IGBT
IGBTwithintegrateddiodeinpackagesofferingspacesavingadvantage
IKD10N60RFA
TRENCHSTOPTMRC-Seriesforhardswitchingapplicationsupto30kHz
Datasheet
IndustrialPowerControl
IKD10N60RFA
TRENCHSTOPTMRC-DrivesFastSeries
IGBTwithintegrateddiodeinpackagesofferingspacesavingadvantage
Features:
C
TRENCHSTOPTMReverseConducting(RC)technologyfor600V
applicationsoffering
•OptimizedEon,EoffandQrrforlowswitchinglosses
•Operatingrangeof4to30kHz
•SmoothswitchingperformanceleadingtolowEMIlevels
•Verytightparameterdistribution
•Maximumjunctiontemperature175°C
•Shortcircuitcapabilityof5µs
•Bestinclasscurrentversuspackagesizeperformance
•QualifiedaccordingtoAEC-Q101
•Pb-freeleadplating;RoHScompliant(soldertemperature
260°C,MSL1)
G
E
C
CompleteproductspectrumandPSpiceModels:
http://www.infineon.com/igbt/
G
E
Applications:
•Smalldrives
•Piezoinjection
•Automotivelighting/HID
KeyPerformanceandPackageParameters
Type
IKD10N60RFA
VCE
IC
VCEsat,Tvj=25°C
Tvjmax
Marking
Package
600V
10A
2.2V
175°C
K10DRFA
PG-TO252-3
2
Rev.2.1,2014-12-15
IKD10N60RFA
TRENCHSTOPTMRC-DrivesFastSeries
TableofContents
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Thermal Resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Electrical Characteristics Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Package Drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15
Testing Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
Disclaimer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
3
Rev.2.1,2014-12-15
IKD10N60RFA
TRENCHSTOPTMRC-DrivesFastSeries
MaximumRatings
Foroptimumlifetimeandreliability,Infineonrecommendsoperatingconditionsthatdonotexceed80%ofthemaximumratingsstatedinthisdatasheet.
Parameter
Symbol
Value
Unit
Collector-emittervoltage,Tvj≥25°C
VCE
600
V
DCcollectorcurrent,limitedbyTvjmax
TC=25°C
TC=100°C
IC
20.0
10.0
A
Pulsedcollectorcurrent,tplimitedbyTvjmax1)
ICpuls
30.0
A
Turn off safe operating area
VCE≤600V,Tvj≤175°C,tp=1µs1)
-
30.0
A
Diodeforwardcurrent,limitedbyTvjmax
TC=25°C
TC=100°C
IF
20.0
10.0
A
Diodepulsedcurrent,tplimitedbyTvjmax1)
IFpuls
30.0
A
Gate-emitter voltage
VGE
±20
V
Short circuit withstand time
VGE=15.0V,VCC≤400V
Allowed number of short circuits < 1000
Time between short circuits: ≥ 1.0s
Tvj=150°C
tSC
PowerdissipationTC=25°C
Ptot
150.0
W
Operating junction temperature
Tvj
-40...+175
°C
Storage temperature
Tstg
-55...+150
°C
µs
5
Soldering temperature,
reflow soldering (MSL1 according to JEDEC J-STA-020)
°C
260
ThermalResistance
Parameter
Characteristic
Symbol Conditions
Max.Value
Unit
IGBT thermal resistance,2)
junction - case
Rth(j-c)
1.00
K/W
Diode thermal resistance,3)
junction - case
Rth(j-c)
2.60
K/W
Thermal resistance, min. footprint
junction - ambient
Rth(j-a)
75
K/W
Thermal resistance, 6cm² Cu on
PCB
junction - ambient
Rth(j-a)
50
K/W
1)
2)
3)
Defined by design. Not subject to production test.
Rth/Zth based on single cooling pulse. Please be aware that a correct Rth measurement of the IGBT, is not possible using a thermocouple.
Rth/Zth based on single cooling pulse. Please be aware that a correct Rth measurement of the Diode, is not possible using a thermocouple.
4
Rev.2.1,2014-12-15
IKD10N60RFA
TRENCHSTOPTMRC-DrivesFastSeries
ElectricalCharacteristic,atTvj=25°C,unlessotherwisespecified
Parameter
Symbol Conditions
Value
Unit
min.
typ.
max.
600
-
-
V
VGE=15.0V,IC=10.0A
Tvj=25°C
Tvj=175°C
-
2.20
2.30
2.50
-
V
-
2.10
2.00
2.40
-
V
4.3
5.0
5.7
V
StaticCharacteristic
Collector-emitter breakdown voltage V(BR)CES VGE=0V,IC=0.20mA
Collector-emitter saturation voltage VCEsat
Diode forward voltage
VF
VGE=0V,IF=10.0A
Tvj=25°C
Tvj=175°C
Gate-emitter threshold voltage
VGE(th)
IC=0.17mA,VCE=VGE
Zero gate voltage collector current
ICES
VCE=600V,VGE=0V
Tvj=25°C
Tvj=175°C
-
440.0
40.0
-
µA
Gate-emitter leakage current
IGES
VCE=0V,VGE=20V
-
-
100
nA
Transconductance
gfs
VCE=10V,IC=10.0A
-
4.6
-
S
Integrated gate resistor
rG
1)
Ω
none
ElectricalCharacteristic,atTvj=25°C,unlessotherwisespecified
Parameter
Symbol Conditions
Value
Unit
min.
typ.
max.
-
655
-
-
37
-
-
22
-
-
64.0
-
nC
-
7.0
-
nH
-
A
DynamicCharacteristic
Input capacitance
Cies
Output capacitance
Coes
Reverse transfer capacitance
Cres
Gate charge
QG
Internal emitter inductance
measured 5mm (0.197 in.) from
case
LE
Short circuit collector current
Max. 1000 short circuits
IC(SC)
Time between short circuits: ≥ 1.0s
1)
VCE=25V,VGE=0V,f=1MHz
VCC=480V,IC=10.0A,
VGE=15V
VGE=15.0V,VCC≤400V,
tSC≤5µs
Tvj=25°C
-
74
pF
TypicalvalueoftransconductancedeterminedatTvj=175°C.
5
Rev.2.1,2014-12-15
IKD10N60RFA
TRENCHSTOPTMRC-DrivesFastSeries
SwitchingCharacteristic,InductiveLoad
Parameter
Symbol Conditions
Value
Unit
min.
typ.
max.
-
12
-
ns
-
15
-
ns
-
168
-
ns
-
18
-
ns
-
0.19
-
mJ
IGBTCharacteristic,atTvj=25°C
Turn-on delay time
td(on)
Rise time
tr
Turn-off delay time
td(off)
Fall time
tf
Turn-on energy
Eon
Turn-off energy
Eoff
-
0.16
-
mJ
Total switching energy
Ets
-
0.35
-
mJ
-
72
-
ns
-
0.27
-
µC
-
9.1
-
A
-
-146
-
A/µs
Tvj=25°C,
VCC=400V,IC=10.0A,
VGE=0.0/15.0V,
RG(on)=26.0Ω,RG(off)=26.0Ω,
Lσ=50nH,Cσ=30pF
Lσ,CσfromFig.E
DiodeCharacteristic,atTvj=25°C
Diode reverse recovery time
trr
Diode reverse recovery charge
Qrr
Diode peak reverse recovery current Irrm
Diode peak rate of fall of reverse
recoverycurrentduringtb
Tvj=25°C,
VR=400V,
IF=10.0A,
diF/dt=750A/µs
dirr/dt
SwitchingCharacteristic,InductiveLoad
Parameter
Symbol Conditions
Value
Unit
min.
typ.
max.
-
12
-
ns
-
15
-
ns
-
178
-
ns
-
20
-
ns
-
0.31
-
mJ
IGBTCharacteristic,atTvj=175°C
Turn-on delay time
td(on)
Rise time
tr
Turn-off delay time
td(off)
Fall time
tf
Turn-on energy
Eon
Turn-off energy
Eoff
-
0.21
-
mJ
Total switching energy
Ets
-
0.52
-
mJ
-
112
-
ns
-
0.62
-
µC
-
12.9
-
A
-
-136
-
A/µs
Tvj=175°C,
VCC=400V,IC=10.0A,
VGE=0.0/15.0V,
RG(on)=26.0Ω,RG(off)=26.0Ω,
Lσ=50nH,Cσ=30pF
Lσ,CσfromFig.E
DiodeCharacteristic,atTvj=175°C
Diode reverse recovery time
trr
Diode reverse recovery charge
Qrr
Diode peak reverse recovery current Irrm
Diode peak rate of fall of reverse
recoverycurrentduringtb
Tvj=175°C,
VR=400V,
IF=10.0A,
diF/dt=720A/µs
dirr/dt
6
Rev.2.1,2014-12-15
IKD10N60RFA
TRENCHSTOPTMRC-DrivesFastSeries
10
9
IC,COLLECTORCURRENT[A]
IC,COLLECTORCURRENT[A]
8
7
6
5
4
3
10
not for linear use
1
2
1
0
0.1
1
10
0.1
100
1
f,SWITCHINGFREQUENCY[kHz]
10
100
1000
VCE,COLLECTOR-EMITTERVOLTAGE[V]
Figure 1. Collectorcurrentasafunctionofswitching
frequency
(Tvj≤175°C,Ta=55°C,D=0.5,VCE=400V,
VGE=15/0V,rG=26Ω,PCBmountingwith
thermal vias and heatsink, see Appnote:
www.infineon.com/igbt)
Figure 2. Forwardbiassafeoperatingarea
(D=0,TC=25°C,Tvj≤175°C,VGE=15V,tp=1µs)
160
20
140
120
IC,COLLECTORCURRENT[A]
Ptot,POWERDISSIPATION[W]
18
100
80
60
40
16
14
12
10
8
6
4
20
0
2
25
50
75
100
125
150
0
175
TC,CASETEMPERATURE[°C]
0
25
50
75
100
125
150
175
TC,CASETEMPERATURE[°C]
Figure 3. Powerdissipationasafunctionofcase
temperature
(Tvj≤175°C)
Figure 4. Collectorcurrentasafunctionofcase
temperature
(VGE≥15V,Tvj≤175°C)
7
Rev.2.1,2014-12-15
IKD10N60RFA
TRENCHSTOPTMRC-DrivesFastSeries
30
30
VGE = 20V
VGE = 20V
17V
25
17V
25
15V
IC,COLLECTORCURRENT[A]
IC,COLLECTORCURRENT[A]
15V
13V
20
11V
9V
15
7V
10
5
0
13V
20
11V
9V
15
7V
10
5
0
1
2
3
0
4
0
VCE,COLLECTOR-EMITTERVOLTAGE[V]
Figure 5. Typicaloutputcharacteristic
(Tvj=25°C)
3
4
4.0
VCEsat,COLLECTOR-EMITTERSATURATION[V]
Tj = 25°C
Tj = 175°C
25
IC,COLLECTORCURRENT[A]
2
Figure 6. Typicaloutputcharacteristic
(Tvj=175°C)
30
20
15
10
5
0
1
VCE,COLLECTOR-EMITTERVOLTAGE[V]
4
6
8
10
12
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
14
VGE,GATE-EMITTERVOLTAGE[V]
IC = 1A
IC = 5A
IC = 10A
IC = 20A
0
25
50
75
100
125
150
175
Tvj,JUNCTIONTEMPERATURE[°C]
Figure 7. Typicaltransfercharacteristic
(VCE=10V)
Figure 8. Typicalcollector-emittersaturationvoltageas
afunctionofjunctiontemperature
(VGE=15V)
8
Rev.2.1,2014-12-15
IKD10N60RFA
TRENCHSTOPTMRC-DrivesFastSeries
1000
td(off)
tf
td(on)
tr
td(off)
tf
td(on)
tr
t,SWITCHINGTIMES[ns]
t,SWITCHINGTIMES[ns]
100
10
1
5.0
7.5
10.0
12.5
15.0
17.5
100
10
1
20.0
0
10
20
IC,COLLECTORCURRENT[A]
30
40
50
60
70
80
90 100 110
rG,GATERESISTOR[Ω]
Figure 9. Typicalswitchingtimesasafunctionof
collectorcurrent
(inductiveload,Tvj=175°C,VCE=400V,
VGE=15/0V,rG=26Ω,Dynamictestcircuitin
Figure E)
Figure 10. Typicalswitchingtimesasafunctionofgate
resistor
(inductiveload,Tvj=175°C,VCE=400V,
VGE=15/0V,IC=10A,Dynamictestcircuitin
Figure E)
7
VGE(th),GATE-EMITTERTHRESHOLDVOLTAGE[V]
t,SWITCHINGTIMES[ns]
td(off)
tf
td(on)
tr
100
10
25
50
75
100
125
150
6
5
4
3
2
1
175
Tvj,JUNCTIONTEMPERATURE[°C]
Figure 11. Typicalswitchingtimesasafunctionof
junctiontemperature
(inductiveload,VCE=400V,VGE=15/0V,
IC=10A,rG=26Ω,Dynamictestcircuitin
Figure E)
typ.
min.
max.
25
50
75
100
125
150
175
Tvj,JUNCTIONTEMPERATURE[°C]
Figure 12. Gate-emitterthresholdvoltageasafunction
ofjunctiontemperature
(IC=0,17mA)
9
Rev.2.1,2014-12-15
IKD10N60RFA
TRENCHSTOPTMRC-DrivesFastSeries
1.0
1.0
Eoff
Eon
Ets
E,SWITCHINGENERGYLOSSES[mJ]
E,SWITCHINGENERGYLOSSES[mJ]
Eoff
Eon
Ets
0.8
0.6
0.4
0.2
0.0
5.0
7.5
10.0
12.5
15.0
17.5
0.8
0.6
0.4
0.2
0.0
20.0
10
20
IC,COLLECTORCURRENT[A]
Figure 13. Typicalswitchingenergylossesasa
functionofcollectorcurrent
(inductiveload,Tvj=175°C,VCE=400V,
VGE=15/0V,rG=26Ω,Dynamictestcircuitin
Figure E)
40
50
60
70
80
Figure 14. Typicalswitchingenergylossesasa
functionofgateresistor
(inductiveload,Tvj=175°C,VCE=400V,
VGE=15/0V,IC=10A,Dynamictestcircuitin
Figure E)
0.6
0.8
Eoff
Eon
Ets
0.7
0.5
E,SWITCHINGENERGYLOSSES[mJ]
E,SWITCHINGENERGYLOSSES[mJ]
30
rG,GATERESISTOR[Ω]
0.4
0.3
0.2
0.1
Eoff
Eon
Ets
0.6
0.5
0.4
0.3
0.2
0.1
0.0
25
50
75
100
125
150
0.0
300
175
Tvj,JUNCTIONTEMPERATURE[°C]
Figure 15. Typicalswitchingenergylossesasa
functionofjunctiontemperature
(inductiveload,VCE=400V,VGE=15/0V,
IC=10A,rG=26Ω,Dynamictestcircuitin
Figure E)
325
350
375
400
425
450
VCE,COLLECTOR-EMITTERVOLTAGE[V]
10
Figure 16. Typicalswitchingenergylossesasa
functionofcollectoremittervoltage
(inductiveload,Tvj=175°C,VGE=15/0V,
IC=10A,rG=26Ω,Dynamictestcircuitin
Figure E)
Rev.2.1,2014-12-15
IKD10N60RFA
TRENCHSTOPTMRC-DrivesFastSeries
16
1000
VCC=120V
VCC=480V
Cies
Coes
Cres
12
C,CAPACITANCE[pF]
VGE,GATE-EMITTERVOLTAGE[V]
14
10
8
6
100
4
2
0
0
10
20
30
40
50
60
10
70
0
QGE,GATECHARGE[nC]
Figure 17. Typicalgatecharge
(IC=10A)
15
20
25
30
12
140
tSC,SHORTCIRCUITWITHSTANDTIME[µs]
IC(SC),SHORTCIRCUITCOLLECTORCURRENT[A]
10
Figure 18. Typicalcapacitanceasafunctionof
collector-emittervoltage
(VGE=0V,f=1MHz)
160
120
100
80
60
40
20
0
5
VCE,COLLECTOR-EMITTERVOLTAGE[V]
12
14
16
18
10
8
6
4
2
0
20
VGE,GATE-EMITTERVOLTAGE[V]
10
11
12
13
14
15
16
17
18
19
VGE,GATE-EMITTERVOLTAGE[V]
Figure 19. Typicalshortcircuitcollectorcurrentasa
functionofgate-emittervoltage
(VCE≤400V,startatTvj=25°C)
Figure 20. Shortcircuitwithstandtimeasafunctionof
gate-emittervoltage
(VCE≤400V,startatTvj=150°C)
11
Rev.2.1,2014-12-15
IKD10N60RFA
TRENCHSTOPTMRC-DrivesFastSeries
Zth(j-c),TRANSIENTTHERMALIMPEDANCE[K/W]
Zth(j-c),TRANSIENTTHERMALIMPEDANCE[K/W]
1
D = 0.5
0.2
0.1
0.05
0.02
0.1
0.01
single pulse
i:
1
2
3
4
ri[K/W]: 0.0972 0.4393 0.3919 0.0443
τi[s]:
1.1E-4 4.5E-4 2.0E-3 0.03487
0.01
1E-7
1E-6
1E-5
1E-4
0.001
0.01
0.1
1
D = 0.5
0.2
0.1
0.05
0.02
0.01
0.1
i:
1
2
3
4
ri[K/W]: 0.3192 1.604 0.6161 0.0732
τi[s]:
6.4E-5 2.6E-4 1.6E-3 0.021807
0.01
1E-7
1
single pulse
1E-6
tp,PULSEWIDTH[s]
1E-5
1E-4
0.001
0.01
0.1
1
tp,PULSEWIDTH[s]
Figure 21. IGBTtransientthermalimpedanceasa
functionofpulsewidth(seepage42))
(D=tp/T)
Figure 22. Diodetransientthermalimpedanceasa
functionofpulsewidth(seepage43))
(D=tp/T)
150
0.8
Tj = 25°C, IF = 10A
Tj = 175°C, IF = 10A
Tj = 25°C, IF = 10A
Tj = 175°C, IF = 10A
0.7
Qrr,REVERSERECOVERYCHARGE[µC]
trr,REVERSERECOVERYTIME[ns]
125
100
75
50
25
0.6
0.5
0.4
0.3
0.2
0.1
0
700
900
1100
1300
1500
1700
0.0
700
1900
diF/dt,DIODECURRENTSLOPE[A/µs]
900
1100
1300
1500
1700
1900
diF/dt,DIODECURRENTSLOPE[A/µs]
Figure 23. Typicalreverserecoverytimeasafunction
ofdiodecurrentslope
(VR=400V)
12
Figure 24. Typicalreverserecoverychargeasa
functionofdiodecurrentslope
(VR=400V)
Rev.2.1,2014-12-15
IKD10N60RFA
TRENCHSTOPTMRC-DrivesFastSeries
30
0
Tj = 25°C, IF = 10A
Tj = 175°C, IF = 10A
25
-200
dIrr/dt,diodepeakrateoffallofIrr[A/µs]
Irr,REVERSERECOVERYCURRENT[A]
Tj = 25°C, IF = 10A
Tj = 175°C, IF = 10A
20
15
10
5
-400
-600
-800
-1000
0
700
900
1100
1300
1500
1700
-1200
700
1900
diF/dt,DIODECURRENTSLOPE[A/µs]
Figure 25. Typicalreverserecoverycurrentasa
functionofdiodecurrentslope
(VR=400V)
1300
1500
1700
1900
3.0
25
IF = 1A
IF = 5A
IF = 10A
IF = 20A
2.5
VF,FORWARDVOLTAGE[V]
IF,FORWARDCURRENT[A]
1100
Figure 26. Typicaldiodepeakrateoffallofreverse
recoverycurrentasafunctionofdiode
currentslope
(VR=400V)
30
20
Tj = 175°C, VGE = 0V
Tj = 25°C, VGE = 0V
15
10
2.0
1.5
1.0
5
0
900
diF/dt,DIODECURRENTSLOPE[A/µs]
0
1
2
3
0.5
4
VF,FORWARDVOLTAGE[V]
0
25
50
75
100
125
150
175
Tvj,JUNCTIONTEMPERATURE[°C]
Figure 27. Typicaldiodeforwardcurrentasafunction
offorwardvoltage
13
Figure 28. Typicaldiodeforwardvoltageasafunction
ofjunctiontemperature
Rev.2.1,2014-12-15
IKD10N60RFA
TRENCHSTOPTMRC-DrivesFastSeries
PG - TO252 - 3
14
Rev.2.1,2014-12-15
IKD10N60RFA
TRENCHSTOPTMRC-DrivesFastSeries
VGE(t)
I,V
90% VGE
t rr = t a + t b
Q rr = Q a + Q b
dIF/dt
a
10% VGE
b
t
Qa
IC(t)
Qb
dI
90% IC
90% IC
10% IC
10% IC
Figure C. Definition of diode switching
characteristics
t
VCE(t)
t
td(off)
tf
td(on)
t
tr
Figure A.
VGE(t)
90% VGE
Figure D.
10% VGE
t
IC(t)
CC
2% IC
t
Figure E. Dynamic test circuit
Parasitic inductance Ls,
parasitic capacitor Cs,
relief capacitor Cr,
(only for ZVT switching)
VCE(t)
t2
E
off
=
t4
VCE x IC x dt
E
t1
t1
on
=
VCE x IC x d t
2% VCE
t3
t2
t3
t4
t
Figure B.
15
Rev.2.1,2014-12-15
IKD10N60RFA
TRENCHSTOPTM RC-Drives Fast Series
Revision History
IKD10N60RFA
Revision: 2014-12-15, Rev. 2.1
Previous Revision
Revision
Date
Subjects (major changes since last revision)
2.1
2014-12-15
Final data sheet
We Listen to Your Comments
Any information within this document that you feel is wrong, unclear or missing at all?
Your feedback will help us to continuously improve the quality of this document.
Please send your proposal (including a reference to this document) to: erratum@infineon.com
Published by
Infineon Technologies AG
81726 Munich, Germany
81726 München, Germany
© 2014 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics.
With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the
application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind,
including without limitation, warranties of non-infringement of intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon
Technologies Office (www.infineon.com).
Warnings
Due to technical requirements, components may contain dangerous substances. For information on the types in
question, please contact the nearest Infineon Technologies Office.
The Infineon Technologies component described in this Data Sheet may be used in life-support devices or systems
and/or automotive, aviation and aerospace applications or systems only with the express written approval of Infineon
Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support,
automotive, aviation and aerospace device or system or to affect the safety or effectiveness of that device or system. Life
support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be
endangered.
16
Rev. 2.1, 2014-12-15