IPB160N08S403ATMA1

IPB160N08S4-03 OptiMOS™-T2 Power-Transistor Product Summary V DS 80 V R DS(on),max 3.2 mW ID 160 A Features • N-channel - Enhancement mode PG-TO263-7-3 • AEC Q101 qualified • MSL1 up to 260°C peak reflow • 175°C operating temperature • Green Product (RoHS compliant) • 100% Avalanche tested Type Package Marking IPB160N08S4-03 PG-TO263-7-3 4N0803 Maximum ratings, at T j=25 °C, unless otherwise specified Parameter Symbol Continuous drain current1) ID Conditions Value T C=25°C, V GS=10V 160 T C=100°C, V GS=10V2) 120 Unit A Pulsed drain current2) I D,pulse T C=25°C 640 Avalanche energy, single pulse2) E AS I D=80A 350 mJ Avalanche current, single pulse I AS - 120 A Gate source voltage V GS - ±20 V Power dissipation P tot T C=25°C 208 W Operating and storage temperature T j, T stg - -55 ... +175 °C Rev. 1.0 page 1 2014-06-20 IPB160N08S4-03 Parameter Symbol Values Conditions Unit min. typ. max. Thermal characteristics2) Thermal resistance, junction - case R thJC - - - 0.72 SMD version, device on PCB R thJA minimal footprint - - 62 6 cm2 cooling area3) - - 40 K/W Electrical characteristics, at T j=25 °C, unless otherwise specified Static characteristics Drain-source breakdown voltage V (BR)DSS V GS=0V, I D= 1mA 80 - - Gate threshold voltage V GS(th) V DS=V GS, I D=150µA 2.0 3.0 4.0 Zero gate voltage drain current I DSS V DS=80V, V GS=0V, T j=25°C - 0.03 1 T j=125°C2) - 10 200 V DS=80V, V GS=0V, V µA Gate-source leakage current I GSS V GS=20V, V DS=0V - - 100 nA Drain-source on-state resistance R DS(on) V GS=10V, I D=100A - 2.6 3.2 mW Rev. 1.0 page 2 2014-06-20 IPB160N08S4-03 Parameter Symbol Values Conditions Unit min. typ. max. - 5961 7750 - 2305 2997 Dynamic characteristics2) Input capacitance C iss Output capacitance C oss Reverse transfer capacitance Crss - 120 239 Turn-on delay time t d(on) - 18 - Rise time tr - 11 - Turn-off delay time t d(off) - 30 - Fall time tf - 38 - Gate to source charge Q gs - 31 40 Gate to drain charge Q gd - 19 37 Gate charge total Qg - 86 112 Gate plateau voltage V plateau - 5.3 - V - - 160 A - - 640 V GS=0V, V DS=25V, f =1MHz V DD=40V, V GS=10V, I D=160A, R G=3.5W pF ns Gate Charge Characteristics2) V DD=64V, I D=160A, V GS=0 to 10V nC Reverse Diode Diode continous forward current2) IS Diode pulse current2) I S,pulse Diode forward voltage V SD V GS=0V, I F=100A, T j=25°C - 0.9 1.3 V Reverse recovery time2) t rr V R=40V, I F=50A, di F/dt =100A/µs - 74 - ns Reverse recovery charge2) Q rr - 160 - nC T C=25°C 1) Current is limited by bondwire; with an R thJC = 0.72K/W the chip is able to carry 186A at 25°C. 2) Specified by design. Not subject to production test. 3) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 µm thick) copper area for drain connection. PCB is vertical in still air. Rev. 1.0 page 3 2014-06-20 IPB160N08S4-03 1 Power dissipation 2 Drain current P tot = f(T C); V GS ≥ 6 V I D = f(T C); V GS = 10 V; SMD 200 200 160 150 120 I D [A] P tot [W] 250 100 80 50 40 0 0 0 50 100 150 200 0 50 100 T C [°C] 150 200 T C [°C] 3 Safe operating area 4 Max. transient thermal impedance I D = f(V DS); T C = 25 °C; D = 0; SMD Z thJC = f(t p) parameter: t p parameter: D =t p/T 100 1000 1 µs 10 µs 0.5 100 µs 1 ms 10-1 I D [A] Z thJC [K/W] 100 0.1 0.05 0.01 10-2 10 single pulse 1 0.1 1 10 100 10-3 10-6 10-5 10-4 -3 t 10 p [s] 10-2 10-1 100 V DS [V] Rev. 1.0 page 4 2014-06-20 IPB160N08S4-03 5 Typ. output characteristics 6 Typ. drain-source on-state resistance I D = f(V DS); T j = 25 °C; SMD R DS(on) = f(I D); T j = 25 °C; SMD parameter: V GS parameter: V GS 640 8 10 V 5V 7V 560 7 480 6 320 R DS(on) [mW] I D [A] 400 6V 240 5 5.5 V 4 5.5 V 6V 160 7V 3 5V 80 10 V 0 2 0 1 2 3 4 5 6 0 40 80 V DS [V] 120 160 I D [A] 7 Typ. transfer characteristics 8 Typ. drain-source on-state resistance I D = f(V GS); V DS = 6V R DS(on) = f(T j); I D = 100 A; V GS = 10 V; SMD parameter: T j 640 5 -55 °C 560 4.5 25 °C 480 400 I D [A] 175 °C 320 240 R DS(on) [mW] 4 3.5 3 160 2.5 80 2 0 3 4 5 6 7 -60 -20 20 60 100 140 180 T j [°C] V GS [V] Rev. 1.0 1.5 page 5 2014-06-20 IPB160N08S4-03 9 Typ. gate threshold voltage 10 Typ. capacitances V GS(th) = f(T j); V GS = V DS C = f(V DS); V GS = 0 V; f = 1 MHz parameter: I D 105 3.5 3 104 Ciss C [pF] 1500 µA V GS(th) [V] 150 µA 2.5 Coss 103 2 Crss 2 10 1.5 101 1 -60 -20 20 60 100 140 0 180 10 20 30 T j [°C] 40 50 60 70 80 V DS [V] 11 Typical forward diode characteristicis 12 Avalanche characteristics IF = f(VSD) I A S= f(t AV) parameter: T j parameter: Tj(start) 103 1000 102 100 175 °C I AV [A] I F [A] 25 °C 175 °C 25 °C 101 10 100 1 0 0.2 0.4 0.6 0.8 1 1.2 1.4 V SD [V] Rev. 1.0 100 °C 150 °C 1 10 100 1000 t AV [µs] page 6 2014-06-20 IPB160N08S4-03 13 Avalanche energy 14 Drain-source breakdown voltage E AS = f(T j) V BR(DSS) = f(T j); I D = 1 mA parameter: I D 90 1600 88 1400 86 1200 30 A 84 V BR(DSS) [V] E AS [mJ] 1000 800 600 82 80 78 60 A 76 400 74 120 A 200 72 70 0 25 75 125 -55 175 -15 25 65 105 145 T j [°C] T j [°C] 15 Typ. gate charge 16 Gate charge waveforms V GS = f(Q gate); I D = 160 A pulsed parameter: V DD 10 V GS 9 Qg 8 16 V 64 V 7 V GS [V] 6 5 V g s(th) 4 3 2 Q g (th) Q sw 1 Q gs 0 0 40 Q gate Q gd 80 Q gate [nC] Rev. 1.0 page 7 2014-06-20 IPB160N08S4-03 Published by Infineon Technologies AG 81726 Munich, Germany © Infineon Technologies AG 2014 All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Rev. 1.0 page 8 2014-06-20 IPB160N08S4-03 Revision History Version Date Changes Revision 1.0 Rev. 1.0 20.06.2014 Final data sheet page 9 2014-06-20