European PowerSemiconductor and Electronics Company GmbH + Co. KG
Marketing Information FD 400 R 12 KF4
11,85 55,2 M8
screwing depth max. 8
31,5
130 114
E1
C2
C1 E1 G1 C1
E2
M4
7 28 2,5 deep
16 40 53 2,5 deep
screwing depth max. 8
E1
E1
C2 (K)
G1
C1
C1
E2 (A)
A15/97 Mod-E/ 21.Jan 1998 G.Schulze
FD 400 R 12 KF 4
Höchstzulässige Werte / Maximum rated values Elektrische Eigenschaften / Electrical properties
Kollektor-Emitter-Sperrspannung Kollektor-Dauergleichstrom Periodischer Kollektor Spitzenstrom Gesamt-Verlustleistung Gate-Emitter-Spitzenspannung Dauergleichstrom Periodischer Spitzenstrom Isolations-Prüfspannung collector-emitter voltage DC-collector current repetitive peak collctor current total power dissipation gate-emitter peak voltage DC forward current repetitive peak forw. current insulation test voltage VCES IC ICRM Ptot VGE IF IFRM VISOL min. 4,5 Eoff 60 - mWs typ. 2,7 3,3 5,5 28 8 32 0,7 0,8 0,9 1,0 0,10 0,15 70 1200 400 800 2700 ± 20 400 800 2,5 max. 3,2 3,9 6,5 400 400 V A A W V A A kV
tp=1 ms tC=25°C, Transistor /transistor
tp=1ms RMS, f=50 Hz, t= 1 min.
Charakteristische Werte / Characteristic values: Transistor
Kollektor-Emitter Sättigungsspannung Gate-Schwellenspannung Eingangskapazität Kollektor-Emitter Reststrom Gate-Emitter Reststrom Emitter-Gate Reststrom Einschaltzeit (induktive Last) Speicherzeit (induktive Last) Fallzeit (induktive Last) Einschaltverlustenergie pro puls Abschaltverlustenergie pro Puls collector-emitter saturation voltage gate threshold voltage input capacity collector-emitter cut-off current gate leakage current gate leakage current turn-on time (inductive load) storage time (inductive load) fall time (inductive load) turn-on energie per pulse turn-off energie loss per pulse i C=400A, vGE=15V, t vj=25°C i C=400A, vGE=15V, t vj=125°C i C=16mA, vCE=vGE, tvj=25°C fO=1MHz,tvj=25°C,vCE=25V, v GE=0V vCE=1200V, v GE=0V, t vj=25°C vCE=1200V, v GE=0V, t vj=125°C vCE=0V, v GE=20V, t vj=25°C vCE=0V, v EG=20V, t vj=25°C i C=400A,vCE=600V,vL=±15V,R G=3,6 i C=400A,vCE=600V,vL=±15V,R G=3,6 i C=400A,vCE=600V,vL=±15V,R G=3,6 i C=400A,vCE=600V,vL=±15V,R G=3,6 i C=400A,vCE=600V,vL=±15V,R G=3,6 i C=400A,vCE=600V,vL=±15V,R G=3,6 i C=400A, vCE=600V, L s=70nH vL=±15V, R G=3,6 , tvj=125°C i C=400A, vCE=600V, L s=70nH vL=±15V, R G=3,6 , tvj=125°C vCE sat vGE(th) Cies i CES i GES i EGS ,tvj= 25°C ton ,tvj=125°C ,tvj= 25°C ts ,tvj=125°C ,tvj= 25°C tf ,tvj=125°C Eon
V V V nF mA mA nA nA µs µs µs µs µs µs
- mWs
Charakteristische Werte / Characteristic values
Inversdiode / Inverse diode Durchlaßspannung Rückstromspitze forward voltage peak reverse recovery current i F=400A, vGE=0V, t vj=25°C i F=400A, vGE=0V, t vj=125°C i F=400A, vRM=600V, v EG = 10V -diF/dt = 2,0 kA/µs, tvj = 25°C -diF/dt = 2,0 kA/µs, tvj = 125°C i F=400A, vRM=600V, v EG = 10V -diF/dt = 3,0 kA/µs, tvj = 25°C -diF/dt = 3,0 kA/µs, tvj = 125°C vF IRM Qr 18 50 - µAs - µAs 140 240 -A -A 2,2 2,0 2,7 V 2,5 V
Sperrverzögerungsladung
recovered charge
Thermische Eigenschaften / Thermal properties
Innerer Wärmewiderstand thermal resistance, junction to case Transistor / transistor, DC Transistor,DC,pro Zweig/per arm Diode, DC, pro Modul/per module Diode, DC, pro Zweig/per arm thermal resistance, case to heatsink pro Modul / per Module pro Zweig / per arm max. junction temperature pro Modul / per Module operating temperature Transistor / transistor storage temperature RthJC 0,023 0,046 0,044 0,088 0,01 0,02 150 -40...+150 -40...+125 °C/W °C/W °C/W °C/W °C/W °C/W °C °C °C
Übergangs-Wärmewiderstand Höchstzul. Sperrschichttemperatur Betriebstemperatur Lagertemperatur
RthCK tvj max tc op tstg
Mechanische Eigenschaften / Mechanical properties
Gehäuse, siehe Anlage Innere Isolation Anzugsdrehmoment f. mech. Befestigung Anzugsdrehmoment f. elektr. Anschlüsse Gewicht case, see appendix internal insulation mounting torque terminal connection torque weight Seite / page terminals M6 / tolerance +/-15% terminals M4 / tolerance +/-15% terminals M8 M1 M2 G 1 AI2O3 5 2 8...10 ca. 1500
Nm Nm Nm g
Bedingung für den Kurzschlußschutz / Conditions for short-circuit protection tfg = 10 µs VCC = 750 V vL = ±15 V vCEM = 900 V RGF = RGR = 3,6 iCMK1 3500 A tvj = 125°C iCMK2 3000 A Unabhängig davon gilt bei abweichenden Bedingungen / with regard to other conditions
v
CEM =
VCES - 20nH x |dic/dt|
Mit dieser technischen Information werden Halbleiterbauelemente spezifiziert, jedoch keine Eigenschaften zugesichert. Sie gilt in Verbindung mit den zugehörigen Technischen Erläuterungen. This technical information specifies semiconductor devices but promises no characteristics. It is valid in combination with the belonging technical notes.
FD 400 R12 KF4
800
800 V GE = 20 V 15 V
700 iC [A] 600 iC [A]
700 12 V 600 10 V
500
500
400
400
9V
300
300 8V
200
200
100
100
0 1.0
1.5
2.0
2.5
3.0
3.5
4.0 v CE [V]
4.5
5.0
0 1.0
1.5
2.0
2.5
3.0
3.5
4.0 v CE [V]
4.5
5.0
FD400R12KF4
FD400R12KF4
Bild/Fig. 1 Kollektor-Emitter-Spannung im Sättigungsbereich (typisch) Collector-emitter-voltage in saturation region (typical) VGE = 15V -----Tvj = 25 °C ___Tvj = 125 °C
Bild/Fig. 2 Kollektor-Emitter-Spannung im Sättigungsbereich (typisch) Collector-emitter-voltage in saturation region (typical) tvj = 125 °C
800 t vj = 125 °C 25 °C
1000
700 iC [A] 600
iC 800 [A]
500
600
400 400 300
200 200 100
0 5 6 7 8 9 10 v GE [V] 11 12
0 0 200
400
600
800
1000
1200
1400
FD400R12KF4
FD400R12KF4
v CE [V]
Bild/Fig. 3 Übertragungscharakteristik (typisch) Transfer characteristic (typical) VCE = 20 V
Bild/Fig. 4 Rückwärts-Arbeitsbereich Reverse biased safe operating area tvj = 125 °C, vLF = vLR = 15 V, RG = 3,6
FD 400 R12 KF4
10-1 Diode 6 Z(th)JC [°C/W] IGBT 3 2
800
700 iF [A] 600
500
10-2
400
300 5 200
3 2
100
10-3 -3 10
2
4
10-2
2
4
10-1
2
4
100
2
4
101
0 0.5
FD400R12KF4
1.0
1.5
2.0
2.5 v F [V]
3.0
FD400R12KF4
t [s ]
Bild/Fig. 5 Transienter innerer Wärmewiderstand je Zweig (DC) Transient thermal impedance per arm (DC)
Bild/Fig. 6 Durchlaßkennlinie der Inversdiode (typisch) Forward characteristic of the inverse diode (typical) tvj = 25 °C tvj = 125 °C
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