IHW30N160R2FKSA1

IHW30N160R2 Soft Switching Series TrenchStop® Reverse Conducting (RC-)IGBT with monolithic body diode Features: • Powerful monolithic Body Diode with very low forward voltage • Body diode clamps negative voltages • Trench and Fieldstop technology for 1600 V applications offers : - very tight parameter distribution - high ruggedness, temperature stable behavior • NPT technology offers easy parallel switching capability due to positive temperature coefficient in VCE(sat) • Low EMI • Qualified according to JEDEC1 for target applications • Pb-free lead plating; RoHS compliant • Complete product spectrum and PSpice Models : http://www.infineon.com/igbt/ C G E PG-TO-247-3 Applications: • Inductive Cooking • Soft Switching Applications VCE IC VCE(sat),Tj=25°C Tj,max Marking Package 1600V 30A 1.8V 175°C H30R1602 PG-TO-247-3 Type IHW30N160R2 Maximum Ratings Parameter Symbol Value Collector-emitter voltage VCE 1600 DC collector current TC = 25°C TC = 100°C IC Pulsed collector current, tp limited by Tjmax ICpuls 90 Turn off safe operating area (VCE ≤ 1600V, Tj ≤ 175°C) - 90 Diode forward current IF 60 TC = 100°C 30 IFpuls Diode surge non repetitive current, tp limited by Tjmax TC = 25°C, tp = 10ms, sine halfwave TC = 25°C, tp ≤ 2.5µs, sine halfwave TC = 100°C, tp ≤ 2.5µs, sine halfwave IFSM Gate-emitter voltage VGE Transient Gate-emitter voltage (tp < 10 µs, D < 0.01) V 60 30 TC = 25°C Diode pulsed current, tp limited by Tjmax A 90 50 130 120 ±20 V ±25 Power dissipation TC = 25°C Ptot Operating junction temperature Tj -40...+175 Storage temperature Tstg -55...+175 Soldering temperature, 1.6mm (0.063 in.) from case for 10s - 1 Unit 312 W °C 260 J-STD-020 and JESD-022 Power Semiconductors 1 Rev. 2.1 Nov 09 IHW30N160R2 Soft Switching Series Thermal Resistance Parameter Symbol Conditions Max. Value Unit Characteristic IGBT thermal resistance, RthJC 0.48 RthJCD 0.48 junction – case Diode thermal resistance, K/W junction – case Thermal resistance, RthJA 40 junction – ambient Electrical Characteristic, at Tj = 25 °C, unless otherwise specified Parameter Symbol Conditions Value min. Typ. max. 1600 - - T j = 25°C - 1.8 2.1 T j = 150 °C - 2.25 - T j = 175 °C - 2.35 - Unit Static Characteristic Collector-emitter breakdown voltage V ( B R ) C E S V G E = 0 V , I C =500 µA Collector-emitter saturation voltage VCE(sat) Diode forward voltage VF V G E = 15 V, I C =30A V VGE=0V, IF=30A T j = 25°C - 1.65 2.0 T j = 150 °C - 2.0 - T j = 175 °C - 2.0 - 5.1 5.8 6.4 T j = 25°C - - 5 T j = 175 °C - - 2500 Gate-emitter threshold voltage VGE(th) I C =0 .75mA, V C E =V G E Zero gate voltage collector current ICES V C E = 16 00 V , VGE=0V µA Gate-emitter leakage current IGES V C E = 0 V , V G E =20V - - 100 nA Transconductance gfs V C E =20V, I C =30A - 22.5 - S Integrated gate resistor RGint Power Semiconductors none 2 Rev. 2.1 Ω Nov 09 IHW30N160R2 Soft Switching Series Dynamic Characteristic Input capacitance Ciss V C E =25V, - 2740 - Output capacitance Coss VGE=0V, - 68.1 - Reverse transfer capacitance Crss f=1MHz - 58.7 - Gate charge QGate V C C = 12 80 V, I C =30A;V G E = 1 5 V - 94 - Internal emitter inductance LE - 13 - measured 5mm (0.197 in.) from case pF nC nH Switching Characteristic, Inductive Load, at Tj=25 °C Parameter Symbol Conditions Value min. typ. max. - 525 - - 38.3 - - - - Unit IGBT Characteristic Turn-off delay time td(off) Fall time tf Turn-on energy Eon Turn-off energy Eoff - 2.53 - Total switching energy Ets - 2.53 - T j = 25°C , V C C = 60 0 V, I C =30A V G E =0 /1 5V, R G = 1 0Ω ns mJ Switching Characteristic, Inductive Load, at Tj=175 °C Parameter Symbol Conditions Value min. Typ. max. - 564 - - 111 - - - - Unit IGBT Characteristic T j = 175 °C V C C = 60 0 V, I C =30A, V G E = 0 /1 5V, R G = 1 0Ω Turn-off delay time td(off) Fall time tf Turn-on energy Eon Turn-off energy Eoff - 4.37 - Total switching energy Ets - 4.37 - Power Semiconductors 3 Rev. 2.1 ns mJ Nov 09 IHW30N160R2 Soft Switching Series tp=1µs 10µs 20µs TC=80°C IC, COLLECTOR CURRENT IC, COLLECTOR CURRENT 80A TC=110°C 60A 40A Ic 20A 0A 10Hz 500µs 1A 5ms 100Hz 1kHz 10kHz 0.1A 1V 100kHz 250W 40A IC, COLLECTOR CURRENT 50A 200W 150W 100W 50W 50°C 75°C 100°C 125°C 100V 1000V 30A 20A 10A 0A 25°C 150°C TC, CASE TEMPERATURE Figure 3. Power dissipation as a function of case temperature (Tj ≤ 175°C) Power Semiconductors 10V VCE, COLLECTOR-EMITTER VOLTAGE Figure 2. IGBT Safe operating area (D = 0, TC = 25°C, Tj ≤175°C;VGE=15V) 300W 0W 25°C 50µs DC f, SWITCHING FREQUENCY Figure 1. Collector current as a function of switching frequency for hard switching (turn-off) (Tj ≤ 175°C, D = 0.5, VCE = 600V, VGE = 0/+15V, RG = 10Ω) Ptot, DISSIPATED POWER 10A 50°C 75°C 100°C 125°C 150°C TC, CASE TEMPERATURE Figure 4. DC Collector current as a function of case temperature (VGE ≥ 15V, Tj ≤ 175°C) 4 Rev. 2.1 Nov 09 IHW30N160R2 Soft Switching Series 80A 70A VGE=20V 60A 15V IC, COLLECTOR CURRENT IC, COLLECTOR CURRENT 80A 13V 50A 11V 9V 40A 7V 30A 20A VGE=20V 60A 13V 0V 3V 80A 70A 60A 50A 40A 30A TJ=175°C 25°C 10A 0V 2V 4V 6V 8V 10V VGE, GATE-EMITTER VOLTAGE Figure 7. Typical transfer characteristic (VCE=20V) Power Semiconductors 1V 2V 3V VCE, COLLECTOR-EMITTER VOLTAGE Figure 6. Typical output characteristic (Tj = 175°C) VCE(sat), COLLECTOR-EMITT SATURATION VOLTAGE VCE, COLLECTOR-EMITTER VOLTAGE Figure 5. Typical output characteristic (Tj = 25°C) 0A 7V 20A 0A 20A 9V 30A 0A 2V 11V 40A 10A 1V 15V 50A 10A 0V IC, COLLECTOR CURRENT 70A IC=60A 3.0V 2.5V 2.0V IC=30A 1.5V IC=15A 1.0V 0.5V 0.0V 0°C 50°C 100°C 150°C TJ, JUNCTION TEMPERATURE Figure 8. Typical collector-emitter saturation voltage as a function of junction temperature (VGE =15V) 5 Rev. 2.1 Nov 09 IHW30N160R2 Soft Switching Series td(off) 1000ns t, SWITCHING TIMES t, SWITCHING TIMES td(off) 100ns tf tf 100ns 10ns 0A 10A 20A 30A 40A 50A 60A 10Ω 70A IC, COLLECTOR CURRENT Figure 9. Typical switching times as a function of collector current (inductive load, TJ=175°C, VCE=600V, VGE=0/15V, RG=10Ω, Dynamic test circuit in Figure E) 20Ω 30Ω 40Ω 50Ω 60Ω 70Ω RG, GATE RESISTOR Figure 10. Typical switching times as a function of gate resistor (inductive load, TJ=175°C, VCE=600V, VGE=0/15V, IC=30A, Dynamic test circuit in Figure E) VGE(th), GATE-EMITT TRSHOLD VOLTAGE t, SWITCHING TIMES td(off) tf 100ns 10ns 25°C 50°C 75°C 100°C 125°C max. 5V typ. 4V min. 3V 2V -50°C 150°C TJ, JUNCTION TEMPERATURE Figure 11. Typical switching times as a function of junction temperature (inductive load, VCE=600V, VGE=0/15V, IC=30A, RG=10Ω, Dynamic test circuit in Figure E) Power Semiconductors 6V 0°C 50°C 100°C TJ, JUNCTION TEMPERATURE Figure 12. Gate-emitter threshold voltage as a function of junction temperature (IC = 0.15mA) 6 Rev. 2.1 Nov 09 IHW30N160R2 Soft Switching Series Eoff E, SWITCHING ENERGY LOSSES E, SWITCHING ENERGY LOSSES 7.0mJ 6.0mJ Eoff 5.0mJ 4.0mJ 3.0mJ 2.0mJ 6.0mJ 5.0mJ 1.0mJ 4.0mJ 0.0mJ 0A 10A 20A 30A 40A 10Ω 50A IC, COLLECTOR CURRENT Figure 13. Typical turn-off energy as a function of collector current (inductive load, TJ=175°C, VCE=600V, VGE=0/15V, RG=10Ω, Dynamic test circuit in Figure E) 30Ω 40Ω 50Ω 60Ω 70Ω 80Ω RG, GATE RESISTOR Figure 14. Typical turn-off energy as a function of gate resistor (inductive load, TJ=175°C, VCE=600V, VGE=0/15V, IC=30A, Dynamic test circuit in Figure E) Eoff 7.5mJ E, SWITCHING ENERGY LOSSES 4.0mJ E, SWITCHING ENERGY LOSSES 20Ω 3.5mJ 3.0mJ 2.5mJ Eoff 7.0mJ 6.5mJ 6.0mJ 5.5mJ 5.0mJ 4.5mJ 2.0mJ 25°C 50°C 75°C 4.0mJ 600V 100°C 125°C 150°C TJ, JUNCTION TEMPERATURE Figure 15. Typical turn-off energy as a function of junction temperature (inductive load, VCE=600V, VGE=0/15V, IC=30A, RG=10Ω, Dynamic test circuit in Figure E) Power Semiconductors 700V 800V 900V 1000V 1100V VCE, COLLECTOR-EMITTER VOLTAGE Figure 16. Typical turn-off energy as a function of collector emitter voltage (inductive load, TJ=175°C, VGE=0/15V, IC=30A, RG=10Ω, Dynamic test circuit in Figure E) 7 Rev. 2.1 Nov 09 IHW30N160R2 Soft Switching Series Ciss 320V 1nF 1280V c, CAPACITANCE VGE, GATE-EMITTER VOLTAGE 15V 10V 5V 0V 100pF Coss Crss 0nC 25nC 50nC 75nC 100nC 125nC 0V QGE, GATE CHARGE Figure 17. Typical gate charge (IC=30 A) 10V 20V VCE, COLLECTOR-EMITTER VOLTAGE Figure 18. Typical capacitance as a function of collector-emitter voltage (VGE=0V, f = 1 MHz) -1 10 K/W ZthJC, TRANSIENT THERMAL RESISTANCE ZthJC, TRANSIENT THERMAL RESISTANCE D=0.5 0.2 0.1 0.05 0.02 R,(K/W) 0.2 0.1514 0.1284 0.01 -2 10 K/W τ, (s) -1 1.51*10 -2 1.14*10 -4 8.98*10 R1 R2 single pulse C1= τ1/R1 C2= τ2/R2 -1 10 K/W 0.2 0.1 0.05 0.02 100µs 1ms 10ms 100ms 1s tP, PULSE WIDTH Figure 19. IGBT transient thermal resistance (D = tp / T) Power Semiconductors τ, (s) -2 5.49*10 -3 7.70*10 -4 6.83*10 -5 1.94*10 R1 single pulse -2 10µs R,(K/W) 0.1385 0.1354 0.1176 0.087 R2 0.01 10 K/W -3 10 K/W D=0.5 1µs 10µs 100µs C1=τ1/R1 1ms C2=τ2/R2 10ms 100ms tP, PULSE WIDTH Figure 20. Diode transient thermal impedance as a function of pulse width (D=tP/T) 8 Rev. 2.1 Nov 09 IHW30N160R2 Soft Switching Series 50A VF, FORWARD VOLTAGE IF, FORWARD CURRENT 60A 40A TJ=25°C 30A 175°C 20A IF=60A 2.0V 30A 15A 1.5V 1.0V 0.5V 10A 0A 2.5V 0.0V 0.0V 0.5V 1.0V 1.5V 2.0V 2.5V VF, FORWARD VOLTAGE Figure 21. Typical diode forward current as a function of forward voltage Power Semiconductors 9 0°C 50°C 100°C 150°C TJ, JUNCTION TEMPERATURE Figure 22. Typical diode forward voltage as a function of junction temperature Rev. 2.1 Nov 09 IHW30N160R2 Soft Switching Series Power Semiconductors 10 Rev. 2.1 Nov 09 IHW30N160R2 Soft Switching Series i,v tr r =tS +tF diF /dt Qr r =QS +QF IF tS QS Ir r m tr r tF 10% Ir r m QF dir r /dt 90% Ir r m t VR Figure C. Definition of diodes switching characteristics τ1 τ2 r1 r2 τn rn Tj (t) p(t) r1 r2 rn Figure A. Definition of switching times TC Figure D. Thermal equivalent circuit Figure E. Dynamic test circuit Figure B. Definition of switching losses Power Semiconductors 11 Rev. 2.1 Nov 09 IHW30N160R2 Soft Switching Series Published by Infineon Technologies AG 81726 Munich, Germany © 2008 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Power Semiconductors 12 Rev. 2.1 Nov 09