–
–
400
–
1200
mVp-p
Duty cycle
40 MHz clock
–
–
–
40
50
60
%
Broadcom®
January 19, 2016 • 43569-DS109-R
Page 24
BROADCOM CONFIDENTIAL
BCM43569 Advance Data Sheet
External Frequency Reference
Table 3: Crystal Oscillator and External Clock—Requirements and Performance (Cont.)
Crystala
External Frequency
Referenceb c
Parameter
Conditions/Notes
Min.
Typ.
Max.
Min.
Typ.
Max.
Units
Phase noisee
(IEEE 802.11b/g)
40 MHz clock at 10 kHz offset
–
–
–
–
–
–129
dBc/Hz
40 MHz clock at 100 kHz offset –
–
–
–
–
–136
dBc/Hz
Phase noisee
(IEEE 802.11a)
40 MHz clock at 10 kHz offset
–
–
–
–
–
–137
dBc/Hz
40 MHz clock at 100 kHz offset –
–
–
–
–
–144
dBc/Hz
Phase noisee
(IEEE 802.11n,
2.4 GHz)
40 MHz clock at 10 kHz offset
–
–
–
–
–
–134
dBc/Hz
40 MHz clock at 100 kHz offset –
–
–
–
–
–141
dBc/Hz
Phase noisee
(IEEE 802.11n,
5 GHz)
40 MHz clock at 10 kHz offset
–
–
–
–
–
–142
dBc/Hz
40 MHz clock at 100 kHz offset –
–
–
–
–
–149
dBc/Hz
Phase noisee
(IEEE 802.11ac,
5 GHz)
40 MHz clock at 10 kHz offset
–
–
–
–
–
–150
dBc/Hz
40 MHz clock at 100 kHz offset –
–
–
–
–
–157
dBc/Hz
a. (Crystal) Use WRF_XTAL_IN and WRF_XTAL_OUT.
b. See “External Frequency Reference” on page 24 for alternative connection methods.
c. For a clock reference other than 40 MHz, 20 × log10(f/40) dB should be added to the limits, where f = the
reference clock frequency in MHz.
d. It is the responsibility of the equipment designer to select oscillator components that comply with these
specifications.
e. Assumes that the external clock has a flat phase noise response above 100 kHz.
Broadcom®
January 19, 2016 • 43569-DS109-R
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BROADCOM CONFIDENTIAL
BCM43569 Advance Data Sheet
Bluetooth Overview
Section 4: Bluetooth Overview
The BCM43569 is a Bluetooth 4.1 + EDR-compliant, baseband processor/2.4 GHz transceiver. It features the
highest level of integration and eliminates all critical external components, thus minimizing the footprint, power
consumption, and system cost of a Bluetooth radio solution.
The BCM43569 is the optimal solution for any Bluetooth voice and/or data application. The Bluetooth subsystem
presents a standard host controller interface (HCI) via a high-speed UART and PCM for audio. The BCM43569
incorporates all Bluetooth 4.1 features including secure simple pairing, sniff subrating, and encryption pause and
resume.
The BCM43569 Bluetooth radio transceiver provides enhanced radio performance. It is fully compatible with any
of the standard TCXO frequencies and provides full radio compatibility to operate simultaneously with GPS,
WLAN, and cellular radios.
The Bluetooth transmitter also features a class 1 power amplifier with class 2 capability.
Features
Major Bluetooth features of the BCM43569 include:
•
Supports key features of upcoming Bluetooth standards
•
Fully supports Bluetooth Core Specification version 4.1 + EDR features:
– Adaptive frequency hopping (AFH)
– Quality of service (QoS)
– Extended synchronous connections (eSCO)—voice connections
– Fast connect (interlaced page and inquiry scans)
– Secure simple pairing (SSP)
– Sniff subrating (SSR)
– Encryption pause resume (EPR)
– Extended inquiry response (EIR)
– Link supervision timeout (LST)
•
UART baud rates up to 4 Mbps
•
Supports all Bluetooth 4.1 + EDR packet types
•
Supports maximum Bluetooth data rates over HCI UART (interface capable but not currently supported in
software driver.)
•
BT supports full-speed USB 2.0-compliant interface
•
Multipoint operation with up to seven active slaves
– Maximum of seven simultaneous active ACL links
– Maximum of three simultaneous active SCO and eSCO connections with scatternet support
•
Trigger Broadcom fast connect (TBFC)
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January 19, 2016 • 43569-DS109-R
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BROADCOM CONFIDENTIAL
BCM43569 Advance Data Sheet
Bluetooth Radio
•
Narrowband and wideband packet loss concealment
•
Scatternet operation with up to four active piconets with background scan and support for scatter mode
•
High-speed HCI UART transport support with low-power out-of-band BT_DEV_WAKE and
BT_HOST_WAKE signaling (see “Host Controller Power Management” on page 31)
•
Channel quality driven data rate and packet type selection
•
Standard Bluetooth test modes
•
Extended radio and production test mode features
•
Full support for power savings modes
– Bluetooth clock request
– Bluetooth standard sniff
– Deep-sleep modes and software regulator shutdown
•
TCXO input and auto-detection of all standard handset clock frequencies. Also supports a low-power
crystal that can be used during power save mode for better timing accuracy.
Bluetooth Radio
The BCM43569 has an integrated radio transceiver that has been optimized for use in 2.4 GHz Bluetooth
wireless systems. It has been designed to provide low-power, low-cost, and robust communications for
applications operating in the globally available 2.4 GHz unlicensed ISM band. It is fully compliant with the
Bluetooth Radio Specification and EDR specification and meets or exceeds the requirements to provide the
highest communication link quality of service. An integrated T/R switch combines the Bluetooth transmit and
receive paths, and connects directly to a dedicated Bluetooth antenna.
Transmit
The BCM43569 features a fully integrated zero-IF transmitter. The baseband transmit data is GFSK-modulated
in the modem block and upconverted to the 2.4 GHz ISM band in the transmitter path. The transmitter path
contains signal filtering, I/Q upconversion, an output power amplifier, and RF filtering. The transmitter path also
incorporates /4-DQPSK for 2 Mbps and 8-DPSK for 3 Mbps to support EDR. The transmitter section is
compatible with the Bluetooth low-energy specification. The transmitter PA bias can also be adjusted to provide
Bluetooth class 1 or class 2 operation.
Digital Modulator
The digital modulator performs the data modulation and filtering required for the GFSK, /4-DQPSK, and
8-DPSK signal. The fully digital modulator minimizes any frequency drift or anomalies in the modulation
characteristics of the transmitted signal and is much more stable than direct VCO modulation schemes.
Digital Demodulator and Bit Synchronizer
The digital demodulator and bit synchronizer take the low-IF received signal and perform an optimal frequency
tracking and bit-synchronization algorithm.
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BCM43569 Advance Data Sheet
Bluetooth Radio
Power Amplifier
The fully integrated PA supports class 1 or class 2 output using a highly linearized, temperature-compensated
design. This provides greater flexibility in front-end matching and filtering. Due to the linear nature of the PA
combined with some integrated filtering, external filtering is required to meet the Bluetooth and regulatory
harmonic and spurious requirements. The transmitter features a sophisticated on-chip transmit signal strength
indicator (TSSI) block to keep the absolute output power variation within a tight range across process, voltage,
and temperature.
Receiver
The receiver path uses a low-IF scheme to downconvert the received signal for demodulation in the digital
demodulator and bit synchronizer. The receiver path provides a high degree of linearity, an extended dynamic
range, and high-order on-chip channel filtering to ensure reliable operation in the noisy 2.4 GHz ISM band. The
front-end topology, with built-in out-of-band attenuation, enables the BCM43569 to be used in most applications
with minimal off-chip filtering.
Digital Demodulator and Bit Synchronizer
The digital demodulator and bit synchronizer take the low-IF received signal and perform an optimal frequency
tracking and bit synchronization algorithm.
Receiver Signal Strength Indicator
The radio portion of the BCM43569 provides a receiver signal strength indicator (RSSI) signal to the baseband
controller so that the controller can take part in a Bluetooth power-controlled link, by providing a metric of its own
receiver signal strength, to determine whether the transmitter should increase or decrease its output power.
Local Oscillator Generation
Local Oscillator (LO) generation provides fast frequency hopping (1600 hops/second) across the 79 maximum
available channels. The LO generation subblock employs an architecture for high immunity to LO pulling during
PA operation. The BCM43569 uses an internal RF and IF loop filter.
Calibration
The BCM43569 radio transceiver features an automated calibration scheme that is fully self contained in the
radio. No user interaction is required during normal operation or during manufacturing to provide the optimal
performance. Calibration optimizes the performance of all the major blocks within the radio to within 2% of
optimal conditions, including gain and phase characteristics of filters, matching between key components, and
key gain blocks. During normal operation, calibration takes place transparently during the settling times that
follow frequency hops. Calibration data is used to compensate for process and temperature variations.
Broadcom®
January 19, 2016 • 43569-DS109-R
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BCM43569 Advance Data Sheet
Bluetooth Baseband Core
Section 5: Bluetooth Baseband Core
The Bluetooth baseband core (BBC) implements all of the time critical functions required for high-performance
Bluetooth operation. The BBC manages the buffering, segmentation, and routing of data for all connections. It
also buffers data that passes through it, handles data flow control, schedules SCO/ACL TX/RX transactions,
monitors Bluetooth slot usage, optimally segments and packages data into baseband packets, manages
connection status indicators, and composes and decodes HCI packets. In addition to these functions, it
independently handles HCI event types and HCI command types.
The following transmit and receive functions are also implemented in the BBC hardware to increase the
reliability and security of the TX/RX data before it is sent over the air:
•
Symbol timing recovery, data deframing, forward error correction (FEC), header error control (HEC), cyclic
redundancy check (CRC), data decryption, and data dewhitening in the receiver.
•
Data framing, FEC generation, HEC generation, CRC generation, key generation, data encryption, and
data whitening in the transmitter.
Bluetooth 4.1 Features
The BBC supports all Bluetooth 4.1 features with the following benefits:
•
Dual-mode Bluetooth low energy (BT and BLE operation)
•
Extended inquiry response (EIR): Shortens the time to retrieve the device name, specific profile, and
operating mode.
•
Encryption pause resume (EPR): Enables the use of Bluetooth technology in a much more secure
environment.
•
Sniff subrating: Optimizes power consumption for low duty cycle asymmetric data flow, which subsequently
extends battery life.
•
Secure simple pairing: Reduces the number of steps for connecting two devices, with minimal or no user
interaction required.
•
Link supervision time out (LSTO): Additional commands added to the HCI and Link Management Protocol
(LMP) for improved link time-out supervision.
•
QoS enhancements: Changes to data traffic control, resulting in better link performance. Audio, human
interface device (HID), bulk traffic, SCO, and enhanced SCO (eSCO) are improved with the erroneous data
(ED) and packet boundary flag (PBF) enhancements.
Bluetooth Low Energy
The BCM43569 supports the Bluetooth low energy operating mode.
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Link Control Layer
Link Control Layer
The link control layer is part of the Bluetooth link control functions that are implemented in dedicated logic in the
link control unit (LCU). This layer consists of the command controller that takes commands from the software,
and other controllers that are activated or configured by the command controller, to perform the link control
tasks. Each task performs a different state in the Bluetooth link controller.
•
Major states:
– Standby
– Connection
•
Substates:
– Page
– Page scan
– Inquiry
– Inquiry scan
– Sniff
Test Mode Support
The BCM43569 fully supports Bluetooth Test mode as described in Part I:1 of the Specification of the Bluetooth
System Version 3.0. This includes the transmitter tests, normal and delayed loopback tests, and reduced
hopping sequence.
In addition to the standard Bluetooth test mode, the BCM43569 also supports enhanced testing features to
simplify RF debugging and qualification and type-approval testing. These features include:
•
Fixed frequency carrier-wave (unmodulated) transmission
– Simplifies some type-approval measurements (Japan)
– Aids in transmitter performance analysis
•
Fixed frequency constant receiver operation
– Directs receiver output to an I/O pin
– Allows for direct BER measurements using standard RF test equipment
– Facilitates spurious emissions testing for receive mode
•
Fixed frequency constant transmission operation
– Provides an 8-bit fixed pattern or PRBS-9
– Enables modulated signal measurements with standard RF test equipment
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BCM43569 Advance Data Sheet
Bluetooth Power Management Unit
Bluetooth Power Management Unit
The Bluetooth power management unit (PMU) provides power management features that can be invoked by
software-controlled power management registers or packet data in the baseband core. The power management
functions provided by the BCM43569 are:
•
RF Power Management
•
Host Controller Power Management
•
BBC Power Management
RF Power Management
The BBC generates power-down control signals for the transmit path, receive path, PLL, and power amplifier to
the 2.4 GHz transceiver. The transceiver then processes the power-down functions accordingly.
Host Controller Power Management
When running in UART mode, the BCM43569 can be configured so that dedicated signals are used for power
management handshaking between it and the host. The basic power-saving functions supported by those
handshaking signals include the standard Bluetooth-defined power savings and standby modes.
Table 4 describes the power-control handshake signals used with the UART interface.
Table 4: Power Control Pin Description
Signal
Mapped to Pin
Type Description
BT_DEV_WAKE
J1
I
Bluetooth device wake up: Signal from the host to the
BCM43569 indicating that the host requires attention.
• Asserted: The Bluetooth device must wake up or remain
awake.
• Deasserted: The Bluetooth device may sleep when sleep
criteria are met.
The polarity of this signal is software configurable and can be
asserted high or low.
BT_HOST_WAKE
J2
O
Host wake up. Signal from the BCM43569 to the host
indicating that the BCM43569 requires attention.
• Asserted: The host device must wake up or remain awake.
• Deasserted: The host device may sleep when sleep
criteria are met.
The polarity of this signal is software configurable and can be
asserted high or low.
BT_CLK_REQ
J5
O
The BCM43569 asserts BT_CLK_REQ when either the
Bluetooth or WLAN functions want the host to turn on the
reference clock. The BT_CLK_REQ polarity is active-high.
Add an external 100 kΩ pull-down resistor to ensure that the
signal is deasserted when the BCM43569 powers up or resets
when VDDIO is present.
Note: Pad function Control Register is set to 0 for these pins (see “DC Characteristics” on page 83).
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BCM43569 Advance Data Sheet
Bluetooth Power Management Unit
Figure 6: Startup Signaling Sequence
LPO
VDDIO
Host I/Os
unconfigured
HostResetX
Host IOs
configured
T1
BT_DEV_WAKE
BT_REG_ON
BT_HOST_WAKE
T4
BT I/Os unconfigured
BT I/Os configured
Tsettle
T2
Indicates that the
BT device is ready
BT_UART_RTS_L
T3
BT_UART_CTS_L
BT_CLK_REQ
Tsettle
Driven
Pulled
Notes :
T1 is the time for host to settle its IOs after a reset.
T2 is the time for the BTH device to settle its IOs after a reset and reference clock settling time elapsed.
T3 is the time for the BT device to complete initialization and drive BT_UART_RTS_L low.
T4 is the setup time for BT_DEV_WAKE prior to driving BT_REG_ON high; BT_DEV_WAKE must be high prior to
BT_REG_ON being released. BT_DEV_WAKE should not be driven low until after the host has completed configuration.
Tsettle is the time for the reference clock signal from the host to be guaranteed to have settled.
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BCM43569 Advance Data Sheet
Bluetooth Power Management Unit
BBC Power Management
The following are low-power operations for the BBC:
•
Physical layer packet-handling turns the RF on and off dynamically within transmit/receive packets.
•
Bluetooth-specified low-power connection modes: sniff, hold, and park. While in these modes, the
BCM43569 runs on the low-power oscillator and wakes up after a predefined time period.
•
A low-power shutdown feature allows the device to be turned off while the host and any other devices in the
system remain operational. When the BCM43569 is not needed in the system, the RF and core supplies
are shut down while the I/O remains powered. This allows the BCM43569 to effectively be off while keeping
the I/O pins powered so they do not draw extra current from any other devices connected to the I/O.
During the low-power shut-down state, provided VDDIO remains applied to the BCM43569, all outputs are
tristated, and most input signals are disabled. Input voltages must remain within the limits defined for normal
operation. This is done to prevent current paths or create loading on any digital signals in the system and
enables the BCM43569 to be fully integrated in an embedded device to take full advantage of the lowest
power-saving modes.
Two BCM43569 input signals are designed to be high-impedance inputs that do not load the driving signal
even if the chip does not have VDDIO power supplied to it: the frequency reference input (WRF_TCXO_IN)
and the 32.768 kHz input (LPO). When the BCM43569 is powered on from this state, it is the same as a
normal power-up, and the device does not contain any information about its state from the time before it was
powered down.
Wideband Speech
The BCM43569 provides support for wideband speech (WBS) using on-chip SmartAudio technology. The
BCM43569 can perform subband-codec (SBC), as well as mSBC, encoding and decoding of linear 16 bits at
16 kHz (256 kbps rate) transferred over the PCM bus.
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BCM43569 Advance Data Sheet
Bluetooth Power Management Unit
Packet Loss Concealment
The packet loss concealment (PLC) improves apparent audio quality for systems with marginal link
performance. Bluetooth messages are sent in packets. When a packet is lost, it creates a gap in the received
audio bit-stream. Packet loss can be mitigated in several ways:
•
Fill in zeros.
•
Ramp down the output audio signal toward zero (this is the method used in current Bluetooth headsets).
•
Repeat the last frame (or packet) of the received bit-stream and decode it as usual (frame repeat).
These techniques cause distortion and popping in the audio stream. The BCM43569 uses a proprietary
waveform extension algorithm to provide dramatic improvement in the audio quality. Figure 7 and Figure 8 show
audio waveforms with and without Packet Loss Concealment. Broadcom PLC/BEC algorithms also support
wideband speech.
Figure 7: CVSD Decoder Output Waveform Without PLC
Packet Loss Causes Ramp-down
Figure 8: CVSD Decoder Output Waveform After Applying PLC
Audio Rate-Matching Algorithms
The BCM43569 has an enhanced rate-matching algorithm that uses interpolation algorithms to reduce audio
stream jitter that may be present when the rate of audio data coming from the host is not the same as the
Bluetooth audio data rates.
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Adaptive Frequency Hopping
Codec Encoding
The BCM43569 can support SBC and mSBC encoding and decoding for wideband speech.
Multiple Simultaneous A2DP Audio Stream
The BCM43569 has the ability to take a single audio stream and output it to multiple Bluetooth devices
simultaneously. This allows a user to share his or her music (or any audio stream) with a friend.
Burst Buffer Operation
The BCM43569 has a data buffer that can buffer data being sent over the HCI and audio transports, then send
the data at an increased rate. This mode of operation allows the host to sleep for the maximum amount of time,
dramatically reducing system current consumption.
Adaptive Frequency Hopping
The BCM43569 gathers link quality statistics on a channel by channel basis to facilitate channel assessment
and channel map selection. The link quality is determined using both RF and baseband signal processing to
provide a more accurate frequency-hop map.
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BCM43569 Advance Data Sheet
Advanced Bluetooth/WLAN Coexistence
Advanced Bluetooth/WLAN Coexistence
The BCM43569 includes advanced coexistence technologies that are only possible with a Bluetooth/WLAN
integrated die solution. These coexistence technologies are targeted at small form-factor platforms, such as
smart TVs, over-the-top (OTT) boxes, set-top boxes, and wireless speakers, including applications such as
VoWLAN + SCO and video-over-WLAN + high fidelity BT stereo.
The BCM43569 integrated solution enables MAC-layer signaling (firmware) and a greater degree of sharing via
an enhanced coexistence interface. Information is exchanged between the Bluetooth and WLAN cores without
host processor involvement.
The BCM43569 also supports Transmit Power Control on the STA together with standard Bluetooth TPC to limit
mutual interference and receiver desensitization. Preemption mechanisms are utilized to prevent AP
transmissions from colliding with Bluetooth frames. Improved channel classification techniques have been
implemented in Bluetooth for faster and more accurate detection and elimination of interferers (including nonWLAN 2.4 GHz interference).
The Bluetooth AFH classification is also enhanced by the WLAN core’s channel information.
Fast Connection (Interlaced Page and Inquiry Scans)
The BCM43569 supports page scan and inquiry scan modes that significantly reduce the average inquiry
response and connection times. These scanning modes are compatible with the Bluetooth version 2.1 page and
inquiry procedures.
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BCM43569 Advance Data Sheet
Microprocessor and Memory Unit for Bluetooth
Section 6: Microprocessor and Memory
Unit for Bluetooth
The Bluetooth microprocessor core is based on the ARM Cortex-M3 32-bit RISC processor with embedded ICERT debug and JTAG interface units. It runs software from the link control (LC) layer, up to the host controller
interface (HCI).
The ARM core is paired with a memory unit that contains 668 KB of ROM memory for program storage and boot
ROM, 200 KB of RAM for data scratch-pad and patch RAM code. The internal ROM allows for flexibility during
power-on reset to enable the same device to be used in various configurations. At power-up, the lower-layer
protocol stack is executed from the internal ROM memory.
External patches may be applied to the ROM-based firmware to provide flexibility for bug fixes or features
additions. These patches may be downloaded from the host to the BCM43569 through the UART transports.
RAM, ROM, and Patch Memory
The BCM43569 Bluetooth core has 200 KB of internal RAM which is mapped between general-purpose scratch
pad memory and patch memory and 668 KB of ROM used for the lower-layer protocol stack, test mode software,
and boot ROM. The patch memory capability enables the addition of code changes for purposes of feature
additions and bug fixes to the ROM memory.
Reset
The BCM43569 has an integrated power-on reset circuit that resets all circuits to a known power-on state. The
BT power-on reset (POR) circuit is out of reset after BT_REG_ON goes high. If BT_REG_ON is low, then the
POR circuit is held in reset.
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BCM43569 Advance Data Sheet
BT Peripheral Transport Unit
S e c t i o n 7 : B T P e r i p h e r a l Tr a n s p o r t U n i t
UART Transport Detection
The BT_HOST_WAKE pin is also used for BT transport detection.
Transport detection occurs during the power-up sequence, based on the following pin state:
•
If the BT_HOST_WAKE pin is not pulled low externally during power-up, then the default internal pull-up is
detected as high and it selects the UART transport interface.
•
If the BT_HOST_WAKE pin is pulled high, it detects the UART/USB interface.
PCM Interface
The BCM43569 supports two independent PCM interfaces that share pins with the serial flash interfaces.
Table 5 shows PCM signal mapping used in this data sheet:
Table 5: PCM-to-Serial Flash Interface Mapping
PCM Interface Pins
Serial Flash Interface Pins
BT_PCM_CLK
BT_SF_CLK
BT_PCM_IN
BT_SF_MISO
BT_PCM_OUT
BT_SF_MOSI
BT_PCM_SYNC
BT_SF_CS_L
The PCM interfaces on the BCM43569 can connect to linear PCM codecs in master or slave mode. In master
mode, the BCM43569 generates the BT_PCM_CLK and BT_PCM_SYNC signals, and in slave mode, these
signals are provided by another master on the PCM interface and are inputs to the BCM43569.
The configuration of the PCM interface can be adjusted by the host through the use of vendor-specific HCI
commands.
Slot Mapping
The BCM43569 supports up to three simultaneous full-duplex SCO or eSCO channels through the PCM
interface. These three channels are time-multiplexed onto the single PCM interface by using a time-slotting
scheme where the 8 kHz or 16 kHz audio sample interval is divided into as many as 16 slots. The number of
slots is dependent on the selected interface rate of 128 kHz, 512 kHz, or 1024 kHz. The corresponding number
of slots for these interface rate is 1, 2, 4, 8, and 16, respectively. Transmit and receive PCM data from an SCO
channel is always mapped to the same slot. The PCM data output driver tristates its output on unused slots to
allow other devices to share the same PCM interface signals. The data output driver tristates its output after the
falling edge of the PCM clock during the last bit of the slot.
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BCM43569 Advance Data Sheet
PCM Interface
Frame Synchronization
The BCM43569 supports both short- and long-frame synchronization in both master and slave modes. In shortframe synchronization mode, the frame synchronization signal is an active-high pulse at the audio frame rate
that is a single-bit period in width and is synchronized to the rising edge of the bit clock. The PCM slave looks
for a high on the falling edge of the bit clock and expects the first bit of the first slot to start at the next rising edge
of the clock. In long-frame synchronization mode, the frame synchronization signal is again an active-high pulse
at the audio frame rate; however, the duration is 3-bit periods and the pulse starts coincident with the first bit of
the first slot.
Data Formatting
The BCM43569 may be configured to generate and accept several different data formats. For conventional
narrowband speech mode, the BCM43569 uses 13 of the 16 bits in each PCM frame. The location and order of
these 13 bits can be configured to support various data formats on the PCM interface. The remaining three bits
are ignored on the input and may be filled with 0s, 1s, a sign bit, or a programmed value on the output. The
default format is 13-bit 2s complement data, left justified, and clocked MSB first.
Wideband Speech Support
When the host encodes Wideband Speech (WBS) packets in transparent mode, the encoded packets are
transferred over the PCM bus for an eSCO voice connection. In this mode, the PCM bus is typically configured
in master mode for a 4 kHz sync rate with 16-bit samples, resulting in a 64 kbps bit rate. The BCM43569 also
supports slave transparent mode using a proprietary rate-matching scheme. In SBC-code mode, linear 16-bit
data at 16 kHz (256 kbps rate) is transferred over the PCM bus.
Burst PCM Mode
In this mode of operation, the PCM bus runs at a significantly higher rate of operation to allow the host to duty
cycle its operation and save current. In this mode of operation, the PCM bus can operate at a rate of up to
24 MHz. This mode of operation is initiated with an HCI command from the host.
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BCM43569 Advance Data Sheet
PCM Interface
PCM Interface Timing
Short Frame Sync, Master Mode
Figure 9: PCM Timing Diagram (Short Frame Sync, Master Mode)
1
2
3
BT_PCM _CLK
4
BT_PCM _SYNC
8
BT_PCM_OUT
HIGH IM PEDANCE
5
7
6
BT_PCM_IN
Table 6: PCM Interface Timing Specifications (Short Frame Sync, Master Mode)
Reference Characteristics
Minimum
Typical
Maximum
Unit
1
PCM bit clock frequency
–
–
12
MHz
2
PCM bit clock low
41
–
–
ns
3
PCM bit clock high
41
–
–
ns
4
PCM_SYNC delay
0
–
25
ns
5
BT_PCM_OUT delay
0
–
25
ns
6
BT_PCM_IN setup
8
–
–
ns
7
BT_PCM_IN hold
8
–
–
ns
8
Delay from rising edge of BT_PCM_CLK during last 0
bit period to BT_PCM_OUT becoming high
impedance.
–
25
ns
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BCM43569 Advance Data Sheet
PCM Interface
Short Frame Sync, Slave Mode
Figure 10: PCM Timing Diagram (Short Frame Sync, Slave Mode)
1
2
3
BT_PCM_CLK
4
5
BT_PCM_SYNC
9
BT_PCM_OUT
HIGH IMPEDANCE
6
8
7
BT_PCM_IN
Table 7: PCM Interface Timing Specifications (Short Frame Sync, Slave Mode)
Reference Characteristics
Minimum
Typical Maximum Unit
1
PCM bit clock frequency
–
–
12
MHz
2
PCM bit clock low
41
–
–
ns
3
PCM bit clock high
41
–
–
ns
4
BT_PCM_SYNC setup
8
–
–
ns
5
BT_PCM_SYNC hold
8
–
–
ns
6
BT_PCM_OUT delay
0
–
25
ns
7
BT_PCM_IN setup
8
–
–
ns
8
BT_PCM_IN hold
8
–
–
ns
9
Delay from rising edge of BT_PCM_CLK
during last bit period to BT_PCM_OUT
becoming high impedance.
0
–
25
ns
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BCM43569 Advance Data Sheet
PCM Interface
Long Frame Sync, Master Mode
Figure 11: PCM Timing Diagram (Long Frame Sync, Master Mode)
1
2
3
BT_PCM_BCLK
4
BT_PCM_SYNC
8
BT_PCM_OUT
Bit 0
Bit 1
Bit 0
Bit 1
HIGH IMPEDANCE
5
6
BT_PCM_IN
7
Table 8: PCM Interface Timing Specifications (Long Frame Sync, Master Mode)
Reference Characteristics
Minimum Typical Maximum Unit
1
PCM bit clock frequency
–
–
12
MHz
2
PCM bit clock low
41
–
–
ns
3
PCM bit clock high
41
–
–
ns
4
BT_PCM_SYNC delay
0
–
25
ns
5
BT_PCM_OUT delay
0
–
25
ns
6
BT_PCM_IN setup
8
–
–
ns
7
BT_PCM_IN hold
8
–
–
ns
8
Delay from rising edge of BT_PCM_CLK
during last bit period to BT_PCM_OUT
becoming high impedance.
0
–
25
ns
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BCM43569 Advance Data Sheet
PCM Interface
Long Frame Sync, Slave Mode
Figure 12: PCM Timing Diagram (Long Frame Sync, Slave Mode)
1
2
3
BT_PCM_BCLK
4
5
BT_PCM _SYNC
9
Bit 0
BT_PCM _OUT
HIGH IM PEDANCE
Bit 1
6
7
BT_PCM_IN
Bit 0
8
Bit 1
Table 9: PCM Interface Timing Specifications (Long Frame Sync, Slave Mode)
Reference Characteristics
Minimum Typical
Maximum Unit
1
PCM bit clock frequency
–
12
2
PCM bit clock low
41
–
–
ns
3
PCM bit clock high
41
–
–
ns
4
BT_PCM_SYNC setup
8
–
–
ns
5
BT_PCM_SYNC hold
8
–
–
ns
6
BT_PCM_OUT delay
0
–
25
ns
7
BT_PCM_IN setup
8
–
–
ns
8
BT_PCM_IN hold
8
–
–
ns
9
Delay from rising edge of BT_PCM_CLK
during last bit period to BT_PCM_OUT
becoming high impedance.
0
–
25
ns
Broadcom®
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MHz
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BCM43569 Advance Data Sheet
PCM Interface
Short Frame Sync, Burst Mode
Figure 13: PCM Burst Mode Timing (Receive Only, Short Frame Sync)
1
2
3
BT_PCM_BCLK
4
5
BT_PCM_SYNC
6
7
BT_PCM_IN
Table 10: PCM Burst Mode (Receive Only, Short Frame Sync)
Reference
Characteristics
Minimum
Typical Maximum Unit
1
PCM bit clock frequency
–
–
24
MHz
2
PCM bit clock low
20.8
–
–
ns
3
PCM bit clock high
20.8
–
–
ns
4
BT_PCM_SYNC setup
8
–
–
ns
5
BT_PCM_SYNC hold
8
–
–
ns
6
BT_PCM_IN setup
8
–
–
ns
7
BT_PCM_IN hold
8
–
–
ns
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BCM43569 Advance Data Sheet
PCM Interface
Long Frame Sync, Burst Mode
Figure 14: PCM Burst Mode Timing (Receive Only, Long Frame Sync)
1
2
3
BT_PCM_BCLK
4
5
BT_PCM_SYNC
6
BT_PCM_IN
Bit 0
7
Bit 1
Table 11: PCM Burst Mode (Receive Only, Long Frame Sync)
Reference Characteristics
Minimum
Typical Maximum Unit
1
PCM bit clock frequency
–
–
24
MHz
2
PCM bit clock low
20.8
–
–
ns
3
PCM bit clock high
20.8
–
–
ns
4
BT_PCM_SYNC setup
8
–
–
ns
5
BT_PCM_SYNC hold
8
–
–
ns
6
BT_PCM_IN setup
8
–
–
ns
7
BT_PCM_IN hold
8
–
–
ns
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BCM43569 Advance Data Sheet
Bluetooth USB Interface
Bluetooth USB Interface
Features
The following USB interface features are supported:
•
USB Protocol, Revision 2.0, full-speed (12 Mbps) compliant including the hub
•
Optional hub compound device with up to three device cores internal to device
•
Bus or self-power, dynamic configuration for the hub
•
Global and selective suspend and resume with remote wake-up
•
Bluetooth HCI
•
HID and DFU
Operation
The BCM43569 can be configured to boot up as either a single USB peripheral or a USB hub with several USB
peripherals attached. As a single peripheral, the host detects a single USB Bluetooth device. In hub mode, the
host detects a hub with one to three of the ports already connected to USB devices (see Figure 15).
Figure 15: USB Compounded Device Configuration
Host
USB Compounded Device
Hub Controller
USB Device 1
HID Keyboard
USB Device 2
HID Mouse
USB Device 3
Bluetooth
Depending on the desired hub mode configuration, the BCM43569 can boot up showing the three ports
connected to logical USB devices internal to the BCM43569: a generic Bluetooth device, a mouse, and a
keyboard. In this mode, the mouse and keyboard are emulated devices, since they connect to real HID devices
via a Bluetooth link. The Bluetooth link to these HID devices is hidden from the USB host. To the host, the mouse
and/or keyboard appear to be directly connected to the USB port.
The USB device, configuration, and string descriptors are fully programmable, allowing manufacturers to
customize the descriptors, including vendor and product IDs, the BCM43569 uses to identify itself on the USB
port. To make custom USB descriptor information available at boot time, stored it in external NVRAM.
Despite the mode of operation (single peripheral or hub), the Bluetooth device is configured to include the
following interfaces:
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BCM43569 Advance Data Sheet
Bluetooth USB Interface
Interface 0
Contains a Control endpoint (Endpoint 0x00) for HCI commands, a Bulk In Endpoint (Endpoint
0x82) for receiving ACL data, a Bulk Out Endpoint (Endpoint 0x02) for transmitting ACL data,
and an Interrupt Endpoint (Endpoint 0x81) for HCI events.
Interface 1
Contains Isochronous In and Out endpoints (Endpoints 0x83 and 0x03) for SCO traffic. Several
alternate Interface 1 settings are available for reserving the proper bandwidth of isochronous
data (depending on the application).
Interface 2
Contains Bulk In and Bulk Out endpoints (Endpoints 0x84 and 0x04) used for proprietary testing
and debugging purposes. These endpoints can be ignored during normal operation.
The BCM43569 supports the USB hub and device model (USB, Revision 2.0, full-speed compliant). When the
hub is enabled, the BCM43569 handles all standard USB functions for the following devices:
•
HID keyboard
•
HID mouse
•
Bluetooth
All hub and device descriptors are firmware-programmable. This USB compound device configuration (see
Figure 15 on page 46) supports up to three downstream ports. This configuration can also be programmed to a
single USB device core. The device automatically detects activity on the USB interface when connected.
Therefore, no special configuration is needed to select HCI as the transport.
The hub’s downstream port definition is as follows:
•
Port 1 USB lite device core (for HID applications)
•
Port 2 USB lite device core (for HID applications)
•
Port 3 USB full device core (for Bluetooth applications)
When operating in hub mode, all three internal devices do not have to be enabled. Each internal USB device
can be optionally enabled. The configuration record in NVRAM determines which devices are present.
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BCM43569 Advance Data Sheet
Bluetooth USB Interface
USB Full-Speed Timing
Table 12 and Figure 16 show the timing specifications for the VDD_USB = 3.3V, VSS = 0V, and TA = 0°C to 85°C
operating temperature range.
Table 12: USB Full-Speed Timing Specifications
Reference
Characteristics
Minimum
Maximum
Unit
1
Transition rise time
4
20
ns
2
Transition fall time
4
20
ns
3
Rise/fall timing matching
90
111
%
4
Full-speed data rate
12 – 0.25%
12 + 0.25%
Mb/s
Figure 16: USB Full-Speed Timing
2
1
D+
90%
90%
VCRS
10%
10%
D-
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BCM43569 Advance Data Sheet
UART Interface
UART Interface
The BCM43569 has a UART host interface for Bluetooth. The UART is a standard 4-wire interface (RX, TX,
RTS, and CTS) with adjustable baud rates from 9600 bps to 4.0 Mbps. The interface features an automatic baud
rate detection capability that returns a baud rate selection. Alternatively, the baud rate may be selected through
a vendor-specific UART HCI command.
The UART has a 1040-byte receive FIFO and a 1040-byte transmit FIFO to support EDR. Access to the FIFOs
is conducted through the AHB interface through either DMA or the CPU. The UART supports the Bluetooth 4.1
UART HCI specification: H4, a custom Extended H4, and H5. The default baud rate is 115.2 Kbaud.
The UART supports the 3-wire H5 UART transport, as described in the Bluetooth specification (“Three-wire
UART Transport Layer”). Compared to H4, the H5 UART transport reduces the number of signal lines required
by eliminating the CTS and RTS signals.
The BCM43569 UART can perform XON/XOFF flow control and includes hardware support for the Serial Line
Input Protocol (SLIP). It can also perform wake-on activity. For example, activity on the RX or CTS inputs can
wake the chip from a sleep state.
Normally, the UART baud rate is set by a configuration record downloaded after device reset, or by automatic
baud rate detection, and the host does not need to adjust the baud rate. Support for changing the baud rate
during normal HCI UART operation is included through a vendor-specific command that allows the host to adjust
the contents of the baud rate registers. The BCM43569 UARTs operate correctly with the host UART as long as
the combined baud rate error of the two devices is within ±2%.
Table 13: Example of Common Baud Rates
Desired Rate
Actual Rate
Error (%)
4000000
4000000
0.00
3692000
3692308
0.01
3000000
3000000
0.00
2000000
2000000
0.00
1500000
1500000
0.00
1444444
1454544
0.70
921600
923077
0.16
460800
461538
0.16
230400
230796
0.17
115200
115385
0.16
57600
57692
0.16
38400
38400
0.00
28800
28846
0.16
19200
19200
0.00
14400
14423
0.16
9600
9600
0.00
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BCM43569 Advance Data Sheet
UART Interface
Figure 17: UART Timing
BT_UART_CTS_L
1
2
BT_UART_TXD
Midpoint of STOP bit
Midpoint of STOP bit
BT_UART_RXD
3
BT_UART_RTS_L
Table 14: UART Timing Specifications
Reference
Characteristics
Minimum
Typical
Maximum Unit
1
Delay time, BT_UART_CTS_L low to
BT_UART_TXD valid
–
–
1.5
Bit periods
2
Setup time, BT_UART_CTS_L high before
midpoint of stop bit
–
–
0.5
Bit periods
3
Delay time, midpoint of stop bit to
BT_UART_RTS_L high
–
–
0.5
Bit periods
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BROADCOM CONFIDENTIAL
I2S Interface
BCM43569 Advance Data Sheet
I2S Interface
The BCM43569 supports an I2S digital audio port for Bluetooth audio. The I2S interface supports both master
and slave modes. The I2S signals are:
•
I2S clock: BT_I2S_CLK
•
I2S word select: BT_I2S_WS
•
I2S data out: BT_I2S_DO
•
I2S data in: BT_I2S_DI
BT_I2S_CLK and BT_I2S_WS become outputs in master mode and inputs in slave mode, whereas BT_I2S_DO
always stays as an output. The channel word length is 16 bits, and the data is justified so that the MSB of the
left-channel data is aligned with the MSB of the I2S bus, in accord with the I2S specification. The MSB of each
data word is transmitted one bit clock cycle after the BT_I2S_WS transition, synchronous with the falling edge
of the bit clock. Left-channel data is transmitted when IBT_I2S_WS is low, and right-channel data is transmitted
when BT_I2S_WS is high. Data bits sent by the BCM43569 are synchronized with the falling edge of
BT_I2S_CLK and should be sampled by the receiver on the rising edge of BT_I2S_CLK.
The clock rate in master mode is either of the following:
48 kHz x 32 bits per frame = 1.536 MHz
48 kHz x 50 bits per frame = 2.400 MHz
The master clock is generated from the input reference clock using a N/M clock divider.
In the slave mode, any clock rate is supported to a maximum of 3.072 MHz.
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I2S Interface
BCM43569 Advance Data Sheet
I2S Timing
Note: Timing values specified in Table 15 are relative to high and low threshold levels.
Table 15: Timing for I2S Transmitters and Receivers
Transmitter
Clock period T
Receiver
Lower LImit
Upper Limit
Lower Limit
Upper Limit
Min.
Max.
Min.
Max.
Min.
Max.
Min.
Max.
Notes
Ttr
–
–
–
Tr
–
–
–
a
Master Mode: Clock generated by transmitter or receiver
HIGH tHC
0.35Ttr
–
–
–
0.35Ttr
–
–
–
b
LOWtLC
0.35Ttr
–
–
–
0.35Ttr
–
–
–
b
Slave Mode: Clock accepted by transmitter or receiver
HIGH tHC
–
0.35Ttr
–
–
–
0.35Ttr
–
–
c
LOW tLC
–
0.35Ttr
–
–
–
0.35Ttr
–
–
c
Rise time tRC
–
–
0.15Ttr
–
–
–
–
–
d
Delay tdtr
–
–
–
0.8T
–
–
–
–
e
Hold time thtr
0
–
–
–
–
–
–
–
d
Setup time tsr
–
–
–
–
–
0.2Tr
–
–
f
Hold time thr
–
–
–
–
–
0
–
–
f
Transmitter
Receiver
a. The system clock period T must be greater than Ttr and Tr because both the transmitter and receiver have to be
able to handle the data transfer rate.
b. At all data rates in master mode, the transmitter or receiver generates a clock signal with a fixed mark/space
ratio. For this reason, tHC and tLC are specified with respect to T.
c. In slave mode, the transmitter and receiver need a clock signal with minimum HIGH and LOW periods so that
they can detect the signal. So long as the minimum periods are greater than 0.35Tr, any clock that meets the
requirements can be used.
d. Because the delay (tdtr) and the maximum transmitter speed (defined by Ttr) are related, a fast transmitter driven
by a slow clock edge can result in tdtr not exceeding tRC which means thtr becomes zero or negative. Therefore,
the transmitter has to guarantee that thtr is greater than or equal to zero, so long as the clock rise-time tRC is not
more than tRCmax, where tRCmax is not less than 0.15Ttr.
e. To allow data to be clocked out on a falling edge, the delay is specified with respect to the rising edge of the
clock signal and T, always giving the receiver sufficient setup time.
f. The data setup and hold time must not be less than the specified receiver setup and hold time.
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I2S Interface
BCM43569 Advance Data Sheet
Note: The time periods specified in Figure 18 and Figure 19 are defined by the transmitter speed. The
receiver specifications must match transmitter performance.
Figure 18: I2S Transmitter Timing
T
tRC*
tLC > 0.35T
tHC > 0.35T
VH = 2.0V
SCK
VL = 0.8V
thtr > 0
totr < 0.8T
SD and WS
T = Clock period
Ttr = Minimum allowed clock period for transmitter
T = Ttr
* tRC is only relevant for transmitters in slave mode.
Figure 19: I2S Receiver Timing
T
tLC > 0.35T
tHC > 0.35
VH = 2.0V
SCK
VL = 0.8V
tsr > 0.2T
thr > 0
SD and WS
T = Clock period
Tr = Minimum allowed clock period for transmitter
T > Tr
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BCM43569 Advance Data Sheet
WLAN Global Functions
Section 8: WLAN Global Functions
WLAN CPU and Memory Subsystem
The BCM43569 WLAN section includes an integrated ARM Cortex-R4 32-bit processor with internal RAM and
ROM. The ARM Cortex-R4 is a low-power processor that features low gate count, low interrupt latency, and lowcost debug capabilities. It is intended for deeply embedded applications that require fast interrupt response
features. Delivering more than 30% performance gain over ARM7TDMI, the ARM Cortex-R4 implements the
ARM v7-R architecture with support for the Thumb-2 instruction set.
At 0.19 µW/MHz, the Cortex-R4 is the most power efficient general-purpose microprocessor available,
outperforming 8- and 16-bit devices on MIPS/µW. It supports integrated sleep modes.
Using multiple technologies to reduce cost, the ARM Cortex-R4 offers improved memory utilization, reduced pin
overhead, and reduced silicon area. It supports independent buses for Code and Data access (ICode/DCode
and System buses), and extensive debug features including real time trace of program execution.
On-chip memory for the CPU includes 768 KB SRAM and 640 KB ROM.
One-Time Programmable Memory
Various hardware configuration parameters may be stored in an internal one-time programmable (OTP)
memory, which is read by the system software after device reset. In addition, customer-specific parameters,
including the system vendor ID and the MAC address can be stored, depending on the specific board design.
Up to 484 bytes of user-accessible OTP are available.
The initial state of all bits in an unprogrammed OTP device is 0. After any bit is programmed to a 1, it cannot be
reprogrammed to 0. The entire OTP array can be programmed in a single write cycle using a utility provided with
the Broadcom WLAN manufacturing test tools. Alternatively, multiple write cycles can be used to selectively
program specific bytes, but only bits which are still in the 0 state can be altered during each programming cycle.
Prior to OTP programming, all values should be verified using the appropriate editable nvram.txt file, which is
provided with the reference board design package.
GPIO Interface
The WLAN section of the BCM43569 supports 16 GPIOs.
Upon power up and reset, these pins become tristated. Subsequently, they can be programmed to be either
input or output pins via the GPIO control register. In addition, the GPIO pins can be assigned to various other
functions, see Table 22: “GPIO Alternative Signal Functions,” on page 79.
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BCM43569 Advance Data Sheet
WLAN USB 2.0 Interface
WLAN USB 2.0 Interface
Figure 20 details the WLAN USB 2.0 host interface.
Figure 20: WLAN USB 2.0 Host Interface Block Diagram
Controller
Section
System Memory
xDC
AMBA AXI
Bus Interface
Application Interface Unit
Data FIFOs and Queues
USB Protocol and MAC
USB PHY
VBUS
D+
D-
The BCM43569 has an USB 2.0 protocol engine that supports the following hardware interfaces:
•
Advanced microcontroller bus architecture (AMBA)/advanced extensible interface (AXI) for an AXI
interconnect.
•
AMPB advanced peripheral bus (APB) for extensible device controller (xDC) certificate signing request
(CSR) access.
•
Interrupts
•
D+/D– as USB signaling
•
VBUS presence is required to indicate that xDC is connected to a host.
The device properties and endpoints [0 to 127] are stored inside the BCM43569 system memory, in which each
endpoint consists of transfer ring and is linked to data buffers.
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BCM43569 Advance Data Sheet
UART Interface
Figure 21: WLAN USB Timing
End of host
chirp
Start of host
40–60 µs
< 100 µs
100–500 µs
DP
DM
Start of reset
> 10 ms
Table 16: USB2.0 Electrical Parameters
Parameter
Symbol
Condition
Min.
Typ.
Max.
Unit
Supply voltage
VDD33
–
2.97
3.30
3.63
V
Operation
temperature
TEMP
Die temperature
–40
25
125
°C
Current consumption ISUSP
Suspend mode
3.3V
–
–
500a
μA
Current consumption IHSTX
HS mode
3.3V
–
28
–
mA
a. Refer to USB 2.0 Standard Specification for details (see Reference [2] on page 12).
UART Interface
One 2-wire UART interface can be enabled by software as an alternate function on GPIO pins. Refer to
Table 22: “GPIO Alternative Signal Functions,” on page 79. Provided primarily for debugging during
development, this UART enables the BCM43569 to operate as RS-232 data termination equipment (DTE) for
exchanging and managing data with other serial devices. It is compatible with the industry standard 16550
UART, and provides a FIFO size of 64 × 8 in each direction.
JTAG Interface
The BCM43569 supports the IEEE 1149.1 JTAG boundary scan standard for performing device package and
PCB assembly testing during manufacturing. In addition, the JTAG interface allows Broadcom to assist
customers by using proprietary debug and characterization test tools during board bring-up. Therefore, it is
highly recommended to provide access to the JTAG pins by means of test points or a header on all PCB designs.
Refer to Table 22: “GPIO Alternative Signal Functions,” on page 79 for JTAG pin assignments.
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BCM43569 Advance Data Sheet
SPROM Interface
SPROM Interface
The BCM43569 is capable of but is not currently supporting SPROM interface as a main feature.
Various hardware configuration parameters may be stored in an external SPROM instead of the OTP. The
SPROM is read by system software after device reset. In addition, depending on the board design, customerspecific parameters may be stored in SPROM.
The four SPROM control signals—SPROM_CS, SPROM_CLK, SPROM_MI, and SPROM_MO are multiplexed
on the GPIO interface (see Table 22: “GPIO Alternative Signal Functions,” on page 79 for additional details). By
default, the SPROM interface supports 2 kbit serial SPROMs, and it can also support 4 kbit and 16 kbit serial
SPROMs by using the appropriate strapping option.
SFLASH Interface
The BCM43569 is capable of but is not currently supporting SFLASH interface as a main feature.
For use only when the HSIC interface mode is selected, an interface to external SFLASH is available.
The four SFLASH control signals —SFLASH_CS#, SFLASH_CLK, SFLASH_MI, and SFLASH_MO are
multiplexed on the GPIO interface (see Table 22: “GPIO Alternative Signal Functions,” on page 79 for additional
details).
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BCM43569 Advance Data Sheet
Wireless LAN MAC and PHY
S e c t i o n 9 : Wi r e l e s s L A N M A C a n d P H Y
IEEE 802.11ac Draft MAC
The BCM43569 WLAN MAC is designed to support high-throughput operation with low-power consumption. It
does so without compromising the Bluetooth coexistence policies, thereby enabling optimal performance over
both networks. In addition, several power saving modes have been implemented that allow the MAC to consume
very little power while maintaining network-wide timing synchronization. The architecture diagram of the MAC
is shown in Figure 22.
The following sections provide an overview of the important modules in the MAC.
Figure 22: WLAN MAC Architecture
Embedded CPU Interface
Host Registers, DMA Engines
TX-FIFO
32 KB
PMQ
RX-FIFO
10 KB
PSM
PSM
UCODE
Memory
IFS
Backoff, BTCX
WEP
TKIP, AES, WAPI
TSF
SHM
BUS
IHR
NAV
EXT- IHR
BUS
TXE
TX A-MPDU
RXE
RX A-MPDU
Shared Memory
6 KB
MAC-PHY Interface
The BCM43569 WLAN media access controller (MAC) supports features specified in the IEEE 802.11 base
standard, and amended by IEEE 802.11n. The key MAC features include:
•
Enhanced MAC for supporting IEEE 802.11ac Draft features
•
Transmission and reception of aggregated MPDUs (A-MPDU) for high throughput (HT)
•
Support for power management schemes, including WMM power-save, power-save multi-poll (PSMP) and
multiphase PSMP operation
•
Support for immediate ACK and Block-ACK policies
•
Interframe space timing support, including RIFS
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BCM43569 Advance Data Sheet
IEEE 802.11ac Draft MAC
•
Support for RTS/CTS and CTS-to-self frame sequences for protecting frame exchanges
•
Back-off counters in hardware for supporting multiple priorities as specified in the WMM specification
•
Timing synchronization function (TSF), network allocation vector (NAV) maintenance, and target beacon
transmission time (TBTT) generation in hardware
•
Hardware offload for AES-CCMP, legacy WPA TKIP, legacy WEP ciphers, WAPI, and support for key
management
•
Support for coexistence with Bluetooth
•
Programmable independent basic service set (IBSS) or infrastructure basic service set functionality
•
Statistics counters for MIB support
PSM
The programmable state machine (PSM) is a micro-coded engine, which provides most of the low-level control
to the hardware, to implement the IEEE 802.11 specification. It is a microcontroller that is highly optimized for
flow control operations, which are predominant in implementations of communication protocols. The instruction
set and fundamental operations are simple and general, which allows algorithms to be optimized until very late
in the design process. It also allows for changes to the algorithms to track evolving IEEE 802.11 specifications.
The PSM fetches instructions from the microcode memory. It uses the shared memory to obtain operands for
instructions, as a data store, and to exchange data between both the host and the MAC data pipeline (via the
SHM bus). The PSM also uses a scratch-pad memory (similar to a register bank) to store frequently accessed
and temporary variables.
The PSM exercises fine-grained control over the hardware engines, by programming internal hardware registers
(IHR). These IHRs are co-located with the hardware functions they control, and are accessed by the PSM via
the IHR bus.
The PSM fetches instructions from the microcode memory using an address determined by the program
counter, instruction literal, or a program stack. For ALU operations the operands are obtained from shared
memory, scratch-pad, IHRs, or instruction literals, and the results are written into the shared memory, scratchpad, or IHRs.
There are two basic branch instructions: conditional branches and ALU based branches. To better support the
many decision points in the IEEE 802.11 algorithms, branches can depend on either a readily available signals
from the hardware modules (branch condition signals are available to the PSM without polling the IHRs), or on
the results of ALU operations.
WEP
The wired equivalent privacy (WEP) engine encapsulates all the hardware accelerators to perform the
encryption and decryption, and MIC computation and verification. The accelerators implement the following
cipher algorithms: legacy WEP, WPA TKIP, WPA2 AES-CCMP.
The PSM determines, based on the frame type and association information, the appropriate cipher algorithm to
be used. It supplies the keys to the hardware engines from an on-chip key table. The WEP interfaces with the
TXE to encrypt and compute the MIC on transmit frames, and the RXE to decrypt and verify the MIC on receive
frames.
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BCM43569 Advance Data Sheet
IEEE 802.11ac Draft MAC
TXE
The transmit engine (TXE) constitutes the transmit data path of the MAC. It coordinates the DMA engines to
store the transmit frames in the TXFIFO. It interfaces with WEP module to encrypt frames, and transfers the
frames across the MAC-PHY interface at the appropriate time determined by the channel access mechanisms.
The data received from the DMA engines are stored in transmit FIFOs. The MAC supports multiple logical
queues to support traffic streams that have different QoS priority requirements. The PSM uses the channel
access information from the IFS module to schedule a queue from which the next frame is transmitted. Once
the frame is scheduled, the TXE hardware transmits the frame based on a precise timing trigger received from
the IFS module.
The TXE module also contains the hardware that allows the rapid assembly of MPDUs into an A-MPDU for
transmission. The hardware module aggregates the encrypted MPDUs by adding appropriate headers and pad
delimiters as needed.
RXE
The receive engine (RXE) constitutes the receive data path of the MAC. It interfaces with the DMA engine to
drain the received frames from the RXFIFO. It transfers bytes across the MAC-PHY interface and interfaces with
the WEP module to decrypt frames. The decrypted data is stored in the RXFIFO.
The RXE module contains programmable filters that are programmed by the PSM to accept or filter frames
based on several criteria such as receiver address, BSSID, and certain frame types.
The RXE module also contains the hardware required to detect A-MPDUs, parse the headers of the containers,
and disaggregate them into component MPDUS.
IFS
The IFS module contains the timers required to determine interframe space timing including RIFS timing. It also
contains multiple backoff engines required to support prioritized access to the medium as specified by WMM.
The interframe spacing timers are triggered by the cessation of channel activity on the medium, as indicated by
the PHY. These timers provide precise timing to the TXE to begin frame transmission. The TXE uses this
information to send response frames or perform transmit frame-bursting (RIFS or SIFS separated, as within a
TXOP).
The backoff engines (for each access category) monitor channel activity, in each slot duration, to determine
whether to continue or pause the backoff counters. When the backoff counters reach 0, the TXE gets notified,
so that it may commence frame transmission. In the event of multiple backoff counters decrementing to 0 at the
same time, the hardware resolves the conflict based on policies provided by the PSM.
The IFS module also incorporates hardware that allows the MAC to enter a low-power state when operating
under the IEEE power save mode. In this mode, the MAC is in a suspended state with its clock turned off. A
sleep timer, whose count value is initialized by the PSM, runs on a slow clock and determines the duration over
which the MAC remains in this suspended state. Once the timer expires the MAC is restored to its functional
state. The PSM updates the TSF timer based on the sleep duration ensuring that the TSF is synchronized to
the network. The IFS module also contains the PTA hardware that assists the PSM in Bluetooth coexistence
functions.
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BCM43569 Advance Data Sheet
IEEE 802.11ac Draft MAC
TSF
The timing synchronization function (TSF) module maintains the TSF timer of the MAC. It also maintains the
target beacon transmission time (TBTT). The TSF timer hardware, under the control of the PSM, is capable of
adopting timestamps received from beacon and probe response frames in order to maintain synchronization
with the network.
The TSF module also generates trigger signals for events that are specified as offsets from the TSF timer, such
as uplink and downlink transmission times used in PSMP.
NAV
The network allocation vector (NAV) timer module is responsible for maintaining the NAV information conveyed
through the duration field of MAC frames. This ensures that the MAC complies with the protection mechanisms
specified in the standard.
The hardware, under the control of the PSM, maintains the NAV timer and updates the timer appropriately based
on received frames. This timing information is provided to the IFS module, which uses it as a virtual carriersense indication.
MAC-PHY Interface
The MAC-PHY interface consists of a data path interface to exchange RX/TX data from/to the PHY. In addition,
there is an programming interface, which can be controlled either by the host or the PSM to configure and control
the PHY.
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BCM43569 Advance Data Sheet
IEEE 802.11ac Draft PHY
IEEE 802.11ac Draft PHY
The BCM43569 WLAN Digital PHY is designed to comply with IEEE 802.11ac Draft and IEEE 802.11a/b/g/n
dual-stream specifications to provide wireless LAN connectivity supporting data rates from 1 Mbps to
866.7 Mbps for low-power, high-performance applications.
The PHY has been designed to work in the presence of interference, radio nonlinearity, and various other
impairments. It incorporates optimized implementations of the filters, FFT and Viterbi decoder algorithms.
Efficient algorithms have been designed to achieve maximum throughput and reliability, including algorithms for
carrier sense/rejection, frequency/phase/timing acquisition and tracking, channel estimation and tracking. The
PHY receiver also contains a robust IEEE 802.11b demodulator. The PHY carrier sense has been tuned to
provide high throughput for IEEE 802.11g/11b hybrid networks with Bluetooth coexistence.
The key PHY features include:
•
Programmable data rates from MCS0–MCS15 in 20 MHz, 40 MHz, and 80 MHz channels, as specified in
IEEE 802.11ac Draft
•
Supports Optional Short GI and Green Field modes in TX and RX
•
TX and RX LDPC for improved range and power efficiency
•
Beamforming support
•
All scrambling, encoding, forward error correction, and modulation in the transmit direction and inverse
operations in the receive direction.
•
Supports IEEE 802.11h/k for worldwide operation
•
Advanced algorithms for low power, enhanced sensitivity, range, and reliability
•
Algorithms to improve performance in presence of Bluetooth
•
Closed loop transmit power control
•
Digital RF chip calibration algorithms to handle CMOS RF chip non-idealities
•
On-the-fly channel frequency and transmit power selection
•
Supports per packet RX antenna diversity
•
Available per-packet channel quality and signal strength measurements
•
Designed to meet FCC and other worldwide regulatory requirements
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BCM43569 Advance Data Sheet
IEEE 802.11ac Draft PHY
Figure 23: WLAN PHY Block Diagram
CCK/DSSS
Demodulate
Filters and Radio
Comp
Frequency and
Timing Synch
OFDM
Demodulate
Radio Control
Block
Carrier Sense, AGC,
and Rx FSM
Buffers
Viterbi Decoder
Descramble and
Deframe
MAC
Interface
FFT/IFFT
AFE
and
Radio
Tx FSM
Common Logic Block
Modulation and
Coding
Frame and
Scramble
Filters and Radio
Comp
PA Comp
Modulate/Spread
COEX
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BCM43569 Advance Data Sheet
WLAN Radio Subsystem
Section 10: WLAN Radio Subsystem
The BCM43569 includes an integrated dual-band WLAN RF transceiver that has been optimized for use in
2.4 GHz and 5 GHz Wireless LAN systems. It has been designed to provide low-power, low-cost, and robust
communications for applications operating in the globally available 2.4 GHz unlicensed ISM or 5 GHz U-NII
bands. The transmit and receive sections include all on-chip filtering, mixing, and gain control functions.
Sixteen RF control signals are available (eight per core) to drive external RF switches and support optional
external power amplifiers and low-noise amplifiers for each band. See the reference board schematics for
further details.
Receiver Path
The BCM43569 has a wide dynamic range, direct conversion receiver that employs high-order on-chip channel
filtering to ensure reliable operation in the noisy 2.4 GHz ISM band or the entire 5 GHz U-NII band. Control
signals are available that can support the use of optional LNAs for each band, which can increase the receive
sensitivity by several decibels.
Transmitter Path
Baseband data is modulated and upconverted to the 2.4 GHz ISM or 5-GHz U-NII bands, respectively. Linear
on-chip power amplifiers are included, which are capable of delivering high output powers while meeting
IEEE 802.11ac and IEEE 802.11a/b/g/n specifications without the need for external PAs. When using the
internal PAs, closed-loop output power control is completely integrated.
Calibration
The BCM43569 features dynamic and automatic on-chip calibration to continually compensate for temperature
and process variations across components. These calibration routines are performed periodically in the course
of normal radio operation. Examples of some of the automatic calibration algorithms are baseband filter
calibration for optimum transmit and receive performance, and LOFT calibration for carrier leakage reduction.
In addition, I/Q Calibration, R Calibration, and VCO Calibration are performed on-chip. No per-board calibration
is required in manufacturing test, which helps to minimize the test time and cost in large volume production.
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BCM43569 Advance Data Sheet
Ball Map and Signal Descriptions
S e c t i on 11 : B a l l M a p a n d Si g n a l
D e s c ri p t i o n s
Ball Map
Figure 24 and Figure 25 on page 66 show the FCBGA ball map.
Figure 24: FCBGA Ball Map, 10 mm × 10 mm Array, 254 Balls, A1–AC12 (Top View, Balls Facing Down)
1
2
A
VSSC
GPIO_5
B
BT_USB_DN
VSSC
C
BT_USB_DP
BT_SF_CLK
D
E
4
GPIO_6
5
GPIO_2
6
7
8
9
USB2_DP
USB2_AVSSBG
USB2_RREF
USB3_RDP
USB3_TDP
USB2_DM
USB2_AVSS
USB3_RDN
USB3_TDN
USB2_AVDD3P3
10
USB2_AVDD1P2
11
BT_UART_RXD
BT_I2S_CLK
USB3_PVDD1P2
BT_UART_CTS_L
BT_I2S_WS
BT_UART_TXD
BT_SF_MISO
GPIO_4
BT_GPIO_4
H
OTP_VDD33
LPO_IN
J
BT_DEV_WAKE
BT_HOST_WAKE
BT_CLK_REQ
K
BT_IFVDD1P2
BT_VCOVDD1P2
BTRGND
L
BT_LNAVDD1P2
BT_PLLVDD1P2
USB2_MONPLL
BT_I2S_DO
USB3_TRVDD1P2
BT_I2S_DI
VSSC
VSS
BTRGND
BTRGND
BTRGND
USB2_MONCDR
USB3_DVDD1P2
BT_SF_MOSI
M
12
USB3_TRGND
BT_SF_CS_L
F
G
3
AVDD_BBPLL
AVSS_BBPLL
VDDC
VDD
BT_GPIO_2
BT_VDDO
BT_VDDC
N
BT_RF
BT_GPIO_3
BTRGND
BT_VDDC
P
BT_PAVDD2P5
BT_GPIO_5
BTRGND
BTRGND
R
BTRGND
BTRGND
BTRGND
BTRGND
T
WRF_RFIN_2G_COR
E0
RGND
RGND
RGND
U
RGND
RGND
RGND
V
WRF_RFOUT_2G_C
ORE0
RGND
RGND
RGND
RGND
RGND
RGND
W
RGND
RGND
RGND
WRF_TSSI_A_
CORE0
RGND
WRF_GPIO_OUT_
CORE0
Y
WRF_PA2G_VBAT_
VDD3P3_CORE0
AA
WRF_PADRV_
VBAT_VDD3P3_
CORE0
RGND
AB
WRF_PA5G_
VBAT_VDD3P3_
CORE0
RGND
RGND
RGND
AC
RGND
WRF_RFOUT_5G_C
ORE0
1
2
VDDC
VDDC
VSSC
VSSC
WRF_PFD_
GND1P2
WRF_CP_
GND1P2
WRF_MMD_
GND1P2
RGND
RGND
RGND
BTRGND
RGND
RGND
RGND
RGND
WRF_RFIN_5G_
CORE0
RGND
WRF_BUCK_
VDD1P5_CORE0
WRF_PFD_
VDD1P2
WRF_MMD_
VDD1P2
WRF_SYNTH_
VBAT_VDD3P3
RGND
WRF_RFIN_2G_
CORE1
RGND
3
4
5
6
7
8
9
10
11
12
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January 19, 2016 • 43569-DS109-R
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BROADCOM CONFIDENTIAL
BCM43569 Advance Data Sheet
Ball Map
Figure 25: FCBGA Ball Map, 10 mm × 10 mm Array, 254 Balls, A12–AC23 (Top View, Balls Facing Down)
12
USB3_PVDD1P2
15
16
17
18
19
20
21
22
23
USB3_PTESTP
13
USB3_REFCLKN
BT_UART_RTS_L
VOUT_CLDO
VSSC
VSSC
SR_VLX
SR_VLX
SR_PVSS
SR_PVSS
A
USB3_PTESTN
USB3_REFCLKP
GPIO_1
GPIO_0
SR_VDDBATA5V
B
USB3_PGND
NC
SR_VDDBATP5V
SR_VDDBATP5V
C
NC
NC
LDO_VDD1P5
LDO_VDD1P5
D
VOUT_LDO3P3_B
VOUT_LDO3P3_B
E
VOUT_3P3
VOUT_3P3
F
LDO_VDDBAT5V
LDO_VDDBAT5V
G
USB3_TRVDD1P2
USB3_DVDD1P2
14
JTAG_SEL
GPIO_3
VSSC
PMU_AVSS
WL_REG_ON
NC
VOUT_3P3_SENSE
NC
VSSC
VSSC
BT_REG_ON
VSSC
GPIO_15
GPIO_14
VOUT_BTLDO2P5
H
VSS
VSS
VDDIO_PMU
GPIO_12
GPIO_11
VOUT_LNLDO
J
VDDC
VDDC
VDDIO
GPIO_9
GPIO_13
RF_SW_CTRL_13
K
VDDIO_RF
RF_SW_CTRL_15
GPIO_10
RF_SW_CTRL_12
L
RF_SW_CTRL_14
GPIO_8
RF_SW_CTRL_11
M
RF_SW_CTRL_6
GPIO_7
RF_SW_CTRL_10
N
RF_SW_CTRL_4
RF_SW_CTRL_9
RF_SW_CTRL_5
RF_SW_CTRL_7
VDDC
VDDC
VDDC
VDDC
VSSC
VSSC
VDDC
VDDC
VSSC
VSSC
VSSC
VSSC
VSSC
VSSC
VSSC
WRF_MMD_
GND1P2
VSSC
RGND
RGND
WRF_LOGENG_
GND1P2
RGND
RGND
WRF_TSSI_A_
CORE1
RGND
WRF_GPIO_OUT_
CORE1
RGND
RGND
RGND
RGND
RF_SW_CTRL_8
RF_SW_CTRL_3
RGND
WRF_VCO_
GND1P2
P
R
T
RF_SW_CTRL_0
WRF_XTAL_
GND1P2
WRF_XTAL_OUT
U
RGND
RF_SW_CTRL_2
WRF_XTAL_
GND1P2
WRF_XTAL_IN
V
RGND
RF_SW_CTRL_1
WRF_XTAL_
GND1P2
WRF_XTAL_
VDD1P2
W
WRF_XTAL_
GND1P2
WRF_XTAL_
VDD1P5
Y
RGND
WRF_BUCK_
VDD1P5_CORE1
AA
RGND
RGND
RGND
RGND
RGND
RGND
AB
AC
RGND
WRF_RFOUT_2G_
CORE1
RGND
WRF_PA2G_
VBAT_VDD3P3_
CORE1
WRF_PADRV_
VBAT_VDD3P3_
CORE1
WRF_PA5G_
VBAT_VDD3P3_
CORE1
RGND
RGND
WRF_RFOUT_5G_C
ORE1
RGND
WRF_RFIN_5G_
CORE1
RGND
12
13
14
15
16
17
18
19
20
21
22
23
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January 19, 2016 • 43569-DS109-R
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BROADCOM CONFIDENTIAL
BCM43569 Advance Data Sheet
Pin List
Pin List
Table 17: Pin List (Cont.)
Table 17: Pin List
Ball
Name
Ball
Name
A1
VSSC
C23
SR_VDDBATP5V
A2
GPIO_5
D2
BT_SF_CS_L
A6
USB2_DP
D12
USB3_PVDD1P2
A7
USB2_AVSSBG
D13
NC
A8
USB2_RREF
A9
USB3_RDP
A11
USB3_TDP
A13
USB3_PTESTP
A15
USB3_REFCLKN
A16
BT_UART_RTS_L
A17
VOUT_CLDO
A20
SR_VLX
A21
SR_VLX
A22
SR_PVSS
A23
SR_PVSS
B1
BT_USB_DN
B2
VSSC
B3
GPIO_6
B4
GPIO_2
B6
USB2_DM
B7
USB2_AVSS
B9
PCIE_AVSS
B11
USB3_TDN
B12
PCIE_AVSS
B13
USB3_PTESTN
B15
USB3_REFCLKP
B17
GPIO_1
B18
GPIO_0
B23
SR_VDDBATA5V
C1
BT_USB_DP
C2
BT_SF_CLK
C5
USB2_AVDD3P3
C8
USB2_AVDD1P2
C11
USB3_TRGND
C13
USB3_PGND
C14
NC
C22
SR_VDDBATP5V
D14
NC
D22
LDO_VDD1P5
D23
LDO_VDD1P5
E1
BT_UART_RXD
E2
BT_UART_CTS_L
E5
BT_I2S_WS
E6
OTP_VDD33
E7
LPO_IN
E9
USB2_MONPLL
E10
USB2_MONCDR
E11
VSSC
E12
USB3_TRVDD1P2
E14
JTAG_SEL
E15
GPIO_3
E17
PMU_AVSS
E18
WL_REG_ON
E22
VOUT_LDO3P3_B
E23
VOUT_LDO3P3_B
F2
BT_UART_TXD
F5
BT_SF_MISO
F12
USB3_DVDD1P2
F13
HSIC_AVDD12
F19
VOUT_3P3_SENSE
F22
VOUT_3P3
F23
VOUT_3P3
G1
BT_I2S_CLK
G2
GPIO_4
G5
BT_GPIO_4
G13
HSIC_AGND12
G22
LDO_VDDBAT5V
G23
LDO_VDDBAT5V
H5
BT_SF_MOSI
H8
BT_I2S_DO
Broadcom®
January 19, 2016 • 43569-DS109-R
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BCM43569 Advance Data Sheet
Pin List
Table 17: Pin List (Cont.)
Table 17: Pin List (Cont.)
Ball
Name
Ball
Name
H10
BT_I2S_DI
M19
RF_SW_CTRL_14
H12
VSSC
M22
GPIO_8
H13
VSSC
M23
RF_SW_CTRL_11
H15
BT_REG_ON
N1
BT_RF
H16
VSSC
N5
BT_GPIO_3
H19
GPIO_15
N8
BTRGND
H22
GPIO_14
N15
VDDC
H23
VOUT_BTLDO2P5
N19
RF_SW_CTRL_6
J1
BT_DEV_WAKE
N22
GPIO_7
J2
BT_HOST_WAKE
N23
RF_SW_CTRL_10
J5
BT_CLK_REQ
P1
BT_PAVDD2P5
J12
VSSC
P5
BT_GPIO_5
J14
VSSC
P8
BTRGND
J16
VDDIO_PMU
P10
BTRGND
J19
GPIO_12
P12
VDDC
J22
GPIO_11
P14
VDDC
J23
VOUT_LNLDO
P15
VDDC
K1
BT_IFVDD1P2
P16
VSSC
K2
BT_VCOVDD1P2
P19
RF_SW_CTRL_4
K5
BTRGND
P22
RF_SW_CTRL_9
K10
AVDD_BBPLL
R1
BTRGND
K12
VDDC
R2
BTRGND
K14
VDDC
R5
BTRGND
K16
VDDIO
R7
BTRGND
K19
GPIO_9
R9
BTRGND
K22
GPIO_13
R11
VSSC
K23
RF_SW_CTRL_13
R12
VSSC
L1
BT_LNAVDD1P2
R13
VSSC
L8
BTRGND
R14
VSSC
L9
AVSS_BBPLL
R15
VSSC
L11
VDDC
R16
VSSC
L14
VDDC
R17
VSSC
L15
VDDC
R19
RF_SW_CTRL_5
L16
VDDIO_RF
R22
RF_SW_CTRL_7
L19
RF_SW_CTRL_15
R23
RF_SW_CTRL_8
M2
BTRGND
T1
WRF_RFIN_2G_CORE0
M5
BT_GPIO_2
T2
RGND
M8
BT_VDDO
T5
RGND
M10
BT_VDDC
T7
RGND
Broadcom®
January 19, 2016 • 43569-DS109-R
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BROADCOM CONFIDENTIAL
BCM43569 Advance Data Sheet
Pin List
Table 17: Pin List (Cont.)
Table 17: Pin List (Cont.)
Ball
Name
Ball
Name
T10
RGND
W16
WRF_TSSI_A_CORE1
T13
VSSC
W17
RGND
T15
VSSC
W18
RGND
T16
VSSC
W19
RF_SW_CTRL_1
T19
RF_SW_CTRL_3
W22
WRF_XTAL_GND1P2
U1
RGND
W23
WRF_XTAL_VDD1P2
U2
RGND
Y1
WRF_PA2G_VBAT_VDD3P3_CORE0
U5
RGND
Y1
WRF_PA2G_VBAT_VDD3P3_CORE0
U13
RGND
Y2
RGND
U16
RGND
Y22
WRF_XTAL_GND1P2
U19
RF_SW_CTRL_0
Y23
WRF_XTAL_VDD1P5
U22
WRF_XTAL_GND1P2
AA1
WRF_PADRV_VBAT_VDD3P3_CORE0
U23
WRF_XTAL_OUT
AA2
RGND
V1
WRF_RFOUT_2G_CORE0
AA22
RGND
V2
RGND
AA23
WRF_BUCK_VDD1P5_CORE1
V5
RGND
AB1
WRF_PA5G_VBAT_VDD3P3_CORE0
V6
RGND
AB2
RGND
V7
RGND
AB4
RGND
V8
RGND
AB5
RGND
V9
RGND
AB7
RGND
V13
WRF_LOGENG_GND1P2
AB8
RGND
V16
RGND
AB9
RGND
V17
RGND
AB10
RGND
V18
RGND
AB11
RGND
V19
RF_SW_CTRL_2
AB13
RGND
V22
WRF_XTAL_GND1P2
AB15
RGND
V23
WRF_XTAL_IN
AB16
RGND
W1
RGND
AB18
RGND
W5
RGND
AB19
RGND
W6
RGND
AB20
RGND
W7
WRF_TSSI_A_CORE0
AB21
RGND
W8
RGND
AB22
RGND
W9
WRF_GPIO_OUT_CORE0
AB23
RGND
W10
WRF_PFD_GND1P2
AC1
RGND
W11
WRF_CP_GND1P2
AC2
WRF_RFOUT_5G_CORE0
W12
WRF_MMD_GND1P2
AC3
RGND
W13
WRF_VCO_GND1P2
AC4
WRF_RFIN_5G_CORE0
W14
WRF_GPIO_OUT_CORE1
AC5
RGND
W15
RGND
AC6
WRF_BUCK_VDD1P5_CORE0
Broadcom®
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BCM43569 Advance Data Sheet
Pin List
Table 17: Pin List (Cont.)
Ball
Name
AC7
WRF_PFD_VDD1P2
AC8
WRF_MMD_VDD1P2
AC9
WRF_SYNTH_VBAT_VDD3P3
AC10
RGND
AC11
WRF_RFIN_2G_CORE1
AC12
RGND
AC13
WRF_RFOUT_2G_CORE1
AC14
RGND
AC15
WRF_PA2G_VBAT_VDD3P3_CORE1
AC16
WRF_PADRV_VBAT_VDD3P3_CORE1
AC17
WRF_PA5G_VBAT_VDD3P3_CORE1
AC18
RGND
AC19
RGND
AC20
WRF_RFOUT_5G_CORE1
AC21
RGND
AC22
WRF_RFIN_5G_CORE1
AC23
RGND
Broadcom®
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BROADCOM CONFIDENTIAL
BCM43569 Advance Data Sheet
Signal Descriptions
Signal Descriptions
The signal name, type, and description of each pin in the BCM43569 is listed in Table 18. The symbols shown
under Type indicate pin directions (I/O = bidirectional, I = input, O = output) and the internal pull-up/pull-down
characteristics (PU = weak internal pull-up resistor and PD = weak internal pull-down resistor), if any.
Table 18: Signal Descriptions
Ball#
Signal Name
Type
Description
WLAN Receive RF Signal Interface
T1
WRF_RFIN_2G_CORE0
I
2.4 GHz WLAN CORE0 receiver input.
AC11
WRF_RFIN_2G_CORE1
I
2.4 GHz WLAN CORE1 receiver input.
AC4
WRF_RFIN_5G_CORE0
I
5 GHz WLAN CORE0 receiver input.
AC22
WRF_RFIN_5G_CORE1
I
5 GHz WLAN CORE1 receiver input.
V1
WRF_RFOUT_2G_CORE0
O
2.4 GHz WLAN CORE0 PA output.
AC13
WRF_RFOUT_2G_CORE1
O
2.4 GHz WLAN CORE1 PA output.
AC2
WRF_RFOUT_5G_CORE0
O
5 GHz WLAN CORE0 PA output.
AC20
WRF_RFOUT_5G_CORE1
O
5 GHz WLAN CORE1 PA output.
W7
WRF_TSSI_A_CORE0
I
5 GHz TSSI CORE0 input.
W16
WRF_TSSI_A_CORE1
I
5 GHz TSSI CORE1 input.
W9
WRF_GPIO_OUT_CORE0
I/O
GPIO or 2.4 GHz TSSI CORE0 input.
W14
WRF_GPIO_OUT_CORE1
I/O
GPIO or 2.4 GHz TSSI CORE1 input.
Programmable RF switch control lines. The
control lines are programmable via the driver
and NVRAM file.
RF Switch Control Lines
U19
RF_SW_CTRL_0
O
W19
RF_SW_CTRL_1
O
V19
RF_SW_CTRL_2
O
T19
RF_SW_CTRL_3
O
P19
RF_SW_CTRL_4
O
R19
RF_SW_CTRL_5
O
N19
RF_SW_CTRL_6
O
R22
RF_SW_CTRL_7
O
R23
RF_SW_CTRL_8
O
P22
RF_SW_CTRL_9
O
N23
RF_SW_CTRL_10
O
M23
RF_SW_CTRL_11
O
L23
RF_SW_CTRL_12
O
K23
RF_SW_CTRL_13
O
M19
RF_SW_CTRL_14
O
L19
RF_SW_CTRL_15
O
Broadcom®
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BCM43569 Advance Data Sheet
Signal Descriptions
Table 18: Signal Descriptions (Cont.)
Ball#
Signal Name
Type
Description
WLAN USB 2.0 Interface
A8
USB2_RREF
I
USB resistance reference. This pin should be
connected to an external 4.75 kΩ 1% resistor in
parallel with a 100 pF capacitor to ground.
A6
USB2_DP
I/O
USB 2.0 data+.
B6
USB2_DM
I/O
USB 2.0 data–.
E9
USB2_MONPLL
O
USB 2.0 test pin.
E10
USB2_MONCDR
O
USB 2.0 test pin.
WLAN USB 3.0 Interface
A9
USB3_RDP
I
Differential pair, receive data, positive.
B9
USB3_RDN
I
Differential pair, receive data, negative.
A11
USB3_TDP
O
Differential pair, transmit data, positive.
B11
USB3_TDN
O
Differential pair, transmit data, negative.
A15
USB3_REFCLKN
O
Differential pair, reference clock, negative.
B15
USB3_REFCLKP
O
Differential pair, reference clock, positive.
A13
USB3_PTESTP
O
Differential pair, test pin, positive.
B13
USB3_PTESTN
O
Differential pair, test pin, negative.
WLAN GPIO Interface
Note: The GPIO signals can be multiplexed via software and the JTAG_SEL pin to support other functions. See
Table 22: “GPIO Alternative Signal Functions,” on page 79 for additional details.
B18
GPIO_0
I/O
B17
GPIO_1
I/O
B4
GPIO_2
I/O
E15
GPIO_3
I/O
G2
GPIO_4
I/O
A2
GPIO_5
I/O
B3
GPIO_6
I/O
N22
GPIO_7
I/O
M22
GPIO_8
I/O
K19
GPIO_9
I/O
L22
GPIO_10
I/O
J22
GPIO_11
I/O
J19
GPIO_12
I/O
K22
GPIO_13
I/O
H22
GPIO_14
I/O
H19
GPIO_15
I/O
Programmable GPIO pins.
Broadcom®
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BCM43569 Advance Data Sheet
Signal Descriptions
Table 18: Signal Descriptions (Cont.)
Ball#
Signal Name
Type
Description
JTAG Interface
E14
JTAG_SEL
I/O
JTAG select. This pin must be connected to
ground if the JTAG interface is not used.
Note: See Table 22: “GPIO Alternative Signal
Functions,” on page 79 for the JTAG signal pins.
Clocks
E7
LPO_IN
I
External sleep clock input (32.768 kHz).
J5
BT_CLK_REQ
O
Asserts when WLAN wants the host to turn on
the reference clock.
U23
WRF_XTAL_OUT
O
XTAL oscillator output.
V23
WRF_XTAL_IN
I
XTAL oscillator input.
Bluetooth Transceiver
N1
BT_RF
O
Bluetooth RF input/output.
C2
BT_SF_CLK
I
SFLASH_CLK.
D2
BT_SF_CS_L
I/O
SFLASH_CSN.
F5
BT_SF_MISO
I/O
SFLASH master input, slave output.
H5
BT_SF_MOSI
I/O
SFLASH master output, slave input.
Bluetooth USB Interface
B1
BT_USB_DN
I/O
USB (host) data negative. Negative terminal of
the USB transceiver.
C1
BT_USB_DP
I/O
USB (host) data positive. Positive terminal of the
USB transceiver.
Bluetooth UART
E2
BT_UART_CTS_L
I
UART clear-to-send. Active-low clear-to-send
signal for the HCI UART interface.
A16
BT_UART_RTS_L
O
UART request-to-send. Active-low request-tosend signal for the HCI UART interface. BT LED
control pin.
E1
BT_UART_RXD
I
UART serial input. Serial data input for the HCI
UART interface.
F2
BT_UART_TXD
O
UART serial output. Serial data output for the
HCI UART interface.
G1
BT_I2S_CLK
I/O
I2S clock, can be master (output) or slave
(input).
H8
BT_I2S_DO
I/O
I2S data output.
H10
BT_I2S_DI
I/O
I2S data input.
E5
BT_I2S_WS
I/O
I2S WS, can be master (output) or slave (input).
Bluetooth I2S
Broadcom®
January 19, 2016 • 43569-DS109-R
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BCM43569 Advance Data Sheet
Signal Descriptions
Table 18: Signal Descriptions (Cont.)
Ball#
Signal Name
Type
Description
Bluetooth GPIO
G5
BT_GPIO_4
I/O
Bluetooth general-purpose I/O.
Miscellaneous
E18
WL_REG_ON
I
Used by PMU to power up or power down the
internal BCM43569 regulators used by the
WLAN section. Also, when deasserted, this pin
holds the WLAN section in reset. This pin has an
internal 200 kΩ pull-down resistor that is
enabled by default. It can be disabled through
programming.
H15
BT_REG_ON
I
Used by PMU to power up or power down the
internal BCM43569 regulators used by the
Bluetooth section. Also, when deasserted, this
pin holds the Bluetooth section in reset. This pin
has an internal 200 kΩ pull-down resistor that is
enabled by default. It can be disabled through
programming.
J1
BT_DEV_WAKE
I/O
Bluetooth DEV_WAKE.
J2
BT_HOST_WAKE
I/O
Bluetooth HOST_WAKE.
M5
BT_GPIO_2
I/O
Bluetooth HL mode.
N5
BT_GPIO_3
I/O
Bluetooth VSYNC_OUT.
P5
BT_GPIO_5
I/O
Bluetooth VSYN_IN.
Integrated Voltage Regulators
B23
SR_VDDBATA5V
I
Quiet VBAT.
C22, C23
SR_VDDBATP5V
I
Power VBAT.
A20, A21
SR_VLX
O
CBUCK switching regulator output. Refer to
Table 36 on page 103 for details of the inductor
and capacitor required on this output.
D22, D23
LDO_VDD1P5
I
LNLDO input.
G22, G23
LDO_VDDBAT5V
I
LDO VBAT.
Y23
WRF_XTAL_VDD1P5
I
XTAL LDO input (1.35V).
W23
WRF_XTAL_VDD1P2
O
XTAL LDO output (1.2V).
J23
VOUT_LNLDO
O
Output of LNLDO.
A17
VOUT_CLDO
O
Output of core LDO.
H23
VOUT_BTLDO2P5
O
2.5V LDO. Connects to a 2.2 µF bypass
capacitor to GND.
E22, E23
VOUT_LDO3P3_B
O
3.3V LDO.
F22, F23
VOUT_3P3
O
LDO 3.3V output.
F19
VOUT_3P3_SENSE
O
Voltage sense pin for LDO 3.3V output.
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BCM43569 Advance Data Sheet
Signal Descriptions
Table 18: Signal Descriptions (Cont.)
Ball#
Signal Name
Type
Description
Bluetooth Supplies
P1
BT_PAVDD2P5
PWR
Bluetooth PA power supply.
L1
BT_LNAVDD1P2
PWR
Bluetooth LNA power supply.
K1
BT_IFVDD1P2
PWR
Bluetooth IF block power supply.
L2
BT_PLLVDD1P2
PWR
Bluetooth RF PLL power supply.
K2
BT_VCOVDD1P2
PWR
Bluetooth RF power supply.
M8
BT_VDDO
PWR
Core supply.
M10, N10
BT_VDDC
PWR
1.2V core supply for BT.
WLAN Supplies
AC6
WRF_BUCK_VDD1P5_CORE0
PWR
Internal capacitor-less CORE0 LDO supply.
AA23
WRF_BUCK_VDD1P5_CORE1
PWR
Internal capacitor-less CORE1 LDO supply.
AC9
WRF_SYNTH_VBAT_VDD3P3
PWR
Synthesizer VDD 3.3V supply.
AA1
WRF_PADRV_VBAT_VDD3P3_
CORE0
PWR
CORE0 PA Driver VBAT supply.
AC16
WRF_PADRV_VBAT_VDD3P3_
CORE1
PWR
CORE1 PA Driver VBAT supply.
AB1
WRF_PA5G_VBAT_VDD3P3_
CORE0
PWR
5 GHz CORE0 PA 3.3V VBAT supply.
AC17
WRF_PA5G_VBAT_VDD3P3_
CORE1
PWR
5 GHz CORE1 PA 3.3V VBAT supply.
Y1
WRF_PA2G_VBAT_VDD3P3_
CORE0
PWR
2 GHz CORE0 PA 3.3V VBAT supply.
AC15
WRF_PA2G_VBAT_VDD3P3_
CORE1
PWR
2 GHz CORE1 PA 3.3V VBAT supply.
AC8
WRF_MMD_VDD1P2
PWR
1.2V supply.
AC7
WRF_PFD_VDD1P2
PWR
1.2V supply.
PWR
OTP 3.3V supply.
K12, K14, L11, VDDC
L14, L15, N15,
P11, P12, P14,
P15
PWR
1.2V core supply for WLAN.
K16
VDDIO
PWR
1.8V–3.3V supply for WLAN. Must be directly
connected to PMU_VDDIO on the PCB.
M10, N10
BT_VDDC
PWR
1.2V core supply for BT.
J16
VDDIO_PMU
PWR
1.8V–3.3V supply for PMU controls. Must be
directly connected to VDDIO on the PCB.
Miscellaneous Supplies
E6
OTP_VDD33
L16
VDDIO_RF
PWR
IO supply for RF switch control pads (3.3V).
C5
USB2_AVDD3P3
PWR
3.3V supply for USB 2.0.
C8
USB2_AVDD1P2
PWR
1.2V supply for USB 2.0.
D12
USB3_PVDD1P2
PWR
1.2V supply for USB 3.0 PLL.
Broadcom®
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BROADCOM CONFIDENTIAL
BCM43569 Advance Data Sheet
Signal Descriptions
Table 18: Signal Descriptions (Cont.)
Ball#
Signal Name
Type
Description
E12
USB3_TRVDD1P2
PWR
1.2V supply for USB 3.0 TX/RX.
F12
USB3_DVDD1P2
PWR
1.2V supply for USB 3.0 I/O.
K10
AVDD_BBPLL
PWR
Baseband PLL supply.
U22, V22,
W22, Y22
WRF_XTAL_GND1P2
GND
XTAL ground.
V13
WRF_LOGENG_GND1P2
GND
LOGEN ground.
W13
WRF_VCO_GND1P2
GND
VCO ground.
W12
WRF_MMD_GND1P2
GND
Ground.
W11
WRF_CP_GND1P2
GND
Ground.
W10
WRF_PFD_GND1P2
GND
Ground.
GND
Core ground for WLAN.
Ground
A1, A18, A19, VSSC
B2, E16, H12,
H13, H16, J12,
J14, P16, R11–
R17, T13, T15,
T16
A22, A23
SR_PVSS
GND
Power ground.
E17
PMU_AVSS
GND
Quiet ground.
L9
AVSS_BBPLL
GND
Baseband PLL ground.
B7
USB2_AVSS
GND
USB2 ground.
A7
USB2_AVSSBG
GND
USB2 ground.
C11
USB3_TRGND
GND
USB 3.0 TX/RX ground.
C13
USB3_PGND
GND
USB 3.0 PLL ground.
GND
Ground.
T2, T5, T7, T10, RGND
U1, U2, U5,
U13, U16, U17,
V2, V5–V9,
V16–V18, W1,
W5, W6, W8,
W15, W17,
W18, Y2, AA2,
AA22, AB2,
AB4, AB5,
AB7–AB11,
AB13, AB15,
AB16, AB18–
AB23,AC1,
AC3, AC5,
AC10, AC12,
AC14, AC18,
AC19, AC21,
AC23
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BCM43569 Advance Data Sheet
Signal Descriptions
Table 18: Signal Descriptions (Cont.)
Ball#
Signal Name
K5, K8, L8, M2, BTRGND
N8, P8, P10,
R1, R2, R5,
R7, R9
Type
Description
GND
Ground.
No-Connects
C14, D13, D14 NC
I/O
No connect pins.
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BROADCOM CONFIDENTIAL
BCM43569 Advance Data Sheet
WLAN/BT GPIO Signals and Strapping Options
WLAN/BT GPIO Signals and Strapping Options
The pins listed in Table 19 and Table 20 are sampled at power-on reset (POR) to determine the various
operating modes. Sampling occurs a few milliseconds after an internal POR or deassertion of the external POR.
After the POR, each pin assumes the GPIO or alternative function specified in the signal descriptions table.
Each strapping option pin has an internal pull-up (PU) or pull-down (PD) resistor that determines the default
mode. To change the mode, connect an external PU resistor to VDDIO or a PD resistor to GND, using a 10 kΩ
resistor or less.
Note: Refer to the reference board schematics for more information.
Table 19: WLAN GPIO Functions and Strapping Options
Pin Name
Default Function Description
GPIO_4
0
GPIO_5
0
GPIO_[10, 9, 8]
GPIO_12
1: SPROM is present
0: SPROM is absent (default). Applicable in PCIe Host mode.
0: SFLASH absent (default)
1: SFLASH present
Host interface selection: see Table 21.
1 = HTAvailable (default)
0 = ResourceModeInit is ALPAvailable. On PCBs, use a pull-down and tie
to ALP clock mode. Only 0 mode is supported in the driver.
[0,0,0]
1
Table 20: BT GPIO Functions and Strapping Options
Pin Name
BT_GPIO4
Default
Function Description
0
1: BT serial flash is present.
0: BT serial flash is absent (default).
Table 21: GPIO_[10, 9, 8] Host Interface Selection
GPIO_[10, 9, 8]
Bit Setting
WLAN Host Interface Mode
110
USB interface
Bluetooth Mode
BTUART or BTUSB;
BT tPorts stand alone.
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BROADCOM CONFIDENTIAL
GPIO Alternative Signal Functions
BCM43569 Advance Data Sheet
GPIO Alternative Signal Functions
Table 22: GPIO Alternative Signal Functions
Test Mode
UART
SFLASH
SPROM
Miscellaneous-0
(JTAG_SEL=1) GCI
BSC
Miscellaneous-1 Miscellaneous-2 PWDOG
Function Select
Pin Names
0
2
3
4
5
6
GPIO_0
TEST_GPIO_0 UART_
TX
–
–
BSC _CLK –
GPIO_1
TEST_GPIO_1 UART_
RX
–
–
GPIO_2
TEST_GPIO_2 –
–
GPIO_3
TEST_GPIO_3 –
–
GPIO_6
TEST_GPIO_6 –
GPIO_7
7
8
9
10
Additional
Functionality
GCI_GPIO_4 –
–
PWDOG
_GPIO_0
–
BSC
_SDA
RF_DISABLE_L GCI_GPIO_5 –
–
PWDOG
_GPIO_1
–
–
N/A
TCK
GCI_GPIO_1 –
–
–
–
–
N/A
TMS
GCI_GPIO_0 –
–
–
–
–
–
N/A
TRST_L
GCI_GPIO_2 –
–
–
–
TEST_GPIO_7 –
SFLASH_
CS
SPROM_
CS
BSC
_SDA
PMU_TEST_O
GCI_GPIO_3 USB_MDC
–
PWDOG
_GPIO_2
–
GPIO_8
TEST_GPIO_8 –
SFLASH_
CLK
SPROM_
CLK
BSC _CLK –
–
USB_MDIO
-–
PWDOG
_GPIO_3
–
GPIO_9
TEST_GPIO_9 –
SFLASH_MI SPROM_MI PALDO
_PU
–
–
PALDO_PD
–
PWDOG
_GPIO_4
–
GPIO_10
TEST_GPIO_10 –
SFLASH_
MO
SPROM_
MO
–
–
–
–
–
PWDOG
_GPIO_5
–
GPIO_11
TEST_GPIO_11 –
–
–
PALDO
_PU
–
–
PALDO_PD
–
–
USB_VBUS
_PRESENT
GPIO_12
TEST_GPIO_12 –
–
–
–
–
–
–
–
–
GPIO_13
TEST_GPIO_13 usbphy
_scan
_resetb
–
–
–
–
–
–
–
–
WL_LED
GPIO_14
TEST_GPIO_14 WL_HOS –
T_WAKE
–
–
–
–
–
–
–
–
GPIO_15
TEST_GPIO_15 –
–
–
–
–
–
–
–
–
–
Note:
1.GPIO_14 is the WL_HOST_WAKE supported by the software driver.
2. USB_VBUS_PRESENT indicates that USB30D is selected.
3. SDIO_PADVDDIO=1 (not in straps table) is set to 3.3V by default for all packages.
4. GPIO_13 supports WL_LED in FCBGA package.
5. USB_MDx MDIO is the interface of USB1.0 and 2.0 PHY (depending on the strap option).
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BROADCOM CONFIDENTIAL
I/O States
BCM43569 Advance Data Sheet
I/O States
The following notations are used in Table 23: “I/O States,” on page 81:
•
I: Input signal
•
O: Output signal
•
I/O: Input/Output signal
•
PU = Pulled up
•
PD = Pulled down
•
NoPull = Neither pulled up nor pulled down
•
Where applicable, the default value is shown in bold brackets, i.e., [default value]
Broadcom®
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BROADCOM CONFIDENTIAL
I/O States
BCM43569 Advance Data Sheet
Table 23: I/O States
Name
WL_REG_ON
I/O Keepera Active Mode
Low Power State/Sleep
(All Power Present)
Power-downb
(BT_REG_ON and
WL_REG_ON Held
Low)
Out-of-Reset;
Before SW Download
(BT_REG_ON High;
WL_REG_ON High)
(WL_REG_ON High
and BT_REG_ON = 0)
and VDDIOs Are
Present
Power Rail
I
N
I: PD
Pull-down can be disabled
I: PD
Pull-down can be disabled
I: PD (of 200K)
I: PD (of 200K)
I: PD (of 200K)
–
BT_CLK_REQ
I/O
Y
Open drain or push-pull
Programmable
Active high
Open drain or push-pull
Programmable
Active high
High-Z, NoPull
Open drain
Active high
Open drain
Active high
BT_VDDO
BT_HOST_WAKE
I/O
Y
I/O: PU, PD, NoPull
Programmable
I/O: PU, PD, NoPull
Programmable
High-Z, NoPull
I: PD
I: PD
BT_UART_CTS_L
I
Y
I: NoPull
I: NoPull
High-Z, NoPull
I: PU
I: PU
BT_UART_RTS_L
O
O: NoPull
O: NoPull
BT_UART_RXD
I
I: PU
I: NoPull
BT_UART_TXD
O
O: NoPull
O: NoPull
SDIO Data
I/O
N
I/O:
PU (SDIO Mode)
I:
PU (SDIO Mode)
High-Z, NoPull
I:
PU (SDIO Mode)
I:
PU (SDIO Mode)
I: NoPull
I: noPull
Y
I: NoPullc
I: NoPullc
I: NoPulld
I: NoPulld
BT_REG_ON
BT_DEV_WAKE
BT_GPIO 2, 3, 4, 5
SDIO CMD
SDIO_CLK
BT_PCM_CLK
I
I/O
High-Z, NoPull
I: NoPull
I: NoPull
I: PD
I: PD
VDDIO_SD
BT_VDDO
BT_PCM_IN
BT_PCM_OUT
BT_PCM_SYNC
BT_I2S_WS
BT_I2S_CLK
BT_I2S_DI
BT_I2S_DO
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BROADCOM CONFIDENTIAL
I/O States
BCM43569 Advance Data Sheet
Table 23: I/O States (Cont.)
Name
GPIO_0
I/O Keepera Active Mode
I/O
Y
Low Power State/Sleep
(All Power Present)
I/O: PU, PD, NoPull
Programmable [NoPull]
I/O: PU, PD, NoPull
Programmable [NoPull]
Power-downb
(BT_REG_ON and
WL_REG_ON Held
Low)
Out-of-Reset;
Before SW Download
(BT_REG_ON High;
WL_REG_ON High)
(WL_REG_ON High
and BT_REG_ON = 0)
and VDDIOs Are
Present
Power Rail
High-Z, NoPull
I: NoPull
I: NoPull
VDDIO
I: PD
I: PD
GPIO_1
Y
GPIO_2
Y
GPIO_3
Y
GPIO_4
Y
I/O: PU, PD, NoPull
Programmable [PD]
I/O: PU, PD, NoPull
Programmable [PD]
GPIO_5
Y
I/O: PU, PD, NoPull
Programmable [PD]
I/O: PU, PD, NoPull
Programmable [PD]
I/O: PU, PD, NoPull
Programmable [NoPull]
I/O: PU, PD, NoPull
Programmable [NoPull]
I: NoPull
I: NoPull
I/O: PU, PD, NoPull
I/O: PU, PD, NoPull
I
I
GPIO_6
Y
GPIO_7
Y
GPIO_8
Y
GPIO_9
Y
GPIO_10
Y
I/O: PU, PD, NoPull
Programmable [PD]
I/O: PU, PD, NoPull
Programmable [PD]
I: PD
I: PD
GPIO_11
Y
I/O: PU, PD, NoPull
Programmable [NoPull]
I/O: PU, PD, NoPull
Programmable [NoPull]
I: NoPull
I: NoPull
GPIO_12
Y
I/O: PU, PD, NoPull
Programmable [PU]
I/O: PU, PD, NoPull
Programmable [PU]
I: PU
I: PU
GPIO_13
Y
I: NoPull
Y
I/O: PU, PD, NoPull
Programmable [NoPull]
I: NoPull
GPIO_14
I/O: PU, PD, NoPull
Programmable [NoPull]
GPIO_15
Y
RF_SW_CTRL_X
Y
O: NoPull
O: NoPull
O: NoPull
: NoPull
VDDIO_RF
a. Keeper column: N = pad has no keeper. Y = pad has a keeper. Keeper is always active except in Power-down state. If there is no keeper, and it is an input
and there is Nopull, then the pad should be driven to prevent leakage due to floating pad (SDIO_CLK, for example).
b. In the Power-down state (xx_REG_ON=0): High-Z; NoPull => the pad is disabled because power is not supplied.
c. Depending on whether the PCM interface is enabled and the configuration of PCM is in master or slave mode, it can be either input or output.
d. Depending on whether the I2S interface is enabled and the configuration of I2S is in master or slave mode, it can be either input or output.
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BROADCOM CONFIDENTIAL
BCM43569 Advance Data Sheet
DC Characteristics
S e c t i o n 1 2 : D C C h a r a c t e ri s t i c s
Note: Values in this data sheet are design goals and are subject to change based on the results of
device characterization.
Absolute Maximum Ratings
Caution! The absolute maximum ratings in Table 24 indicate levels where permanent damage to the
device can occur, even if these limits are exceeded for only a brief duration. Functional operation is
not guaranteed under these conditions. Operation at absolute maximum conditions for extended
periods can adversely affect long-term reliability of the device.
Table 24: Absolute Maximum Ratings
Rating
Symbol
Value
Unit
DC supply for VBATa and PA driver supplyb
VBAT
–0.5 to +6.0
V
DC supply voltage for digital I/O
VDDIO
–0.5 to 3.9
V
DC supply voltage for RF switch I/Os
VDDIO_RF
–0.5 to 3.9
V
DC input supply voltage for CLDO and LNLDO
–
–0.5 to 1.575
V
DC supply voltage for RF analog
VDDRF
–0.5 to 1.32
V
DC supply voltage for core
VDDC
–0.5 to 1.32
V
WRF_TCXO_VDD
–
–0.5 to 3.63
V
Maximum undershoot voltage for I/Oc
Vundershoot
–0.5
V
Maximum overshoot voltage for I/Oc
Vovershoot
VDDIO + 0.5
V
Maximum junction temperature
Tj
125
°C
a. VBAT is the main power supply of the chip.
b. The maximum continuous voltage is 5.25V. Voltage transients up to 6.0V for up to 10 seconds, cumulative
duration over the lifetime of the device, are allowed. Voltage transients as high as 5.5V for up to 250 seconds,
cumulative duration over the lifetime of the device, are allowed.
c. Duration not to exceed 25% of the duty cycle.
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January 19, 2016 • 43569-DS109-R
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BROADCOM CONFIDENTIAL
BCM43569 Advance Data Sheet
Environmental Ratings
Environmental Ratings
The environmental ratings are shown in Table 25.
Table 25: Environmental Ratings
Characteristic
Value
Units
Conditions/Comments
Ambient temperature (TA)
0 to +60
°C
Functional operationa
Storage temperature
–40 to +125
°C
–
Relative humidity
Less than 60
%
Storage
Less than 85
%
Operation
a. Functionality is guaranteed but specifications require derating at extreme temperatures; see the specification
tables for details.
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January 19, 2016 • 43569-DS109-R
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BROADCOM CONFIDENTIAL
BCM43569 Advance Data Sheet
Recommended Operating Conditions and DC Characteristics
Recommended Operating Conditions and DC Characteristics
Caution! Functional operation is not guaranteed outside of the limits shown in Table 26, and operation
outside these limits for extended periods can adversely affect long-term reliability of the device.
Table 26: Recommended Operating Conditions and DC Characteristics
Value
Parameter
Symbol
Minimum
Typical
Maximum Unit
DC supply voltage for VBAT
VBATa
3.0b
–
3.6
V
DC supply voltage for core
VDD
1.14
1.2
1.26
V
DC supply voltage for RF blocks in chip
VDDRF
1.14
1.2
1.26
V
DC supply voltage for TCXO input buffer
WRF_TCXO_VDD 1.62
1.8
1.98
V
DC supply voltage for digital I/O
VDDIO, VDDIO_SD 1.71
–
3.63
V
DC supply voltage for RF switch I/Os
VDDIO_RF
3.3
3.6
V
3.0
External TSSI input
TSSI
0.15
–
0.95
V
Internal POR threshold
Vth_POR
0.4
–
0.7
V
Other Digital I/O Pins
For VDDIO = 1.8V:
Input high voltage
VIH
0.65 × VDDIO
–
–
V
Input low voltage
VIL
–
–
0.35 ×
VDDIO
V
Output high voltage @ 2 mA
VOH
VDDIO – 0.45
–
–
V
Output low voltage @ 2 mA
VOL
–
–
0.45
V
Input high voltage
VIH
2.00
–
–
V
Input low voltage
VIL
–
–
0.80
V
For VDDIO = 3.3V:
Output high voltage @ 2 mA
VOH
VDDIO – 0.4
–
–
V
Output low Voltage @ 2 mA
VOL
–
–
0.40
V
Output high voltage @ 2 mA
VOH
VDDIO – 0.4
–
–
V
Output low voltage @ 2 mA
VOL
–
–
0.40
V
CIN
–
–
5
pF
RF Switch Control Output Pinsc
For VDDIO_RF = 3.3V:
Input capacitance
a. VBAT is the main power supply of the chip
b. The BCM43569 is functional across this range of voltages. Optimal RF performance specified in the data sheet,
however, is guaranteed only for 3.13V < VBAT < 3.6V.
c. Programmable 2 mA to 16 mA drive strength. Default is 10 mA.
Broadcom®
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BROADCOM CONFIDENTIAL
BCM43569 Advance Data Sheet
Bluetooth RF Specifications
S e c t i on 1 3 : B l u e t o o th R F S p e c i f i c a t i o n s
Note: Values in this data sheet are design goals and are subject to change based on the results of
device characterization.
Unless otherwise stated, limit values apply for the conditions specified in Table 25: “Environmental Ratings,” on
page 84 and Table 26: “Recommended Operating Conditions and DC Characteristics,” on page 85. Typical
values apply for an ambient temperature of +25°C.
Figure 26: RF Port Location for Bluetooth Testing
BCM43569
Filter
BT RX/TX
RF Port
Antenna
Port
Note: All Bluetooth specifications are measured at the chip port unless otherwise specified.
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January 19, 2016 • 43569-DS109-R
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BROADCOM CONFIDENTIAL
BCM43569 Advance Data Sheet
Bluetooth RF Specifications
Table 27: Bluetooth Receiver RF Specifications
Parameter
Conditions
Minimum
Typical
Maximum Unit
Note: The specifications in this table are measured at the chip port output unless otherwise specified.
General
Frequency range
–
RX sensitivity
2402
–
2480
MHz
GFSK, 0.1% BER, 1 Mbps –
–92
–
dBm
/4-DQPSK, 0.01% BER,
2 Mbps
–
–94
–
dBm
8-DPSK, 0.01% BER,
3 Mbps
–
–88
–
dBm
Minimum input IP3
–
–
–16
–
dBm
Maximum input at antenna
–
–
–20
–
dBm
–
–
–93
–80.0
dBm
C/I co-channel
GFSK, 0.1% BER
–
8
11
dB
C/I 1 MHz adjacent channel
GFSK, 0.1% BER
–
–7
0
dB
C/I 2 MHz adjacent channel
GFSK, 0.1% BER
–
–38
–30
dB
RX LO Leakage
2.4 GHz band
Interference Performancea
C/I 3 MHz adjacent channel
GFSK, 0.1% BER
–
–56
–40
dB
C/I image channel
GFSK, 0.1% BER
–
–31
–9
dB
C/I 1 MHz adjacent to image
channel
GFSK, 0.1% BER
–
–46
–20
dB
C/I co-channel
/4-DQPSK, 0.1% BER
–
9
13
dB
C/I 1 MHz adjacent channel
/4-DQPSK, 0.1% BER
–
–11
0
dB
C/I 2 MHz adjacent channel
/4-DQPSK, 0.1% BER
–
–39
–30
dB
C/I 3 MHz adjacent channel
/4-DQPSK, 0.1% BER
–
–55
–40
dB
C/I image channel
/4-DQPSK, 0.1% BER
–
–23
–7
dB
C/I 1 MHz adjacent to image
channel
/4-DQPSK, 0.1% BER
–
–43
–20
dB
C/I co-channel
8-DPSK, 0.1% BER
–
17
21
dB
C/I 1 MHz adjacent channel
8-DPSK, 0.1% BER
–
–4
5
dB
C/I 2 MHz adjacent channel
8-DPSK, 0.1% BER
–
–37
–25
dB
C/I 3 MHz adjacent channel
8-DPSK, 0.1% BER
–
–53
–33
dB
C/I Image channel
8-DPSK, 0.1% BER
–
–16
0
dB
C/I 1 MHz adjacent to image
channel
8-DPSK, 0.1% BER
–
–37
–13
dB
a. The maximum value represents the actual Bluetooth specification required for Bluetooth qualification
as defined in the version 4.1 specification.
Broadcom®
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BCM43569 Advance Data Sheet
Bluetooth RF Specifications
Table 28: Bluetooth Transmitter RF Specifications
Parameter
Conditions
Minimum Typical Maximum
Unit
Note: The specifications in this table are measured at the Chip port output unless otherwise specified.
General
Frequency range
2402
–
2480
MHz
Basic rate (GFSK) TX power at Bluetooth
–
12.0
–
dBm
QPSK TX power at Bluetooth
–
9.0
–
dBm
–
9.0
–
dBm
–
4
8
dB
–
0.93
1
MHz
M–N = the frequency range –
for which the spurious
–
emission is measured relative
–
to the transmit center
frequency.
–38
–26.0
dBc
–31
–20.0
dBm
–43
–40.0
dBm
dBm
8PSK TX power at Bluetooth
Power control step
–
Note: Output power is with TCA and TSSI enabled.
GFSK In-Band Spurious Emissions
–20 dBc BW
–
EDR In-Band Spurious Emissions
1.0 MHz < |M – N| < 1.5 MHz
1.5 MHz < |M – N| < 2.5 MHz
|M – N| 2.5
MHza
Out-of-Band Spurious Emissions
30 MHz to 1 GHz
–
–
–
–36.0 b, c
1 GHz to 12.75 GHz
–
–
–
–30.0 b, d, e dBm
1.8 GHz to 1.9 GHz
–
–
–
–47.0
dBm
5.15 GHz to 5.3 GHz
–
–
–
–47.0
dBm
–
–
–103
–
dBm
GPS Band Spurious Emissions
Spurious emissions
a. The typical number is measured at ± 3 MHz offset.
b. The maximum value represents the value required for Bluetooth qualification as defined in the v4.1
specification.
c. The spurious emissions during Idle mode are the same as specified in Table 28.
d. Specified at the Bluetooth Antenna port.
e. Meets this specification using a front-end band-pass filter.
Broadcom®
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BCM43569 Advance Data Sheet
Bluetooth RF Specifications
Table 29: Local Oscillator Performance
Parameter
Minimum
Typical
Maximum Unit
LO Performance
Lock time
–
72
–
s
Initial carrier frequency tolerance
–
±25
±75
kHz
DH1 packet
–
±8
±25
kHz
DH3 packet
–
±8
±40
kHz
DH5 packet
–
±8
±40
kHz
Drift rate
–
5
20
kHz/50 µs
00001111 sequence in payloada
140
155
175
kHz
10101010 sequence in payloadb
115
140
–
kHz
Channel spacing
–
1
–
MHz
Frequency Drift
Frequency Deviation
a. This pattern represents an average deviation in payload.
b. Pattern represents the maximum deviation in payload for 99.9% of all frequency deviations.
Table 30: BLE RF Specifications
Parameter
Conditions
Minimum
Typical
Maximum Unit
Frequency range
–
2402
–
2480
MHz
GFSK, 0.1% BER, 1 Mbps
–
–94
–
dBm
–
–
8.5
–
dBm
225
255
275
kHz
RX
sensea
TX powerb
Mod Char: delta F1 average –
Mod Char: delta F2 maxc
–
–
99.9
–
%
Mod Char: ratio
–
0.8
0.95
–
%
a. Dirty TX is on.
b. BLE TX power can be increased to compensate for front-end losses (such as BPF, diplexer, switch,
etc.). The output is capped at 12 dBm out. The BLE TX power at the antenna port cannot exceed the
10 dBm specification limit.
c. At least 99.9% of all delta F2 max frequency values recorded over 10 packets must be greater than
185 kHz.
Broadcom®
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BCM43569 Advance Data Sheet
WLAN RF Specifications
Section 14: WLAN RF Specifications
Introduction
The BCM43569 includes an integrated dual-band direct conversion radio that supports the 2.4 GHz and the
5 GHz bands. This section describes the RF characteristics of the 2.4 GHz and 5 GHz radios.
Note: Values in this section of the data sheet are design goals and are subject to change based on the
results of device characterization.
Unless otherwise stated, limit values apply for the conditions specified inTable 25: “Environmental Ratings,” on
page 84 and Table 26: “Recommended Operating Conditions and DC Characteristics,” on page 85. Typical
values apply for an ambient temperature +25°C.
Figure 27: Port Locations (Applies to 2.4 GHz and 5 GHz)
BCM43569
RF Switch
(0.5 dB Insertion Loss)
WLAN TX
Filter
WLAN RX
Antenna
Port
Chip
Port
RF Port
2.4 GHz Band General RF Specifications
Table 31: 2.4 GHz Band General RF Specifications
Item
Condition
Minimum Typical
Maximum Unit
TX/RX switch time
Including TX ramp down
–
–
5
µs
RX/TX switch time
Including TX ramp up
–
–
2
µs
Power-up and power-down ramp
time
DSSS/CCK modulations
–
–
100 mA VBAT = 3.6V
2.8
4
5.2
MHz
PWM output current
–
–
–
600
mA
Output current limit
–
–
1400
–
mA
Output voltage range
Programmable, 30 mV steps
Default = 1.35V
1.2
1.35
1.5
V
PWM output voltage
DC accuracy
Includes load and line regulation.
Forced PWM mode
–4
–
4
%
PWM ripple voltage,
static
–
Measure with 20 MHz bandwidth limit.
Static Load. Max Ripple based on
VBAT = 3.6V, Vout = 1.35V,
Fsw = 4 MHz, 2.2 μH inductor L > 1.05 μH,
Cap + Board total-ESR < 20 mΩ,
Cout > 1.9 μF, ESL 1.35V, Co= 2.2 μF,
Vo = 1.2V
20
–
–
dB
LDO turn-on time
LDO turn-on time when rest of chip is up –
140
180
μs
2.2
4.7
μF
1
2.2
μF
External output capacitor, Total ESR (trace/capacitor):
Co
5–240 mΩ
External input capacitor
0.5
Only use an external input capacitor at the –
VDD_LDO pin if it is not supplied from
CBUCK output.
Total ESR (trace/capacitor): 30–200 mΩ
a
a. Minimum capacitor value refers to the residual capacitor value after taking into account the part-to-part
tolerance, DC-bias, temperature, and aging.
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BCM43569 Advance Data Sheet
System Power Consumption
Section 16: System Power Consumption
Note: Values in this data sheet are design goals and are subject to change based on the results of
device characterization.
Unless otherwise stated, these values apply for the conditions specified in Table 26: “Recommended
Operating Conditions and DC Characteristics,” on page 85.
WLAN Current Consumption
The WLAN current consumption measurements are shown in Table 40.
All values in Table 40 are with the Bluetooth core in reset.
VBAT is the main power supply of the chip (ranges from 3.0 to 3.6V).
.
Table 40: Typical WLAN Power Consumption
Mode
Bandwidth
(MHz)
Band
(GHz)
VBAT = VIO = 3.3V
(mA)
OFFa
–
–
0.01
Sleepb
–
–
0.2
IEEE power save, WoWL mode, DTIM 1 1 RX corec
20
2.4
3.5
IEEE power save, WoWL mode, DTIM 3 1 RX corec
20
2.4
1.5
IEEE power save, WoWL mode, DTIM 1 1 RX corec
20
5
2.2
IEEE power save, WoWL mode, DTIM 3 1 RX corec
20
5
1.2
IEEE power save, WoWL mode, DTIM 1 1 RX corec
40
5
2.4
IEEE power save, WoWL mode, DTIM 3 1 RX corec
40
5
1.2
IEEE power save, WoWL mode, DTIM 1 1 RX corec
80
5
2.8
IEEE power save, WoWL mode, DTIM 3 1 RX corec
80
5
2.5
IEEE power save, DTIM 1 1 RX corec
20
2.4
37
IEEE power save, DTIM 3 1 RX corec
20
2.4
35.2
IEEE power save, DTIM 1 1 RX corec
20
5
35.9
IEEE power save, DTIM 3 1 RX corec
20
5
35.2
IEEE power save, DTIM 1 1 RX corec
40
5
35.9
IEEE power save, DTIM 3 1 RX corec
40
5
35.2
IEEE power save, DTIM 1 1 RX corec
80
5
36.1
IEEE power save, DTIM 3 1 RX corec
80
5
35.4
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BCM43569 Advance Data Sheet
WLAN Current Consumption
Table 40: Typical WLAN Power Consumption (Cont.)
Bandwidth
(MHz)
Band
(GHz)
VBAT = VIO = 3.3V
(mA)
Rate 11 (at measured power/core = 18.5 dBm)
20
2.4
365
MCS8, NSS 1 (at measured power/core = 14 dBm)
20
2.4
292
MCS8, NSS 2 (at measured power/core = 14 dBm)
20
2.4
514
MCS7, SGI (at measured power/core = 15 dBm)
20
5
344
MCS15, SGI (at measured power/core = 15 dBm)
20
5
598
MCS7 (at measured power/core = 17 dBm)
40
5
380
MCS9, NSS 1 (at measured power/core = 14.5 dBm)
40
5
363
MCS9, NSS 2 (at measured power/core = 14.5 dBm)
40
5
632
MCS9, NSS 1 (at measured power/core = 13 dBm)
80
5
401
MCS9, NSS 2 (at measured power/core = 13 dBm)
80
5
694
20
2.4
99
Mode
Active Modes
Transmit
Receive
1 Mbps, 1 RX core
1 Mbps, 2 RX cores
20
2.4
118
20
2.4
100
MCS7, HT20 2 RX coresd
20
2.4
123
MCS15, HT20d
20
2.4
130
CRS 1 RX coree
20
2.4
94
CRS 2 RX corese
20
2.4
116
Receive MCS7, SGI 1 RX cored
20
5
112
Receive MCS7, SGI 2 RX coresd
20
5
138
Receiver MCS15, SGId
20
5
148
CRS 1 RX coree
20
5
103
CRS 2 RX corese
20
5
128
Receive MCS 7, SGI 1 RX cored
40
5
131
Receive MCS 7, SGI 2 RX coresd
40
5
170
Receive MCS 15, SGId
40
5
186
CRS 1 RX coree
40
5
115
CRS 2 RX corese
40
5
150
Receive MCS9, NSS 1, SGId
80
5
166
Receive MCS9, NSS 1, SGI 2 RX coresd
80
5
226
Receive MCS9, NSS 2, SGId
80
5
240
CRS 1 RX coree
80
5
145
MCS7, HT20 1 RX
cored
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BCM43569 Advance Data Sheet
WLAN Current Consumption
Table 40: Typical WLAN Power Consumption (Cont.)
Mode
Bandwidth
(MHz)
Band
(GHz)
VBAT = VIO = 3.3V
(mA)
CRS 2 RX corese
80
5
202
a. WL_REG_ON, BT_REG_ON low, no VDDIO.
b. Idle, not associated, or inter-beacon.
c. Beacon Interval = 102.4 ms. Beacon duration = 1 ms @1 Mbps. Average current over three DTIM
intervals.
d. Duty cycle is 100%. Carrier sense (CS) detect/packet receive.
e. Carrier sense (CCA) when no carrier is present.
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BCM43569 Advance Data Sheet
Bluetooth Current Consumption
Bluetooth Current Consumption
The Bluetooth current consumption measurements are shown in Table 41.
Note:
•
•
•
•
VBAT is the main power supply of the chip (ranges from 3.0 to 3.6V).
The WLAN core is in reset (WL_REG_ON = low) for all measurements provided in Table 41.
The BT current consumption numbers are measured based on GFSK TX output power = 12 dBm.
The BT current consumption numbers are measured based on VBAT at 3.3V and VIO at 3.3V.
Table 41: Bluetooth Current Consumption
Operating Mode
VBAT = VIO = 3.3V (mA)
Sleep with external LPOs
1.0
Standard 1.28s inquiry scan
1.2
Standard R1 page and 1.28s inquiry scan
1.3
500 ms sniff att = 4 master
1.2
500 ms sniff att = 4 slave
1.2
DM1/DH1 master TX/RX
25.5
DM3/DH3 master TX/RX
30.9
DM5/DH5 master TX/RX
31.8
3DH1 master TX/RX
23.2
3DH5 master TX/RX
29.5
3DH5 slave TX/RX
29.3
HV3 master (500 ms sniff)
11.7
2EV3 master (500 ms sniff)
8.4
HV3 slave R1 page and 2.56s inquiry scan
11.9
Transmit 100% on maximum OP BDR
49.8
Receive 100% on
17.4
Passive scan 1.28s
1.2
Adv unconnectable 1.00s
1.1
Adv connectable undirected 1.00s
1.1
Connected 1.00s interval master
1.1
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BCM43569 Advance Data Sheet
Interface Timing and AC Characteristics
S e c t i o n 1 7 : I n t e r f a c e Ti m i n g a n d A C
C h a r a c t e ri s t i c s
JTAG Timing
Table 42: JTAG Timing Characteristics
Signal Name
Period
Output
Maximum
Output
Minimum
Setup
Hold
TCK
125 ns
–
–
–
–
TDI
–
–
–
20 ns
0 ns
TMS
–
–
–
20 ns
0 ns
TDO
–
100 ns
0 ns
–
–
JTAG_TRST
250 ns
–
–
–
–
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BCM43569 Advance Data Sheet
Power-Up Sequence and Timing
Section 18: Power-Up Sequence and
Ti m i n g
Sequencing of Reset and Regulator Control Signals
The BCM43569 has two signals that allow the host to control power consumption by enabling or disabling the
Bluetooth, WLAN, and internal regulator blocks. These signals are described below. Additionally, diagrams are
provided to indicate proper sequencing of the signals for various operational states (see Figure 28 on page 113,
Figure 29 on page 113, and Figure 30 on page 114 and Figure 31 on page 114). The timing values indicated are
minimum required values; longer delays are also acceptable.
Description of Control Signals
•
WL_REG_ON: Used by the PMU to power up the WLAN section. It is also OR-gated with the BT_REG_ON
input to control the internal BCM43569 regulators. When this pin is high, the regulators are enabled and the
WLAN section is out of reset. When this pin is low the WLAN section is in reset. If both the BT_REG_ON
and WL_REG_ON pins are low, the regulators are disabled.
•
BT_REG_ON: Used by the PMU (OR-gated with WL_REG_ON) to power up the internal BCM43569
regulators. If both the BT_REG_ON and WL_REG_ON pins are low, the regulators are disabled. When this
pin is low and WL_REG_ON is high, the BT section is in reset.
Note:
•
•
•
•
VBAT is the main power supply of the chip (ranges from 3.0 to 3.6V).
For both the WL_REG_ON and BT_REG_ON pins, there should be at least a 100 ms time delay
between consecutive toggles (where both signals have been driven low). This is to allow time for
the CBUCK regulator to discharge. If this delay is not followed, then there may be a VDDIO in-rush
current on the order of 36 mA during the next PMU cold start.
The BCM43569 has an internal power-on reset (POR) circuit. The device will be held in reset for
a maximum of 110 ms after VDDC and VDDIO have both passed the POR threshold.
VBAT should not rise 10%–90% faster than 40 microseconds. VBAT should be up before or at the
same time as VDDIO. VDDIO should NOT be present first or be held high before VBAT is high.
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BCM43569 Advance Data Sheet
Sequencing of Reset and Regulator Control Signals
Control Signal Timing Diagrams
Figure 28: WLAN = ON, Bluetooth = ON
32.678 kHz
Sleep Clock
VBAT*
High is 90% of VBAT and low is 10% of VBAT.
VDDIO
100 ms
WL_REG_ON
BT_REG_ON
*Notes:
1. VBAT should not rise 10%–90% faster than 40 microseconds.
2. VBAT should be up before or at the same time as VDDIO. VDDIO should NOT be present first or be held high before VBAT is high.
3. Reset control signal timing for warm boot (high/low/high on REG_ON) is 100 ms and for cold power-on (low/high) is 10 ms.
Figure 29: WLAN = OFF, Bluetooth = OFF
32.678 kHz
Sleep Clock
VBAT*
VDDIO
WL_REG_ON
BT_REG_ON
*Notes:
1. VBAT should not rise 10%–90% faster than 40 microseconds.
2. VBAT should be up before or at the same time as VDDIO. VDDIO should NOT be present first or be held high before VBAT is high.
Broadcom®
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BCM43569 Advance Data Sheet
Sequencing of Reset and Regulator Control Signals
Figure 30: WLAN = ON, Bluetooth = OFF
32.678 kHz
Sleep Clock
VBAT*
High is 90% of VBAT and low is 10% of VBAT.
VDDIO
100 ms
WL_REG_ON
BT_REG_ON
*Notes:
1. VBAT should not rise 10%–90% faster than 40 microseconds.
2. VBAT should be up before or at the same time as VDDIO. VDDIO should NOT be present first or be held high before VBAT is high.
3. Reset control signal timing for warm boot (high/low/high on REG_ON) is 100 ms and for cold power-on (low/high) is 10 ms.
Figure 31: WLAN = OFF, Bluetooth = ON
32.678 kHz
Sleep Clock
VBAT*
High is 90% of VBAT and low is 10% of VBAT.
VDDIO
100 ms
WL_REG_ON
BT_REG_ON
*Notes:
1. VBAT should not rise 10%–90% faster than 40 microseconds.
2. VBAT should be up before or at the same time as VDDIO. VDDIO should NOT be present first or be held high before VBAT is high.
3. Reset control signal timing for warm boot (high/low/high on REG_ON) is 100 ms and for cold power-on (low/high) is 10 ms.
Broadcom®
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BCM43569 Advance Data Sheet
Sequencing of Reset and Regulator Control Signals
Figure 32 shows the WLAN boot-up sequence from power-up to firmware download.
Figure 32: WLAN Boot-Up Sequence
VBAT*
VDDIO
WL_REG_ON
< 850 µs
VDDC
(from internal PMU)
< 104 ms
Internal POR
After a fixed delay following Internal POR and WL_REG_ON
going high, the device responds to host F0 (address 0x14)
reads.
< 4 ms
Device requests for reference clock
8 ms
After 8 ms the reference clock is
assumed to be up. Access to PLL
registers is possible.
Host Interaction:
Host polls F0 (address 0x14) until it reads a
predefined pattern.
Host sets wake-up-wlan bit and
waits 8 ms, the maximum time
for reference clock availability.
After 8 ms, host programs PLL
registers to set crystal frequency
Chip active interrupt is asserted after the PLL locks
Host downloads
code.**
*Notes:
1. VBAT should not rise 10%–90% faster than 40 microseconds.
2. VBAT should be up before or at the same time as VDDIO. VDDIO should NOT be present first or be held high
before VBAT is high.
3. For timing information of the host interaction (after asserting WL_REG_ON) to be ready for firmware download is
typically 124 ms, including POR.
4. Wi-Fi FW download depends on the system performance and memory available. Typically, the firmware download
on a FC19 Linux PC is 102 ms.
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BCM43569 Advance Data Sheet
Sequencing of Reset and Regulator Control Signals
Figure 33 shows the Bluetooth boot-up sequence from power-up to firmware download.
Figure 33: Bluetooth Boot-Up Sequence
VBATT/VDDIO
BT_REG_ON
BT_USB_DP
T1
T2
T3
T5
T6
BT_USB_DN
Notes:
T1: Reset control signal timing ~100 ms.
T2: BT POR and FW ROM boot time, before BT enables USB D+ pull-up to connect the device to the host, ranges from 100 ms (ROM boot) to 250 ms
(depends on the size of FW download, based on Broadcom qualified BT Sflash).
T3: > 100 ms USB connection de-bounce time on the host side.
T5: > 10 ms Host drives USB reset.
T6: > 10 ms Host sends USB SOF packet.
After T6: Device is ready to communicate with the host.
Broadcom®
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BCM43569 Advance Data Sheet
Package Information
Section 19: Package Information
Package Thermal Characteristics
Table 43: Package Thermal Characteristicsa
Characteristic
Value
JA (°C/W) (value in still air)
26.38
JB (°C/W)
8.37
JC (°C/W)
9.94
JT (°C/W)
6.12
JB (°C/W)
12.62
Maximum Junction Temperature Tj (°C)
125
Maximum Power Dissipation (W)
2.46
a. No heat sink, TA = 60°C. This is an estimate, based on a 4-layer PCB that conforms to EIA/JESD51–7
(101.6 mm × 101.6 mm × 1.6 mm) and P = 1.53W continuous dissipation.
Junction Temperature Estimation and PSIJT Versus ThetaJC
The package thermal characterization parameter PSIJT (JT) yields a better estimation of actual junction
temperature (TJ) than using the junction-to-case thermal resistance parameter ThetaJC (JC). The reason for
this is that JC is based on the assumption that all the power is dissipated through the top surface of the package
case. In actual applications, however, some of the power is dissipated through the bottom and sides of the
package. JT takes into account the power dissipated through the top, bottom, and sides of the package. The
equation for calculating the device junction temperature is:
TJ = TT + P x JT
Where:
•
TJ = Junction temperature at steady-state condition (°C)
•
TT = Package case top center temperature at steady-state condition (°C)
•
P = Device power dissipation (Watts)
•
JT = Package thermal characteristics; no airflow (°C/W)
Environmental Characteristics
For environmental characteristics data, see Table 25: “Environmental Ratings,” on page 84.
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BCM43569 Advance Data Sheet
Mechanical Information
Section 20: Mechanical Information
Figure 34: 254-Ball Package Mechanical Information
Broadcom®
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BCM43569 Advance Data Sheet
Ordering Information
S e c t i o n 2 1 : O rd e r i n g I n f o r m a t i o n
Table 44: Ordering Information
Part Number
Package
Description
Operating
Ambient
Temperature
BCM43569PKFFBG
254-ball FCBGA
(10 mm × 10 mm,
0.4 mm pitch)
Dual-band 2.4 GHz and 5 GHz WLAN
+ BT 4.1
0°C to +60°C
(32°F to 140°F)
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BCM43569 Advance Data Sheet
Broadcom® Corporation reserves the right to make changes without further notice to any products or
data herein to improve reliability, function, or design.
Information furnished by Broadcom Corporation is believed to be accurate and reliable. However,
Broadcom Corporation does not assume any liability arising out of the application or use of this
information, nor the application or use of any product or circuit described herein, neither does it
convey any license under its patent rights nor the rights of others.
®
Broadcom Corporation
5300 California Avenue
Irvine, CA 92617
© 2016 by BROADCOM CORPORATION. All rights reserved.
43569-DS109-R
January 19, 2016
Phone: 949-926-5000
Fax: 949-926-5203
E-mail: info@broadcom.com
Web: www.broadcom.com