DEMOBOARDTLE7181EMTOBO1

H-Bridge Driver IC TLE7181EM Evaluation Board Application Note Rev 1.2, 2012-03-20 Automotive Power H-Bridge Driver IC TLE7181EM Evaluation Board Abstract 1 Abstract Note: The following information is given as a hint for the implementation of the device only and shall not be regarded as a description or warranty of a certain functionality, condition or quality of the device. This Application Note is intended to provide information about the TLE7181EM Evalution Board Revision 1.1. The board is designed to facilitate the evaluation of the Infineon H-bridge driver TLE7181EM. This document includes a board description, a quick start guide, the schematics and the layout of the board. It is assumed that the reader is familiar with the driver IC data sheet. The board itself can be ordered using the usual Infineon Technologies sales channels. Please make sure that the revision of your evaluation board and the board revision described in this document (1.1) match before you get started. Application Note 2 Rev 1.2, 2012-03-20 H-Bridge Driver IC TLE7181EM Evaluation Board Board description 2 Board description Besides the H-bridge driver itself, the TLE7181EM Evalution Board contains 5 N-Channel Power MOSFETs, a current sense shunt resistor and other additional components like a 5V regulator to allow operation without a lot of external equipment. It is designed for automotive 12V applications. This chapter describes all parts of the board. Schematics and layout are covered in detail in Chapter 4 2.1 Overview Figure 1 contains the top view of the board. Figure 1 top view of the TLE7181EM Evalution Board 2.2 Power Supply The power supply of the board and the load (=motor) has to be connected to the connector X2. Please see Figure 1 for the required polarity. 2.3 Power Stages and Phase Outputs Each of the two power stages contain two IPD90N04S04-02 n-channel MOSFETs. One of them is used as a low side switch, the other one as a high side switch. Two DC link capacitors (220µF and 2.2µF) have been added. It is possible to add snubber circuits for high side as well as the low side MOSFETs but they are not mounted by default. The phase outputs are available on the connector X3. Figure 2 shows the power stage components in detail. Application Note 3 Rev 1.2, 2012-03-20 H-Bridge Driver IC TLE7181EM Evaluation Board Board description Figure 2 power stage 2.4 Status LEDs The TLE7181EM Evalution Board has two status LEDs. The green 5V LED indicates that the 5V voltage regulator is working correctly. The red ERR LED will light up if there is a warning or an error indication of the bridge driver. 2.5 Solder Bridges The PCB of the TLE7181EM Evalution Board is also used for the TLE7182EM Evalution Board. The solder bridges have to be set according to Figure 3. Figure 3 required solder bridges configuration for TLE7181EM Application Note 4 Rev 1.2, 2012-03-20 H-Bridge Driver IC TLE7181EM Evaluation Board Board description 2.6 Drive Card Connector to Microcontroller The drive card connector is the interface to the microcontroller. It contains the 5V supply voltage for the microcontroller as well as all relevant connections to input and output pins of the bridge driver. Please see the schematics in Chapter 4 for a detailed pin description. All jumpers except JP1 (SCDL open) have to be open if a microcontroller is used. 2.7 Jumpers, Buttons and Potentiometers The TLE7181EM Evalution Board has several jumpers to simplify usage without a microcontroller, to allow tweaking of the dead time (DT) and short circuit detection level (SCDL) and for testing purposes. 2.7.1 ENA jumper JP5 and Reset Button The ENA pin of the driver IC enables it. ENA can be set to 5V by setting the jumper JP5. ENA can be temporarily set to GND by pressing the reset button. This will reset the IC. If the device is used with a microcontroller, JP5 has to be open in order not to override the ENA signal coming from the microcontroller. 2.7.2 Dead Time Configuration and Testing with R25, R31 and JP4 The dead time generated by TLE7181EM depends on the resistor value connected between the DT pin of the IC and GND. Please see the data sheet for the full description. R25 and R31 can be used to tweak the value of this resistor. Setting JP4 connects the DT pin of the IC directly to GND. In this case the IC will generate the mininum dead time specified in the data sheet. 2.7.3 Short Circuit Detection Level Configuration The short circuit detection level can be adjusted with the SCD potentiometer next to the jumper JP1. It has to be assured that SCDL is within the range specified in the data sheet. The jumper JP1 has to be set in normal operation mode. In order to test the SCD open pin detection, JP1 can be removed. In this case the ERR LED has to light up. 2.7.4 DIR Configuration with JP2 TLE7181EM has a PWM/DIR input interface to control the external MOSFETs. The DIR signal is used to control the direction. JP2 can be used to set DIR to high without any external equipment. If the device is used with a microcontroller, JP2 has to be disconnected in order not to override the DIR signal coming from the microcontroller. 2.7.5 DRVDIS Configuration with JP3 DRVDIS set to high switches off all external MOSFETs. The default value is also high, so the MOSFETs are switched off by default. JP3 allows setting DRVDIS to low without external equipment, so switching of the external MOSFETs according to the input patterns is possible. If the device is used with a microcontroller, JP3 has to be disconnected in order not to override the DRVDIS signal coming from the microcontroller. Application Note 5 Rev 1.2, 2012-03-20 H-Bridge Driver IC TLE7181EM Evaluation Board Quick Start Guide 3 Quick Start Guide 3.1 Before You Begin Please make sure that the revision of your evaluation board and the board revision described in this document (1.1) match before you get started. The revision number is printed on the PCB as shown in Figure 4. Figure 4 board revision 3.2 Preparation The same PCB is used for both, the TLE7181EM Evalution Board and the TLE7182EM Evalution Board. Please check whether the correct H-bridge driver IC is mounted on the PCB. Please set the solder bridges according to Chapter 2.5. 3.3 Simple Example without a Microcontroller To drive an external DC-brush motor at the phase outputs, only a few steps are required. • • • • • • • • • • • set jumper JP1 (see Chapter 2.7.3) to avoid the SCDL open pin error set jumper JP5 (see Chapter 2.7.1) to set the ENA pin to high to select a specific direction of the motor, change the DIR jumper JP2 accordingly (see Chapter 2.7.4) open jumper JP4 (see Chapter 2.7.2) to be able use the dead time configuration with the potentiometers at R25 and R31 connect a 12V power supply according to Chapter 2.2 connect a DC-brush motor to the outputs OUT1 and OUT2 if the red ERR LED indicates a problem, make sure that the SCDL voltage is within the range specified in the data sheet. At the time of writing this document, the current data sheet defines a valid range from 0.2..2.0V. If the SCDL voltage is not within this range, please change it as described in Chapter 2.7.3 if the red ERR LED still indicates a problem, please go through the error conditions specified in the data sheet. If one or more of them are met, please resolve them enable the output stages of the driver IC by setting DRVDIS to low. This can be done by setting the jumper JP3 (see Chapter 2.7.5) apply a PWM signal with a duty cycle of 50% which meets the requirements defined in the data sheet to the pin X1-B4 of the drive card connector (see Figure 5) now the MOSFETs should be switching as defined by the input signals Application Note 6 Rev 1.2, 2012-03-20 H-Bridge Driver IC TLE7181EM Evaluation Board Quick Start Guide Figure 5 Driver Card Connector PIN for PWM (X1-B4) Application Note 7 Rev 1.2, 2012-03-20 H-Bridge Driver IC TLE7181EM Evaluation Board schematics and layout 4 schematics and layout Figure 6 contains the schematics. Table 1 contains the part list. Figure 6 schematics Application Note 8 Rev 1.2, 2012-03-20 H-Bridge Driver IC TLE7181EM Evaluation Board schematics and layout Figure 7 placing of components Application Note 9 Rev 1.2, 2012-03-20 H-Bridge Driver IC TLE7181EM Evaluation Board schematics and layout Figure 8 first layer Application Note 10 Rev 1.2, 2012-03-20 H-Bridge Driver IC TLE7181EM Evaluation Board schematics and layout Figure 9 second layer Application Note 11 Rev 1.2, 2012-03-20 H-Bridge Driver IC TLE7181EM Evaluation Board schematics and layout Figure 10 third layer Application Note 12 Rev 1.2, 2012-03-20 H-Bridge Driver IC TLE7181EM Evaluation Board schematics and layout Figure 11 bottom layer Application Note 13 Rev 1.2, 2012-03-20 H-Bridge Driver IC TLE7181EM Evaluation Board schematics and layout Table 1 part list (major components only) Part Value Package C1 4,7nF (n.m.) C0805 C2 100n C0805 C3 4,7nF (n.m.) C0805 C4 100n C0805 C5 2,2µ C1210 C6 4,7nF (n.m.) C0805 C7 330n C0805 C8 330n C0805 C9 4,7nF (n.m.) C0805 C10 22u/50V E2,5-6 C11 10u C0805 C12 100p C0805 C13 47n/50V C1210 C14 10p C0805 C15 10p C0805 C16 220p C0805 C17 220p C0805 C18 2,2u/50V C1206 C19 100n C0805 C20 2,2u/50V C1206 C21 100n C0805 C22 22n C0805 C23 22n C0805 C24 (n.m.) C0805 C26 220u/50V E5-10,5 C28 220u/50V E5-10,5 C29 2,2µ C1210 D1 (n.m.) MINIMELF D2 BAW56 SOT23C D3 (n.m.) MINIMELF D4 BAW56 SOT23C D5 (n.m.) MINIMELF D6 (n.m.) MINIMELF D7 ZMM12 MINIMELF D8 (n.m.) MINIMELF HS1 IPD90N04S4-02 TO252-3-1 HS2 IPD90N04S4-02 TO252-3-1 IC1 TLE7181EM SSPO24_EXPOSED IC2 TLE4269 P-DSO08 L1 2,2 µH SER2000 Application Note 14 Rev 1.2, 2012-03-20 H-Bridge Driver IC TLE7181EM Evaluation Board schematics and layout Table 1 part list (major components only) Part Value Package LS1 IPD90N04S4-02 TO252-3-1 LS2 IPD90N04S4-02 TO252-3-1 Q1 BC846B SOT23 R1 2,2R (n.m.) R1206 R2 2,2R (n.m.) R1206 R3 2,2R (n.m.) R1206 R4 2,2R (n.m.) R1206 R5 10R 1% R0805 R6 10R 1% R0805 R7 10R 1% R0805 R8 10R 1% R0805 R9 0R R0805 R10 0R R0805 R11 0R R0805 R12 220R/1% R0805 R13 220R/1% R0805 R14 10k/1% R0805 R15 10k/1% R0805 R16 10k/1% R0805 R17 1k R0805 R18 4k7 R0805 R19 22R 1% R0805 R20 100k TS53Y R21 10k R0805 R22 1R R1206 R23 22k R0805 R24 1k R0805 R25 47k TS53Y R27 10k R0805 R28 1R R1206 R29 10k R0805 R30 10k R0805 R31 220k TS53Y R32 10k R0805 R33 0,002/5W SMV R34 10k R0805 R35 10k R0805 R36 10k R0805 R37 2k7 R1206 R38 2k7 R1206 R39 47k R0805 Application Note 15 Rev 1.2, 2012-03-20 H-Bridge Driver IC TLE7181EM Evaluation Board schematics and layout Table 1 part list (major components only) Part Value Package R40 5,1k R0805 R41 5,1k R0805 R42 47k R0805 R43 47k R0805 R44 10k/1% R0805 RPP-MOSFET IPD90N04S4-02 TO252-3-1 Application Note 16 Rev 1.2, 2012-03-20 H-Bridge Driver IC TLE7181EM Evaluation Board Revision History 5 Revision History TLE7181EM Evalution Board Revision History: Rev 1.2, 2012-03-20 Previous Version(s):1.1 Page Subjects (major changes since last revision) - several changes related to updated Evaluation Board revision 1.1 - editorial changes Application Note 17 Rev 1.2, 2012-03-20 Edition 2012-03-20 Published by Infineon Technologies AG 81726 Munich, Germany © 2012 Infineon Technologies AG All Rights Reserved. LEGAL DISCLAIMER THE INFORMATION GIVEN IN THIS APPLICATION NOTE IS GIVEN AS A HINT FOR THE IMPLEMENTATION OF THE INFINEON TECHNOLOGIES COMPONENT ONLY AND SHALL NOT BE REGARDED AS ANY DESCRIPTION OR WARRANTY OF A CERTAIN FUNCTIONALITY, CONDITION OR QUALITY OF THE INFINEON TECHNOLOGIES COMPONENT. THE RECIPIENT OF THIS APPLICATION NOTE MUST VERIFY ANY FUNCTION DESCRIBED HEREIN IN THE REAL APPLICATION. INFINEON TECHNOLOGIES HEREBY DISCLAIMS ANY AND ALL WARRANTIES AND LIABILITIES OF ANY KIND (INCLUDING WITHOUT LIMITATION WARRANTIES OF NON-INFRINGEMENT OF INTELLECTUAL PROPERTY RIGHTS OF ANY THIRD PARTY) WITH RESPECT TO ANY AND ALL INFORMATION GIVEN IN THIS APPLICATION NOTE. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.