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ESD5V3U4U-HDMIE6327

ESD5V3U4U-HDMIE6327

  • 厂商:

    EUPEC(英飞凌)

  • 封装:

    XFDFN8_EP

  • 描述:

    TVSDIODE5.3VWM28VCTSLP9

  • 数据手册
  • 价格&库存
ESD5V3U4U-HDMIE6327 数据手册
TVS Diode Transient Voltage Suppressor Diode ESD5V3U4U-HDMI Uni-directional Ultra-low Capacitance ESD / Transient Protection Array ESD5V3U4U-HDMI Data Sheet Revision 1.1, 2012-07-03 Final Powermanagement & Multi-Market Edition 2012-07-03 Published by Infineon Technologies AG 81726 Munich, Germany © 2012 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. ESD5V3U4U-HDMI Revision History Revision 1.0, 2012-06-30 Page or Item Subjects (major changes since previous revision) Revision 1.1, 2012-07-03 7 Figure 2-1 Trademarks of Infineon Technologies AG AURIX™, BlueMoon™, C166™, CanPAK™, CIPOS™, CIPURSE™, COMNEON™, EconoPACK™, CoolMOS™, CoolSET™, CORECONTROL™, CROSSAVE™, DAVE™, EasyPIM™, EconoBRIDGE™, EconoDUAL™, EconoPIM™, EiceDRIVER™, eupec™, FCOS™, HITFET™, HybridPACK™, I²RF™, ISOFACE™, IsoPACK™, MIPAQ™, ModSTACK™, my-d™, NovalithIC™, OmniTune™, OptiMOS™, ORIGA™, PRIMARION™, PrimePACK™, PrimeSTACK™, PRO-SIL™, PROFET™, RASIC™, ReverSave™, SatRIC™, SIEGET™, SINDRION™, SIPMOS™, SMARTi™, SmartLEWIS™, SOLID FLASH™, TEMPFET™, thinQ!™, TRENCHSTOP™, TriCore™, X-GOLD™, X-PMU™, XMM™, XPOSYS™. Other Trademarks Advance Design System™ (ADS) of Agilent Technologies, AMBA™, ARM™, MULTI-ICE™, KEIL™, PRIMECELL™, REALVIEW™, THUMB™, µVision™ of ARM Limited, UK. AUTOSAR™ is licensed by AUTOSAR development partnership. Bluetooth™ of Bluetooth SIG Inc. CAT-iq™ of DECT Forum. COLOSSUS™, FirstGPS™ of Trimble Navigation Ltd. EMV™ of EMVCo, LLC (Visa Holdings Inc.). EPCOS™ of Epcos AG. FLEXGO™ of Microsoft Corporation. FlexRay™ is licensed by FlexRay Consortium. HYPERTERMINAL™ of Hilgraeve Incorporated. IEC™ of Commission Electrotechnique Internationale. IrDA™ of Infrared Data Association Corporation. ISO™ of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLAB™ of MathWorks, Inc. MAXIM™ of Maxim Integrated Products, Inc. MICROTEC™, NUCLEUS™ of Mentor Graphics Corporation. Mifare™ of NXP. MIPI™ of MIPI Alliance, Inc. MIPS™ of MIPS Technologies, Inc., USA. muRata™ of MURATA MANUFACTURING CO., MICROWAVE OFFICE™ (MWO) of Applied Wave Research Inc., OmniVision™ of OmniVision Technologies, Inc. Openwave™ Openwave Systems Inc. RED HAT™ Red Hat, Inc. RFMD™ RF Micro Devices, Inc. SIRIUS™ of Sirius Satellite Radio Inc. SOLARIS™ of Sun Microsystems, Inc. SPANSION™ of Spansion LLC Ltd. Symbian™ of Symbian Software Limited. TAIYO YUDEN™ of Taiyo Yuden Co. TEAKLITE™ of CEVA, Inc. TEKTRONIX™ of Tektronix Inc. TOKO™ of TOKO KABUSHIKI KAISHA TA. UNIX™ of X/Open Company Limited. VERILOG™, PALLADIUM™ of Cadence Design Systems, Inc. VLYNQ™ of Texas Instruments Incorporated. VXWORKS™, WIND RIVER™ of WIND RIVER SYSTEMS, INC. ZETEX™ of Diodes Zetex Limited. Last Trademarks Update 2010-10-26 FinalData Sheet 3 Revision 1.1, 2012-07-03 ESD5V3U4U-HDMI Uni-directional Ultra-low Capacitance ESD / Transient Protection Array 1 Uni-directional Ultra-low Capacitance ESD / Transient Protection Array 1.1 Features • • • • • • • ESD / Transient protection of high speed data lines exceeding: – IEC61000-4-2 (ESD): ±20 kV (air / contact) – IEC61000-4-4 (EFT): 2.5 kV / 50 A (5/50 ns) – IEC61000-4-5 (surge): 3 A (8/20 μs) Maximum working voltage: VR = 5.3 V Very low reverse current: IR < 1 nA typ. Extremely low capacitance: 0.4 pF typ. (I/O to GND) Four-lines protection array with pad pitch = 0.5 mm Flow-through design for optimal PCB layout of differential lines Pb-free package (RoHS compliant) and halogen free package 1.2 • • • Application Examples Protection of high speed digital interfaces like: HDMI 1.3, HDMI 1.4a, MHL, DisplayPort, S-ATA, DVI, MIPI, MDDI USB2.0, 10/100/1000 Ethernet, FireWire 2 Product Description Pin 9 Pin 8 Pin 7 Pin 6 Pin 1 I/O Pin 2 I/O Pin 4 I/O Pin 5 I/O GND Pin 1 Pin 2 Pin 3 Pin 4 Pin 5 a) Pin configuration b) Schematic diagram Figure 2-1 Pin Configuration and Schematic Diagram Table 2-1 Ordering information Type Package Configuration ESD5V3U4U-HDMI PG-TSLP-9-1 4 lines, uni-directional FinalData Sheet Pin 3 4 Marking code Z1 Revision 1.1, 2012-07-03 ESD5V3U4U-HDMI Characteristics 3 Characteristics Table 3-1 Maximum Rating at TA = 25 °C, unless otherwise specified Parameter Symbol Values Unit Min. Typ. Max. VESD – – 20 kV IPP – – 3 A Operating temperature range TOP -40 – 125 °C Storage temperature 1) VESD according to IEC61000-4-2 2) IPP according to IEC61000-4-5 Tstg -65 – 150 °C ESD (air / contact) discharge 1) Peak pulse current (tp = 8/20 μs) 3.1 2) Electrical Characteristics at TA = 25 °C, unless otherwise specified RDYN: Dynamic resistance IF VBR: Breakdown voltage VRWM: Maximum working voltage IPP VCL: Clamping voltage RDYN VFC: Forward clamping voltage I PP: Peak pulse current IF VCL VBR VRWM VR VF I RWM VF VFC IR VF: Forward voltage I F: Forward current RDYN VR: Reverse voltage I PP I R: Reverse current IR Diode_Charac teris tic_Curv e_Uni-directional. v sd Figure 3-1 Definitions of Electrical Characteristics Table 3-2 DC Characteristics at TA = 25 °C, unless otherwise specified Parameter Symbol Values Unit Min. Typ. Max. Reverse working voltage VRWM – – 5.3 V Breakdown voltage 6 – – V VBR Note / Test Condition IBR = 1 mA (I/O to GND) Reverse current IR – 10pF), Low (
ESD5V3U4U-HDMIE6327 价格&库存

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