HybridPACK™1Module
FS400R07A3E3
FinalDataSheet
V3.0,2017-03-07
AutomotiveHighPower
FS400R07A3E3
HybridPACKª1Module
1Features/Description
HybridPACK™1modulewithTrench/FieldstopIGBT3andEmitterControlled3diodeandNTC
VCES = 700V
IC nom = 400A / ICRM = 800A
TypicalApplications
• HybridElectricalVehicles(H)EV
• MotorDrives
• Optimized for automotive applications with DC link
voltagesupto450V
Description
Infineon’s HybridPACKTM 1 DC6 is a variant of the
HybridPACKTM 1 power module family with
increased continuous current capability and a
reduced stray inductance.
Like all HybridPACKTM 1 products the
HybridPACKTM 1 DC6 is an automotive qualified
powermodule designed for electric vehicle
applications. Designed for a 150°C junction
operation temperature, with a 30 hour limited 175°C
capacity the module accommodates a 3-phase
Six-Pack configuration of Trench-Field-Stop
IGBT3and matching emitter controlled diodes. The
HybridPACKTM 1 power module family is built on
Infineon’s long time experience in the development
of IGBT power modules, intense research efforts of
new material combinations and assembly
technologies. HybridPACKTM 1 DC6 is suitable for
air or liquid cooling. The copper base plate
combined with high-performance ceramic substrate
and Infineon’s enhanced wire-bonding process
provides unparalleled thermal and power cycling
capabilityand highest reliability for mild hybrid
inverter or generator applications. For a compact
design the driver stage PCB can easily be soldered
on top of the module. All power connections are
realized with screw terminals.
ElectricalFeatures
• Increasedblockingvoltagecapabilityto705V
• VCEsatwithpositiveTemperatureCoefficient
• LowVCEsat
• LowSwitchingLosses
• LowInductiveDesign
• Tvjop=150°C
• Short-time extended Operation Temperature
Tvjop=175°C
MechanicalFeatures
• 2.5kVAC1minInsulation
• Al2O3SubstratewithLowThermalResistance
• CopperBasePlate
• IntegratedNTCtemperaturesensor
• Highmechanicalrobustness
• RoHScompliant
ProductName
OrderingCode
FS400R07A3E3
Final Data Sheet
2
V3.0,2017-03-07
FS400R07A3E3
HybridPACKª1Module
2IGBT,Inverter
2.1MaximumRatedValues
Parameter
Conditions
Collector-emittervoltage
Tvj = 25°C
Symbol
Value
Unit
VCES
705
V
ContinuousDCcollectorcurrent
TC = 65°C, Tvj max = 175°C
TC = 25°C, Tvj max = 175°C
IC nom
IC
400
5001)
A
A
MaximumRMSmoduleterminalcurrent
TF = 25°C, TCt = 150°C
ItRMS
3202)
A
Repetitivepeakcollectorcurrent
tP = 1 ms
ICRM
800
A
Totalpowerdissipation
TC = 25°C, Tvj max = 175°C
Ptot
1250
W
VGES
+/-20
V
Gate-emitterpeakvoltage
2.2CharacteristicValues
Collector-emittersaturationvoltage
min.
IC = 400 A, VGE = 15 V
IC = 400 A, VGE = 15 V
IC = 400 A, VGE = 15 V
Tvj = 25°C
Tvj = 125°C
Tvj = 150°C
VCE sat
Gatethresholdvoltage
IC = 6.40 mA, VCE = VGE
Tvj = 25°C
VGEth
Gatecharge
VGE = -15 V ... 15 V
4.90
QG
1)
typ.
max.
1.45
1.60
1.70
1.70
5.80
6.50
V
4.30
V
µC
Tvj = 25°C
RGint
1.0
Ω
Inputcapacitance
f = 1 MHz, VCE = 25 V, VGE = 0 V
Tvj = 25°C
Cies
26.0
nF
Reversetransfercapacitance
f = 1 MHz, VCE = 25 V, VGE = 0 V
Tvj = 25°C
Cres
0.76
Collector-emittercut-offcurrent
VCE = 450 V, VGE = 0 V
Tvj = 25°C
ICES
Gate-emitterleakagecurrent
VCE = 0 V, VGE = 20 V
Tvj = 25°C
IGES
Turn-ondelaytime,inductiveload
IC = 400 A, VCE = 300 V
VGE = ±15 V
RGon = 1.8 Ω
Tvj = 25°C
Tvj = 125°C
Tvj = 150°C
IC = 400 A, VCE = 300 V
VGE = ±15 V
RGon = 1.8 Ω
Internalgateresistor
nF
0.1
mA
400
nA
td on
0.12
0.12
0.12
µs
Tvj = 25°C
Tvj = 125°C
Tvj = 150°C
tr
0.08
0.08
0.08
µs
IC = 400 A, VCE = 300 V
VGE = ±15 V
RGoff = 1.8 Ω
Tvj = 25°C
Tvj = 125°C
Tvj = 150°C
td off
0.36
0.40
0.40
µs
IC = 400 A, VCE = 300 V
VGE = ±15 V
RGoff = 1.8 Ω
Tvj = 25°C
Tvj = 125°C
Tvj = 150°C
tf
0.02
0.03
0.03
µs
IC = 400 A, VCE = 300 V, LS = 16 nH
VGE = ±15 V, di/dt = 4500 A/µs (Tvj = 150°C)
RGon = 1.8 Ω
Tvj = 25°C
Tvj = 125°C
Tvj = 150°C
Eon
5.10
6.80
7.30
mJ
IC = 400 A, VCE = 300 V, LS = 16 nH
Tvj = 25°C
VGE = ±15 V, du/dt = 3400 V/µs (Tvj = 150°C) Tvj = 125°C
RGoff = 1.8 Ω
Tvj = 150°C
Eoff
9.10
12.0
12.5
mJ
SCdata
VGE ≤ 15 V, VCC = 360 V
VCEmax = VCES -LsCE ·di/dt
ISC
2800
2000
A
Thermalresistance,junctiontocase
perIGBT
RthJC
Thermalresistance,casetoheatsink
perIGBT
λPaste=1W/(m·K)/λgrease=1W/(m·K)
RthCH
Temperatureunderswitchingconditions
top continuous
top max 30h over life time, for 10s within period of 10min
Tvj op
Risetime,inductiveload
Turn-offdelaytime,inductiveload
Falltime,inductiveload
Turn-onenergylossperpulse
Turn-offenergylossperpulse
1)
2)
tP ≤ 8 µs, Tvj = 25°C
tP ≤ 6 µs, Tvj = 150°C
0.120 K/W
0.0800
-40
150
K/W
150
175
°C
DC-collector current limited by power terminals.
DC-collector current limited by internal busbar.
Final Data Sheet
3
V3.0,2017-03-07
FS400R07A3E3
HybridPACKª1Module
3Diode,Inverter
3.1MaximumRatedValues
Parameter
Conditions
Repetitivepeakreversevoltage
Tvj = 25°C
ContinuousDCforwardcurrent
MaximumRMSmoduleterminalcurrent
Repetitivepeakforwardcurrent
tP = 1 ms
I²t-value
VR = 0 V, tP = 10 ms, Tvj = 125°C
VR = 0 V, tP = 10 ms, Tvj = 150°C
Symbol
Value
Unit
VRRM
705
V
IF
400
ItRMS
800
Peakreverserecoverycurrent
Recoveredcharge
Reverserecoveryenergy
A
A
IFRM
800
A
I²t
8800
8500
A²s
A²s
3.2CharacteristicValues
Forwardvoltage
1)
min.
typ.
max.
1.95
VF
1.55
1.50
1.45
Tvj = 25°C
Tvj = 125°C
Tvj = 150°C
IRM
205
295
305
A
IF = 400 A, - diF/dt = 4500 A/µs (Tvj = 150°C)
VR = 300 V
VGE = -15 V
Tvj = 25°C
Tvj = 125°C
Tvj = 150°C
Qr
15.0
32.0
34.0
µC
IF = 400 A, - diF/dt = 4500 A/µs (Tvj = 150°C)
VR = 300 V
VGE = -15 V
Tvj = 25°C
Tvj = 125°C
Tvj = 150°C
Erec
3.35
6.90
8.10
mJ
IF = 400 A, VGE = 0 V
IF = 400 A, VGE = 0 V
IF = 400 A, VGE = 0 V
Tvj = 25°C
Tvj = 125°C
Tvj = 150°C
IF = 400 A, - diF/dt = 4500 A/µs (Tvj = 150°C)
VR = 300 V
VGE = -15 V
Thermalresistance,junctiontocase
perdiode
RthJC
Thermalresistance,casetoheatsink
perdiode
λPaste=1W/(m·K)/λgrease=1W/(m·K)
RthCH
Temperatureunderswitchingconditions
top continuous
top max 30h over life time, for 10s within period of 10min
Tvj op
4NTC-Thermistor
V
0.200 K/W
0.0850
-40
150
min.
Symbol
K/W
150
175
typ.
°C
max.
Parameter
Conditions
Value
Ratedresistance
TC = 25°C
DeviationofR100
TC = 100°C, R100 = 493 Ω
Powerdissipation
TC = 25°C
B-value
R2 = R25 exp [B25/50(1/T2 - 1/(298,15 K))]
B25/50
3375
K
B-value
R2 = R25 exp [B25/80(1/T2 - 1/(298,15 K))]
B25/80
3411
K
B-value
R2 = R25 exp [B25/100(1/T2 - 1/(298,15 K))]
B25/100
3433
K
R25
∆R/R
Unit
5.00
kΩ
5
P25
5
%
20.0
mW
Specificationaccordingtothevalidapplicationnote.
1)
Diode forward current limited by power terminals.
Final Data Sheet
4
V3.0,2017-03-07
FS400R07A3E3
HybridPACKª1Module
5Module
Parameter
Conditions
Isolationtestvoltage
RMS, f = 50 Hz, t = 1 min.
Symbol
VISOL
Materialofmodulebaseplate
Value
Unit
2.5
kV
Cu
Al2O3
Internalisolation
basicinsulation(class1,IEC61140)
Creepagedistance
terminaltoheatsink
terminaltoterminal
dCreep
12.0
6.1
mm
Clearance
terminaltoheatsink
terminaltoterminal
dClear
12.0
6.1
mm
CTI
Comperativetrackingindex
min.
Strayinductancemodule
Moduleleadresistance,terminals-chip
LsCE
TC=25°C,perswitch
15
RCC'+EE'
Storagetemperature
Tstg
ScrewM5baseplatetoheatsink
M
3.00
Terminalconnectiontorque
ScrewM6
M
3.01)
1)
G
nH
1.00
-40
Mountingtorqueformodulmounting
Weight
> 200
typ. max.
mΩ
125
1)
6.00
510
1)
6.01)
°C
Nm
Nm
g
Mounting according to valid application note AN 2010-08 Mounting Instruction HybridPACK 1.
Final Data Sheet
5
V3.0,2017-03-07
FS400R07A3E3
HybridPACKª1Module
6CharacteristicsDiagrams
outputcharacteristicIGBT,Inverter(typical)
IC=f(VCE)
VGE=15V
outputcharacteristicIGBT,Inverter(typical)
IC=f(VCE)
Tvj=150°C
800
800
Tvj = 25°C
Tvj = 125°C
Tvj = 150°C
700
600
600
500
500
IC [A]
IC [A]
700
400
400
300
300
200
200
100
100
0
VGE = 19V
VGE = 17V
VGE = 15V
VGE = 13V
VGE = 11V
VGE = 9V
0
0,0 0,2 0,4 0,6 0,8 1,0 1,2 1,4 1,6 1,8 2,0 2,2 2,4 2,6
VCE [V]
transfercharacteristicIGBT,Inverter(typical)
IC=f(VGE)
VCE=20V
0,0
0,5
1,0
1,5
2,0
2,5 3,0
VCE [V]
3,5
4,0
4,5
5,0
switchinglossesIGBT,Inverter(typical)
Eon=f(IC),Eoff=f(IC)
VGE=±15V,RGon=1,8Ω,RGoff=400Ω,VCE=300V
800
25
Tvj = 25°C
Tvj = 125°C
Tvj = 150°C
700
Eon, Tvj = 150°C
Eoff, Tvj = 150°C
Eon, Tvj = 125°C
Eoff, Tvj = 125°C
20
600
15
E [mJ]
IC [A]
500
400
10
300
200
5
100
0
5
Final Data Sheet
6
7
8
9
VGE [V]
10
11
0
12
6
0
100
200
300
IC [A]
400
500
600
V3.0,2017-03-07
FS400R07A3E3
HybridPACKª1Module
switchinglossesIGBT,Inverter(typical)
Eon=f(RG),Eoff=f(RG)
VGE=±15V,IC=400A,VCE=300V
transientthermalimpedanceIGBT,Inverter
ZthJC=f(t)
80
1
Eon, Tvj = 150°C
Eoff, Tvj = 150°C
Eon, Tvj = 125°C
Eoff, Tvj = 125°C
70
ZthJC : IGBT
60
0,1
ZthJC [K/W]
E [mJ]
50
40
30
0,01
20
i:
1
2
3
4
ri[K/W]: 0,01419 0,06479 0,0335 0,00743
τi[s]:
0,00036 0,01937 0,03762 0,98695
10
0
0
2
4
6
8
10
RG [Ω]
12
14
16
0,001
0,001
18
reversebiassafeoperatingareaIGBT,Inverter(RBSOA)
IC=f(VCE)
VGE=±15V,RGoff=1,8Ω,Tvj=150°C
1
10
800
IC, Modul
IC, Chip
700
700
600
600
500
500
IF [A]
IC [A]
0,1
t [s]
forwardcharacteristicofDiode,Inverter(typical)
IF=f(VF)
800
400
300
200
200
100
100
0
Final Data Sheet
100
200
300
400
500
VCE [V]
600
700
0
800
7
Tvj = 25°C
Tvj = 125°C
Tvj = 150°C
400
300
0
0,01
0,0
0,2
0,4
0,6
0,8
1,0 1,2
VF [V]
1,4
1,6
1,8
2,0
V3.0,2017-03-07
FS400R07A3E3
HybridPACKª1Module
switchinglossesDiode,Inverter(typical)
Erec=f(IF)
RGon=1,8Ω,VCE=300V
switchinglossesDiode,Inverter(typical)
Erec=f(RG)
IF=400A,VCE=300V
10
11
Erec, Tvj = 150°C
Erec, Tvj = 125°C
9
10
8
9
7
8
E [mJ]
E [mJ]
Erec, Tvj = 150°C
Erec, Tvj = 125°C
6
7
5
6
4
5
3
4
2
0
100
200
300
IF [A]
400
500
3
600
transientthermalimpedanceDiode,Inverter
ZthJC=f(t)
0
2
4
6
8
10
RG [Ω]
12
14
16
18
140
160
NTC-Thermistor-temperaturecharacteristic(typical)
R=f(T)
1
100000
ZthJC : Diode
Rtyp
10000
R[Ω]
ZthJC [K/W]
0,1
0,01
1000
i:
1
2
3
4
ri[K/W]: 0,02989 0,12491 0,03869 0,00643
τi[s]:
0,00051 0,01769 0,04823 1,81616
0,001
0,001
Final Data Sheet
0,01
0,1
t [s]
1
100
10
8
0
20
40
60
80
100
TC [°C]
120
V3.0,2017-03-07
FS400R07A3E3
HybridPACKª1Module
7Circuitdiagram
Final Data Sheet
9
V3.0,2017-03-07
FS400R07A3E3
HybridPACKª1Module
8Packageoutlines
DEC
D(2:1)
(21)
B-B ( 3: 1 )
C
9x
6,6
B
8
7
77,5
29 28 27
57
0,1 A B C
4,5 0
-0,3
C
9x
F
B
26
10
12
11
A
3x
9
23
21
22
0
17 18 13 14
F
C(2:1)
M6
ABC
19 20 15 16
A(5:1)
18x
0,6 D E C
20,5
68,7
68,64
B
6
18x
128
96
5
111
117
4
71,505 75
3
64
2
32
33,405
41,025
44,835 53
0
0
11
17
1
0,6 D E C
69,74
68,7
A
D
39,43
31,81
28
D
4x
0,06
0
0
1,04
113,8
75,32
79,13
34,67
37,21
0
123,575
113,8
71,505
75,315
82,935
86,745
27,055
30,865
38,485
42,295
0
9,775
R2,5
Final Data Sheet
E
All dimensions are to be measured in the
mounted condition
10
V3.0,2017-03-07
FS400R07A3E3
HybridPACKª1Module
9LabelCodes
9.1ModuleCode
CodeFormat
Data Matrix
Encoding
ASCII Text
SymbolSize
16x16
Standard
IEC24720 and IEC16022
CodeContent
Content
Module Serial Number
Module Material Number
Production Order Number
Datecode (Production Year)
Datecode (Production Week)
Digit
1-5
6 - 11
12 - 19
20 - 21
22 - 23
Example(below)
71549
142846
55054991
15
30
Example
71549142846550549911530
9.2PackingCode
CodeFormat
Code128
Encoding
Code Set A
SymbolSize
34 digits
Standard
IEC8859-1
CodeContent
Content
Backend Construction Number
Production Lot Number
Serial Number
Date Code
Box Quantity
Identifier
X
1T
S
9D
Q
Digit
2-9
12 - 19
21 - 25
28 - 31
33 - 34
Example(below)
95056609
2X0003E0
754389
1139
15
Example
X950566091T2X0003E0S754389D1139Q15
Final Data Sheet
11
V3.0,2017-03-07
FS400R07A3E3
HybridPACKª1Module
RevisionHistory
Major changes since previous revision
Revision History
Reference
Date
Description
V1.0
2015-04-24
-
V2.0
2015-11-09
-
V3.0
2017-03-07
-
Final Data Sheet
12
V3.0,2017-03-07
FS400R07A3E3
HybridPACKª1Module
Terms&Conditionsofusage
Edition2014-05-30
Publishedby
InfineonTechnologiesAG
81726Munich,Germany
©2014InfineonTechnologiesAG
AllRightsReserved.
LegalDisclaimer
Theinformationgiveninthisdocumentshallinnoeventberegardedasaguaranteeofconditionsorcharacteristics.Withrespecttoany
examplesorhintsgivenherein,anytypicalvaluesstatedhereinand/oranyinformationregardingtheapplicationofthedevice,Infineon
Technologiesherebydisclaimsanyandallwarrantiesandliabilitiesofanykind,includingwithoutlimitation,warrantiesofnon-infringementof
intellectualpropertyrightsofanythirdparty.
Information
Forfurtherinformationontechnology,deliverytermsandconditionsandprices,pleasecontactthenearestInfineonTechnologiesOffice
(http://www.infineon.com)
Warnings
Duetotechnicalrequirements,componentsmaycontaindangeroussubstances.Forinformationonthetypesinquestion,pleasecontactthe
nearestInfineonTechnologiesOffice.
InfineonTechnologiescomponentsmaybeusedinlife-supportdevicesorsystemsonlywiththeexpresswrittenapprovalofInfineon
Technologies,ifafailureofsuchcomponentscanreasonablybeexpectedtocausethefailureofthatlife-supportdeviceorsystemortoaffect
thesafetyoreffectivenessofthatdeviceorsystem.Lifesupportdevicesorsystemsareintendedtobeimplantedinthehumanbodyorto
supportand/ormaintainandsustainand/orprotecthumanlife.Iftheyfail,itisreasonabletoassumethatthehealthoftheuserorotherpersons
maybeendangered.
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Last update
Final Data Sheet
2011-11-11
13
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