FZ1600R33HE4
IHM-B module
IHM-B module with Trench/Fieldstop IGBT4 and emitter controlled 4 diode
Features
• Electrical features
- VCES = 3300 V
- IC nom = 1600 A / ICRM = 3200 A
- High DC stability
- High short-circuit capability
- Low switching losses
- Low VCE,sat
- Tvj,op = 150°C
- Trench IGBT 4
- Unbeatable robustness
- VCE,sat with positive temperature coefficient
- High current density
- Low Qg and Cres
• Mechanical features
- AlSiC base plate for increased thermal cycling capability
- High power density
- Isolated base plate
- Package with CTI > 600
- RoHS compliant
Potential applications
•
•
•
•
•
•
High-power converters
Medium-voltage converters
Motor drives
Traction drives
UPS systems
Active frontend (energy recovery)
Product validation
• Qualified for industrial applications according to the relevant tests of IEC 60747, 60749 and 60068
Description
Datasheet
www.infineon.com
Please read the sections "Important notice" and "Warnings" at the end of this document
Revision 1.30
2022-11-22
FZ1600R33HE4
IHM-B module
Table of contents
Table of contents
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
Potential applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Product validation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Table of contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1
Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2
IGBT, Inverter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
3
Diode, Inverter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
4
Characteristics diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
5
Circuit diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
6
Package outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
7
Module label code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Disclaimer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Datasheet
2
Revision 1.30
2022-11-22
FZ1600R33HE4
IHM-B module
1 Package
1
Package
Table 1
Insulation coordination
Parameter
Symbol Note or test condition
Values
Unit
Isolation test voltage
VISOL
RMS, f = 50 Hz, t = 60 s
6.0
kV
Partial discharge
extinction voltage
Visol
RMS, f = 50 Hz, QPD ≤ 10 pC
2.6
kV
2100
V
DC stability
VCE(D)
Tvj = 25 °C, 100 Fit
Material of module
baseplate
AlSiC
Creepage distance
dCreep
terminal to heatsink
32.2
mm
Clearance
dClear
terminal to heatsink
19.1
mm
Comparative tracking
index
Table 2
CTI
> 600
Characteristic values
Parameter
Symbol Note or test condition
Values
Min.
Stray inductance module
LsCE
Typ.
Unit
Max.
9
nH
Module lead resistance,
terminals - chip
RAA'+CC'
TC = 25 °C, per switch
0.12
mΩ
Module lead resistance,
terminals - chip
RCC'+EE'
TC = 25 °C, per switch
0.14
mΩ
Storage temperature
Tstg
Mounting torque for
module mounting
M
Terminal connection
torque
M
Weight
G
2
Table 3
-40
150
°C
- Mounting according to M6, Screw
valid application note
4.25
5.75
Nm
- Mounting according to M4, Screw
valid application note
M8, Screw
1.8
2.1
Nm
8
10
800
g
Values
Unit
Tvj = -40 °C
3300
V
Tvj = 150 °C
3300
TC = 100 °C
1600
A
3200
A
IGBT, Inverter
Maximum rated values
Parameter
Collector-emitter voltage
Symbol Note or test condition
VCES
Continuous DC collector
current
ICDC
Tvj max = 150 °C
Repetitive peak collector
current
ICRM
tp limited by Tvj op
(table continues...)
Datasheet
3
Revision 1.30
2022-11-22
FZ1600R33HE4
IHM-B module
2 IGBT, Inverter
Table 3
(continued) Maximum rated values
Parameter
Symbol Note or test condition
Gate-emitter peak voltage
Table 4
VGES
Values
Unit
±20
V
Values
Unit
Characteristic values
Parameter
Symbol Note or test condition
Min.
Collector-emitter
saturation voltage
Gate threshold voltage
Gate charge
VCE sat
VGEth
QG
IC = 1600 A, VGE = 15 V
Typ.
Max.
Tvj = 25 °C
2.40
2.65
Tvj = 125 °C
2.95
Tvj = 150 °C
3.10
3.25
5.80
6.40
IC = 62 mA, VCE = VGE, Tvj = 25 °C
5.20
VGE = ±15 V, VCC = 1800 V
V
V
28
µC
Internal gate resistor
RGint
Tvj = 25 °C
0.75
Ω
Input capacitance
Cies
f = 1000 kHz, Tvj = 25 °C, VCE = 25 V, VGE = 0 V
187
nF
Reverse transfer
capacitance
Cres
f = 1000 kHz, Tvj = 25 °C, VCE = 25 V, VGE = 0 V
5.33
nF
Collector-emitter cut-off
current
ICES
VCE = 3300 V, VGE = 0 V
Gate-emitter leakage
current
IGES
VCE = 0 V, VGE = 20 V, Tvj = 25 °C
Turn-on delay time
(inductive load)
tdon
IC = 1600 A, VCC = 1800 V, Tvj = 25 °C
VGE = ±15 V, RGon = 0.8 Ω
Tvj = 125 °C
0.600
Tvj = 150 °C
0.760
IC = 1600 A, VCC = 1800 V, Tvj = 25 °C
VGE = ±15 V, RGon = 0.8 Ω
Tvj = 125 °C
0.220
Tvj = 150 °C
0.250
IC = 1600 A, VCC = 1800 V, Tvj = 25 °C
VGE = ±15 V, RGoff = 3.9 Ω
Tvj = 125 °C
3.420
Tvj = 150 °C
3.740
IC = 1600 A, VCC = 1800 V, Tvj = 25 °C
VGE = ±15 V, RGoff = 3.9 Ω
Tvj = 125 °C
0.690
Tvj = 150 °C
1.470
Rise time (inductive load)
Turn-off delay time
(inductive load)
Fall time (inductive load)
tr
tdoff
tf
Turn-on time (resistive
load)
ton_R
Turn-on energy loss per
pulse
Eon
IC = 500 A, VCC = 2000 V,
VGE = ±15 V, RGon = 0.8 Ω
Tvj = 25 °C
Tvj = 25 °C
IC = 1600 A, VCC = 1800 V, Tvj = 25 °C
Lσ = 85 nH, VGE = ±15 V,
Tvj = 125 °C
RGon = 0.8 Ω, di/dt =
5300 A/µs (Tvj = 150 °C) Tvj = 150 °C
5
mA
400
nA
µs
0.710
µs
0.240
µs
3.670
µs
1.290
1.18
µs
1850
mJ
2850
3200
(table continues...)
Datasheet
4
Revision 1.30
2022-11-22
FZ1600R33HE4
IHM-B module
3 Diode, Inverter
Table 4
(continued) Characteristic values
Parameter
Symbol Note or test condition
Values
Min.
Turn-off energy loss per
pulse
SC data
Eoff
ISC
IC = 1600 A, VCC = 1800 V, Tvj = 25 °C
Lσ = 85 nH, VGE = ±15 V,
Tvj = 125 °C
RGoff = 3.9 Ω, dv/dt =
1700 V/µs (Tvj = 150 °C) Tvj = 150 °C
2280
VGE ≤ 15 V, VCC = 2400 V,
VCEmax=VCES-LsCE*di/dt
6400
Thermal resistance,
junction to case
RthJC
per IGBT
Thermal resistance, case to
heat sink
RthCH
per IGBT
Temperature under
switching conditions
Tvj op
3
Typ.
Unit
Max.
mJ
2980
3140
tP ≤ 10 µs,
Tvj ≤ 150 °C
A
9.30
5.60
-40
K/kW
K/kW
150
°C
Diode, Inverter
Table 5
Maximum rated values
Parameter
Symbol Note or test condition
Repetitive peak reverse
voltage
VRRM
Continuous DC forward
current
IF
Repetitive peak forward
current
IFRM
I2t - value
I 2t
Maximum power
dissipation
PRQM
Minimum turn-on time
tonmin
Table 6
Values
Unit
Tvj = -40 °C
3300
V
Tvj = 150 °C
3300
1600
A
3200
A
Tvj = 125 °C
630
kA²s
Tvj = 150 °C
570
Tvj = 150 °C
3600
kW
10
µs
Values
Unit
tP = 1 ms
tP = 10 ms, VR = 0 V
Characteristic values
Parameter
Symbol Note or test condition
Min.
Forward voltage
VF
IF = 1600 A, VGE = 0 V
Typ.
Max.
Tvj = 25 °C
2.90
3.30
Tvj = 125 °C
2.60
Tvj = 150 °C
2.50
V
2.80
(table continues...)
Datasheet
5
Revision 1.30
2022-11-22
FZ1600R33HE4
IHM-B module
3 Diode, Inverter
Table 6
(continued) Characteristic values
Parameter
Symbol Note or test condition
Values
Min.
Peak reverse recovery
current
Recovered charge
Reverse recovery energy
IRM
Qr
Erec
VCC = 1800 V, IF = 1600 A, Tvj = 25 °C
VGE = -15 V, -diF/dt =
Tvj = 125 °C
5300 A/µs (Tvj = 150 °C)
Tvj = 150 °C
1470
VCC = 1800 V, IF = 1600 A, Tvj = 25 °C
VGE = -15 V, -diF/dt =
Tvj = 125 °C
5300 A/µs (Tvj = 150 °C)
Tvj = 150 °C
685
RthJC
per diode
Thermal resistance, case to
heat sink
RthCH
per diode
Temperature under
switching conditions
Tvj op
Max.
A
1650
1700
µC
1360
2000
VCC = 1800 V, IF = 1600 A, Tvj = 25 °C
VGE = -15 V, -diF/dt =
Tvj = 125 °C
5300 A/µs (Tvj = 150 °C)
Tvj = 150 °C
Thermal resistance,
junction to case
Datasheet
Typ.
Unit
730
mJ
1450
1750
17.5
8.50
-40
6
K/kW
K/kW
150
°C
Revision 1.30
2022-11-22
FZ1600R33HE4
IHM-B module
4 Characteristics diagrams
4
Characteristics diagrams
Output characteristic (typical), IGBT, Inverter
IC = f(VCE)
VGE = 15 V
Output characteristic field (typical), IGBT, Inverter
IC = f(VCE)
Tvj = 150 °C
3200
3200
2800
2800
2400
2400
2000
2000
1600
1600
1200
1200
800
800
400
400
0
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Transfer characteristic (typical), IGBT, Inverter
IC = f(VGE)
VCE = 20 V
Switching losses (typical), IGBT, Inverter
E = f(IC)
RGoff = 3.9 Ω, RGon = 0.8 Ω, VCC = 1800 V, VGE = ± 15 V
3200
10000
9000
2800
8000
2400
7000
2000
6000
1600
5000
4000
1200
3000
800
2000
400
1000
0
0
5
Datasheet
6
7
8
9
10
11
12
13
0
7
400
800
1200 1600 2000 2400 2800 3200
Revision 1.30
2022-11-22
FZ1600R33HE4
IHM-B module
4 Characteristics diagrams
Switching losses (typical), IGBT, Inverter
E = f(RG)
IC = 1600 A, VCC = 1800 V, VGE = ± 15 V
Switching times (typical), IGBT, Inverter
t = f(IC)
RGoff = 3.9 Ω, RGon = 0.8 Ω, VCC = 1800 V, VGE = ± 15 V, Tvj =
125 °C
10
10000
9000
8000
7000
1
6000
5000
4000
0.1
3000
2000
1000
0
0.01
0
1
2
3
4
5
6
7
8
0
Switching times (typical), IGBT, Inverter
t = f(RG)
IC = 1600 A, VCC = 1800 V, VGE = ± 15 V, Tvj = 125 °C
400
800
1200 1600 2000 2400 2800 3200
Transient thermal impedance , IGBT, Inverter
Zth = f(t)
10
100
10
1
1
0.1
0
Datasheet
1
2
3
4
5
6
7
0.1
0.001
8
8
0.01
0.1
1
10
Revision 1.30
2022-11-22
FZ1600R33HE4
IHM-B module
4 Characteristics diagrams
Reverse bias safe operating area (RBSOA), IGBT,
Inverter
IC = f(VCE)
RGoff = 3.9 Ω, VGE = ±15 V, Tvj = 150 °C
Capacity characteristic (typical), IGBT, Inverter
C = f(VCE)
f = 100 kHz, VGE = 0 V, Tvj = 25 °C
4000
300
3600
250
3200
2800
200
2400
2000
150
1600
100
1200
800
50
400
0
0
0
500
1000
1500
2000
2500
3000
3500
0.1
Gate charge characteristic (typical), IGBT, Inverter
VGE = f(QG)
IC = 1600 A, Tvj = 25 °C
1
10
100
Forward characteristic (typical), Diode, Inverter
IF = f(VF)
15
3200
13
2800
11
9
2400
7
5
2000
3
1
1600
-1
-3
1200
-5
-7
800
-9
-11
400
-13
-15
0
0
Datasheet
4
8
12
16
20
24
28
0.0 0.4 0.8 1.2 1.6 2.0 2.4 2.8 3.2 3.6 4.0
9
Revision 1.30
2022-11-22
FZ1600R33HE4
IHM-B module
4 Characteristics diagrams
Switching losses (typical), Diode, Inverter
Erec = f(IF)
VCE = 1800 V, RGon = RGon(IGBT)
Switching losses (typical), Diode, Inverter
Erec = f(RG)
VCE = 1800 V, IF = 1600 A
2500
2500
2000
2000
1500
1500
1000
1000
500
500
0
0
0
400
800
1200 1600 2000 2400 2800 3200
0
Transient thermal impedance, Diode, Inverter
Zth = f(t)
1
2
3
4
5
6
7
8
3000
3500
Safe operating area (SOA), Diode, Inverter
IR = f(VR)
Tvj = 150 °C
100
3600
3200
2800
2400
10
2000
1600
1200
1
800
400
0.1
0.001
Datasheet
0
0.01
0.1
1
0
10
10
500
1000
1500
2000
2500
Revision 1.30
2022-11-22
FZ1600R33HE4
IHM-B module
5 Circuit diagram
5
Circuit diagram
Figure 1
6
Package outlines
Figure 2
Datasheet
11
Revision 1.30
2022-11-22
FZ1600R33HE4
IHM-B module
7 Module label code
7
Module label code
Module label code
Code format
Data Matrix
Barcode Code128
Encoding
ASCII text
Code Set A
Symbol size
16x16
23 digits
Standard
IEC24720 and IEC16022
IEC8859-1
Code content
Content
Module serial number
Module material number
Production order number
Date code (production year)
Date code (production week)
Digit
1–5
6 - 11
12 - 19
20 – 21
22 – 23
Example
71549
142846
55054991
15
30
Example
71549142846550549911530
71549142846550549911530
Figure 3
2
Datasheet
12
Revision 1.30
2022-11-22
FZ1600R33HE4
IHM-B module
Revision history
Revision history
Document revision
Date of release
1.00
2021-03-02
1.10
2021-04-13
Final
1.20
2021-10-28
Final datasheet
1.30
2022-11-22
Final datasheet
Datasheet
Description of changes
13
Revision 1.30
2022-11-22
Trademarks
All referenced product or service names and trademarks are the property of their respective owners.
Edition 2022-11-22
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2022 Infineon Technologies AG
All Rights Reserved.
Do you have a question about any
aspect of this document?
Email: erratum@infineon.com
Document reference
IFX-AAO543-004
Important notice
The information given in this document shall in no
event be regarded as a guarantee of conditions or
characteristics (“Beschaffenheitsgarantie”).
With respect to any examples, hints or any typical
values stated herein and/or any information regarding
the application of the product, Infineon Technologies
hereby disclaims any and all warranties and liabilities
of any kind, including without limitation warranties of
non-infringement of intellectual property rights of any
third party.
In addition, any information given in this document is
subject to customer’s compliance with its obligations
stated in this document and any applicable legal
requirements, norms and standards concerning
customer’s products and any use of the product of
Infineon Technologies in customer’s applications.
The data contained in this document is exclusively
intended for technically trained staff. It is the
responsibility of customer’s technical departments to
evaluate the suitability of the product for the intended
application and the completeness of the product
information given in this document with respect to such
application.
Warnings
Due to technical requirements products may contain
dangerous substances. For information on the types
in question please contact your nearest Infineon
Technologies office.
Except as otherwise explicitly approved by Infineon
Technologies in a written document signed by
authorized representatives of Infineon Technologies,
Infineon Technologies’ products may not be used in
any applications where a failure of the product or
any consequences of the use thereof can reasonably
be expected to result in personal injury.