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FS400R07A1E3BOSA1

FS400R07A1E3BOSA1

  • 厂商:

    EUPEC(英飞凌)

  • 封装:

    模块

  • 描述:

    IGBT 650V 500A 1250W

  • 数据手册
  • 价格&库存
FS400R07A1E3BOSA1 数据手册
HybridPACK™1Module FS400R07A1E3 FinalDataSheet V3.4,2018-08-09 AutomotiveHighPower FS400R07A1E3 HybridPACKª1Module 1Features/Description HybridPACK™1modulewithTrench/FieldstopIGBT3andEmitterControlled3diodeandNTC VCES = 650V IC nom = 400A TypicalApplications • AutomotiveApplications • HybridElectricalVehicles(H)EV • CommercialAgricultureVehicles • MotorDrives • Optimized for automotive applications with DC link voltagesupto420V Description Infineon®’s HybridPACKTM 1 is an automotive qualified power module designed for electric vehicle applications for a power range up to 20–30kW. Designed for a 150°C junction operation temperature, the module accommodates a 3-phase Six-Pack configuration of Trench-Field-Stop IGBT3 and matching emitter controlled diodes. The HybridPACKTM 1 power module is built on Infineon’s long time experience in the development of IGBT power modules, intense research efforts of new material combinations and assembly technologies. HybridPACKTM 1 is suitable for air or liquid cooling. The copper base plate combined with high-performance ceramic substrate and Infineon’s enhanced wire-bonding process provides unparalleled thermal and power cycling capability and highest reliability for mild hybrid inverter or generator applications. For a compact design the driver stage PCB can easily be soldered on top of the module. All power connections are realized with screw terminals. ElectricalFeatures • LowSwitchingLosses • LowVCEsat • Tvjop=150°C • VCEsatwithpositiveTemperatureCoefficient MechanicalFeatures • 2.5kVAC1minInsulation • Al2O3SubstratewithLowThermalResistance • Highmechanicalrobustness • IntegratedNTCtemperaturesensor • CopperBasePlate • RoHScompliant ProductName OrderingCode FS400R07A1E3 SP000663446 Final Data Sheet 2 V3.4,2018-08-09 FS400R07A1E3 HybridPACKª1Module 2IGBT,Inverter 2.1MaximumRatedValues Parameter Conditions Symbol Value Unit Collector-emittervoltage Tvj = 25°C VCES 650 V ContinuousDCcollectorcurrent TC = 65°C, Tvj max = 175°C TC = 25°C, Tvj max = 175°C IC nom IC 400 500 A A Repetitivepeakcollectorcurrent tP = 1 ms ICRM 800 A Totalpowerdissipation TC = 25°C, Tvj max = 175°C Ptot 1250 W VGES +/-20 V Gate-emitterpeakvoltage 2.2CharacteristicValues Collector-emittersaturationvoltage min. typ. max. 1.45 1.60 1.70 1.90 5.80 6.50 IC = 400 A, VGE = 15 V IC = 400 A, VGE = 15 V IC = 400 A, VGE = 15 V Tvj = 25°C Tvj = 125°C Tvj = 150°C VCE sat Gatethresholdvoltage IC = 6.40 mA, VCE = VGE Tvj = 25°C VGEth Gatecharge VGE = -15 V ... 15 V QG 4.30 µC Tvj = 25°C RGint 1.0 Ω Internalgateresistor 4.90 V V Inputcapacitance f = 1 MHz, VCE = 25 V, VGE = 0 V Tvj = 25°C Cies 26.0 nF Reversetransfercapacitance f = 1 MHz, VCE = 25 V, VGE = 0 V Tvj = 25°C Cres 0.76 nF Collector-emittercut-offcurrent VCE = 650 V, VGE = 0 V Tvj = 25°C ICES 1.0 mA Gate-emitterleakagecurrent VCE = 0 V, VGE = 20 V Tvj = 25°C IGES 400 nA Turn-ondelaytime,inductiveload IC = 400 A, VCE = 300 V VGE = ±15 V RGon = 1.8 Ω Tvj = 25°C Tvj = 125°C Tvj = 150°C td on 0.10 0.11 0.12 µs IC = 400 A, VCE = 300 V VGE = ±15 V RGon = 1.8 Ω Tvj = 25°C Tvj = 125°C Tvj = 150°C tr 0.08 0.08 0.08 µs IC = 400 A, VCE = 300 V VGE = ±15 V RGoff = 1.8 Ω Tvj = 25°C Tvj = 125°C Tvj = 150°C td off 0.46 0.50 0.50 µs IC = 400 A, VCE = 300 V VGE = ±15 V RGoff = 1.8 Ω Tvj = 25°C Tvj = 125°C Tvj = 150°C tf 0.05 0.07 0.08 µs IC = 400 A, VCE = 300 V, LS = 25 nH VGE = ±15 V, di/dt = 5500 A/µs (Tvj = 150°C) RGon = 1.8 Ω Tvj = 25°C Tvj = 125°C Tvj = 150°C Eon 2.90 4.20 4.50 mJ IC = 400 A, VCE = 300 V, LS = 25 nH Tvj = 25°C VGE = ±15 V, du/dt = 3000 V/µs (Tvj = 150°C) Tvj = 125°C RGoff = 1.8 Ω Tvj = 150°C Eoff 13.0 16.0 17.0 mJ SCdata VGE ≤ 15 V, VCC = 360 V VCEmax = VCES -LsCE ·di/dt ISC 2800 2000 A Thermalresistance,junctiontocase perIGBT RthJC Thermalresistance,casetoheatsink perIGBT λPaste=1W/(m·K)/λgrease=1W/(m·K) RthCH Temperatureunderswitchingconditions top continuous Tvj op Risetime,inductiveload Turn-offdelaytime,inductiveload Falltime,inductiveload Turn-onenergylossperpulse Turn-offenergylossperpulse Final Data Sheet tP ≤ 8 µs, Tvj = 25°C tP ≤ 6 µs, Tvj = 150°C 3 0.120 K/W 0.080 -40 K/W 150 °C V3.4,2018-08-09 FS400R07A1E3 HybridPACKª1Module 3Diode,Inverter 3.1MaximumRatedValues Parameter Conditions Symbol Value Unit Repetitivepeakreversevoltage Tvj = 25°C VRRM 650 V IF 400 A Repetitivepeakforwardcurrent tP = 1 ms IFRM 800 A I²t-value VR = 0 V, tP = 10 ms, Tvj = 125°C VR = 0 V, tP = 10 ms, Tvj = 150°C I²t 8800 8500 A²s A²s ContinuousDCforwardcurrent 3.2CharacteristicValues Forwardvoltage Peakreverserecoverycurrent Recoveredcharge Reverserecoveryenergy min. typ. max. 1.95 VF 1.55 1.50 1.45 Tvj = 25°C Tvj = 125°C Tvj = 150°C IRM 210 280 300 A IF = 400 A, - diF/dt = 5500 A/µs (Tvj = 150°C) VR = 300 V VGE = -15 V Tvj = 25°C Tvj = 125°C Tvj = 150°C Qr 18.0 30.0 34.0 µC IF = 400 A, - diF/dt = 5500 A/µs (Tvj = 150°C) VR = 300 V VGE = -15 V Tvj = 25°C Tvj = 125°C Tvj = 150°C Erec 3.60 7.25 8.30 mJ IF = 400 A, VGE = 0 V IF = 400 A, VGE = 0 V IF = 400 A, VGE = 0 V Tvj = 25°C Tvj = 125°C Tvj = 150°C IF = 400 A, - diF/dt = 5500 A/µs (Tvj = 150°C) VR = 300 V VGE = -15 V Thermalresistance,junctiontocase perdiode RthJC Thermalresistance,casetoheatsink perdiode λPaste=1W/(m·K)/λgrease=1W/(m·K) RthCH Temperatureunderswitchingconditions top continuous Tvj op 4NTC-Thermistor 0.200 K/W 0.085 -40 min. Parameter Conditions Ratedresistance TC = 25°C DeviationofR100 TC = 100°C, R100 = 493 Ω Symbol Powerdissipation TC = 25°C B-value R2 = R25 exp [B25/50(1/T2 - 1/(298,15 K))] B-value B-value K/W 150 typ. °C max. Value R25 ∆R/R V Unit 5.00 kΩ 5 P25 5 % 20.0 mW B25/50 3375 K R2 = R25 exp [B25/80(1/T2 - 1/(298,15 K))] B25/80 3411 K R2 = R25 exp [B25/100(1/T2 - 1/(298,15 K))] B25/100 3433 K Specificationaccordingtothevalidapplicationnote. Final Data Sheet 4 V3.4,2018-08-09 FS400R07A1E3 HybridPACKª1Module 5Module Parameter Conditions Isolationtestvoltage RMS, f = 50 Hz, t = 1 min. Symbol VISOL Materialofmodulebaseplate Value  Unit 2.5  kV  Cu   Al2O3  Internalisolation basicinsulation(class1,IEC61140) Creepagedistance terminaltoheatsink terminaltoterminal dCreep  12.0 6.1  mm Clearance terminaltoheatsink terminaltoterminal dClear  12.0 6.1  mm CTI  Comperativetrackingindex min. Strayinductancemodule Moduleleadresistance,terminals-chip LsCE TC=25°C,perswitch 30 RCC'+EE' Storagetemperature -40 ScrewM5baseplatetoheatsink M 3.00 Terminalconnectiontorque ScrewM6 M 3.0 G nH 1.00 Tstg Mountingtorqueformodulmounting Weight > 200  typ. max. 485 mΩ 125 °C 6.00 Nm 6.0 Nm g Der Kollektor-Dauergleichstrom / Dioden-Dauergleichstrom ist durch die Lastanschlüsse begrenzt. DC-collector current / diode forward current limited by power terminals. Final Data Sheet 5 V3.4,2018-08-09 FS400R07A1E3 HybridPACKª1Module 6CharacteristicsDiagrams outputcharacteristicIGBT,Inverter(typical) IC=f(VCE) VGE=15V outputcharacteristicIGBT,Inverter(typical) IC=f(VCE) Tvj=150°C 800 800 Tvj = 25°C Tvj = 125°C Tvj = 150°C 700 600 600 500 500 IC [A] IC [A] 700 400 400 300 300 200 200 100 100 0 VGE = 19V VGE = 17V VGE = 15V VGE = 13V VGE = 11V VGE = 9V 0 0,0 0,2 0,4 0,6 0,8 1,0 1,2 1,4 1,6 1,8 2,0 2,2 2,4 2,6 VCE [V] transfercharacteristicIGBT,Inverter(typical) IC=f(VGE) VCE=20V 0,0 0,5 1,0 1,5 2,0 2,5 3,0 VCE [V] 3,5 4,0 4,5 5,0 switchinglossesIGBT,Inverter(typical) Eon=f(IC),Eoff=f(IC) VGE=±15V,RGon=1.8Ω,RGoff=1.8Ω,VCE=300V 800 30 Tvj = 25°C Tvj = 125°C Tvj = 150°C 700 Eon, Tvj = 125°C Eoff, Tvj = 125°C Eon, Tvj = 150°C Eoff, Tvj = 150°C 25 600 20 E [mJ] IC [A] 500 400 15 300 10 200 5 100 0 5 Final Data Sheet 6 7 8 9 VGE [V] 10 11 0 12 6 0 100 200 300 IC [A] 400 500 600 V3.4,2018-08-09 FS400R07A1E3 HybridPACKª1Module switchinglossesIGBT,Inverter(typical) Eon=f(RG),Eoff=f(RG) VGE=±15V,IC=400A,VCE=300V transientthermalimpedanceIGBT,Inverter ZthJC=f(t) 80 1 Eon, Tvj = 125°C Eoff, Tvj = 125°C Eon, Tvj = 150°C Eoff, Tvj = 150°C 70 ZthJC : IGBT 60 0,1 ZthJC [K/W] E [mJ] 50 40 30 0,01 20 i: 1 2 3 4 ri[K/W]: 0,01419 0,06479 0,0335 0,00743 τi[s]: 0,00036 0,01937 0,03762 0,98695 10 0 0 2 4 6 8 10 RG [Ω] 12 14 16 0,001 0,001 18 reversebiassafeoperatingareaIGBT,Inverter(RBSOA) IC=f(VCE) VGE=±15V,RGoff=1.8Ω,Tvj=150°C 0,01 0,1 t [s] 1 10 forwardcharacteristicofDiode,Inverter(typical) IF=f(VF) 900 800 IC, Modul IC, Chip 800 Tvj = 25°C Tvj = 125°C Tvj = 150°C 700 700 600 600 500 IF [A] IC [A] 500 400 400 300 300 200 200 100 100 0 0 Final Data Sheet 100 200 300 400 VCE [V] 500 600 0 700 7 0,0 0,2 0,4 0,6 0,8 1,0 1,2 VF [V] 1,4 1,6 1,8 2,0 V3.4,2018-08-09 FS400R07A1E3 HybridPACKª1Module switchinglossesDiode,Inverter(typical) Erec=f(IF) RGon=1.8Ω,VCE=300V switchinglossesDiode,Inverter(typical) Erec=f(RG) IF=400A,VCE=300V 12 12 Erec, Tvj = 125°C Erec, Tvj = 150°C 10 10 8 8 E [mJ] E [mJ] Erec, Tvj = 125°C Erec, Tvj = 150°C 6 6 4 4 2 2 0 0 100 200 300 IF [A] 400 500 0 600 transientthermalimpedanceDiode,Inverter ZthJC=f(t) 0 2 4 6 8 10 RG [Ω] 12 14 16 18 140 160 NTC-Thermistor-temperaturecharacteristic(typical) R=f(T) 1 100000 ZthJC : Diode Rtyp 10000 R[Ω] ZthJC [K/W] 0,1 0,01 1000 i: 1 2 3 4 ri[K/W]: 0,02989 0,12491 0,03869 0,00643 τi[s]: 0,00051 0,01769 0,04823 1,81616 0,001 0,001 Final Data Sheet 0,01 0,1 t [s] 1 100 10 8 0 20 40 60 80 100 TC [°C] 120 V3.4,2018-08-09 FS400R07A1E3 HybridPACKª1Module 7Circuitdiagram J Final Data Sheet 9 V3.4,2018-08-09 FS400R07A1E3 HybridPACKª1Module 8Packageoutlines Final Data Sheet 10 V3.4,2018-08-09 FS400R07A1E3 HybridPACKª1Module 9LabelCodes 9.1ModuleCode CodeFormat Data Matrix Encoding ASCII Text SymbolSize 16x16 Standard IEC24720 and IEC16022 CodeContent Content Module Serial Number Module Material Number Production Order Number Datecode (Production Year) Datecode (Production Week) Digit 1-5 6 - 11 12 - 19 20 - 21 22 - 23 Example(below) 71549 142846 55054991 15 30 Example 71549142846550549911530 9.2PackingCode CodeFormat Code128 Encoding Code Set A SymbolSize 34 digits Standard IEC8859-1 CodeContent Content Backend Construction Number Production Lot Number Serial Number Date Code Box Quantity Identifier X 1T S 9D Q Digit 2-9 12 - 19 21 - 25 28 - 31 33 - 34 Example(below) 95056609 2X0003E0 754389 1139 15 Example X950566091T2X0003E0S754389D1139Q15 Final Data Sheet 11 V3.4,2018-08-09 FS400R07A1E3 HybridPACKª1Module RevisionHistory Major changes since previous revision Revision History Reference Date Description V1.0 2009-08-26 Initial Version V1.1 2009-10-14 target data V2.0 2009-11-19 preliminary data V3.0 2010-04-21 final data V3.1 2012-02-29 final data V3.2 2016-11-08 new datasheet format V3.3 2017-03-07 - V3.4 2018-08-09 update of "Terms & Conditions of usage" Final Data Sheet 12 V3.4,2018-08-09 FS400R07A1E3 HybridPACKª1Module Terms&Conditionsofusage  Edition2018-08-01 Publishedby InfineonTechnologiesAG 81726Munich,Germany ©2018InfineonTechnologiesAG AllRightsReserved. LegalDisclaimer Theinformationgiveninthisdocumentshallinnoeventberegardedasaguaranteeofconditionsorcharacteristics.Withrespecttoany examplesorhintsgivenherein,anytypicalvaluesstatedhereinand/oranyinformationregardingtheapplicationofthedevice,Infineon Technologiesherebydisclaimsanyandallwarrantiesandliabilitiesofanykind,includingwithoutlimitation,warrantiesofnon-infringementof intellectualpropertyrightsofanythirdparty. Information Forfurtherinformationontechnology,deliverytermsandconditionsandprices,pleasecontactthenearestInfineonTechnologiesOffice (http://www.infineon.com) Warnings Duetotechnicalrequirements,componentsmaycontaindangeroussubstances.Forinformationonthetypesinquestion,pleasecontactthe nearestInfineonTechnologiesOffice. Thesecomponentsarenotdesignedfor“specialapplications”thatdemandextremelyhighreliabilityorsafetysuchasaerospace,defenseorlife supportdevicesorsystems(ClassIIImedicaldevices).Ifyouintendtousethecomponentsinanyofthesespecialapplications,pleasecontact yourlocalrepresentativeatInternationalRectifierHiRelProducts,Inc.ortheInfineonsupport(https://www.infineon.com/support)toreview productrequirementsandreliabilitytesting. InfineonTechnologiescomponentsmaybeusedinspecialapplicationsonlywiththeexpresswrittenapprovalofInfineonTechnologies.Class IIImedicaldevicesareintendedtobeimplantedinthehumanbodyortosupportand/ormaintainandsustainand/orprotecthumanlife.Ifthey fail,itisreasonabletoassumethatthehealthoftheuserorotherpersonsmaybeendangered. Trademarks  TrademarksofInfineonTechnologiesAG AURIX™,C166™,CanPAK™,CIPOS™,CIPURSE™,EconoPACK™,CoolMOS™,CoolSET™,CORECONTROL™,CROSSAVE™,DAVE™, DI-POL™,EasyPIM™,EconoBRIDGE™,EconoDUAL™,EconoPIM™,EconoPACK™,EiceDRIVER™,eupec™,FCOS™,HITFET™, HybridPACK™,I²RF™,ISOFACE™,IsoPACK™,MIPAQ™,ModSTACK™,my-d™,NovalithIC™,OptiMOS™,ORIGA™,POWERCODE™, PRIMARION™,PrimePACK™,PrimeSTACK™,PRO-SIL™,PROFET™,RASIC™,ReverSave™,SatRIC™,SIEGET™,SINDRION™, SIPMOS™,SmartLEWIS™,SOLIDFLASH™,TEMPFET™,thinQ™,TRENCHSTOP™,TriCore™. OtherTrademarks AdvanceDesignSystem™(ADS)ofAgilentTechnologies,AMBA™,ARM™,MULTI-ICE™,KEIL™,PRIMECELL™,REALVIEW™,THUMB™, µVision™ofARMLimited,UK.AUTOSAR™islicensedbyAUTOSARdevelopmentpartnership.Bluetooth™ofBluetoothSIGInc.CAT-iq™of DECTForum.COLOSSUS™,FirstGPS™ofTrimbleNavigationLtd.EMV™ofEMVCo,LLC(VisaHoldingsInc.).EPCOS™ofEpcosAG. FLEXGO™ofMicrosoftCorporation.FlexRay™islicensedbyFlexRayConsortium.HYPERTERMINAL™ofHilgraeveIncorporated.IEC™of CommissionElectrotechniqueInternationale.IrDA™ofInfraredDataAssociationCorporation.ISO™ofINTERNATIONALORGANIZATION FORSTANDARDIZATION.MATLAB™ofMathWorks,Inc.MAXIM™ofMaximIntegratedProducts,Inc.MICROTEC™,NUCLEUS™ofMentor GraphicsCorporation.MIPI™ofMIPIAlliance,Inc.MIPS™ofMIPSTechnologies,Inc.,USA.muRata™ofMURATAMANUFACTURINGCO., MICROWAVEOFFICE™(MWO)ofAppliedWaveResearchInc.,OmniVision™ofOmniVisionTechnologies,Inc.Openwave™Openwave SystemsInc.REDHAT™RedHat,Inc.RFMD™RFMicroDevices,Inc.SIRIUS™ofSiriusSatelliteRadioInc.SOLARIS™ofSun Microsystems,Inc.SPANSION™ofSpansionLLCLtd.Symbian™ofSymbianSoftwareLimited.TAIYOYUDEN™ofTaiyoYudenCo. TEAKLITE™ofCEVA,Inc.TEKTRONIX™ofTektronixInc.TOKO™ofTOKOKABUSHIKIKAISHATA.UNIX™ofX/OpenCompanyLimited. VERILOG™,PALLADIUM™ofCadenceDesignSystems,Inc.VLYNQ™ofTexasInstrumentsIncorporated.VXWORKS™,WINDRIVER™of WINDRIVERSYSTEMS,INC.ZETEX™ofDiodesZetexLimited. Last update Final Data Sheet 2011-11-11 13 V3.4,2018-08-09 www.infineon.com PublishedbyInfineonTechnologiesAG
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