IM72D128V01XTMA1

IM72D128V01 IP57 dust and water resistant digital PDM XENSIVTM MEMS microphone Description The IM72D128V01 is an ultra-high performance digital PDM MEMS microphone designed for applications which require a very high SNR (low self-noise) and low distortion (high AOP) and which is also IP57 robust to dust and water. Best-in-class signal-to-noise ratio (SNR) of 72dB(A) enables far field and low volume audio pick-up. The flat frequency response (20Hz low-frequency roll-off) and tight manufacturing tolerance improve performance of multi-microphone (array) applications. The digital microphone ASIC contains an extremely low-noise preamplifier and a high-performance sigma-delta ADC. Different power modes can be selected in order to suit specific clock frequency and current consumption requirements. Each IM72D128V01 microphone is calibrated with an advanced Infineon calibration algorithm, resulting in low sensitivity tolerances (± 1dB). Features • • • • • Component level IP57 water and dust resistant Dynamic range of 106dB Acoustic overload point at 128dBSPL Signal to noise ratio of 72dB(A) SNR Digital PDM output • • • • Flat frequency response with a low frequency rolloff at 20Hz Package dimensions: 4mm x 3mm x 1.2mm Omnidirectional pickup pattern Power optimized modes determined by PDM clock frequency Typical applications • • Active Noise Cancellation (ANC) headphones and earphones Devices with Voice User Interface (VUI) - Smart speakers - Home automation - IOT devices • • High quality audio capturing - Laptops and tablets - Conference systems - Cameras and camcorders Industrial or home monitoring with audio pattern detection Ordering information Table 1 Ordering information Product name Package Marking Ordering code IM72D128V01 PG-LLGA-5-3 I72D07 SP005738480 Datasheet www.infineon.com Please read the sections "Important notice" and "Warnings" at the end of this document 1.01 2022-05-05 IM72D128V01 IP57 dust and water resistant digital PDM XENSIVTM MEMS microphone Product validation Product validation Technology qualified for industrial applications. Ready for validation in industrial applications according to the relevant tests of IEC 60747 and 60749 or alternatively JEDEC47/20/22. Block diagram Figure 1 Block diagram Environmental robustness Infineon’s latest Sealed Dual Membrane MEMS technology delivers high ingress protection (IP57) at a microphone level. The sealed MEMS design prevents water or dust from entering between membrane and backplate, preventing mechanical blockage or electric leakage issues commonly observed in MEMS microphones. Microphones built with the Sealed Dual Membrane technology can be used to create IP68 devices, requiring only minimal mesh protection. Table 2 Environmental robustness Test Standard Test Condition IP5x dust resistance1) Arizona dust A4 coarse, vertical orientation , sound hole upwards, 10 cycles (15 minutes sedimentation, 6 sec blowing) IPx7 water immersion2) Temporary immersion of 1 meters for 30 minutes. Microphone tested 2 hours after removal 1 2 The number "5" stands for the dust ingress rating or the capacity to withstand the effects of fine, abrasive dust particles. The "7" specifies the higher water immersion rating. Datasheet 2 1.01 2022-05-05 IM72D128V01 IP57 dust and water resistant digital PDM XENSIVTM MEMS microphone Table of contents Table of contents Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Typical applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 Product validation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Environmental robustness . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 Table of contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1 Typical performance characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2 Acoustic characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3 3.1 3.2 3.3 3.4 3.5 Electrical characteristics and parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 Electrical parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Audio DC offset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Stereo PDM configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 4 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 5 Footprint and stencil recommendation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 6 Packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 7 Reflow soldering and board assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 8 Reliability specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17 Disclaimer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Datasheet 3 1.01 2022-05-05 IM72D128V01 IP57 dust and water resistant digital PDM XENSIVTM MEMS microphone Typical performance characteristics 1 Typical performance characteristics Test conditions: VDD = 1.8V, fCLK = 3.072MHz, unless otherwise specified. Sensitivity relative to 1kHz [dB] Normalized Output Level [dB] 12 9 6 3 0 -3 -6 -9 -12 10 100 1000 10000 30 25 20 15 10 5 0 -5 -10 0 Frequency [Hz] Figure 2 20 40 60 80 Frequency [kHz] Typical amplitude response Figure 3 90 Typical free field ultrasonic response 10000 60 Group Delay [µs] Phase Response [°] 75 45 30 15 0 1000 100 10 -15 -30 1 10 100 1000 10000 10 Frequency [Hz] Figure 4 100 1000 10000 Frequency [Hz] Typical phase response Figure 5 Typical group delay 1 THD [%] THD [%] 10 10 128dB SPL 1 126dB SPL 0.1 110dB SPL 0.1 0.01 90 95 100 105 110 115 120 125 100 130 Input Sound Pressure Level [dB] Figure 6 Datasheet 1000 10000 Frequency [Hz] Typical THD vs SPL Figure 7 4 Typical THD vs frequency 1.01 2022-05-05 IM72D128V01 IP57 dust and water resistant digital PDM XENSIVTM MEMS microphone Typical performance characteristics -110 1200 fclock = 4.800MHz 800 Spectral Noise Density [dBFS/sqrt(Hz)] 1000 IDD [µA] -115 fclock = 3.072MHz fclock = 2.400MHz fclock = 1.536MHz 600 400 fclock = 768kHz 200 -120 -125 -130 -135 -140 -145 -150 -155 -160 10.00 0 1.60 2.10 2.60 3.10 3.60 Figure 8 Datasheet 100.00 1000.00 10000.00 Frequency [Hz] VDD [V] Typical IDD vs VDD Figure 9 5 Typical noise floor (unweighted) 1.01 2022-05-05 IM72D128V01 IP57 dust and water resistant digital PDM XENSIVTM MEMS microphone Acoustic characteristics 2 Acoustic characteristics Test conditions (unless otherwise specified in the table): VDD = 1.8V, fCLK = 3.072MHz, TA = 25°C, 55% R.H., audio bandwidth 20Hz to 20kHz, select pin grounded, no load on DATA, Tedge = 9ns Table 3 acoustic specifications Parameter Symbol Sensitivity S Low Frequency Roll-off Values Min. Typ. Max. -37 -36 -35 Note or Test Condition dBFS 1kHz, 94dBSPL, all operating modes 20 Hz -3dB relative to 1kHz High Frequency Flatness3) 19 kHz +3dB relative to 1kHz Resonance Frequency Peak3) 37 kHz Signal to Noise fclock = 768kHz Ratio LFRO Unit SNR fclock = 1.536MHz 68 fclock = 2.4MHz Total Harmonic Distortion 72 fclock = 4.8MHz3) 71.5 Phase Response Directivity Polarity 3 THD 0.5 126dBSPL Acoustic 10% THD Overload Point Group Delay 71.5 fclock = 3.072MHz 94dBSPL 20Hz to 8kHz bandwidth, A-Weighted 67 1.0 AOP 128 250Hz 60 600Hz 12 1kHz 7 4kHz 3.5 75Hz 20 1kHz 0.5 4kHz -2 20Hz to 20kHz bandwidth, dB(A) A-Weighted % Measuring 2nd to 5th harmonics; 1kHz. all operating modes Measuring 2nd to 5th dBSPL harmonics; 1kHz. all operating modes µs ° Omnidirectional Positive pressure increases density of 1's, negative pressure decreases density of 1's in data output Parameter not subject to productive test. Verified by laboratory characterization / design. Datasheet 6 1.01 2022-05-05 IM72D128V01 IP57 dust and water resistant digital PDM XENSIVTM MEMS microphone Electrical characteristics and parameters 3 Electrical characteristics and parameters 3.1 Absolute maximum ratings Stresses at or above the listed maximum ratings may affect device reliability or cause permanent device damage. Functional device operation at these conditions is not guaranteed. Table 4 Absolute maximum ratings Parameter Symbol Values Min. Voltage on any Pin Unit Max. Vmax 3.6 V Storage Temperature TS -40 125 °C Ambient Temperature TA -40 85 °C 3.2 Electrical parameters Table 5 Electrical parameters and digital interface input Parameter Symbol Supply Voltage VDD Clock Frequency Range fclock Standby Mode Note / Test Condition Values Unit Note / Test Condition Min. Typ. Max. 1.62 1.8 3.6 V 4) 350 kHz 5) Low Power Mode 450 768 850 kHz Normal Mode 1.2 1.536 1.65 MHz High Performance Mode 2.0 2.4 2.6 MHz 2.9 3.072 3.3 MHz Ultrasonic Mode 4.56 4.8 5.04 MHz 50 ms VDD Ramp-up Time Time until VDD ≥ VDD_min Input Logic Low Level VIL -0.3 0.35xVDD V Input Logic High Level VIH 0.65xVDD VDD+0.3 V 13 ns 10% to 90% 40 60 % fclock≤ 3MHz 48 52 % fclock> 3MHz 200 pF Clock Rise/Fall Time Clock Duty Cycle Output Load Capacitance on DATA 4 5 Cload A 1μF bypass capacitor shall be placed close to the microphone VDD pad to ensure best SNR performance. Data pad is high impedance in standby mode. Datasheet 7 1.01 2022-05-05 IM72D128V01 IP57 dust and water resistant digital PDM XENSIVTM MEMS microphone Electrical characteristics and parameters 3.3 Electrical characteristics Test conditions (unless otherwise specified in the table): VDD = 1.8V, TA = 25°C, 55% R.H. Table 6 General electrical characteristics Parameter Symbol Values Min. Current Clock Off Mode Consumption Standby Mode Typ. Iclock_off Unit Max. 1 Istandby 25 50 IDD 280 310 fclock = 1.536MHz 690 770 fclock = 2.4MHz 820 945 fclock = 3.072MHz 980 1120 fclock = 4.8MHz 900 1000 fclock = 768kHz Short Circuit Current Power Supply Rejection 1 20 PSR1k_NM -80 PSR217_NM -86 ±0.2dB sensitivity accuracy 50 ±0.5dB sensitivity accuracy 20 ±0.2dB sensitivity accuracy 50 VOL Output Logic High Level VOH 0.7xVDD Delay Time for DATA Driven tDD Delay Time for DATA High-Z7) tHZ No load on DATA mA Grounded DATA pin 100mVpp sine wave on VDD swept from 200Hz to 20kHz. dBFS(A) 100mVrms, 217Hz square wave on VDD. A-weighted. 20 Output Logic Low Level CLOCK pulled low