FF300R08W2P2B11ABOMA1

FF300R08W2P2_B11A EasyPACK™ module EasyPACK™ module with EDT2 IGBT and diode and PressFIT / NTC Features • Electrical features - Blocking voltage 750 V - Low VCE,sat - Low switching losses - Low Qg and Crss - Low inductive design - Tvj,op = 150°C • Mechanical features - 4.2 kV DC 1 second insulation - High creepage and clearance distances - High power density - Integrated NTC temperature sensor - PressFIT contact technology - RoHS compliant - UL 94 V0 module frame Potential applications • Automotive applications • (Hybrid) electrical vehicles (H)EV • Motor drives Product validation • Qualified according to AQG 324 Description The FF300R08W2P2_B11A is a very compact and flexible product offering integrated isolation for the main inverter of hybrid and electric vehicles. The module uses the benchmark EDT2 IGBT generation allowing 750V blocking voltage and IcN of 300A.The chipset has benchmark current density combined with short circuit ruggedness for reliable inverter operation under harsh environmental conditions. The EDT2 IGBTs also show excellent light load power losses, which helps to improve system efficiency over a real driving cycle. The EDT2 IGBT was optimized for applications with switching frequencies in the range of 10 kHz.The EasyPACKTM package is qualified for automotive applications and is validated according to AQG 324. Its high power cycling capability as well as the high creepage and clearance distances add to the product reliability. Neuer Schaltplan für AP00H261 The power module comes with PressFIT Pins for the signal terminals to avoid additional time consuming selective solder processes, which provides cost savings on system level and increases system reliability. Type FF300R08W2P2_B11A Datasheet www.infineon.com 2020-07-13 Package restricted Copyright © Infineon Technologies AG 2020. All rights reserved. EasyPACK™ 2B Module Marking 2 SP005424885 Please read the Important Notice and Warnings at the end of this document Revision 1.01 2021-09-13 FF300R08W2P2_B11A EasyPACK™ module Table of contents Table of contents Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 Potential applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Product validation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Table of contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 1 Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 IGBT, Inverter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 3 Diode, Inverter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 4 NTC-Thermistor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6 5 Characteristics diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 6 Circuit diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 7 Package outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 8 Module label code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Disclaimer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Datasheet 2 Revision 1.01 2021-09-13 FF300R08W2P2_B11A EasyPACK™ module 1 Package 1 Package Table 1 Maximum rated values Parameter Symbol Note or test condition Maximum RMS module DCterminal current1) 1) It,rms Tterminal = 105 °C, Tc = 65 °C Values Unit 25 A ItRMS: Current per pin, continous, steady state. Verified by characterization / design not by test Table 2 Insulation coordination Parameter Symbol Note or test condition Isolation test voltage VISOL Internal isolation Values Unit 4.2 kV basic insulation (class 1, IEC 61140) Al2O3 Creepage distance dcreep terminal to heatsink 11.5 mm Creepage distance dcreep terminal to terminal 6.3 mm Clearance dclear terminal to heatsink 10.0 mm Clearance dclear terminal to terminal 5.0 mm Comparative tracking index Table 3 CTI > 200 Characteristic values Parameter Symbol Note or test condition Values Min. Stray inductance module Module lead resistance, terminals - chip Storage temperature Ls,CE RCC'+EE' Tstg Weight 2 Table 4 Max. 8.0 nH 4.00 mΩ -40 G 125 °C 41 g Values Unit 750 V 300 A 200 A 600 A ±20 V IGBT, Inverter Maximum rated values Parameter Symbol Note or test condition Collector-emitter voltage VCES Implemented collector current ICN Continuous DC collector current IC,nom Repetitive peak collector current ICRM Gate-emitter peak voltage VGES Datasheet T = 25°C, per switch Typ. Unit Tvj = 25 °C Tvj,max = 150 °C tP = 1 ms 3 Th = 65 °C Revision 1.01 2021-09-13 FF300R08W2P2_B11A EasyPACK™ module 2 IGBT, Inverter Table 5 Characteristic values Parameter Symbol Note or test condition Values Min. Collector-emitter saturation voltage Gate threshold voltage Gate charge Internal gate resistor VCE,sat IC = 200 A, VGE = 15 V VGE,th IC = 6.4 mA, VCE = VGE QG VGE = 15 V, VCE = 400 V RG,int Unit Typ. Max. Tvj = 25 °C 1.00 1.18 V Tvj = 125 °C 0.99 Tvj = 150 °C 0.98 6.5 V Tvj = 25 °C 4.9 5.8 2.9 µC Tvj = 25 °C 1.1 Ω Input capacitance Cies f = 1 MHz, VCE = 50 V, VGE = 0 V Tvj = 25 °C 53.0 nF Output capacitance Coes f = 1 MHz, VCE = 50 V, VGE = 0 V Tvj = 25 °C 0.7 nF Reverse transfer capacitance Cres f = 1 MHz, VCE = 50 V, VGE = 0 V Tvj = 25 °C 0.20 nF Collector-emitter cut-off current ICES VCE = 750 V, VGE = 0 V Tvj = 25 °C 1.0 mA Gate-emitter leakage current IGES VGE = 0 V Tvj = 25 °C 10 nA Turn-on delay time, inductive load td,on IC = 200 A, VCE = 400 V, VGE = 15 V, RG,on = 2.4 Ω Tvj = 25 °C 0.21 Tvj = 125 °C 0.23 Tvj = 150 °C 0.24 Tvj = 25 °C 0.03 Tvj = 125 °C 0.04 Tvj = 150 °C 0.04 Tvj = 25 °C 0.70 Tvj = 125 °C 0.80 Tvj = 150 °C 0.80 Tvj = 25 °C 0.06 Tvj = 125 °C 0.10 Tvj = 150 °C 0.10 Tvj = 25 °C 4.4 Tvj = 125 °C 7.0 Tvj = 150 °C, di/dt = 6360 A/µs 7.6 Tvj = 25 °C 7.3 Tvj = 125 °C 10.7 Tvj = 150 °C, du/dt = 2530 V/µs 11.5 Rise time, inductive load Turn-off delay time, inductive load Fall time, inductive load Turn-on energy loss per pulse Turn-off energy loss per pulse Datasheet tr td,off tf Eon Eoff IC = 200 A, VCE = 400 V, VGE = 15 V, RG,on = 2.4 Ω IC = 200 A, VCE = 400 V, VGE = 15 V, RG,off = 5.1 Ω IC = 200 A, VCE = 400 V, VGE = 15 V, RG,off = 5.1 Ω IC = 200 A, VCE = 400 V, Lσ = 20 nH, VGE = 15 V, RG,on = 2.4 Ω IC = 200 A, VCE = 400 V, Lσ = 20 nH, VGE = 15 V, RG,off = 5.1 Ω 4 µs µs µs µs mJ mJ Revision 1.01 2021-09-13 FF300R08W2P2_B11A EasyPACK™ module 3 Diode, Inverter Table 5 Characteristic values (continued) Parameter Symbol Note or test condition Values Min. SC data ISC VCC = 400 V, VGE = 15 V Typ. tP ≤ 6.0 µs, Tvj = 25 °C 3800 tP ≤ 4.0 µs, Tvj = 150 °C 3000 Unit Max. A Thermal resistance, junction to case Rth,j-c per IGBT 0.09 K/W Thermal resistance, junction to heatsink Rth,j-h per IGBT, λpaste= 3 W /(m*K) / λgrease= 3 W/ (m*K) 0.25 K/W Temperature under switching conditions Tvj,op 3 -40 150 °C Diode, Inverter Table 6 Maximum rated values Parameter Symbol Note or test condition Unit 750 V Repetitive peak reverse voltage VRRM Implemented forward current IFN 300 A Continuous DC forward current IF,nom 200 A Repetitive peak forward current IFRM 600 A Tvj = 125 °C 15770 A²s Tvj = 150 °C 13180 I2t - value Table 7 I2t Tvj = 25 °C Values tP = 1 ms VR = 400 V, tP = 50 ms Characteristic values Parameter Symbol Note or test condition Values Min. Forward voltage Peak reverse recovery current Datasheet VF Irm IF = 200 A IF = 200 A, VCE = 400 V, VGE = -8 V 5 Unit Typ. Max. Tvj = 25 °C 1.30 1.47 Tvj = 125 °C 1.20 Tvj = 150 °C 1.15 Tvj = 25 °C 200 Tvj = 125 °C 294 Tvj = 150 °C, -diF/dt = 7250 A/µs 321 V A Revision 1.01 2021-09-13 FF300R08W2P2_B11A EasyPACK™ module 4 NTC-Thermistor Table 7 Characteristic values (continued) Parameter Symbol Note or test condition Values Min. Recovered charge Qr Reverse recovery energy Erec IF = 200 A, VCE = 400 V, VGE = -8 V IF = 200 A, VCE = 400 V, VGE = -8 V, RG = 2.4 Ω Typ. Tvj = 25 °C 11.0 Tvj = 125 °C 24.0 Tvj = 150 °C, -diF/dt = 7250 A/µs 29.0 Tvj = 25 °C 3.34 Tvj = 125 °C 7.02 Tvj = 150 °C, -diF/dt = 7250 A/µs 8.51 Unit Max. µC mJ Thermal resistance, junction to case Rth,j-c per diode 0.17 K/W Thermal resistance, junction to heatsink Rth,j-h per diode, λpaste= 3 W /(m*K) / λgrease= 3 W/ (m*K) 0.36 K/W Temperature under switching conditions Tvj,op 4 -40 150 °C NTC-Thermistor Table 8 Parameter Characteristic values Symbol Note or test condition Values Min. Rated resistance R25 Deviation of R100 ΔR/R Power dissipation P25 TNTC = 25 °C Typ. Unit Max. 5 TNTC = 100 °C, R100 = 493 Ω -5 TNTC = 25 °C kΩ 5 % 20 mW B-value B25/50 R2 = R25 exp[B25/50(1/T2-1/(298,15 K))] 3375 K B-value B25/80 R2 = R25 exp[B25/80(1/T2-1/(298,15 K))] 3433 K B-value B25/100 R2 = R25 exp[B25/100(1/T2-1/(298,15 K))] 3411 K Datasheet 6 Revision 1.01 2021-09-13 FF300R08W2P2_B11A EasyPACK™ module 5 Characteristics diagrams 5 Characteristics diagrams output characteristic (typical), IGBT, Inverter IC = f(VCE) VGE = -8 V / +15 V output characteristic (typical), IGBT, Inverter IC = f(VCE) Tvj = 25 °C 600 600 550 550 500 500 450 450 400 400 350 350 300 300 250 250 200 200 150 150 100 100 50 50 0 0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0.0 transfer characteristic (typical), IGBT, Inverter IC = f(VGE) VCE = 20 V 0.4 0.8 1.2 1.6 2.0 switching losses (typical), IGBT, Inverter E = f(IC) RG,off = 5.1 Ω, RG,on = 2.4 Ω, VCE = 400 V, VGE = -8 V / +15 V 600 25 525 20 450 375 15 300 10 225 150 5 75 0 0 5 Datasheet 6 7 8 9 10 11 0 7 50 100 150 200 250 300 350 400 Revision 1.01 2021-09-13 FF300R08W2P2_B11A EasyPACK™ module 5 Characteristics diagrams Switching losses (typical), IGBT, Inverter E = f(RG) VCE = 400 V, VGE = -8 V / +15 V, IC = 200 A transient thermal impedance , IGBT, Inverter Zth = f(t) 32 28 1 24 20 0.1 16 12 0.01 8 4 0 0 2 4 6 8 10 12 14 16 18 0.001 0.001 20 Reverse bias safe operating area (RBSOA), IGBT, Inverter IC = f(VCE) Tvj = 150 °C, RG,off = 5.1 Ω, VGE = -8 V / +15 V 0.01 0.1 1 10 forward characteristic of (typical), Diode, Inverter IF = f(VF) 650 600 600 550 500 500 450 400 400 350 300 300 250 200 200 150 100 100 50 0 0 400 Datasheet 450 500 550 600 650 700 750 800 0.0 8 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 Revision 1.01 2021-09-13 FF300R08W2P2_B11A EasyPACK™ module 5 Characteristics diagrams switching losses (typical), Diode, Inverter Erec = f(IF) RGon = RGon(IGBT) , VCE = 400 V Switching losses (typical), Diode, Inverter Erec = f(RG) VCE = 400 V, IF = 200 A 16 12 11 14 10 12 9 8 10 7 8 6 6 5 4 4 3 2 2 0 1 0 100 200 300 400 0 transient thermal impedance , Diode, Inverter Zth = f(t) 2 4 6 8 10 12 14 16 18 20 temperature characteristic (typical), NTC-Thermistor R = f(TNTC) 100000 1 10000 0.1 1000 0.01 0.001 0.001 Datasheet 100 0.01 0.1 1 0 10 9 20 40 60 80 100 120 140 160 Revision 1.01 2021-09-13 FF300R08W2P2_B11A Neuer Schaltplan für AP00H261 ™ 0-07-13 EasyPACK module 6 Circuit diagram 6 Circuit diagram 1 C1 G1 E1 3 T1 G2 E2 T2 2 Figure 2 restricted Datasheet Copyright © Infineon Technologies AG 2020. All rights reserved. 10 Revision 1.01 2021-09-13 FF300R08W2P2_B11A EasyPACK™ module 7 Package outlines Infineon 12 0,35 1,4 0,2 Package outlines 16,4 0,5 7 GYYWW FxxxRxxW2 xx TM EasyPIM 0001 - Pin-Grid 3,2mm 51 0,15 0,1 - Tolerance of PCB hole pattern - Hole specification for contacts see AN 2009-01 20,8 24 25,5 8 11,2 8 62,8 0,5 (53) 48 0,3 42,5 0,15 1,6 0 1,6 1,15mm and copper thickness in hole 25-50 m 25,5 24 20,8 17,6 - Diameters of drill PCB hole pattern 26,5 21,25 1 C1 E1 2,3 0,1 G1 3 x8,5+0,3 2 4,5 0,1 G2 16,4 0,2 22,7 0,3 56,7 0,3 T1 E2 T2 1 16 12,8 9,6 6,4 3,2 0 3,2 6,4 9,6 12,8 16 21,25 26,5 4x 2,8 2x 9 according to screw head / washer ISO 8015 principle of independency dimensions ISO 14405 GG target geometry according CAD file with general tolerances 1 method of least-squares Drawing: W00175000 edges general tolerances surface DIN ISO 1. DIN 16742-TG6 DIN EN ISO 2. DIN ISO 2768-mk 1302 13715 All dimensions refer to module in delivery condition Figure 3 Datasheet 11 Revision 1.01 2021-09-13 FF300R08W2P2_B11A EasyPACK™ module 8 Module label code 8 Module label code Module label code Code format Data Matrix Barcode Code128 Encoding ASCII text Code Set A Symbol size 16x16 23 digits Standard IEC24720 and IEC16022 IEC8859-1 Code content Content Module serial number Module material number Production order number Date code (production year) Date code (production week) Example 71549 142846 55054991 15 30 Digit 1–5 6 - 11 12 - 19 20 – 21 22 – 23 Example 71549142846550549911530 71549142846550549911530 Packing label code Code format Barcode Code128 Encoding Code Set A Symbol size 34 digits Standard IEC8859-1 Code content Content Module serial number Module material number Production order number Date code (production year) Date code (production week) Identifier X 1T S 9D Q Digit 2–9 12 – 19 21 – 25 28 – 31 33 – 34 Example 95056609 2X0003E0 754389 1139 15 Example X950566091T2X0003E0S754389D1139Q15 Figure 4 Datasheet 12 Revision 1.01 2021-09-13 FF300R08W2P2_B11A EasyPACK™ module Revision history Revision history Document revision Date of release Description of changes V1.0 2020-07-24 Target Datasheet 1.00 2021-07-29 Final datasheet 1.01 2021-09-13 Layout correction Datasheet 13 Revision 1.01 2021-09-13 Trademarks All referenced product or service names and trademarks are the property of their respective owners. Edition 2021-09-13 Published by Infineon Technologies AG 81726 Munich, Germany © 2021 Infineon Technologies AG All Rights Reserved. Do you have a question about any aspect of this document? Email: erratum@infineon.com Document reference IFX-AAK248-003 IMPORTANT NOTICE The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples, hints or any typical values stated herein and/or any information regarding the application of the product, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. 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