IKZA50N65SS5
CoolSiC™ Hybrid Discrete
CoolSiC™ Hybrid Discrete - TRENCHSTOP™ 5 S5 IGBT co-packed with full-rated 6th generation CoolSiC™ diode
TO-247-4 – 3Pin
Features
• VCE = 650 V
• IC = 50 A
• Ultra-low switching losses due to the combination of TRENCHSTOPTM 5 and CoolSiCTM
technology as well as the Kelvin emitter pin
• Very low on-state losses
• Benchmark efficiency in hard switching topologies
• Plug-and-play replacement of pure silicon devices
• Simplified PCB design due to the optimized pin-out of the four-pin package
• Improved wave soldering quality due to the increased clearance of the Kelvin emitter and gate
pins
• Maximum junction temperature Tvjmax = 175°C
• Qualified according to JEDEC for target applications
• Pb-free lead plating; RoHS compliant
• Complete product spectrum and PSpice Models: http://www.infineon.com/igbt/
2021-10-27
restricted
Copyright © Infineon Techn
Potential applications
•
•
•
•
•
Industrial SMPS
Industrial UPS
Solar string inverter
Energy storage
Charger
Product validation
• Qualified for applications listed above based on the test conditions in the relevant tests of
JEDEC20/22
Description
Package pin definition:
• Pin C & backside - collector
• Pin E - emitter
• Pin K - Kelvin emitter
• Pin G - gate
Type
Package
Marking
IKZA50N65SS5
PG-TO247-4-3
K50ESS5
Datasheet
www.infineon.com
Please read the sections "Important notice" and "Warnings" at the end of this document
Revision 1.10
2022-09-22
IKZA50N65SS5
CoolSiC™ Hybrid Discrete
Table of contents
Table of contents
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
Potential applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Product validation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Table of contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1
Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2
IGBT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3
3
Diode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
4
Characteristics diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
5
Package outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
6
Testing conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Disclaimer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Datasheet
2
Revision 1.10
2022-09-22
IKZA50N65SS5
CoolSiC™ Hybrid Discrete
1 Package
1
Package
Table 1
Characteristic values
Parameter
Symbol Note or test condition
Values
Min.
Internal emitter
inductance measured 5
mm (0.197 in.) from case
LE
Storage temperature
Tstg
Soldering temperature
Mounting torque
M
Thermal resistance,
junction-ambient
2
Typ.
Unit
Max.
13.0
-55
nH
150
°C
wave soldering 1.6 mm (0.063 in.) from case
for 10 s
260
°C
M3 screw Maximum of mounting process: 3
0.6
Nm
40
K/W
Rth(j-a)
IGBT
Table 2
Maximum rated values
Parameter
Symbol Note or test condition
Collector-emitter voltage
DC collector current,
limited by Tvjmax
Pulsed collector current, tp
limited by Tvjmax
VCE
IC
Unit
650
V
Tc = 25 °C
80
A
Tc = 100 °C
60.5
Tvj ≥ 25 °C
limited by bondwire
ICpulse
Turn-off safe operating
area
200
A
200
A
±20
V
±30
V
Tc = 25 °C
274
W
Tc = 100 °C
137
VCE ≤ 650 V, tp = 1 µs, Tvj ≤ 175 °C
Gate-emitter voltage
VGE
Transient gate-emitter
voltage
VGE
Power dissipation
Ptot
Table 3
Values
tp ≤ 10 µs, D < 0.01
Characteristic values
Parameter
Symbol Note or test condition
Values
Min.
Collector-emitter
saturation voltage
Gate-emitter threshold
voltage
VCEsat
VGEth
IC = 50 A, VGE = 15 V
IC = 0.5 mA, VCE = VGE
Unit
Typ.
Max.
Tvj = 25 °C
1.35
1.7
V
Tvj = 125 °C
1.55
Tvj = 175 °C
1.65
4.8
V
3.2
4
(table continues...)
Datasheet
3
Revision 1.10
2022-09-22
IKZA50N65SS5
CoolSiC™ Hybrid Discrete
2 IGBT
Table 3
(continued) Characteristic values
Parameter
Symbol Note or test condition
Values
Min.
Zero gate-voltage collector
current
ICES
VCE = 650 V, VGE = 0 V
Zero gate-voltage collector
current
ICES
VCE = 480 V, VGE = 0 V
Gate-emitter leakage
current
IGES
VCE = 0 V, VGE = 20 V
Transconductance
gfs
IC = 50 A, VCE = 20 V
Input capacitance
Cies
Output capacitance
Typ.
Tvj = 25 °C
Tvj = 175 °C
Unit
Max.
1300
µA
40
µA
100
nA
2000
Tvj = 25 °C
62
S
VCE = 25 V, VGE = 0 V, f = 250 kHz
2660
pF
Coes
VCE = 25 V, VGE = 0 V, f = 250 kHz
530
pF
Reverse transfer
capacitance
Cres
VCE = 25 V, VGE = 0 V, f = 250 kHz
10
pF
Gate charge
QG
IC = 50 A, VGE = 15 V, VCC = 520 V
110
nC
VCC = 400 V, VGE = 0/15 V, Tvj = 25 °C,
RGon = 9 Ω, RGoff = 9 Ω,
IC = 50 A
Lσ = 30 nH, Cσ = 30 pF
Tvj = 25 °C,
IC = 25 A
19
ns
Turn-on delay time
Rise time (inductive load)
Turn-off delay time
td(on)
tr
td(off)
18
Tvj = 150 °C,
IC = 50 A
19
Tvj = 150 °C,
IC = 25 A
18
VCC = 400 V, VGE = 0/15 V, Tvj = 25 °C,
RGon = 9 Ω, RGoff = 9 Ω,
IC = 50 A
Lσ = 30 nH, Cσ = 30 pF
Tvj = 25 °C,
IC = 25 A
9
5
Tvj = 150 °C,
IC = 50 A
10
Tvj = 150 °C,
IC = 25 A
6
VCC = 400 V, VGE = 0/15 V, Tvj = 25 °C,
RGon = 9 Ω, RGoff = 9 Ω,
IC = 50 A
Lσ = 30 nH, Cσ = 30 pF
Tvj = 25 °C,
IC = 25 A
ns
140
ns
150
Tvj = 150 °C,
IC = 50 A
165
Tvj = 150 °C,
IC = 25 A
191
(table continues...)
Datasheet
4
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IKZA50N65SS5
CoolSiC™ Hybrid Discrete
2 IGBT
Table 3
(continued) Characteristic values
Parameter
Symbol Note or test condition
Values
Min.
Fall time (inductive load)
Turn-on energy
Turn-off energy
Total switching energy
IGBT thermal resistance,
junction-case
Operating junction
temperature
Datasheet
tf
Eon
Eoff
Ets
VCC = 400 V, VGE = 0/15 V, Tvj = 25 °C,
RGon = 9 Ω, RGoff = 9 Ω,
IC = 50 A
Lσ = 30 nH, Cσ = 30 pF
Tvj = 25 °C,
IC = 25 A
ns
24
Tvj = 150 °C,
IC = 50 A
19
Tvj = 150 °C,
IC = 25 A
24
0.23
mJ
0.11
Tvj = 150 °C,
IC = 50 A
0.29
Tvj = 150 °C,
IC = 25 A
0.14
VCC = 400 V, VGE = 0/15 V, Tvj = 25 °C,
RGon = 9 Ω, RGoff = 9 Ω,
IC = 50 A
Lσ = 30 nH, Cσ = 30 pF
Tvj = 25 °C,
IC = 25 A
0.52
mJ
0.28
Tvj = 150 °C,
IC = 50 A
0.88
Tvj = 150 °C,
IC = 25 A
0.48
VCC = 400 V, VGE = 0/15 V, Tvj = 25 °C,
RGon = 9 Ω, RGoff = 9 Ω,
IC = 50 A
Lσ = 30 nH, Cσ = 30 pF
Tvj = 25 °C,
IC = 25 A
0.75
mJ
0.39
Tvj = 150 °C,
IC = 50 A
1.17
Tvj = 150 °C,
IC = 25 A
0.62
Rth(j-c)
-40
5
Max.
19
VCC = 400 V, VGE = 0/15 V, Tvj = 25 °C,
RGon = 9 Ω, RGoff = 9 Ω,
IC = 50 A
Lσ = 30 nH, Cσ = 30 pF
Tvj = 25 °C,
IC = 25 A
Tvj
Typ.
Unit
0.55
K/W
175
°C
Revision 1.10
2022-09-22
IKZA50N65SS5
CoolSiC™ Hybrid Discrete
3 Diode
3
Diode
Table 4
Maximum rated values
Parameter
Symbol Note or test condition
Repetitive peak reverse
voltage
VRRM
Diode forward current,
limited by Tvjmax
IF
Diode pulsed current, tp
limited by Tvjmax 1)
IFpulse
1)
Values
Unit
650
V
Tc = 25 °C
57.5
A
Tc = 100 °C
38.5
Tvj ≥ 25 °C
150
A
Pulse current level depends on Tvj of diode chip, see also Fig. "Maximum pulse current as a function of junction temperature"
Table 5
Characteristic values
Parameter
Symbol Note or test condition
Values
Min.
Diode forward voltage
Diode thermal resistance,
junction-case
Operating junction
temperature
Note:
Datasheet
VF
IF = 40 A
Typ.
Max.
Tvj = 25 °C
1.35
1.5
V
Tvj = 125 °C
1.55
Tvj = 175 °C
1.65
1
K/W
175
°C
Rth(j-c)
Tvj
Unit
-40
For optimum lifetime and reliability, Infineon recommends operating conditions that do not exceed 80% of
the maximum ratings stated in this datasheet.
Electrical Characteristic at Tvj = 25°C, unless otherwise specified.
Dynamic test circuit, parasitic inductance Lσ, parasitic capacitor Cσ from Fig. E. Energy losses include “tail”
and diode reverse recovery.
6
Revision 1.10
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IKZA50N65SS5
CoolSiC™ Hybrid Discrete
4 Characteristics diagrams
4
Characteristics diagrams
Power dissipation as a function of case temperature
Ptot = f(Tc)
Tvj ≤ 175 °C
300
Collector current as a function of case temperature
IC = f(Tc)
Tvj ≤ 175 °C, VGE ≥ 15 V
90
80
250
70
200
60
50
150
40
100
30
20
50
10
0
0
25
50
75
100
125
150
175
25
Typical output characteristic
IC = f(VCE)
Tvj = 25 °C
75
100
125
150
175
Typical output characteristic
IC = f(VCE)
Tvj = 150 °C
200
200
175
175
150
150
125
125
100
100
75
75
50
50
25
25
0
0
0.0
Datasheet
50
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
0.0
7
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
Revision 1.10
2022-09-22
IKZA50N65SS5
CoolSiC™ Hybrid Discrete
4 Characteristics diagrams
Typical transfer characteristic
IC = f(VGE)
VCE = 20 V
Typical collector-emitter saturation voltage as a
function of junction temperature
VCEsat = f(Tvj)
VGE = 15 V
200
2.50
175
2.25
150
2.00
125
1.75
100
1.50
75
1.25
50
1.00
25
0.75
0.50
0
2.5
3.5
4.5
5.5
6.5
7.5
8.5
25
9.5
Typical switching times as a function of collector
current
t = f(IC)
VCC = 400 V, Tvj = 150 °C, VGE = 0/15 V, RG = 9 Ω
75
100
125
150
175
Typical switching times as a function of gate resistor
t = f(RG)
IC = 50 A, VCC = 400 V, Tvj = 150 °C, VGE = 0/15 V
1000
1000
100
100
10
10
1
1
0
Datasheet
50
25
50
75
100
125
150
0
8
10
20
30
40
50
60
70
Revision 1.10
2022-09-22
IKZA50N65SS5
CoolSiC™ Hybrid Discrete
4 Characteristics diagrams
Typical switching times as a function of junction
temperature
t = f(Tvj)
IC = 50 A, VCC = 400 V, VGE = 0/15 V, RG = 9 Ω
Gate-emitter threshold voltage as a function of
junction temperature
VGEth = f(Tvj)
IC = 0.5 mA
1000
5.5
5.0
4.5
100
4.0
3.5
3.0
2.5
10
2.0
1.5
1.0
1
25
50
75
100
125
150
175
25
Typical switching energy losses as a function of
collector current
E = f(IC)
VCC = 400 V, Tvj = 150 °C, VGE = 0/15 V, RG = 9 Ω
50
75
100
125
150
Typical switching energy losses as a function of gate
resistor
E = f(RG)
IC = 50 A, VCC = 400 V, Tvj = 150 °C, VGE = 0/15 V
4.0
3.0
3.5
2.5
3.0
2.0
2.5
2.0
1.5
1.5
1.0
1.0
0.5
0.5
0.0
0.0
0
Datasheet
25
50
75
100
125
150
0
9
10
20
30
40
50
60
70
Revision 1.10
2022-09-22
IKZA50N65SS5
CoolSiC™ Hybrid Discrete
4 Characteristics diagrams
Typical switching energy losses as a function of
junction temperature
E = f(Tvj)
IC = 50 A, VCC = 400 V, VGE = 0/15 V, RG = 9 Ω
Typical switching energy losses as a function of
collector emitter voltage
E = f(VCE)
IC = 50 A, VGE = 0/15 V, Tvj = 150 °C, RG = 9 Ω
1.50
1.50
1.25
1.25
1.00
1.00
0.75
0.75
0.50
0.50
0.25
0.25
0.00
25
50
75
100
125
150
0.00
200
175
Typ. reverse current vs. reverse voltage as a function
of Tvj
ICES = f(VCE)
250
300
350
400
450
500
40
60
80
100
120
Typical gate charge
VGE = f(QG)
IC = 50 A
0.1
16
0.01
14
12
0.001
10
0.0001
8
1E-5
6
1E-6
4
1E-7
2
0
1E-8
100
Datasheet
200
300
400
500
600
700
0
10
20
Revision 1.10
2022-09-22
IKZA50N65SS5
CoolSiC™ Hybrid Discrete
4 Characteristics diagrams
Typical capacitance as a function of collector-emitter
voltage
C = f(VCE)
f = 250 kHz, VGE = 0 V
IGBT transient thermal impedance as a function of
pulse width
Zth(j-c) = f(tp)
D = tp/T
1
10000
0.1
1000
0.01
100
0.001
10
0.0001
1E-8 1E-7 1E-6 1E-5 0.0001 0.001 0.01
1
0
5
10
15
20
25
30
Diode transient thermal impedance as a function of
pulse width
Zth(j-c) = f(tp)
D = tp/T
0.1
1
Maximum pulse current as a function of junction
temperature
IFpulse = f(Tvj)
225
1
200
175
150
0.1
125
100
75
0.01
50
25
0.001
1E-7 1E-6 1E-5 0.0001 0.001 0.01
Datasheet
0
0.1
1
10
25
11
50
75
100
125
150
175
Revision 1.10
2022-09-22
IKZA50N65SS5
CoolSiC™ Hybrid Discrete
4 Characteristics diagrams
Typical diode forward current as a function of forward Typical diode forward voltage as a function of
voltage
junction temperature
IF = f(VF)
VF = f(Tvj)
3.5
150
3.0
120
2.5
90
2.0
1.5
60
1.0
30
0.5
0.0
0
0.0
Datasheet
0.5
1.0
1.5
2.0
2.5
3.0
3.5
25
4.0
12
50
75
100
125
150
175
Revision 1.10
2022-09-22
IKZA50N65SS5
CoolSiC™ Hybrid Discrete
5 Package outlines
5
Package outlines
PG-TO247-4-3
DIMENSIONS
A
A1
A2
A3
b
b1
b2
b3
c
D
D1
D2
D3
D4
E
E1
E2
e1
e2
e3
L
L1
øP
øP1
øP2
Q
S
T
U
MILLIMETERS
MIN.
MAX.
4.90
5.10
2.31
2.51
1.90
2.10
0.05
0.25
1.10
1.30
0.79
0.65
0.20
1.34
1.44
0.66
0.58
21.10
20.90
16.85
16.25
1.05
1.35
24.97
25.27
4.90
5.10
15.70
15.90
13.10
13.50
2.40
2.60
5.08
2.79
2.54
20.10
19.80
4.30
3.50
3.70
7.00
7.40
2.40
2.60
6.00
5.60
6.15
9.80
10.20
6.40
6.00
DOCUMENT NO.
Z8B00184785
REVISION
03
SCALE 2:1
0
5
10mm
EUROPEAN PROJECTION
ISSUE DATE
21.08.2017
Figure 1
Datasheet
13
Revision 1.10
2022-09-22
IKZA50N65SS5
CoolSiC™ Hybrid Discrete
6 Testing conditions
6
Testing Conditions
Testing conditions
VGE(t)
I,V
90% VGE
t rr = t a + t b
Q rr = Q a + Q b
dIF/dt
a
10% VGE
b
t
Qa
IC(t)
Qb
dI
90% IC
90% IC
10% IC
10% IC
Figure C. Definition of diode switching
characteristics
t
VCE(t)
t
td(off)
tf
t
tr
td(on)
Figure A.
VGE(t)
90% VGE
Figure D.
10% VGE
t
IC(t)
CC
2% IC
t
Figure E. Dynamic test circuit
Parasitic inductance Ls,
parasitic capacitor Cs,
relief capacitor Cr,
(only for ZVT switching)
VCE(t)
t2
E
off
=
t4
VCE x IC x dt
E
t1
t1
on
=
VCE x IC x d t
2% VCC
t3
t2
t3
t4
t
Figure B.
Figure 2
Datasheet
14
Revision 1.10
2022-09-22
IKZA50N65SS5
CoolSiC™ Hybrid Discrete
Revision history
Revision history
Document revision
Date of release
Description of changes
V1.1
2020-03-20
Preliminary data sheet
V2.1
2020-07-27
Final Data Sheet
V2.2
2020-07-29
Additional specification of internal emitter inductance
n/a
2020-11-30
Datasheet migrated to a new system with a new layout and new revision
number schema: target or preliminary datasheet = 0.xy; final datasheet =
1.xy
1.10
2022-09-22
Rename of product family name from “Hybrid CoolSiC™ IGBT” to
“CoolSiC™ hybrid discrete”
Datasheet
15
Revision 1.10
2022-09-22
Trademarks
All referenced product or service names and trademarks are the property of their respective owners.
Edition 2022-09-22
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2022 Infineon Technologies AG
All Rights Reserved.
Do you have a question about any
aspect of this document?
Email: erratum@infineon.com
Document reference
IFX-AAL370-004
Important notice
The information given in this document shall in no
event be regarded as a guarantee of conditions or
characteristics (“Beschaffenheitsgarantie”).
With respect to any examples, hints or any typical
values stated herein and/or any information regarding
the application of the product, Infineon Technologies
hereby disclaims any and all warranties and liabilities
of any kind, including without limitation warranties of
non-infringement of intellectual property rights of any
third party.
In addition, any information given in this document is
subject to customer’s compliance with its obligations
stated in this document and any applicable legal
requirements, norms and standards concerning
customer’s products and any use of the product of
Infineon Technologies in customer’s applications.
The data contained in this document is exclusively
intended for technically trained staff. It is the
responsibility of customer’s technical departments to
evaluate the suitability of the product for the intended
application and the completeness of the product
information given in this document with respect to such
application.
Please note that this product is not qualified
according to the AEC Q100 or AEC Q101 documents
of the Automotive Electronics Council.
Warnings
Due to technical requirements products may contain
dangerous substances. For information on the types
in question please contact your nearest Infineon
Technologies office.
Except as otherwise explicitly approved by Infineon
Technologies in a written document signed by
authorized representatives of Infineon Technologies,
Infineon Technologies’ products may not be used in
any applications where a failure of the product or
any consequences of the use thereof can reasonably
be expected to result in personal injury.