HybridPACK™DriveModule
FS820R08A6P2B
FinalDataSheet
V3.1,2019-10-10
AutomotiveHighPower
FS820R08A6P2B
HybridPACK™DriveModule
1Features/Description
HybridPACK™DrivemodulewithEDT2IGBTandDiode
T
T
T
VCES = 750 V
IC = 820 A
Typical Applications
•Automotive Applications
•Hybrid Electrical Vehicles (H)EV
•Motor Drives
•Commercial Agriculture Vehicles
Description
The HybridPACKTM Drive is a very compact
six-pack module (750V/820A) optimized for hybrid
and electric vehicles. The power module
implements the new EDT2 IGBT generation, which
is an automotive Micro-Pattern Trench-Field-Stop
cell design optimized for electric drive train
applications. The chipset has benchmark current
density combined with short circuit ruggedness and
increased blocking voltage for reliable inverter
operation under harsh environmental conditions.
The EDT2 IGBTs also show excellent light load
power losses, which helps to improve system
efficiency over a real driving cycle. The EDT2 IGBT
was optimized for applications with switching
frequencies in the range of 10 kHz.
Electrical Features
•Blocking voltage 750V
•Low VCEsat
•Low Switching Losses
•Low Qg and Crss
•Low Inductive Design
•Tvj op = 150°C
•Short-time extended Operation Temperature
Tvj op = 175°C
The new HybridPACKTM Drive power module family
comes with mechanical guiding elements
supporting easy assembly processes for customers.
Furthermore, the press-fit pins for the signal
terminals avoid additional time consuming selective
solder processes, which provides cost savings on
system level and increases system reliability. The
direct cooled baseplate with PinFin structure in the
FS820R08A6P2B product best utilizes the
implemented chipset and shows superior thermal
characteristics. Due to the high clearance &
creepage distances, the module family is also well
suited for increased system working voltages and
supports modular inverter approaches.
Mechanical Features
•4.2kV DC 1sec Insulation
•High Creepage and Clearance Distances
•Compact design
•High Power Density
•Direct Cooled PinFin Base Plate
•Guiding elements for PCB and cooler assembly
•Integrated NTC temperature sensor
•PressFIT Contact Technology
•RoHS compliant
•UL 94 V0 module frame
Product Name
Ordering Code
FS820R08A6P2B
SP001499708
Final Data Sheet
2
V3.1,2019-10-10
FS820R08A6P2B
HybridPACK™ Drive Module
2
IGBT,Inverter
2.1
Maximum Rated Values
Parameter
Conditions
Symbol
Value
Unit
Collector-emitter voltage
Tvj = 25°C
VCES
750
V
ICN
820
A
Continuous DC collector current
TF = 80°C, Tvj max = 175°C
IC nom
4501)
A
Repetitive peak collector current
tP = 1 ms
ICRM
1640
A
Total power dissipation
TF = 75°C, Tvj max = 175°C
Ptot
7141)
W
VGES
+/-20
V
Implemented collector current
Gate-emitter peak voltage
2.2
Characteristic Values
Collector-emitter saturation voltage
min.
IC = 450 A, VGE = 15 V
IC = 450 A, VGE = 15 V
IC = 450 A, VGE = 15 V
Tvj = 25°C
Tvj = 150°C
Tvj = 175°C
VCE sat
typ.
max.
1.10
1.15
1.15
1.35
V
IC = 820 A, VGE = 15 V
IC = 820 A, VGE = 15 V
Tvj = 25°C
Tvj = 175°C
Gate threshold voltage
IC = 9.60 mA, VCE = VGE
Tvj = 25°C
Tvj = 175°C
VGEth
Gate charge
VGE = -8 V ... 15 V, VCE = 400V
QG
4.40
µC
Tvj = 25°C
RGint
0.7
Ω
Internal gate resistor
1.30
1.50
4.90
5.80
4,10
6.50
V
Input capacitance
f = 1 MHz, VCE = 50 V, VGE = 0 V
Tvj = 25°C
Cies
80.0
nF
Output capacitance
f = 1 MHz, VCE = 50 V, VGE = 0 V
Tvj = 25°C
Coes
1.00
nF
Reverse transfer capacitance
f = 1 MHz, VCE = 50 V, VGE = 0 V
Tvj = 25°C
Cres
0.30
Collector-emitter cut-off current
VCE = 750 V, VGE = 0 V
VCE = 750 V, VGE = 0 V
Tvj = 25°C
Tvj = 175°C
ICES
Gate-emitter leakage current
VCE = 0 V, VGE = 20 V
Tvj = 25°C
IGES
Turn-on delay time, inductive load
IC = 450 A, VCE = 400 V
VGE = -8 V / +15 V
RGon = 2.4 Ω
Tvj = 25°C
Tvj = 150°C
Tvj = 175°C
IC = 450 A, VCE = 400 V
VGE = -8 V / +15 V
RGon = 2.4 Ω
Rise time, inductive load
Turn-off delay time, inductive load
Fall time, inductive load
Turn-on energy loss per pulse
Turn-off energy loss per pulse
nA
µs
Tvj = 25°C
Tvj = 150°C
Tvj = 175°C
tr
0.07
0.08
0.08
µs
IC = 450 A, VCE = 400 V
VGE = -8 V / +15 V
RGoff = 5.1 Ω
Tvj = 25°C
Tvj = 150°C
Tvj = 175°C
td off
0.94
1.05
1.05
µs
IC = 450 A, VCE = 400 V
VGE = -8 V / +15 V
RGoff = 5.1 Ω
Tvj = 25°C
Tvj = 150°C
Tvj = 175°C
tf
0.04
0.05
0.06
µs
IC = 450 A, VCE = 400 V, LS = 20 nH
VGE = -8 V / +15 V
RGon = 2.4 Ω
di/dt (Tvj 25°C) = 5500 A/µs
di/dt (Tvj 150°C) = 5000 A/µs
Tvj = 25°C
Tvj = 150°C
Tvj = 175°C
IC = 450 A, VCE = 400 V, LS = 20 nH
VGE = -8 V / +15 V
RGoff = 5.1 Ω
dv/dt (Tvj 25°C) = 3100 V/µs
dv/dt (Tvj 150°C) = 2500 V/µs
Tvj = 25°C
Tvj = 150°C
Tvj = 175°C
tP ≤ 6 µs, Tvj = 25°C
tP ≤ 3 µs, Tvj = 175°C
Eon
13.5
17.5
18.0
mJ
Eoff
23.5
29.0
30.0
mJ
Thermal resistance, junction to cooling fluid
per IGBT; ∆V/∆t = 10 dm³/min, TF = 75°C
RthJF
Temperature under switching conditions
top continuous
for 10s within a period of 30s, occurence maximum 3000
times over lifetime
Tvj op
3)
400
mA
td on
VGE ≤ 15 V, VCC = 400 V
VCEmax = VCES -LsCE ·di/dt
2)
5
0.28
0.29
0.30
SC data
1)
nF
1.0
4800
3900
ISC
A
0.1202) 0.1402) K/W
-40
150
1503)
175
°C
Verified by characterization / design not by test.
Cooler design and flow direction according to application note AN-HPD-ASSEMBLY. Cooling fluid 50% water / 50% ethylenglycol.
For Tvjop > 150°C: Baseplate temperature has to be limited to 125°C.
Final Data Sheet
3
V3.1, 2019-10-10
FS820R08A6P2B
HybridPACK™ Drive Module
3
Diode, Inverter
3.1
Maximum Rated Values
Parameter
Conditions
Symbol
Value
Unit
Repetitive peak reverse voltage
Tvj = 25°C
VRRM
750
V
Implemented forward current
IFN
820
A
Continuous DC forward current
IF
4501)
A
Repetitive peak forward current
tP = 1 ms
I²t - value
VR = 0 V, tP = 10 ms, Tvj = 150°C
VR = 0 V, tP = 10 ms, Tvj = 175°C
3.2
IFRM
1640
A
I²t
19000
16000
A²s
A²s
Characteristic Values
Forward voltage
Peak reverse recovery current
Recovered charge
Reverse recovery energy
min.
max.
1.65
Tvj = 25°C
Tvj = 150°C
Tvj = 175°C
IF = 820 A, VGE = 0 V
IF = 820 A, VGE = 0 V
Tvj = 25°C
Tvj = 175°C
IF = 450 A, - diF/dt = 5000 A/µs (Tvj = 150°C)
VR = 400 V
VGE = -8 V
Tvj = 25°C
Tvj = 150°C
Tvj = 175°C
IRM
250
350
370
A
IF = 450 A, - diF/dt = 5000 A/µs (Tvj = 150°C)
VR = 400 V
VGE = -8 V
Tvj = 25°C
Tvj = 150°C
Tvj = 175°C
Qr
20.0
40.0
45.0
µC
IF = 450 A, - diF/dt = 5000 A/µs (Tvj = 150°C)
VR = 400 V
VGE = -8 V
Tvj = 25°C
Tvj = 150°C
Tvj = 175°C
Erec
7.00
13.0
15.0
mJ
VF
V
1.70
1.60
Thermal resistance, junction to cooling fluid
per diode; ∆V/∆t = 10 dm³/min, TF = 75°C
RthJF
Temperature under switching conditions
top continuous
for 10s within a period of 30s, occurence maximum 3000
times over lifetime
Tvj op
4
typ.
1.45
1.30
1.25
IF = 450 A, VGE = 0 V
IF = 450 A, VGE = 0 V
IF = 450 A, VGE = 0 V
NTC-Thermistor
0.1752) 0.2002) K/W
1503)
175
-40
150
min.
typ.
°C
max.
Parameter
Conditions
Symbol
Value
Unit
Rated resistance
TC = 25°C
R25
5.00
kΩ
Deviation of R100
TC = 100°C, R100 = 493 Ω
Power dissipation
TC = 25°C
B-value
R2 = R25 exp [B25/50(1/T2 - 1/(298,15 K))]
B25/50
3375
K
B-value
R2 = R25 exp [B25/80(1/T2 - 1/(298,15 K))]
B25/80
3411
K
B-value
R2 = R25 exp [B25/100(1/T2 - 1/(298,15 K))]
B25/100
3433
K
∆R/R
-5
P25
5
%
20.0
mW
Specification according to the valid application note.
1)
2)
3)
Verified by characterization / design not by test.
Cooler design and flow direction according to application note AN-HPD-ASSEMBLY. Cooling fluid 50% water / 50% ethylenglycol.
For Tvjop > 150°C: Baseplate temperature has to be limited to 125°C.
Final Data Sheet
4
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FS820R08A6P2B
HybridPACK™ Drive Module
5
Module
Parameter
Conditions
Symbol
Value
Unit
Isolation test voltage
RMS, f = 0 Hz, t = 1 sec
VISOL
4.2
kV
Maximum RMS module terminal current
TF = 75°C, TCt = 105°C
ItRMS
500
A
Cu+Ni1)
Material of module baseplate
Al2O32)
Internal isolation
basic insulation (class 1, IEC 61140)
Creepage distance
terminal to heatsink
terminal to terminal
dCreep
9.0
9.0
mm
Clearance
terminal to heatsink
terminal to terminal
dClear
4.5
4.5
mm
CTI
Comperative tracking index
min.
Pressure drop in cooling circuit
Maximum pressure in cooling circuit
∆V/∆t = 10.0 dm³/min; TF = 75°C
Tbaseplate < 40°C
Tbaseplate > 40°C
(relative pressure)
8.0
RCC'+EE'
TF = 25 °C, per switch
Screw M4 baseplate to heatsink
Screw EJOT Delta PCB to frame
bar
nH
0.75
mΩ
Tstg
-40
125
M
1.80
0.45
2.00 2.20
Nm
0.50 0.554)
G
Weight
mbar
2.5
2.0
LsCE
Storage temperature
Mounting torque for modul mounting
643)
p
Stray inductance module
Module lead resistance, terminals - chip
∆p
> 200
typ. max.
720
°C
g
1)
Ni plated Cu baseplate.
Improved Al2O3 ceramic.
Cooler design and flow direction according to application note AN-HPD-ASSEMBLY. Cooling fluid 50% water / 50% ethylenglycol.
4)
EJOT Delta PT WN 5451 30x10. Effective mounting torque according to application note AN-HPD-ASSEMBLY
2)
3)
Final Data Sheet
5
V3.1, 2019-10-10
FS820R08A6P2B
HybridPACK™ Drive Module
6
Characteristics Diagrams
output characteristic IGBT,Inverter (typical)
IC = f (VCE)
VGE = 15 V
output characteristic IGBT,Inverter (typical)
IC = f (VCE)
Tvj = 150°C
1600
1600
Tvj = 25°C
Tvj = 150°C
Tvj = 175°C
1500
1400
1400
1300
1200
1200
1100
1100
1000
1000
900
900
IC [A]
1300
IC [A]
VGE = 19V
VGE = 17V
VGE = 15V
VGE = 13V
VGE = 11V
VGE = 9V
1500
800
800
700
700
600
600
500
500
400
400
300
300
200
200
100
100
0
0
0,0 0,2 0,4 0,6 0,8 1,0 1,2 1,4 1,6 1,8 2,0 2,2
VCE [V]
transfer characteristic IGBT,Inverter (typical)
IC = f (VGE)
VCE = 20 V
0,0
0,4
0,8
1,2
1,6
2,0 2,4
VCE [V]
2,8
3,2
3,6
4,0
800
900
switching losses IGBT,Inverter (typical)
Eon = f (IC), Eoff = f (IC),
VGE = +15 V / -8 V, RGon = 2.4 Ω, RGoff = 5.1 Ω, VCE = 400 V
1600
70
Tvj = 25°C
Tvj = 150°C
Tvj = 175°C
1500
1400
Eon, Tvj = 150°C
Eoff, Tvj = 150°C
Eon, Tvj = 175°C
Eoff, Tvj = 175°C
60
1300
1200
50
1100
1000
40
E [mJ]
IC [A]
900
800
700
30
600
500
20
400
300
10
200
100
0
0
5
Final Data Sheet
6
7
8
9
VGE [V]
10
11
12
0
6
100
200
300
400 500
IC [A]
600
700
V3.1, 2019-10-10
FS820R08A6P2B
HybridPACK™ Drive Module
switching losses IGBT,Inverter (typical)
Eon = f (RG), Eoff = f (RG),
VGE = +15V / -8V, IC = 450 A, VCE = 400 V
transient thermal impedance IGBT,Inverter
ZthJF = f (t), cooler design according to AN-HPD-ASSEMBLY
∆V/∆t = 10 dm³/min; Tf = 75°C; 50% water / 50% ethylenglycol
140
1
Eon, Tvj = 150°C
Eoff, Tvj = 150°C
Eon, Tvj = 175°C
Eoff, Tvj = 175°C
120
ZthJF : IGBT
100
0,1
E [mJ]
ZthJF [K/W]
80
60
0,01
40
20
i:
1
2
3
4
ri[K/W]: 0,005 0,05 0,065 0,02
τi[s]:
0,001 0,03 0,25 1,5
0
0
2
4
6
8
10
12 14
RG [Ω]
16
18
20
22
0,001
0,001
24
reverse bias safe operating area IGBT,Inverter (RBSOA)
IC = f (VCE)
VGE = +15V / -8V, RGoff = 5,1 Ω, Tvj = 175°C
0,01
0,1
t [s]
1
10
thermal impedance IGBT,Inverter
RthJF = f (∆V/∆t), cooler design according to AN-HPD-Assembly
Tf = 75°C; 50% water / 50% ethylenglycol
1700
0,152
RthJF: IGBT
1600
0,150
1500
1400
0,148
1300
1200
0,146
1100
RthJF [K/W]
IC [A]
1000
900
800
700
600
0,144
0,142
0,140
500
400
0,138
300
IC, Modul
IC, Chip
200
0,136
100
0
0,134
0
Final Data Sheet
100
200
300
400
500
VCE [V]
600
700
800
4
7
5
6
7
8
9
10
∆V/∆t [dm³/min]
11
12
13
14
V3.1, 2019-10-10
FS820R08A6P2B
HybridPACK™ Drive Module
capacity characteristic IGBT,Inverter (typical)
C = f(VCE)
VGE = 0 V, Tvj = 25°C, f = 1MHz
gate charge characteristic IGBT,Inverter (typical)
VGE = f(QG)
VCE = 400 V, IC = 450 A, Tvj = 25°C
100
15
QG
Cies
Coes
Cres
12
9
10
C [nF]
VGE [V]
6
3
0
1
-3
-6
0,1
-9
0
100
200
300
400
500
0
1
VCE [V]
maximum allowed collector-emitter voltage
VCES = f(Tvj),
verified by characterization / design not by test
ICES = 1 mA for Tvj ≤ 25°C; ICES = 30 mA for Tvj > 25°C
2
3
4
5
QG [µC]
forward characteristic of Diode, Inverter (typical)
IF = f (VF)
800
1600
VCES
1500
1400
775
Tvj = 25°C
Tvj = 150°C
Tvj = 175°C
1300
1200
1100
750
900
IF [A]
VCES [V]
1000
725
800
700
600
700
500
400
300
675
200
100
650
-50
Final Data Sheet
0
-25
0
25
50
75 100 125 150 175 200
Tvj [°C]
0,0 0,2 0,4 0,6 0,8 1,0 1,2 1,4 1,6 1,8 2,0 2,2
VF [V]
8
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FS820R08A6P2B
HybridPACK™ Drive Module
switching losses Diode, Inverter (typical)
Erec = f (IF),
RGon = 2.4 Ω, VCE = 400 V
switching losses Diode, Inverter (typical)
Erec = f (RG),
IF = 450 A, VCE = 400 V
22
20
Erec, Tvj = 150°C
Erec, Tvj = 175°C
20
Erec, Tvj = 150°C
Erec, Tvj = 175°C
18
18
16
16
14
14
E [mJ]
E [mJ]
12
12
10
10
8
8
6
6
4
4
2
2
0
0
0
100
200
300
400 500
IF [A]
600
700
800
900
transient thermal impedance Diode, Inverter
ZthJF = f (t), cooler design according to AN-HPD-ASSEMBLY
∆V/∆t = 10 dm³/min; Tf = 75°C; 50% water / 50% ethylenglycol
0
2
4
6
8
10
12 14
RG [Ω]
16
18
20
22
24
thermal impedance Diode, Inverter
RthJF = f (∆V/∆t), cooler design according to AN-HPD-ASSEMBLY
Tf = 75°C; 50% water / 50% ethylenglycol
1
0,214
ZthJC : Diode
RthJF: Diode
0,212
0,210
0,208
0,1
ZthJC [K/W]
RthJF [K/W]
0,206
0,204
0,202
0,01
0,200
0,198
i:
1
2
3
4
ri[K/W]: 0,015 0,1 0,065 0,02
τi[s]:
0,001 0,03 0,25 1,5
0,001
0,001
Final Data Sheet
0,196
0,194
0,01
0,1
t [s]
1
10
4
9
5
6
7
8
9
10
∆V/∆t [dm³/min]
11
12
13
14
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FS820R08A6P2B
HybridPACK™ Drive Module
NTC-Thermistor-temperature characteristic (typical)
R = f (T)
pressure drop in cooling circuit
∆p = f (∆V/∆t), cooler design according to AN-HPD-ASSEMBLY
Tf = 75°C; 50% water / 50% ethylenglycol
100000
120
∆p: Modul
Rtyp
100
80
R[Ω]
∆p [mbar]
10000
1000
60
40
20
100
0
0
Final Data Sheet
20
40
60
80
100
TC [°C]
120
140
160
4
10
5
6
7
8
9
10
∆V/∆t [dm³/min]
11
12
13
14
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HybridPACK™ Drive Module
7
Circuit diagram
P1
P2
P3
T1
C1
C3
C5
T
T2
G1
G3
G5
E1
E3
E5
U
C2
T3
V
C4
W
T
C6
T4
G2
G4
G6
E2
E4
E6
T5
T
T6
N1
Final Data Sheet
N2
N3
11
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HybridPACK™ Drive Module
122
127 c0,4
128,25 c0,4
107,3
88,3
74,67
60,3
41,3
13,3
27,33
o5,3 c0,15~
m
G
6x
6x
8,5 c0,3
B
0
D
22,25 c0,4
16,25
9,75 c0,4
5 c0,4
0
N2
P1
P2
N3
P3
q0,5
q1,6
A
DE
BC
8x
0
15,5 c0,5
E2 G2
C2
FG
DE
6x
X
4 c0,3
A
6x(N1-N3;P1-P3)
m
Y
N1
q1,2
q5,5 c0,1
14 c0,2 6x
16 c0,2
q4,5 c0,15
1 c0,15
q0,6
E4 G4
C4
E6 G6
C6
8x
B
5,7
0
F
26,25 c0,4
25 c0,4
20
10,1 c0,4
7,6 c0,4
0
Package outlines
26 c0,3
8
+0
6 - 0,2
T1
T3
T2
T4
G3 E3
G1 E1
6,5 c0,5
T5
T6
G5 E5
C1
C3
4,3 c0,15
6,35 c0,5
C5
A
82
V
16 c0,2
3x
U
W
C
E
3x
q5,5 c0,1
14 c0,2
H
m
122
102,3
74,67
55,3
27,33
(87)
3x
0
8,3
20
0
reference
plane 22
7,6 c0,4
C
82
87 c0,4
1 c0,15 90,75 c0,4
98,25
3x
104,25 c0,4
I
q0,6
A
q1,2
HI
DE
3x(U;V;W)
125,25
98
102,05
74,65
81,8
51
55,05
27,35
34,8
0
4
8,05
12,2
23,25
0
12,8 c0,2
B
S
X-Y ( 1 : 1 )
L
8x
9,3 c0,2
dimensioned for
Y
D1
0
8
A
f 0,3 CZ
6x common zones
D1-D2
D2-D3
D3-D4
D8-D7
D7-D6
D6-D5
D2
N1
P2
N3
P3
8x
m
q0,8
q1,6
A
LM
BC
M
X
18,85
C2
E2 G2
J
EJOT Delta PT
WN5451 30 x
D4
D3
N2
P1
C4
E4 G4
C6
Z
E6 G6
origin axis generated by
K C2;E2;G2;C4;E4;G4;C6;E6;G6
R
51,85
59,35
67,15
69,85
74,1
82
3,94 +- 0,4
0,5
refers
to local CZ
Areas R,S or T
T1
T3
T2
T4
G1 E1
T6
G5 E5
G3 E3
C3
C1
U
D8
C5
V
D7
T
T5
C
W
D6
D5
Final Data Sheet
m
q
q
115,95
117,35
125,25
68,95
70,35
74,65
83,75
87
87,8
21,95
23,35
27,35
36,75
40,8
Z ( 1,5 : 1 )
23,25
Drawing: D00043903_09
general toler
surface
1. DIN
DIN EN ISO
DIN ISO 13715 16742-TG4
1302
2. DIN ISO
2768-mK
All dimensions refer to module in
delivery condition
edges
10,25
6,2
0
(19,75)
** K J
A
** B C
24x
C2
E2 G2 ** Pin position
checked with pin gauge
according to Application
Note AN-HPD_ASSEMBLY
12
V3.1, 2019-10-10
FS820R08A6P2B
HybridPACK™ Drive Module
9
Label Codes
9.1
Module Code
Code Format
Data Matrix
Encoding
ASCII Text
Symbol Size
16x16
Standard
IEC24720 and IEC16022
Code Content
Content
Module Serial Number
Module Material Number
Production Order Number
Datecode (Production Year)
Datecode (Production Week)
Digit
1-5
6 - 11
12 - 19
20 - 21
22 - 23
Example (below)
71549
142846
55054991
15
30
Example
71549142846550549911530
9.2
Packing Code
Code Format
Code128
Encoding
Code Set A
Symbol Size
34 digits
Standard
IEC8859-1
Code Content
Content
Backend Construction Number
Production Lot Number
Serial Number
Date Code
Box Quantity
Identifier
X
1T
S
9D
Q
Digit
2-9
12 - 19
21 - 25
28 - 31
33 - 34
Example (below)
95056609
2X0003E0
754389
1139
15
Example
X950566091T2X0003E0S754389D1139Q15
Final Data Sheet
13
V3.1, 2019-10-10
FS820R08A6P2B
HybridPACK™ Drive Module
Revision History
Major changes since previous revision
Revision History
Reference
Date
Description
V1.2
2016-01-14
Increased ICRM and minor revisions, based on FS660R08A6P2B revision 1.1
V2.0
2016-11-24
Preliminary datasheet 2.0
V3.0
2017-03-09
Final datasheet 3.0
V3.1
2019-10-10
Adjustment of package outlines. Correction of typing errors.
Final Data Sheet
14
V3.1, 2019-10-10
FS820R08A6P2B
HybridPACK™ Drive Module
Terms & Conditions of usage
Edition 2018-08-01
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2018 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any
examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon
Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of
intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office
(http://www.infineon.com)
Warnings
Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the
nearest Infineon Technologies Office.
These components are not designed for “special applications” that demand extremely high reliability or safety such as aerospace, defense or life
support devices or systems (Class III medical devices). If you intend to use the components in any of these special applications, please contact
your local representative at International Rectifier HiRel Products, Inc. or the Infineon support (https://www.infineon.com/support) to review
product requirements and reliability testing.
Infineon Technologies components may be used in special applications only with the express written approval of Infineon Technologies. Class
III medical devices are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they
fail, it is reasonable to assume that the health of the user or other persons may be endangered.
Trademarks
Trademarks of Infineon Technologies AG
AURIX™, C166™, CanPAK™, CIPOS™, CIPURSE™, EconoPACK™, CoolMOS™, CoolSET™, CORECONTROL™, CROSSAVE™, DAVE™,
DI-POL™, EasyPIM™, EconoBRIDGE™, EconoDUAL™, EconoPIM™, EconoPACK™, EiceDRIVER™, eupec™, FCOS™, HITFET™,
HybridPACK™, I²RF™, ISOFACE™, IsoPACK™, MIPAQ™, ModSTACK™, my-d™, NovalithIC™, OptiMOS™, ORIGA™, POWERCODE™,
PRIMARION™, PrimePACK™, PrimeSTACK™, PRO-SIL™, PROFET™, RASIC™, ReverSave™, SatRIC™, SIEGET™, SINDRION™,
SIPMOS™, SmartLEWIS™, SOLID FLASH™, TEMPFET™, thinQ!™, TRENCHSTOP™, TriCore™.
Other Trademarks
Advance Design System™ (ADS) of Agilent Technologies, AMBA™, ARM™, MULTI-ICE™, KEIL™, PRIMECELL™, REALVIEW™, THUMB™,
µVision™ of ARM Limited, UK. AUTOSAR™ is licensed by AUTOSAR development partnership. Bluetooth™ of Bluetooth SIG Inc. CAT-iq™ of
DECT Forum. COLOSSUS™, FirstGPS™ of Trimble Navigation Ltd. EMV™ of EMVCo, LLC (Visa Holdings Inc.). EPCOS™ of Epcos AG.
FLEXGO™ of Microsoft Corporation. FlexRay™ is licensed by FlexRay Consortium. HYPERTERMINAL™ of Hilgraeve Incorporated. IEC™ of
Commission Electrotechnique Internationale. IrDA™ of Infrared Data Association Corporation. ISO™ of INTERNATIONAL ORGANIZATION
FOR STANDARDIZATION. MATLAB™ of MathWorks, Inc. MAXIM™ of Maxim Integrated Products, Inc. MICROTEC™, NUCLEUS™ of Mentor
Graphics Corporation. MIPI™ of MIPI Alliance, Inc. MIPS™ of MIPS Technologies, Inc., USA. muRata™ of MURATA MANUFACTURING CO.,
MICROWAVE OFFICE™ (MWO) of Applied Wave Research Inc., OmniVision™ of OmniVision Technologies, Inc. Openwave™ Openwave
Systems Inc. RED HAT™ Red Hat, Inc. RFMD™ RF Micro Devices, Inc. SIRIUS™ of Sirius Satellite Radio Inc. SOLARIS™ of Sun
Microsystems, Inc. SPANSION™ of Spansion LLC Ltd. Symbian™ of Symbian Software Limited. TAIYO YUDEN™ of Taiyo Yuden Co.
TEAKLITE™ of CEVA, Inc. TEKTRONIX™ of Tektronix Inc. TOKO™ of TOKO KABUSHIKI KAISHA TA. UNIX™ of X/Open Company Limited.
VERILOG™, PALLADIUM™ of Cadence Design Systems, Inc. VLYNQ™ of Texas Instruments Incorporated. VXWORKS™, WIND RIVER™ of
WIND RIVER SYSTEMS, INC. ZETEX™ of Diodes Zetex Limited.
Last update
Final Data Sheet
2011-11-11
15
V3.1, 2019-10-10
www.infineon.com
Published by Infineon Technologies AG
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