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Rev. 2.1
Page 8
2018-02-14
IPA50R250CP
Outline PGTO220 FullPAK
1
2
3
DIMENSIONS
A
A1
A2
b
b1
b2
b3
b4
c
D
D1
E
e
H
L
L1
øP
Q
Rev. 2.1
Page 9
MILLIMETERS
MIN.
MAX.
4.90
4.50
2.85
2.34
2.86
2.42
0.90
0.65
0.95
1.38
1.51
0.95
0.65
1.38
0.65
1.51
0.63
0.40
16.15
15.67
9.83
8.97
10.65
10.00
2.54
28.70
29.75
13.75
12.78
3.45
2.83
3.30
3.00
3.50
3.15
DOCUMENT NO.
Z8B00003319
REVISION
07
SCALE
0
1
2
5:1
3
4
5mm
EUROPEAN PROJECTION
ISSUE DATE
27.01.2017
2018-02-14
500VCoolMOSªCPPowerTransistor
IPA50R250CP
RevisionHistory
IPA50R250CP
Revision:2018-02-26,Rev.2.1
Previous Revision
Revision
Date
Subjects (major changes since last revision)
2.1
2018-02-26
Outline PG-TO220 FullPAK update
TrademarksofInfineonTechnologiesAG
AURIX™,C166™,CanPAK™,CIPOS™,CoolGaN™,CoolMOS™,CoolSET™,CoolSiC™,CORECONTROL™,CROSSAVE™,DAVE™,DI-POL™,DrBlade™,
EasyPIM™,EconoBRIDGE™,EconoDUAL™,EconoPACK™,EconoPIM™,EiceDRIVER™,eupec™,FCOS™,HITFET™,HybridPACK™,Infineon™,
ISOFACE™,IsoPACK™,i-Wafer™,MIPAQ™,ModSTACK™,my-d™,NovalithIC™,OmniTune™,OPTIGA™,OptiMOS™,ORIGA™,POWERCODE™,
PRIMARION™,PrimePACK™,PrimeSTACK™,PROFET™,PRO-SIL™,RASIC™,REAL3™,ReverSave™,SatRIC™,SIEGET™,SIPMOS™,SmartLEWIS™,
SOLIDFLASH™,SPOC™,TEMPFET™,thinQ™,TRENCHSTOP™,TriCore™.
TrademarksupdatedAugust2015
OtherTrademarks
Allreferencedproductorservicenamesandtrademarksarethepropertyoftheirrespectiveowners.
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©2018InfineonTechnologiesAG
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10
Rev.2.1,2018-02-26