IMZ120R030M1H

IMZ120R030M1H IMZ120R030M1H CoolSiC™ 1200V SiC Trench MOSFET Silicon Carbide MOSFET Features Drain pin 1  Very low switching losses  Threshold-free on state characteristic  Benchmark gate threshold voltage, VGS(th) = 4.5V  0V turn-off gate voltage for easy and simple gate drive  Fully controllable dV/dt  Robust body diode for hard commutation  Temperature independent turn-off switching losses  Sense pin for optimized switching performance Gate pin 4 Sense pin 3 Source pin 2 Benefits  Efficiency improvement  Enabling higher frequency  Increased power density  Cooling effort reduction  Reduction of system complexity and cost Potential applications  Energy generation o   Solar string inverter and solar optimizer Industrial power supplies o Industrial UPS o Industrial SMPS Infrastructure – Charge o Charger Product validation Qualified for industrial applications according to the relevant tests of JEDEC 47/20/22 Note: the source and sense pins are not exchangeable, their exchange might lead to malfunction Table 1 Key Performance and Package Parameters Type IMZ120R030M1H VDS 1200V Datasheet www.infineon.com ID RDS(on) TC = 25°C, Rth(j-c,max) Tvj = 25°C, ID = 25A, VGS = 18V 56A 30mΩ Tvj,max Marking Package 175°C 12M1H030 PG-TO247-4 Please read the Important Notice and Warnings at the end of this document page 1 of 17 2.1 2019-12-10 IMZ120R030M1H CoolSiC™ 1200V SiC Trench MOSFET Table of contents 1200V SiC Trench MOSFET Table of contents Features ........................................................................................................................................ 1 Benefits ......................................................................................................................................... 1 Potential applications ..................................................................................................................... 1 Product validation .......................................................................................................................... 1 Table of contents ............................................................................................................................ 2 1 Maximum ratings ................................................................................................................... 3 2 Thermal resistances ............................................................................................................... 4 3 3.1 3.2 3.3 Electrical Characteristics ........................................................................................................ 5 Static characteristics ............................................................................................................................... 5 Dynamic characteristics .......................................................................................................................... 6 Switching characteristics ........................................................................................................................ 7 4 Electrical characteristic diagrams ............................................................................................ 8 5 Package drawing................................................................................................................... 14 6 Test conditions ..................................................................................................................... 15 Revision history............................................................................................................................. 16 Datasheet 2 of 17 2.1 2019-12-10 IMZ120R030M1H CoolSiC™ 1200V SiC Trench MOSFET Maximum ratings 1 Maximum ratings For optimum lifetime and reliability, Infineon recommends operating conditions that do not exceed 80% of the maximum ratings stated in this datasheet. Table 2 Maximum ratings Parameter Symbol Value Unit Drain-source voltage, Tvj ≥ 25°C VDSS 1200 V DC drain current for Rth(j-c,max), limited by Tvjmax, VGS = 18V, TC = 25°C TC = 100°C ID 56 45 A Pulsed drain current, tp limited by Tvjmax, VGS = 18V ID,pulse1 150 A DC body diode forward current for Rth(j-c,max), limited by Tvjmax, VGS = 0V TC = 25°C TC = 100°C ISD Pulsed body diode current, tp limited by Tvjmax ISD,pulse1 150 Gate-source voltage2 Max transient voltage, < 1% duty cycle Recommended turn-on gate voltage Recommended turn-off gate voltage VGS VGS,on VGS,off -7… 23 15… 18 0 Short-circuit withstand time VDD = 800V, VDS,peak < 1200V, VGS,on = 15V, Tj,start = 25°C tSC 3 Power dissipation, limited by Tvjmax TC = 25°C TC = 100°C Ptot 227 114 W Virtual junction temperature Tvj -55… 175 °C Storage temperature Tstg -55… 150 °C Soldering temperature, wave soldering only allowed at leads, 1.6mm (0.063 in.) from case for 10 s Tsold 260 °C Mounting torque, M3 screw Maximum of mounting processes: 3 M 0.6 Nm 56 35 A A V µs verified by design Important note: The selection of positive and negative gate-source voltages impacts the long-term behavior of the device. The design guidelines described in Application Note AN2018-09 must be considered to ensure sound operation of the device over the planned lifetime. 1 2 Datasheet 3 of 17 2.1 2019-12-10 IMZ120R030M1H CoolSiC™ 1200V SiC Trench MOSFET Thermal resistances 2 Thermal resistances Table 3 Parameter Symbol MOSFET/body diode thermal resistance, junction – case Rth(j-c) Thermal resistance, junction – ambient Rth(j-a) Datasheet Value Conditions leaded 4 of 17 Unit min. typ. max. - 0.51 0.66 K/W - - 62 K/W 2.1 2019-12-10 IMZ120R030M1H CoolSiC™ 1200V SiC Trench MOSFET Electrical Characteristics 3 Electrical Characteristics 3.1 Static characteristics Table 4 Static characteristics (at Tvj = 25°C, unless otherwise specified) Parameter Drain-source on-state resistance Symbol RDS(on) Body diode forward voltage VSD Gate-source threshold voltage VGS(th) Conditions Value VGS = 18V, ID = 25A, Tvj = 25°C Tvj = 100°C Tvj = 175°C VGS = 15V, ID = 25A, Tvj = 25°C VGS = 0V, ISD = 25A Tvj = 25°C Tvj = 100°C Tvj = 175°C Unit min. typ. max. - 30 38 57 42 - - 42 56 - 4.1 4.0 3.9 5.2 - mΩ V (tested after 1 ms pulse at VGS = 20V) ID = 10mA, VDS = VGS Tvj = 25°C Tvj =175°C 3.5 - 4.5 3.6 5.7 - VGS = 0V, VDS = 1200V Tvj = 25°C Tvj = 175°C - 1.1 3.4 200 - µA VGS = 23V, VDS = 0V - - 120 nA VGS = -7V, VDS = 0V - - -120 nA V Zero gate voltage drain current IDSS Gate-source leakage current IGSS Transconductance gfs VDS = 20V, ID = 25A - 14 - S Internal gate resistance RG,int f = 1MHz, VAC = 25mV - 3 - Ω Datasheet 5 of 17 2.1 2019-12-10 IMZ120R030M1H CoolSiC™ 1200V SiC Trench MOSFET Electrical Characteristics 3.2 Dynamic characteristics Table 5 Dynamic characteristics (at Tvj = 25°C, unless otherwise specified) Parameter Symbol Input capacitance Ciss Output capacitance Coss Reverse capacitance Crss Coss stored energy Eoss Total gate charge QG Gate to source charge QGS,pl Gate to drain charge QGD Datasheet Value Conditions VDD = 800V, VGS = 0V, f = 1MHz, VAC = 25mV VDD = 800V, ID = 25A, VGS = 0/18V, turn-on pulse 6 of 17 min. typ. max. - 2120 - - 116 - - 13 - - - - 44 63 - 18 - - 15 - Unit pF µJ nC 2.1 2019-12-10 IMZ120R030M1H CoolSiC™ 1200V SiC Trench MOSFET Electrical Characteristics 3.3 Switching characteristics Table 6 Switching characteristics, Inductive load 4 Parameter Symbol Conditions Value Unit min. typ. max. - 7.7 - - 11.6 - - 17.3 - - 11.5 - - 260 - - 78 - - 338 - - 320 - nC - 10 - A - 7.7 - - 27.9 - - 17.3 - - 11.5 - - 384 - - 91 - - 475 - - 401 - nC - 14 - A MOSFET Characteristics, Tvj = 25°C Turn-on delay time td(on) Rise time tr Turn-off delay time td(off) Fall time tf Turn-on energy Eon Turn-off energy Eoff Total switching energy Etot VDD = 800V, ID = 25A, VGS = 0/18V, RG,ext = 2Ω, Lσ = 40nH, diode: body diode at VGS = 0V see Fig. E ns µJ Body Diode Characteristics, Tvj = 25°C Diode reverse recovery charge Qrr Diode peak reverse recovery current Irrm VDD = 800V, ISD = 25A, VGS at diode = 0V, dif/dt = 1000A/µs, Qrr includes also QC , see Fig. C MOSFET Characteristics, Tvj = 175°C Turn-on delay time td(on) Rise time tr Turn-off delay time td(off) Fall time tf Turn-on energy Eon Turn-off energy Eoff Total switching energy Etot VDD = 800V, ID = 25A, VGS = 0/18V, RG,ext = 2Ω, Lσ = 40nH, diode: body diode at VGS = 0V see Fig. E ns µJ Body Diode Characteristics, Tvj = 175°C Diode reverse recovery charge Qrr Diode peak reverse recovery current Irrm VDD = 800V, ISD = 25A, VGS at diode = 0V, dif/dt = 1000A/µs, Qrr includes also QC , see Fig. C The chip technology was characterized up to 200 kV/µs. The measured dV/dt was limited by measurement test setup and package. 4 Datasheet 7 of 17 2.1 2019-12-10 IMZ120R030M1H CoolSiC™ 1200V SiC Trench MOSFET Electrical characteristic diagrams 4 Electrical characteristic diagrams 160 250 140 100 150 Ptot [W] IDS [A] 200 not for linear use 120 80 100 60 40 50 Rth(j-c,max) 20 Rth(j-c,typ) 0 0 0 800 VDS [V] 0 1200 Safe operating area (SOA) (VGS = 0/18V, Tc = 25°C, Tj ≤ 175°C) Figure 2 60 60 50 50 40 40 ISD [A] IDS [A] Figure 1 400 30 75 100 125 150 175 TC [ C] Power dissipation as a function of case temperature limited by bond wire (Ptot = f(TC)) 30 Rth(j-c,typ) Rth(j-c,max) 10 10 Rth(j-c,max) Rth(j-c,typ) 0 0 0 Datasheet 50 20 20 Figure 3 25 0 25 50 75 100 125 150 175 TC [ C] Maximum DC drain to source current as Figure 4 a function of case temperature limited by bond wire (IDS = f(TC)) 8 of 17 25 50 75 100 125 150 175 TC [ C] Maximum source to drain current as a function of case temperature limited by bond wire (ISD = f(TC), VGS = 0V) 2.1 2019-12-10 IMZ120R030M1H CoolSiC™ 1200V SiC Trench MOSFET Electrical characteristic diagrams 240 6 25°C 200 5 175°C VGS (th) [V] IDS [A] 160 120 80 40 2 0 0 5 10 VGS [V] 15 20 Typical transfer characteristic (IDS = f(VGS), VDS = 20V, tP = 20µs) 240 -40 Figure 6 120 120 80 40 40 0 0 0 Datasheet 160 20V 18V 16V 15V 14V 12V 10V 8V 6V 160 80 Figure 7 60 110 Tvj [ C] Typical gate-source threshold voltage as a function of junction temperature (VGS(th) = f(Tvj), IDS = 10mA, VGS = VDS) 200 IDS [A] 160 10 240 20V 18V 16V 15V 14V 12V 10V 8V 6V 200 IDS [A] 3 1 0 Figure 5 4 4 8 12 VDS [V] 16 0 20 Typical output characteristic, VGS as parameter (IDS = f(VDS), Tvj=25°C, tP = 20µs) Figure 8 9 of 17 4 8 12 VDS [V] 16 20 Typical output characteristic, VGS as parameter (IDS = f(VDS), Tvj=175°C, tP = 20µs) 2.1 2019-12-10 IMZ120R030M1H CoolSiC™ 1200V SiC Trench MOSFET Electrical characteristic diagrams 18 80 16 VGS = 15V 60 14 12 VGS [V] RDS (ON) [mOhm] VGS = 18V 40 10 8 6 20 4 2 0 -40 Figure 9 10 60 110 Tvj [ C] 0 160 0 Typical on-resistance as a function of junction temperature (RDS(on) = f(Tvj), IDS = 25A) Figure 10 10 20 30 40 QG [nC] 50 60 Typical gate charge (VGS = f(QG), IDS = 25A, VDS = 800V, turn-on pulse) 6 10000 5 1000 VSD [V] C [pF] 4 100 3 2 10 Ciss Coss 1 Crss 1 1 10 100 0 1000 -40 VDS[V] Figure 11 Datasheet Typical capacitance as a function of drain-source voltage (C = f(VDS), VGS = 0V, f = 1MHz) Figure 12 10 of 17 10 60 110 Tvj [ C] 160 Typical body diode forward voltage as function of junction temperature (VSD=f(Tvj), VGS=0V, ISD=25A) 2.1 2019-12-10 IMZ120R030M1H CoolSiC™ 1200V SiC Trench MOSFET Electrical characteristic diagrams 60 60 VGS=18V 50 VGS=15V 40 ISD [A] ISD [A] 40 30 20 30 20 VGS=0V VGS=-2V 10 10 0 0 0 Figure 13 VGS=18V 50 VGS=15V 1 2 3 4 VSD [V] 5 6 VGS=0V VGS=-2V 0 Typical body diode forward current as function of forward voltage, VGS as parameter (ISD = f(VSD), Tvj = 25°C, tP = 20µs) Figure 14 800 1 2 600 Etot Eon 800 Eoff Eoff E [µJ] E [µJ] 6 1000 Eon 400 200 600 400 200 0 0 25 Datasheet 5 Typical body diode forward current as function of forward voltage, VGS as parameter (ISD = f(VSD), Tvj = 175°C, tP = 20µs) Etot Figure 15 3 4 VSD [V] 50 75 100 125 150 175 Tvj [ C] 0 Typical switching energy losses as a function of junction temperature (E = f(Tvj), VDD = 800V, VGS = 0V/18V, RG,ext = 2Ω, ID = 25A, ind. load, test circuit in Fig. E, diode: body diode at VGS = 0V) Figure 16 11 of 17 10 20 30 ID [A] 40 50 Typical switching energy losses as a function of drain-source current (E = f(IDS), VDD = 800V, VGS = 0V/18V, RG,ext = 2Ω, Tvj = 175°C, ind. load, test circuit in Fig. E, diode: body diode at VGS = 0V) 2.1 2019-12-10 IMZ120R030M1H CoolSiC™ 1200V SiC Trench MOSFET Electrical characteristic diagrams 5000 3000 2000 240 160 1000 80 0 0 0 Figure 17 20 td(on) tr td(off) tf 320 Time [ns] 4000 E [µJ] 400 Etot Eon Eoff 0 40 60 80 100 120 RG [Ohm] Typical switching energy losses as a function of gate resistance (E = f(RG,ext), VDD = 800V, VGS = 0V/18V, ID = 25A, Tvj = 175°C, ind. load, test circuit in Fig. E, diode: body diode at VGS = 0V) Figure 18 20 40 60 80 100 120 RG [Ohm] Typical switching times as a function of gate resistor (t = f(RG,ext), VDD = 800V, VGS = 0V/18V, ID = 25A, Tvj = 175°C, ind. load, test circuit in Fig. E, diode: body diode at VGS = 0V) 50 0.7 175°C 0.6 25°C 40 IRRM [A] QRR [µC] 0.5 0.4 0.3 30 20 0.2 10 175°C 0.1 25°C 0 0.0 0 Figure 19 Datasheet 2000 4000 diF /dt[A/µs] 0 6000 Typical reverse recovery charge as a function of diode current slope (Qrr = f(dif/dt), VDD = 800V, VGS = 0V/18V, ID = 25A, ind. load, test circuit in Fig.E, body diode at VGS = 0V) Figure 20 12 of 17 2000 4000 diF /dt[A/µs] 6000 Typical reverse recovery current as a function of diode current slope (Irrm = f(dif/dt), VDD = 800V, VGS = 0V/18V, ID = 25A, ind. load, test circuit in Fig.E, body diode at VGS = 0V) 2.1 2019-12-10 IMZ120R030M1H CoolSiC™ 1200V SiC Trench MOSFET Electrical characteristic diagrams Zthjc [K/W] 1.00 0.5 0.2 0.1 0.05 0.02 0.01 Single Pulse 0.10 i: ri: [K/W] τi: [s] 0.01 1E-6 Figure 21 Datasheet 1E-5 1E-4 1E-3 tp [s] 1 2.78E-01 1.78E-02 2 2.01E-01 2.98E-03 1E-2 3 1.58E-01 5.23E-04 1E-1 4 2.34E-02 1.52E-05 1E0 Max. transient thermal resistance (MOSFET/diode) (Zth(j-c,max) = f(tP), parameter D = tp/T, thermal equivalent circuit in Fig. D) 13 of 17 2.1 2019-12-10 IMZ120R030M1H CoolSiC™ 1200V SiC Trench MOSFET Package drawing 5 Package drawing PG-TO247-4 Figure 22 Datasheet Package drawing 14 of 17 2.1 2019-12-10 IMZ120R030M1H CoolSiC™ 1200V SiC Trench MOSFET Test conditions 6 Test conditions Figure 23 Test conditions Datasheet 15 of 17 2.1 2019-12-10 IMZ120R030M1H 1200V SiC Trench MOSFET Revision history Revision history Document version Date of release Description of changes 2.0 2019-08-22 Final Datasheet 2.1 2019-12-10   Datasheet Move the short circuit time from dynamic characteristics table 5 to maximum ratings table 2. Update the Figure 12, 13, 14 the body diode forward voltage. 16 of 17 2.1 2019-12-10 Trademarks All referenced product or service names and trademarks are the property of their respective owners. Published by Infineon Technologies AG 81726 München, Germany © Infineon Technologies AG 2019. owners. All Rights Reserved. Important notice The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples, hints or any typical values stated herein and/or any information regarding the application of the product, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. In addition, any information given in this document is subject to customer’s compliance with its obligations stated in this document and any applicable legal requirements, norms and standards concerning customer’s products and any use of the product of Infineon Technologies in customer’s applications. The data contained in this document is exclusively intended for technically trained staff. It is the responsibility of customer’s technical departments to evaluate the suitability of the product for the intended application and the completeness of the product information given in this document with respect to such application. For further information on the product, technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies office (www.infineon.com). Please note that this product is not qualified according to the AEC Q100 or AEC Q101 documents of the Automotive Electronics Council. Warnings Due to technical requirements products may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies office. Except as otherwise explicitly approved by Infineon Technologies in a written document signed by authorized representatives of Infineon Technologies, Infineon Technologies’ products may not be used in any applications where a failure of the product or any consequences of the use thereof can reasonably be expected to result in personal injury.