IM73A135V01
IP57 dust and water resistant analog XENSIVTM MEMS microphone
Description
The IM73A135V01 is designed for applications which require a microphone with high SNR (low self-noise), low
distortion (high AOP), which is also IP57 robust to dust and water.
Best-in-class Signal to Noise Ratio (SNR) of 73dB(A) enables far field and low volume audio pick-up. The flat
frequency response ( 20Hz low-frequency roll-off) and tight manufacturing tolerance improve the performance
of multi-microphone array applications.
The high performance analog microphone ASIC contains an extremely low noise preamplifier and a high
performance differential output amplifier. Different power modes can be selected in order to suit specific
current consumption requirements.
Each IM73A135V01 microphone is calibrated with an advanced Infineon calibration algorithm, resulting in small
sensitivity tolerances (± 1dB).
Features
•
•
•
•
Component level IP57 water and dust resistant
Signal to noise ratio of 73dB(A) SNR
Acoustic overload point at 135dBSPL
Flat frequency response with low frequency roll off
at 20Hz
•
•
•
•
Power optimized modes determined by VDD level
Package dimensions: 4mm x 3mm x 1.2mm
Differential output
Omnidirectional pickup pattern
•
High quality audio capturing
- Conference systems
- Cameras and camcorders
Industrial or home monitoring with audio pattern
detection
Typical applications
•
•
Active Noise Cancellation (ANC) headphones and
wireless earbuds
Devices with Voice User Interface (VUI)
- Smart speakers
- Home automation
- IoT devices
•
Ordering information
Table 1
Ordering information
Product name
Package
Marking
Ordering code
IM73A135V01
PG-LLGA-5-2
I73A03
SP003803274
Datasheet
www.infineon.com
Please read the Important Notice and Warnings at the end of this document
V 1.20
2021-07-07
IM73A135V01
IP57 dust and water resistant analog XENSIVTM MEMS microphone
Block diagram
Block diagram
VDD
CALIBRATION
BAND GAP
LDO
POWER
MODE
DETECTOR
MEMS BIAS
CHARGE PUMP
MEMBRANE 1
AMP
OUT+
AMP
OUT-
STATOR
MEMBRANE 2
MEMS
ASIC
GROUND
Figure 1
IM73A135V01 block diagram
Product validation
Technology qualified for industrial applications.
Ready for validation in industrial applications according to the relevant tests of IEC 60747 and 60749 or
alternatively JEDEC47/20/22.
Environmental robustness
Infineon’s latest Sealed Dual Membrane MEMS technology delivers high ingress protection (IP57) at a
microphone level. The sealed MEMS design prevents water or dust from entering between membrane
and backplate, preventing mechanical blockage or electric leakage issues commonly observed in MEMS
microphones. Microphones built with the sealed dual membrane technology can be used to create IP68 devices,
requiring only minimal mesh protection.
Table 2
Environmental robustness
Test Standard
Test Condition
IP5x dust resistance1)
Arizona dust A4 coarse, vertical orientation , sound hole upwards, 10
cycles (15 minutes sedimentation, 6 sec blowing)
IPx7 water immersion2)
Temporary immersion in 1 meter of water for 30 minutes.
Microphone tested 2 hours after removal
1
2
The number "5" stands for the dust ingress rating or the capacity to withstand the effects of fine, abrasive
dust particles.
The number "7" identifies the level of liquid protection.
Datasheet
2
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IM73A135V01
IP57 dust and water resistant analog XENSIVTM MEMS microphone
Table of contents
Table of contents
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Typical applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Product validation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Environmental robustness . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Table of contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1
Typical performance characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2
2.1
Acoustic characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Free field frequency response . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
3
3.1
3.2
3.3
Electrical characteristics and parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Electrical parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
4
Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5
Footprint and stencil recommendation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
6
Packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
7
Reflow soldering and board assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
8
Reliability specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Disclaimer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Datasheet
3
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IM73A135V01
IP57 dust and water resistant analog XENSIVTM MEMS microphone
Typical performance characteristics
1
Typical performance characteristics
Test conditions(unless otherwise specified): VDD = 2.75V, TA= 25°C, output unloaded
Figure 2
Typical amplitude response
Figure 3
Typical free field ultrasonic
response
Figure 4
Typical group delay and phase
response
Figure 5
Typical noise floor
(unweighted)
Figure 6
Typical THD vs SPL
Figure 7
Typical THD vs frequency
Datasheet
4
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IM73A135V01
IP57 dust and water resistant analog XENSIVTM MEMS microphone
Typical performance characteristics
Figure 8
Datasheet
Figure 9
Typical IDD vs VDD
5
Typical PSRR
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IM73A135V01
IP57 dust and water resistant analog XENSIVTM MEMS microphone
Acoustic characteristics
2
Acoustic characteristics
Test conditions (unless otherwise specified in the table): VDD = 2.75V, TA = 25°C, 55% R.H., audio bandwidth 20Hz
to 20kHz, output unloaded
Table 3
IM73A135V01 acoustic specifications
Parameter
Symbol
Sensitivity
Low Frequency Cutoff Point
Values
Min.
Typ.
Max.
-39
-38
-37
fC LP
20
Normal mode
AOPNP
135
Low power mode
AOPLP
130
Signal to Noise
ratio
Normal mode
SNRNP
73
Low power mode
SNRLP
71
Noise floor
Normal mode
-111
Low power mode
-109
Acoustic overload
point
Total harmonic
distortion
Normal 94dBSPL
mode
132dBSPL
THDNP
0.5
Phase Response
Group Delay
94dBSPL
Note or Test Condition
dBV
1kHz, 94 dB SPL, all
operating modes
Hz
-3dB point relative to 1kHz
dBSPL THD = 10%.
dB(A)
A-Weighted
dBV(A) A-Weighted
%
1.0
135dBSPL
Low
power
mode
Unit
Measuring 2nd to 5th
harmonics, 1kHz
10.0
THDLP
0.5
124dBSPL
1.0
130dBSPL
10.0
75Hz
12
1kHz
2
3kHz
-2
250Hz
52
600Hz
7
1kHz
2
4kHz
0.5
°
µs
Directivity
Omnidirectional
Pickup pattern
Polarity
Increasing Vout
Increasing SPL
Datasheet
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IM73A135V01
IP57 dust and water resistant analog XENSIVTM MEMS microphone
Acoustic characteristics
2.1
Free field frequency response
Figure 10
IM73A135V01 free field frequency response
Table 4
IM73A135V01 free field frequency response, normalised to 1kHz sensitivity value.
Datasheet
Frequency (Hz)
Upper Limit (dB)
Lower Limit (dB)
20
-1.5
-4.5
50
+0.5
-1.5
800
+1
-1
1000
0
0
1200
+1
-1
6000
+2
-1
8000
+4
-1
15000
+9
0
7
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IM73A135V01
IP57 dust and water resistant analog XENSIVTM MEMS microphone
Electrical characteristics and parameters
3
Electrical characteristics and parameters
3.1
Absolute maximum ratings
Stresses at or above the listed maximum ratings may affect device reliability or cause permanent device
damage. Functional device operation at these conditions is not guaranteed.
Table 5
Absolute maximum ratings
Parameter
Symbol
Values
Min.
Supply voltage
VDDmax
Unit
Max.
3.0
V
Storage temperature
TS
-40
100
°C
Operating temperature
TA
-40
85
°C
3.2
Electrical parameters
Table 6
IM73A135V01 electrical parameters
Parameter
Supply voltage
Symbol
Normal
mode
Low power
mode
Values
Min.
Typ.
Max.
2.3
2.75
3.0
VDD
1.52
1.6
VDD ramp-up time
Output load
Rload
Input VCM
Normal
mode
Low power
mode
Datasheet
Ca, Cb
100
Cd
100
Rp, Rn
25
1.17
1.3
V
ms
VDD reaches its final value
within ± 10 % tolerance
pF
kΩ
1.43
Vcm
V
0.765
8
0.85
Note / Test Condition
A 100nF bypass
capacitor(CVDD) should be
placed close to the
microphone VDD pin
to ensure best SNR
performance
1.8
5
Cload
Unit
Note / Test
Condition
0.935
Input VCM is the voltage at
the input pins of the audio
front end if not driven
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IM73A135V01
IP57 dust and water resistant analog XENSIVTM MEMS microphone
Electrical characteristics and parameters
VDD
Ca
CVDD
Rp
VDD
OUT+
Cd
OUTGND
MIC
Figure 11
Datasheet
VCM
Rn
Cb
Output load configuration
9
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IM73A135V01
IP57 dust and water resistant analog XENSIVTM MEMS microphone
Electrical characteristics and parameters
3.3
Electrical characteristics
Test conditions (unless otherwise specified in the table): VDD = 2.75V, TA = 25°C, 55% R.H.
Table 7
IM73A135V01 electrical characteristics
Parameter
Current
consumption
Min.
170
230
IDDLP
70
80
tstartup
10
30
tModeChange
Unit
Note / Test Condition
µA
Input ≤ 94 dBSPL
ms
Start-up time in all
operating modes after
VDDmin is applied
10
ms
Time of undefined output
after mode change detected
VBrownOut
1.2
V
Normal
mode
VOUT_DC_NP
1.35
Low power
mode
VOUT_DC_LP
Normal
mode
0.9
PSRRInBand_
80
dB
PSRRInBand_
LP
Normal
mode
PSRRCM_NP
Low power
mode
PSRRCM_LP
Output impedance Normal
mode
Low power
mode
Brown out is triggered for
voltage below VBrownOut
V
NP
Low power
mode
Datasheet
Max.
Low power
mode
Brown out voltage
Power supply
rejection ratio
common mode
Typ.
IDDNP
Mode switching time
Power supply
rejection ratio in
band (differential)
Values
Normal
mode
Start-up time
Vout DC-voltage
Symbol
80
VDD=1.6V + 100mVpp
sinewave (PSR=1/Apower;
Apower = Transfer function
VDD → Differential Output of
ASIC)
65
VDD= 2.75 V + 100mVpp
sinewave
dB
60
Zout_NP
250
Ω
Zout_LP
500
Ω
10
VDD=2.75V + 100mVpp
sinewave (PSR=1/Apower;
Apower = Transfer function
VDD → Differential Output of
ASIC)
VDD= 1.6 V + 100mVpp
sinewave
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IM73A135V01
IP57 dust and water resistant analog XENSIVTM MEMS microphone
Package information
4
Package information
Figure 12
IM73A135V01 package drawing
Table 8
IM73A135V01 pin configuration
Pin Number
Name
1
Output +
2
VDD
3
Output -
4
GND
Ground
5
GND
Ground
Datasheet
Description
Differential Output +
Power supply
Differential Output -
11
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IM73A135V01
IP57 dust and water resistant analog XENSIVTM MEMS microphone
Footprint and stencil recommendation
5
Footprint and stencil recommendation
The acoustic port hole diameter in the PCB should be larger than the acoustic port hole diameter of the MEMS
Microphone to ensure optimal performance. A PCB sound port size of radius 0.4 mm (diameter 0.8mm) is
recommended.
The board pad and stencil aperture recommendations shown in Figure 13 are based on Solder Mask Defined
(SMD) pads. The specific design rules of the board manufacturer should be considered for individual design
optimizations or adaptations.
Figure 13
Datasheet
IM73A135V01 footprint and stencil recommendation
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IM73A135V01
IP57 dust and water resistant analog XENSIVTM MEMS microphone
Packing information
6
Packing information
For shipping and assembly the Infineon microphones are packed in product specific tape-and-reel carriers. A
detailed drawing of the carrier can be seen in Figure 14.
Figure 14
Datasheet
IM73A135V01 tape and reel packing information
13
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IM73A135V01
IP57 dust and water resistant analog XENSIVTM MEMS microphone
Reflow soldering and board assembly
7
Reflow soldering and board assembly
Infineon MEMS microphones are qualified in accordance with the IPC/JEDEC J-STD-020D-01. The moisture
sensitivity level of MEMS microphones is rated as MSL1. For PCB assembly of the MEMS microphone the widely
used reflow soldering using a forced convection oven is recommended.
The soldering profile should be in accordance with the recommendations of the solder paste manufacturer
to reach an optimal solder joint quality. The reflow profile shown in Figure 15 is recommended for board
manufacturing with Infineon MEMS microphones.
Figure 15
Recommended reflow profile
Table 9
Reflow profile limits
Profile feature
Pb-Free assembly
Sn-Pb Eutectic assembly
Temperature Min (Tsmin)
150 °C
100 °C
Temperature Max (Tsmax)
200 °C
150 °C
Time (Tsmin to Tsmax) (ts)
60-120 seconds
60-120 seconds
Ramp-up rate (TL to TP)
3 °C/second max.
3 °C/second max.
217 °C
183 °C
Time (tL) maintained above TL
60-150 seconds
60-150 seconds
Peak Temperature (Tp)
260°C +0°C/-5°C
235°C +0°C/-5°C
20-40 seconds
10-30 seconds
6 °C/second max.
6 °C/second max.
8 minutes max.
6 minutes max.
Liquidous temperature (TL)
Time within 5°C of actual peak
temperature (tp) 3)
Ramp-down rate
Time 25°C to peak temperature
Note:
3
For further information please consult the 'General recommendation for assembly of Infineon
packages' document which is available on the Infineon Technologies web page
Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum
Datasheet
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IM73A135V01
IP57 dust and water resistant analog XENSIVTM MEMS microphone
Reflow soldering and board assembly
The MEMS microphones can be handled using industry standard pick and place equipment. Care should be
taken to avoid damage to the microphone structure as follows:
•
Do not pick the microphone with vacuum tools which make contact with the microphone acoustic port
hole.
•
The microphone acoustic port hole should not be exposed to vacuum, this can destroy or damage the
MEMS.
•
Do not blow air into the microphone acoustic port hole. If an air blow cleaning process is used, the port
hole must be sealed to prevent particle contamination.
•
It is recommended to perform the PCB assembly in a clean room environment in order to avoid
microphone contamination.
•
Air blow and ultrasonic cleaning procedures shall not be applied to MEMS Microphones. A no-clean paste
is recommended for the assembly to avoid subsequent cleaning steps. The microphone MEMS can be
severely damaged by cleaning substances.
•
To prevent the blocking or partial blocking of the sound port during PCB assembly, it is recommended to
cover the sound port with protective tape during PCB sawing or system assembly.
•
Do not use excessive force to place the microphone on the PCB. The use of industry standard pick and place
tools is recommended in order to limit the mechanical force exerted on the package.
Datasheet
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IM73A135V01
IP57 dust and water resistant analog XENSIVTM MEMS microphone
Reliability specifications
8
Reliability specifications
The microphone sensitivity after stress must deviate by no more than 3dB from the initial value.
Table 10
Reliability specification
Test
Abbreviation Test Condition
Standard
Low Temperature Operating Life
LTOL
Ta=-40°C, VDD=3.6V, 1000 hours
JESD22-A108
Low Temperature Storage Life
LTSL
Ta=-40°C, 1000 hours
JESD22-A119
High Temperature Operation Life
HTOL
Ta=+125°C, VDD=3.6V, 1000 hours JESD22-A108
High Temperature Storage Life
HTSL
Ta=+125°C, 1000 hours
JESD22-A103
PC + TC
Pre conditioning MSL-1
JESD22-A113
1000 cycles, -40°C to +125°C, 30
minutes per cycle
JESD22-A104
Pre conditioning MSL-1
JESD22-A113
Ta=+85°C, R.H = 85%, VDD=3.6V,
1000 hours
JESD22-A101
IEC 60068-2-6
Temperature Cycling
Temperature Humidity Bias
PC + THB
Vibration Test
VVF
20Hz to 2000Hz with a peak
acceleration of 20g in X, Y, and
Z for 4 minutes each, total 4
-cycles
Mechanical Shock
MS
10000g/0.1msec direction ±x,y,z, IEC 60068-2-27
5 shocks in each direction, 5
shocks in total
Reflow Solder4)
RS
3 reflow cycles, peak
temperature = +260°C
IPC-JEDEC JSTD-020D-01
Electrostatic Discharge -System
Level Test
ESD - SLT
3 discharges of ±8kV direct
contact to lid while Vdd is
supplied according to the
operational modes; (Vdd ground
is separated from earth ground)
IEC-61000-4-2
Electrostatic Discharge - Human
Body Model
ESD - HBM
1 pulse of ±2kV between all I/O
pin combinations
JEDEC-JS001
Electrostatic Discharge - Charged
Device Model
ESD - CDM
3 discharges of ±500V direct
contact to I/O pins.
JEDEC JS-002
LU
Trigger current from ±200mA
JESD78
Latch up
4
The microphone sensitivity must deviate by no more than 1dB from the initial value after 3 reflow cycles.
Datasheet
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IM73A135V01
IP57 dust and water resistant analog XENSIVTM MEMS microphone
Revision history
Revision history
Document
version
Date of
release
Description of changes
V 1.00
2021-01-07
Initial release
V 1.10
2021-04-19
Updated Typical performance characteristics
V 1.20
2021-07-07
Updated Figure 11 title
Datasheet
17
V 1.20
2021-07-07
Trademarks
All referenced product or service names and trademarks are the property of their respective owners.
Edition 2021-07-07
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2021 Infineon Technologies AG
All Rights Reserved.
Do you have a question about any
aspect of this document?
Email: erratum@infineon.com
Document reference
IFX-mcx1539678668960
IMPORTANT NOTICE
The information given in this document shall in no
event be regarded as a guarantee of conditions or
characteristics (“Beschaffenheitsgarantie”).
With respect to any examples, hints or any typical
values stated herein and/or any information regarding
the application of the product, Infineon Technologies
hereby disclaims any and all warranties and liabilities
of any kind, including without limitation warranties of
non-infringement of intellectual property rights of any
third party.
In addition, any information given in this document is
subject to customer’s compliance with its obligations
stated in this document and any applicable legal
requirements, norms and standards concerning
customer’s products and any use of the product of
Infineon Technologies in customer’s applications.
The data contained in this document is exclusively
intended for technically trained staff. It is the
responsibility of customer’s technical departments to
evaluate the suitability of the product for the intended
application and the completeness of the product
information given in this document with respect to such
application.
WARNINGS
Due to technical requirements products may contain
dangerous substances. For information on the types
in question please contact your nearest Infineon
Technologies office.
Except as otherwise explicitly approved by Infineon
Technologies in a written document signed by
authorized representatives of Infineon Technologies,
Infineon Technologies’ products may not be used in
any applications where a failure of the product or
any consequences of the use thereof can reasonably
be expected to result in personal injury.
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