IFX1117MEV33HTMA1

Voltage Regulator IFX1117 Data Sheet Features • • • • • • • • Output voltage 3.3 V or adjustable 1.0 A output current Low drop voltage < 1.2 V @ 800 mA Short circuit protected Overtemperature protected Operating range up to 15 V Industrial type Green Product (RoHS compliant) For automotive and transportation applications, please refer to the Infineon TLE and TLF voltage regulator series. Functional Description The IFX1117 is a monolithic integrated fixed NPN type voltage regulator that can supply loads up to 1.0 A. The device is housed in the small surface mounted SOT223 package. The IC is equipped with additional protection against overload, short circuit and overtemperature. The IFX1117ME V33 supplies a regulated output voltage of 3.3 V (±2%). The IFX1117ME V supplies an output voltage with ±2% precision adjustable via an external voltage divider. The input voltage for the IFX1117ME V33 ranges from 4.5 V (= VQ+VDR) to 15 V for a load current of 800 mA, for the maximum load current of 1.0 A a minimum input voltage of 4.7 V is required. The drop voltage VDR ranges from 1.1 V to 1.4 V depending on the load current level. The device operates in the temperature range of Tj = 0 to 125 °C. Type Package Marking IFX1117ME V33 PG-SOT223 111733 IFX1117ME V PG-SOT223 1117V Data Sheet 1 Rev. 1.0, 2011-02-24 IFX 1117 I Q Control with Overtemperature Protection; Overcurrent Protection Internal Reference GND AES02840 Figure 1 Data Sheet Block Diagram for Fixed Output Voltage IFX1117ME V33 2 Rev. 1.0, 2011-02-24 IFX 1117 SOT223 Q 4 1 2 GND Q 3 I AEP02868_1117_01 Figure 2 Pin Configuration IFX1117ME V33 (top view) Table 1 Pin Definitions and Functions IFX1117ME V33 Pin No. Symbol Function 1 GND Ground 2 Q Output; Connect output pin to GND via a capacitor CQ ≥ 10 μF with ESR ≤ 20 Ω (see also graph “Region of Stability”) 3 I Input 4 (TAB) Q Output; Connect to pin 2 and heatsink area on PCB Data Sheet 3 Rev. 1.0, 2011-02-24 IFX 1117 SOT223 Q 4 1 2 ADJ Q 3 I AEP02868_1117_02 Figure 3 Pin Configuration IFX1117ME V (top view) Table 2 Pin Definitions and Functions IFX1117ME V Pin No. Symbol Function 1 ADJ Adjust; defines output voltage level by external voltage divider between Q, ADJ and GND. 2 Q Output; Connect output pin to GND via a capacitor CQ ≥ 10 μF with ESR ≤ 20 Ω (see also graph “Region of Stability”). 3 I Input 4 (TAB) Q Output; Connect to pin 2 and heatsink area on PCB Data Sheet 4 Rev. 1.0, 2011-02-24 IFX 1117 Table 3 Absolute Maximum Ratings Parameter Symbol Limit Values Min. Unit Test Condition Max. Input - Output Voltage Difference (variable device only) VI - VQ Voltage -0.3 20 V – Input Voltage (fixed voltage version only) Voltage VI -0.3 20 V – VQ IQ -0.3 20 V – – – – Internally limited VESD -2 2 kV Human Body Model Tstg Tj -50 150 °C – -40 150 °C – Output Voltage Current ESD Rating Electrostatic discharge voltage Temperature Storage temperature Junction temperature Note: Stresses above those listed here may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Table 4 Operating Range Parameter Symbol Limit Values Unit Remarks VQ + VDR 15 V – 0 125 °C – – 164 K/W PG-SOT223, footprint only. – 81 K/W PG-SOT223, 300 mm2 heat sink area – 4 K/W – Min. Input Voltage Junction temperature Table 5 VI Tj Max. Thermal Resistance Junction ambient Junction case Rthja Rthjc Note: In the operating range, the functions given in the circuit description are fulfilled. Data Sheet 5 Rev. 1.0, 2011-02-24 IFX 1117 Characteristics 3.3 V Fixed Output Voltage Device IFX1117ME V33 0 °C < Tj < 125 °C; VI = 5 V, IQ = 10 mA; unless otherwise specified. Parameter Symbol Limit Values min. typ. Unit Measuring Conditions max. Output voltage VQ 3.23 5 3.300 3.36 5 V 0 mA ≤ IQ ≤ 800 mA 4.7 V ≤ VI ≤ 10 V Output voltage VQ – 3.300 – V 0 mA ≤ IQ ≤ 1000 mA; 4.7 V ≤ VI ≤ 15V Line regulation ΔVQ – 1 6 mV 4.7 V ≤ VI ≤ 15V Load regulation ΔVQ – 1 10 mV 0 mA ≤ IQ ≤ 800 mA;1) – 2 – mV 0 mA ≤ IQ ≤ 1.0 A1) VDR Drop voltage VDR Drop voltage VDR Drop voltage VDR Current consumption; Iq Iq = II – IQ Temperature stability ΔVQ – 1.00 1.10 V – 1.05 1.15 V – 1.10 1.20 V – 1.30 1.40 V – 5 10 mA IQ = 100 mA2) IQ = 500 mA2) IQ = 800 mA2) IQ = 1.0 A2) IQ = 10 mA – 16.5 – mV 3) Long Term Stability – – 0.3 – % 3) Current limit IQmax 1100 – 2250 mA RMS Output Noise – – 30 – ppm Power Supply Ripple Rejection PSRR 60 65 – dB Drop voltage VQ = 0.5 V ppm of VQ, Tj = 25 °C 10 Hz ≤ f ≤ 10 kHz3) fr = 120 Hz, Vr = 1 VPP3) 1) Measured at constant junction temperature 2) Drop voltage measured when the output voltage has dropped 100 mV from the nominal value obtained at VI = 5.0 V. 3) Specified by design; not subject to production test. Data Sheet 6 Rev. 1.0, 2011-02-24 IFX 1117 Characteristics Adjustable Output Voltage Device IFX1117ME V 0 °C < Tj < 125 °C; VI = 5 V, IQ = 10 mA; unless otherwise specified. Parameter Symbol Limit Values min. typ. Unit Measuring Conditions max. Reference voltage VQ 1.22 5 1.250 1.27 0 V 10 mA ≤ IQ ≤ 800 mA; 1.4 V ≤ (VI-VQ) ≤ 10 V Output voltage VQ – 1.250 – V 10 mA ≤ IQ ≤ 1000 mA; 2.65 V ≤ VI ≤ 15 V Line regulation ΔVQ – 0.035 0.2 %1) 1.5 V ≤(VI-VQ)≤ 13.75 V Load regulation ΔVQ – 0.2 0.4 %1) 10 mA ≤ IQ ≤ 800 mA;2) – 0.25 – %1) 10 mA ≤ IQ ≤ 1.0 A 2) VDR VDR VDR VDR Iq – 1.00 1.10 V – 1.05 1.15 V – 1.10 1.20 V – 1.30 1.40 V – 1.7 5.0 mA IQ = 100 mA 3) IQ = 500 mA 3) IQ = 800 mA 3) IQ = 1.0 A 3) VI = 15 V Adjust Current IADJ – 100 120 µA Adjust Current Change ΔIADJ – 2 5 µA IQ = 10 mA 1.4 V ≤(VI-VQ)≤ 13.6 V; 10 mA ≤ IQ ≤ 800 mA Temperature stability ΔVQ – 0.5 – %1) 5) – 1) 5) Drop voltage Drop voltage Drop voltage Drop voltage Minimum Load Current 4) Long Term Stability – – 0.3 % Current limit IQmax 1100 – 2250 mA RMS Output Noise – – 30 – ppm Power Supply Ripple Rejection PSRR 65 70 – dB VQ = 0.5 V ppm of VQ, Tj = 25 °C 10 Hz ≤ f ≤ 10 kHz 5) fr = 120 Hz, Vr = 1 VPP 5) 1) Related to VQ 2) Measured at constant junction temperature 3) Drop voltage measured when the output voltage has dropped 100 mV from the nominal value obtained at VI = 5.0 V. 4) Minimum load current required to maintain regulation 5) Specified by design; not subject to production test. Data Sheet 7 Rev. 1.0, 2011-02-24 IFX 1117 IFX1117ME V33 II VI CI I 3 2 IQ Q CQ 100 nF VQ 1 GND IGND AES02937_1117 Figure 4 Measuring Circuit Application Information IFX1117ME V33 I VI CI1 3 2 Q CI2 VQ CQ2 1 GND AES02816_1117 Figure 5 Data Sheet Typical Application Circuit IFX1117ME V33 8 Rev. 1.0, 2011-02-24 IFX 1117 Output The IFX1117 requires a 10 μF output capacitor with ESR ≤ 20 Ω for the stability of the regulation loop. The use of a tantalum output capacitor is recommended. For the adjustable device IFX1117ME V the output voltage level can be defined by a voltage divider between Q, ADJ and GND. The output voltage calculates: R V Q = V REF × ⎛⎝ 1 + -----2-⎞⎠ + I ADJ × R 2 R1 (1) At the input of the regulator a capacitor is recommended to compensate line influences. As a minimum a 100 nF ceramic input capacitor should be used. If the regulator is used in an environment with long input lines an input capacitance of 10 μF is suggested. IFX1117ME V I VI CI1 3 2 Q CI2 VQ CQ2 R1 1 ADJ VQ - VADJ = VREF IADJ R2 CADJ AES02815_1117 Figure 6 Data Sheet Typical Application Circuit IFX1117ME V 9 Rev. 1.0, 2011-02-24 IFX 1117 Typical Performance Characteristics Output Voltage VQ versus Junction Temperature T j Dropout Voltage Vdr versus Output Current IQ VQ-TJ.VSD VDR-IQ.VSD 1300 ΔV Q [%] Vdr [mV] 1.0 1100 I Q = 10 mA T j = 25 °C 0.0 1000 Tj = 125 °C -1.0 900 -2.0 800 0 25 50 75 100 125 150 0 200 400 600 Tj [°C] 800 I Q [mA] Dropout Voltage Vdr versus Junction Temperature Tj Maximum Output Current IQ versus Junction Temperature Tj VDR-TJ.VSD 1300 IQMAX-TJ.VSD 2.2 I Q [A] Vdr [mV] 1100 1.8 VQ = 0.5 V I Q = 800 mA I Q = 500 mA 1000 1.6 I Q = 100 mA 900 1.4 800 1.2 0 25 50 75 100 125 1.0 150 0 T j [°C] Data Sheet 10 25 50 75 100 125 150 T j [°C] Rev. 1.0, 2011-02-24 IFX 1117 Typical Performance Characteristics Adjust Pin Current IADJ versus Junction Temperature Tj Power Supply Ripple Rejection PSRR versus Frequency f IADJ.VSD PSRR.VSD 80 IFX1117 ME V VI = 5 V I A DJ [µA] PSRR 88 60 84 50 80 40 76 30 [dB] 0 25 50 75 100 IFX1117 ME V33 VI = 8 V VRIPPLE = 1 V I Q = 10 mA CQ = 10 µF Tantalum 10 125 T j [°C] IFX1117 ME V33 VI = 5 V 100 10k 1k 100k f [Hz] Region of Stability Version ME V33 Region of Stability Version ME V V33_ESR-IQ.VSD V_ESR-IQ.VSD ESR CQ [Ω ] ESR CQ [Ω ] C Q = 10 µF 10 Stable Region 1 C Q = 10 µF 10 Stable Region 1 T j = 125 °C 0.1 0.1 T j = 125 °C T j = 25°C T j = 25°C 0.01 0 40 80 120 0.01 160 I Q [mA] Data Sheet 0 40 80 120 160 I Q [mA] 11 Rev. 1.0, 2011-02-24 IFX 1117 Typical Performance Characteristics Load Transient Response Version ME V33 Line Transient Response Version ME V33 V33_dVQ-dIQ.vsd V33_dVQ-dVI.vsd ΔVQ Δ VQ 50 50 [mV] [mV] 0 0 -50 -50 VI = 5 V CQ = 10 µF Tantalum -100 IQ = 100 mA CQ = 10 µF Tantalum Ι Q [A] VI [V] 0.6 5.75 0.1 4.75 0 20 40 60 80 0 20 40 60 t [µs] 80 t [µs] Load Transient Response Version ME V Line Transient Response Version ME V V_dVQ-dIQ.vsd V_dVQ-dVI.vsd ΔVQ ΔV Q 3 3 0 0 [%] [%] -3 -3 VI - V Q = 3 V CQ = 10 µF Tantalum -6 -6 I Q = 100 mA C Q = 10 µF Tantalum VI - VQ [V] Ι Q [A] 0.6 3.5 0.1 2.5 0 20 40 60 0 80 t [µs] Data Sheet 20 40 60 80 t [µs] 12 Rev. 1.0, 2011-02-24 IFX 1117 Package Outline 1.6±0.1 6.5 ±0.2 3 ±0.1 A 0.1 MAX. B 1 0.25 M A 2 3 3.5 ±0.2 0.5 MIN. 7 ±0.3 4 2.3 0.7 ±0.1 4.6 0.28 ±0.04 0.25 M B 0...10˚ SOT223-PO V04 4 1.4 1.7 4.8 4.8 1.4 1.7 3.5 1.2 1.1 1.4 0.9 SOT223-FPW V04 SOT223-FPR V04 Footprint Wave Soldering Footprint Reflow Soldering Figure 7 Outline and footprint PG-SOT223 Green Product (RoHS-Compliant) To meet the world-wide customer requirements for environmentally friendly products and to be compliant with government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020). You can find all of our packages, sorts of packing and others in our Infineon Internet Page “Products”: http://www.infineon.com/products. Dimensions in mm SMD = Surface Mounted Device Data Sheet 13 Rev. 1.0, 2011-02-24 IFX 1117 Revision History Version Date Rev. 1.0 2011-02-24 Data Sheet Data Sheet Changes 14 2011-02-24 Edition 2011-02-24 Published by Infineon Technologies AG 81726 Munich, Germany © 2011 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. The Infineon Technologies component described in this Data Sheet may be used in life-support devices or systems and/or automotive, aviation and aerospace applications or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support automotive, aviation and aerospace device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.