Confidential
IM241 Series
CIPOS™ Micro IPM 600 V, 4 A
IM241 Series
Description
IM241-M6 is a 3-phase Intelligent Power Module (IPM) designed for high-efficiency appliance motor drives such as
fans and pumps. This IPM is available in both fast and slow speeds for low loss and low EMI operation respectively.
Features
•
•
•
•
•
•
•
•
•
•
600V 3-phase inverter including gate drivers &
bootstrap function
Reverse Conducting IGBT Gen 2 (RCD2) optimized
for motor drives
Temperature monitor
Accurate overcurrent shutdown (±5%)
Fault reporting and programmable fault clear
Advanced input filter with shoot-through
protection
Optimized dV/dt for loss and EMI trade offs
Open-emitter for single and leg-shunt current
sensing
3.3V logic compatible
Isolation 2000VRMS, 1min
SOP 29x12
DIP 29x12
Potential Applications
Fans
• Pumps
•
Product validation
Qualified for industrial applications according to the relevant tests of JEDEC47/20/22.
Table 1
Product Information
Base Part Number
Package Type
IM241-M6T2y
IM241-M6S1y
Standard Pack
Form
Quantity
DIP 29x12
Tube
240
SOP 29x12
Tube
240
Tape & Reel
500
y = B (fast speed for low losses; for x = S, M, L) or J (slow speed for low EMI; for x = S, M)
Final Datasheet
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Please read the Important Notice and Warnings at the end of this document
Revision 1.6
2022-06-26
CIPOS™ Micro
IM241 Series
Table of contents
Table of contents
Description 1
Features
1
Potential Applications ..................................................................................................................... 1
Product validation .......................................................................................................................... 1
Table of contents ............................................................................................................................ 2
1
Internal Electrical Schematic .......................................................................................... 3
2
2.1
2.2
Pin Configuration........................................................................................................... 4
Pin Assignment ........................................................................................................................................ 4
Pin Descriptions....................................................................................................................................... 5
3
3.1
3.2
3.3
Absolute Maximum Rating .............................................................................................. 7
Module ..................................................................................................................................................... 7
Inverter .................................................................................................................................................... 7
Control ............................................................................................................................................................ 7
4
Thermal Characteristics ................................................................................................. 8
5
Recommended Operating Conditions ............................................................................... 9
6
6.1
6.2
Static Parameters ......................................................................................................... 10
Inverter .................................................................................................................................................. 10
Control ................................................................................................................................................... 10
7
7.1
7.2
Dynamic Parameters ..................................................................................................... 12
Inverter .................................................................................................................................................. 12
Control ................................................................................................................................................... 13
8
Thermistor Characteristics ............................................................................................ 14
9
Mechanical Characteristics and Ratings........................................................................... 15
10
Qualification Information .............................................................................................. 16
11
11.1
11.2
11.3
11.4
Diagrams & Tables ........................................................................................................ 17
TC Measurement Point ........................................................................................................................... 17
Backside Curvature Measurement Points ............................................................................................ 17
Input-Output Logic Table ...................................................................................................................... 18
Switching Time Definitions ................................................................................................................... 19
12
12.1
12.2
12.3
Application Guide ......................................................................................................... 20
Typical Application Schematic ............................................................................................................. 20
TJ vs TTH .................................................................................................................................................. 21
–VS Immunity ......................................................................................................................................... 22
13
13.1
13.2
Package Outline ........................................................................................................... 23
DIP 29x12 ............................................................................................................................................... 23
SOP 29x12 .............................................................................................................................................. 24
14
Revision History ........................................................................................................... 25
Final Datasheet
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2
Revision 1.6
2022-06-26
CIPOS™ Micro
IM241 Series
Internal Electrical Schematic
1
Internal Electrical Schematic
1 VSS
17 P
2 VB(U)
3 VDD1
4 HIN (U)
5 LIN (U)
Half-Bridge
HVIC
18 U/V S(U)
19 NU
6 RFE
7 VB(V)
20 NV
8 VDD2
9 HIN (V)
10 L IN (V)
Half-Bridge
HVIC
21 V/VS(V)
11 VTH
12 V B(W)
22 NW
13 V DD3
14 H IN (W)
15 L IN (W)
Half-Bridge
HVIC
23 W/VS(W)
16 I TRIP
Figure 1
Internal electrical schematic.
Final Datasheet
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3
Revision 1.6
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CIPOS™ Micro
IM241 Series
Pin Configuration
2
Pin Configuration
2.1
Pin Assignment
16
14
12
10
8
6
4
2
15
13
11
9
7
5
3
1
e
23
22
21
Pin Assignment
20
Table 2
19
Module pinout
18
17
Figure 2
Pin
Name
Description
1
VSS
Logic ground
2
VB(U)
U-phase high-side floating IC supply voltage
3
VDD1
Low-side control supply 1
4
HIN(U)
U-phase high-side gate driver input
5
LIN(U)
U-phase low-side gate driver input
6
RFE
RCIN / Fault / Enable
7
VB(V)
V-phase high-side floating IC supply voltage
8
VDD2
Low-side control supply 2
9
HIN(V)
V-phase high-side gate driver input
10
LIN(V)
V-phase low-side gate driver input
11
VTH
Thermistor output
12
VB(W)
W-phase high-side floating IC supply voltage
13
VDD3
Low-side control supply 3
14
HIN(W)
W-phase high-side gate driver input
15
LIN(W)
W-phase low-side gate driver input
16
ITRIP
Over-current protection input
17
P
DC bus voltage positive
18
U/VS(U)
Motor U-phase output, U-phase high-side floating IC supply offset voltage
19
NU
U-phase low-side emitter
20
NV
U-phase low-side emitter -phase low-side emitter
21
V/VS(V)
Motor V-phase output, V-phase high-side floating IC supply offset voltage
22
NW
W-phase low-side emitter
23
W/VS(W)
Motor W-phase output, W-phase high-side floating IC supply offset voltage
Final Datasheet
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4
Revision 1.6
2022-06-26
CIPOS™ Micro
IM241 Series
Pin Configuration
2.2
Pin Descriptions
HIN(U,V,W) and LIN(U,V,W) (Low side and high side
control pins)
The IC shuts down all the gate drivers power outputs,
when the VDD supply voltage is below VDDUV- = 10.9V.
This prevents the external power switches from
critically low gate voltage levels during on-state and
therefore from excessive power dissipation.
These pins are positive logic and they are
responsible for the control of the integrated IGBT.
The Schmitt-trigger input thresholds of them are
such to guarantee LSTTL and CMOS compatibility
down to 3.3V controller outputs. Pull-down resistor
of about 800k is internally provided to pre-bias
inputs during supply start-up and an ESD diode is
provided for pin protection purposes. Input
Schmitt-trigger and noise filter provide beneficial
noise rejection to short input pulses.
VB (U,V,W) and VS (U,V,W) (High side supplies)
VB to VS is the high side supply voltage. The high side
circuit can float with respect to VSS following the
external high side power device source voltage.
Due to the low power consumption, the floating
driver stage is supplied by integrated bootstrap
circuit.
The noise filter suppresses control pulses which are
below the filter time TFILIN. The filter acts according
to Figure 4.
The under-voltage detection operates with a rising
supply threshold of typical VBSUV+ = 11.1V and a falling
threshold of VBSUV- = 10.9V.
CIPOSTM
VS(U,V,W) provide a high robustness against
negative voltage in respect of VSS. This ensures very
stable designs even under rough conditions.
Schmitt-Trigger
HINx
LINx
INPUT NOISE
FILTER
0.8M
SWITCH LEVEL
VIH; VIL
COM
Figure 3
a)
NU, NV, NW (Low side emitters)
Input pin structure
tFILIN
b)
The low side emitters are available for current
measurements of each phase leg. It is
recommended to keep the connection to pin VSS as
short as possible in order to avoid unnecessary
inductive voltage drops.
tFILIN
HIN
LIN
HIN
LIN
HO
LO
HO
LO
high
Figure 4
low
VTH (Thermistor output)
Input filter timing diagram
A UL certified NTC resistor is integrated in the
module with one terminal of the chip connected to
VSS and the other to VTH. When pulled up to a rail
voltage such as VDD or 3.3V by a resistor, the VTH pin
provides an analog voltage signal corresponding to
the temperature of the thermistor.
The integrated gate drive provides additionally a
shoot through prevention capability which avoids
the simultaneous on-state of the high-side and lowside switch of the same inverter phase. A minimum
deadtime insertion of typically 300ns is also
provided by driver IC, in order to reduce crossconduction of the external power switches.
RFE (RCIN / Fault / Enable)
The RFE pin combines 3 functions in one pin: RCIN or
RC-network based programmable fault clear timer,
fault output and enable input.
VDDX, VSS (Low side control supply and reference)
VDD is the control supply and it provides power both
to input logic and to the output power stage. Input
logic is referenced to VSS ground.
The RFE pin is normally connected to an RC network
on the PCB per the schematic in Figure 5. Under
normal operating conditions, RRCIN pulls the RFE pin to
3.3V, thus enabling all the functions in the IPM. The
microcontroller can pull this pin low to disable the
IPM functionality. This is is the Enable function.
The under-voltage circuit enables the device to
operate at power on when a supply voltage of at
least a typical voltage of VDDUV+ = 11.1V is present.
Final Datasheet
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5
Revision 1.6
2022-06-26
CIPOS™ Micro
IM241 Series
Pin Configuration
VRFE(t) = 3.3V * e-t/RC < VRFECRCIN < 350ns / ( - ln (VRFE- / 3.3V) * RRFE_ON)
+3.3V
To Microcontroller
6 RFE
Consider VRFE- of 0.8V and RRFE_ON of 50ohm, CRCIN
should be less than 5nF. It is also suggested to use a
RRCIN of between 0.5MΩ and 2MΩ.
IM231-L6
RRCIN
CRCIN
HIN
Figure 5
Input
Noise
filter
Deadtime &
Shoot-Through
Prevention
Typical PCB circuit connected to the
RFE pin
LIN
Input
Noise
filter
VDD
Undervoltage
detection
COM
The Fault function allows the IPM to report a Fault
condition to the microncontroller by pulling the RFE
pin low in one of two situations. The first is an undervoltage condition on VDD and the second is when the
ITRIP pin sees a voltage rising above VIT,TH+.
ITRIP
The programmable fault clear timer function
provides a means of automatically re-enabling the
module operation a preset amount of time (TFLT-CLR)
after the fault condition has disappeared. Figure 6
shows the RFE-related circuit block diagram inside
the IPM.
RFE
ITRIP
Noise
filter
Noise
filter
The length of TFLT-CLR can be determined by using
the formula below.
VRFE(t) = 3.3V * (1 – e-t/RC)
Figure 6
TFLT-CLR = -RRCIN * CRCIN * ln(1-VRFE +/3.3V)
U/VS(U) , V/VS(V), W/VS(W) (High side emitter and
low side collector)
For example, if RRCIN is 1.2MΩ and CRCIN is 1nF, the TFLTCLR is about 1.7ms with VRFE + of 2.2V. It is also important
to note that CRCIN needs to be minimized in order to
make sure it is fully discharged in case of over current
event.
These pins are connected to motor U, V, W input pins.
P (Positive bus input voltage)
Since the ITRIP pin has a 500ns input filter, it is
appropriate to ensure that CRCIN will be discharged
below VRFE- by the open-drain MOSFET, after 350ns.
Therefore, the max CRCIN can be calculated as:
Final Datasheet
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RFE internal circuit structure
The high side IGBTs are connected to the bus voltage.
It is noted that the bus voltage should not exceed
450V.
6
Revision 1.6
2022-06-26
CIPOS™ Micro
IM241 Series
Absolute Maximum Rating
3
Absolute Maximum Rating
3.1
Module
Table 3
Parameter
Symbol
Storage temperature
Condition
Units
TSTG
-40 ~ 150
°C
Operating case temperature
TC
-40 ~ 125
°C
Operating junction temperature
TJ
-40 ~ 150
°C
Isolation test voltage
VISO
2000
V
3.2
Inverter
Table 4
IM241-M6
Parameter
Max. blocking voltage
Symbol
1min, RMS, f = 60Hz
Condition
VCES/VRRM
Units
600
V
Output current
IO
TC = 25°C
4
A
Peak output current
IOP
TC = 25°C, tp < 1ms
6
A
Peak power dissipation per IGBT
Ptot
TC = 25°C
13
W
Short circuit withstand time
TSC
VDD=15V, VDC ≤400V, TJ=150°C
Allowed number of short
circuits: 500ns
-
-
50
ns
Internal dead time
Matching propagation delay
time (on and off) for same
phase high-side and low-side
Final Datasheet
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DTIC
MT
13
Revision 1.6
2022-06-26
CIPOS™ Micro
IM241 Series
Thermistor Characteristics
8
Thermistor Characteristics
Table 13
Parameter
Symbol
Conditions
Min.
Typ.
Max.
Units
Resistance
R25
TC = 25°C, ±5% tolerance
44.65
47
49.35
kΩ
Resistance
R125
TC = 125°C
1.27
1.39
1.51
kΩ
B-constant
(25/100)
B
-
4006
-
K
-20
-
150
°C
±1% tolerance
Temperature
Range
+3.3V
4.0
Thermistor Pin Readout Voltage VTH (V)
REX T
VTH
3.5
R
3.0
2.5
max
typ
min
2.0
1.5
1.0
0.5
0.0
0
Figure 7
TTH [℃]
Rmin
[kΩ]
Rtyp
[kΩ]
Rmax
[kΩ]
50
15.448
16.432
17.436
60
10.483
11.194
11.924
70
7.245
7.765
8.302
80
5.092
5.477
5.876
90
3.648
3.937
4.237
100
2.653
2.872
3.101
110
1.957
2.125
2.301
120
1.462
1.592
1.729
125
1.269
1.384
1.505
10 20 30 40 50 60 70 80 90 100 110 120 130 140 150
Thermistor Temperature TTH (°C)
Thermistor resistance – temperature curve, for REXT=9.76kΩ, and thermistor resistance
variation with temperature.
Final Datasheet
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Revision 1.6
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CIPOS™ Micro
IM241 Series
Mechanical Characteristics and Ratings
9
Mechanical Characteristics and Ratings
Table 14
Parameter
Symbol
Comparative Tracking
Index
CTI
Curvature of module
backside
BC
Mounting Torque
τ
Weight
Final Datasheet
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Conditions
Min.
Typ.
Max.
Units
550
-
-
V
See Figure 9
-50
-
50
µm
M3 screw & washer,
thermal grease
0.4
0.8
1.2
Nm
M3 screw & washer,
SIL-PAD 1500ST
-
0.6
1.0
Nm
-
3
-
g
W
15
Revision 1.6
2022-06-26
CIPOS™ Micro
IM241 Series
Qualification Information
10
Qualification Information
Table 15
UL Certification
UL-US-L252584-15-22508102-2
Moisture sensitivity level
(SOP 29 x 12 only)
MSL3
RoHS Compliant
Yes
ESD
Human body model
1C
Charge discharge model
C3
Final Datasheet
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Revision 1.6
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CIPOS™ Micro
IM241 Series
Diagrams & Tables
11
Diagrams & Tables
11.1
TC Measurement Point
10.15 mm
4.05 mm
Figure 8
TC measurement point
11.2
Backside Curvature Measurement Points
Figure 9
Curvature measurement points
Final Datasheet
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Revision 1.6
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CIPOS™ Micro
IM241 Series
Diagrams & Tables
11.3
Input-Output Logic Table
V+
HIN U,V,W
HO
(4,9,14)
LIN U,V,W
U,V,W
(5,10,15)
IC Driver
(18,21,23)
ITRIP
(16)
LO
RFE
(6)
Figure 10
Module block diagram
Table 16
RFE
ITRIP
HIN U,V,W
LIN U,V,W
U,V,W
1
0
1
0
V+
1
0
0
1
0
1
0
0
0
‡
1
0
1
1
‡
1
1
x
x
‡
0
x
x
x
‡
‡ Voltage depends on direction of phase current
Final Datasheet
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Revision 1.6
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CIPOS™ Micro
IM241 Series
Diagrams & Tables
11.4
Switching Time Definitions
HINx
LINx
2.1V
0.9V
trr
toff
ton
10%
iCx
90%
90%
tf
tr
10%
10%
10%
10%
vCEx
tc(on)
tc(off)
Figure 11
Switching times definition
HIN(U, V, W)
LIN(U, V, W)
ITRIP
50%
50%
TFLT
50%
RFE
U, V, W
50%
50%
TITRIP
Figure 12
TFL T-CLR
ITRIP time waveform
RFE
50%
TEN
U, V, W
Figure 13
50%
Output disable timing diagram
Final Datasheet
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Revision 1.6
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CIPOS™ Micro
IM241 Series
Application Guide
12
Application Guide
12.1
Typical Application Schematic
#10
P (26)
(1) VS(U)
(2) VB(U)
RC -IGBT
VB1
HO1
U (25)
VS(U)
(3) VS(V)
RC -IGBT
#4
(4) VB(V)
VB2
V (24)
VS(V)
(5) VS(W)
(6) VB(W)
HO2
3-ph AC
Motor
RC -IGBT
VB3
HO3
#3
W (23)
VS(W)
5 or 3.3V
15V
#8
VDD
VDD
VT H
#5
(9) VSS
RC -IGBT
VSS
#9
5 or 3.3V
Micro
Controller
LO1
#2
(11) ITRIP
(12) RFE
(13) HIN(U)
(14) HIN(V)
(14) HIN(W)
(15) LIN(U)
(16) LIN(V)
RC -IGBT
HIN(U)
LO2
#6
HIN(V)
Power
GND line
RC -IGBT
LIN(U)
LIN(V)
#7
NV (21)
HIN(W)
LO3
LIN(W)
NW (20)
#1
Figure 14
NU (22)
RFE
Control
GND line
(17) LIN(W)
ITRIP
Application schematic
Final Datasheet
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Revision 1.6
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CIPOS™ Micro
IM241 Series
Application Guide
12.2
TJ vs TTH
Figure 15
Typical TJ vs TTH correlation without heatsink (AN-2021-08 for reference)
Figure 16
Typical TJ vs TTH correlation with heatsink and Rthc-amb = 7 K/W (AN-2021-08 for reference)
Final Datasheet
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Revision 1.6
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CIPOS™ Micro
IM241 Series
Application Guide
12.3
–VS Immunity
0
-10
VS (V)
-20
-30
-40
-50
-60
0
Figure 17
100
200
300
Time (ns)
400
500
Negative transient Vs SOA for integrated gate driver
Final Datasheet
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Revision 1.6
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CIPOS™ Micro
IM241 Series
Package Outline
13
Package Outline
13.1
DIP 29x12
Dimensions in mm
Final Datasheet
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23
Revision 1.6
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CIPOS™ Micro
IM241 Series
Package Outline
13.2
SOP 29x12
Dimensions in mm
Final Datasheet
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24
Revision 1.6
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CIPOS™ Micro
IM241 Series
Revision History
14
Revision History
Major changes since the last revision
Page or Reference
Final Datasheet
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Description of change
25
Revision 1.6
2022-06-26
Trademarks
All referenced product or service names and trademarks are the property of their respective owners.
Edition 2022-06-26
Published by
Infineon Technologies AG
81726 München, Germany
© 2022 Infineon Technologies AG.
All Rights Reserved.
Do you have a question about this
document?
Email: erratum@infineon.com
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event be regarded as a guarantee of conditions or
characteristics (“Beschaffenheitsgarantie”) .
For further information on the product, technology,
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contact your nearest Infineon Technologies office
(www.infineon.com).
With respect to any examples, hints or any typical
values stated herein and/or any information
regarding the application of the product, Infineon
Technologies hereby disclaims any and all
warranties and liabilities of any kind, including
without limitation warranties of non-infringement of
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dangerous substances. For information on the types
in question please contact your nearest Infineon
Technologies office.
In addition, any information given in this document
is subject to customer’s compliance with its
obligations stated in this document and any
applicable legal requirements, norms and standards
concerning customer’s products and any use of the
product of Infineon Technologies in customer’s
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of
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Technologies, Infineon Technologies’ products may
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The data contained in this document is exclusively
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respect to such application.