ESD208B102ELSE6327XTSA1 数据手册
TVS Diode
Transient Voltage Suppressor Diodes
ESD208-B1-02 Series
Ultra Low Clamping ESD / Transient Protection Diode
ESD208-B1-02EL
ESD208-B1-02ELS
Data Sheet
Revision 1.2, 2013-11-29
Final
Power Management & Multimarket
ESD208-B1-02 Series
Revision History Revision 1.1, 2013-11-26
Page or Item
Subjects (major changes since previous revision)
Revision 1.2, 2013-11-29
5
Update of Table 2-2)
Trademarks of Infineon Technologies AG
AURIX™, BlueMoon™, C166™, CanPAK™, CIPOS™, CIPURSE™, COMNEON™, EconoPACK™, CoolMOS™,
CoolSET™, CORECONTROL™, CROSSAVE™, DAVE™, EasyPIM™, EconoBRIDGE™, EconoDUAL™,
EconoPIM™, EiceDRIVER™, eupec™, FCOS™, HITFET™, HybridPACK™, I²RF™, ISOFACE™, IsoPACK™,
MIPAQ™, ModSTACK™, my-d™, NovalithIC™, OmniTune™, OptiMOS™, ORIGA™, PRIMARION™,
PrimePACK™, PrimeSTACK™, PRO-SIL™, PROFET™, RASIC™, ReverSave™, SatRIC™, SIEGET™,
SINDRION™, SIPMOS™, SMARTi™, SmartLEWIS™, SOLID FLASH™, TEMPFET™, thinQ!™,
TRENCHSTOP™, TriCore™, X-GOLD™, X-PMU™, XMM™, XPOSYS™.
Other Trademarks
Advance Design System™ (ADS) of Agilent Technologies, AMBA™, ARM™, MULTI-ICE™, KEIL™,
PRIMECELL™, REALVIEW™, THUMB™, µVision™ of ARM Limited, UK. AUTOSAR™ is licensed by AUTOSAR
development partnership. Bluetooth™ of Bluetooth SIG Inc. CAT-iq™ of DECT Forum. COLOSSUS™,
FirstGPS™ of Trimble Navigation Ltd. EMV™ of EMVCo, LLC (Visa Holdings Inc.). EPCOS™ of Epcos AG.
FLEXGO™ of Microsoft Corporation. FlexRay™ is licensed by FlexRay Consortium. HYPERTERMINAL™ of
Hilgraeve Incorporated. IEC™ of Commission Electrotechnique Internationale. IrDA™ of Infrared Data
Association Corporation. ISO™ of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLAB™ of
MathWorks, Inc. MAXIM™ of Maxim Integrated Products, Inc. MICROTEC™, NUCLEUS™ of Mentor Graphics
Corporation. Mifare™ of NXP. MIPI™ of MIPI Alliance, Inc. MIPS™ of MIPS Technologies, Inc., USA. muRata™
of MURATA MANUFACTURING CO., MICROWAVE OFFICE™ (MWO) of Applied Wave Research Inc.,
OmniVision™ of OmniVision Technologies, Inc. Openwave™ Openwave Systems Inc. RED HAT™ Red Hat, Inc.
RFMD™ RF Micro Devices, Inc. SIRIUS™ of Sirius Satellite Radio Inc. SOLARIS™ of Sun Microsystems, Inc.
SPANSION™ of Spansion LLC Ltd. Symbian™ of Symbian Software Limited. TAIYO YUDEN™ of Taiyo Yuden
Co. TEAKLITE™ of CEVA, Inc. TEKTRONIX™ of Tektronix Inc. TOKO™ of TOKO KABUSHIKI KAISHA TA.
UNIX™ of X/Open Company Limited. VERILOG™, PALLADIUM™ of Cadence Design Systems, Inc. VLYNQ™
of Texas Instruments Incorporated. VXWORKS™, WIND RIVER™ of WIND RIVER SYSTEMS, INC. ZETEX™ of
Diodes Zetex Limited.
Last Trademarks Update 2010-10-26
Final Data Sheet
2
Revision 1.2, 2013-11-29
ESD208-B1-02 Series
Ultra Low Clamping ESD / Transient Protection Diode
1
Ultra Low Clamping ESD / Transient Protection Diode
1.1
Features
•
•
•
•
•
ESD / transient protection of signal lines in low voltage applications according to:
– IEC61000-4-2 (ESD): ±30 kV air discharge, ±25 kV contact discharge
– IEC61000-4-4 (EFT): ±80 A / ±4 kV (5/50 ns)
– IEC61000-4-5 (Surge): ±4 A (8/20 µs)
Bi-directional, symmetrical working voltage up to VRWM = ±3.3 V
Low capacitance: CL = 6 pF (typical)
Very low clamping voltage due to extremely low dynamic resistance down to: RDYN = 0.2 Ω (typical)
Pb-free (RoHS compliant) and halogen free package, very small form factor down to: 0.62 x 0.32 x 0.31 mm3
1.2
•
•
•
Application Examples
Keypad, touchpad, buttons, convenience keys
LCD displays, Camera, audio lines, mobile communication, Consumer products (E-Book, MP3, DVD, DSC...)
Notebooks tablets and desktop computers and their peripherals
1.3
Product Description
Pin 1
Pin 2
Pin 1 marking
(lasered)
Pin 1
TSLP-2
Pin 1
Pin 2
Pin 2
TSSLP-2
a) Pin configuration
b) Schematic diagram
P G-TS (S)LP -2_Dual_Diode_S erie_P inConf_and_S c hematic Diag. v s d
Figure 1-1 Pin Configuration and Schematic Diagram
Table 1-1
Ordering Information
Type
Package
Configuration
Marking code
ESD208-B1-02EL
TSLP-2-19
1 line, bi-directional
C
ESD208-B1-02ELS
TSSLP-2-3
1 line, bi-directional
C
Final Data Sheet
3
Revision 1.2, 2013-11-29
ESD208-B1-02 Series
Characteristics
2
Characteristics
Table 2-1
Maximum Ratings at TA = 25 °C, unless otherwise specified 1)
Parameter
Symbol
Values
Unit
Min.
Typ.
Max.
–
–
–
–
30
25
IPP
–
–
4
A
Peak pulse power (tp = 8/20 μs)
PPK
–
–
30
W
Operating temperature range
TOP
-55
–
125
°C
Storage temperature
Tstg
-65
–
150
°C
ESD discharge
air
contact
2)
kV
VESD
Peak pulse current (tp = 8/20 μs)3)
3)
1) Device is electrically symmetrical
2) VESD according to IEC61000-4-2 (R = 330 Ω, C = 150 pF)
3) IPP according to IEC61000-4-5 (tp = 8/20 μs)
Attention: Stresses above the max. values listed here may cause permanent damage to the device.
Exposure to absolute maximum rating conditions for extended periods may affect device
reliability. Maximum ratings are absolute ratings; exceeding only one of these values may
cause irreversible damage to the integrated circuit.
2.1
Electrical Characteristics at TA = 25 °C, unless otherwise specified
!"#
Figure 2-1 Definitions of electrical characteristics
Final Data Sheet
4
Revision 1.2, 2013-11-29
ESD208-B1-02 Series
Characteristics
Table 2-2
DC Characteristics at TA = 25 °C, unless otherwise specified 1)
Parameter
Symbol
Values
Unit
Note /
Test Condition
Min.
Typ.
Max.
Reverse working voltage VRWM
–
–
3.3
V
Reverse current
IR
–