IPB240N04S4R9ATMA1

IPB240N04S4-R9 OptiMOS™-T2 Power-Transistor Product Summary V DS 40 V R DS(on) 0.87 mW ID 240 A Features • N-channel - Enhancement mode PG-TO263-7-3 • AEC qualified • MSL1 up to 260°C peak reflow • 175°C operating temperature • Green product (RoHS compliant) • Ultra low Rds(on) • 100% Avalanche tested Type Package Marking IPB240N04S4-R9 PG-TO263-7-3 4N04R9 Maximum ratings, at T j=25 °C, unless otherwise specified Parameter Symbol Continuous drain current ID Conditions T C=25°C, V GS=10V1) T C=100 °C, Value 240 V GS=10 V2) 240 Unit A Pulsed drain current2) I D,pulse T C=25 °C 960 Avalanche energy, single pulse2) E AS I D=120 A 750 mJ Avalanche current, single pulse I AS - 190 A Gate source voltage V GS - ±20 V Power dissipation P tot T C=25 °C 300 W Operating and storage temperature T j, T stg - -55 ... +175 °C IEC climatic category; DIN IEC 68-1 - - 55/175/56 Rev. 1.1 page 1 2014-04-07 IPB240N04S4-R9 Parameter Symbol Values Conditions Unit min. typ. max. Thermal characteristics2) Thermal resistance, junction - case R thJC - - - 0.5 SMD version, device on PCB R thJA minimal footprint - - 62 6 cm2 cooling area3) - - 40 K/W Electrical characteristics, at T j=25 °C, unless otherwise specified Static characteristics Drain-source breakdown voltage V (BR)DSS V GS=0 V, I D= 1 mA 40 - - Gate threshold voltage V GS(th) V DS=V GS, I D=230 µA 2.0 3.0 4.0 Zero gate voltage drain current I DSS V DS=40 V, V GS=0 V, T j=25 °C - 0.1 1 T j=85 °C2) - 20 240 V DS=18 V, V GS=0 V, V µA Gate-source leakage current I GSS V GS=20 V, V DS=0 V - - 100 nA Drain-source on-state resistance RDS(on) V GS=10 V, I D=100 A - - 0.87 mΩ Rev. 1.1 page 2 2014-04-07 IPB240N04S4-R9 Parameter Symbol Values Conditions Unit min. typ. max. - 17700 23000 pF - 3850 5000 Dynamic characteristics2) Input capacitance C iss Output capacitance C oss Reverse transfer capacitance Crss - 150 345 Turn-on delay time t d(on) - 55 - Rise time tr - 28 - Turn-off delay time t d(off) - 64 - Fall time tf - 59 - Gate to source charge Q gs - 90 117 Gate to drain charge Q gd - 32 65 Gate charge total Qg - 220 290 Gate plateau voltage V plateau - 5.4 - V - - 240 A - - 960 - 0.9 1.3 V - 85 - ns - 130 - nC V GS=0 V, V DS=25 V, f =1 MHz V DD=20 V, V GS=10 V, I D=240 A, R G,ext=3.5 W ns Gate Charge Characteristics2) V DD=32 V, I D=240 A, V GS=0 to 10 V nC Reverse Diode Diode continous forward current2) IS Diode pulse current2) I S,pulse Diode forward voltage V SD Reverse recovery time2) t rr Reverse recovery charge2) Q rr T C=25 °C V GS=0 V, I F=100 A, T j=25 °C V R=20 V, I F=50A, di F/dt =100 A/µs 1) Current is limited by bondwire; with an R thJC = 0.5 K/W the chip is able to carry 451A at 25°C. 2) Defined by design. Not subject to production test. 3) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 µm thick) copper area for drain connection. PCB is vertical in still air. Rev. 1.1 page 3 2014-04-07 IPB240N04S4-R9 1 Power dissipation 2 Drain current P tot = f(T C); V GS ≥ 6 V I D = f(T C); V GS ≥ 6 V 350 260 240 300 220 200 250 180 160 I D [A] P tot [W] 200 140 120 150 100 80 100 60 40 50 20 0 0 0 50 100 150 200 0 50 100 T C [°C] 150 200 T C [°C] 3 Safe operating area 4 Max. transient thermal impedance I D = f(V DS); T C = 25 °C; D = 0 Z thJC = f(t p) parameter: t p parameter: D =t p/T 100 1000 10 µs 1 µs 100 µs 0.5 1 ms 10-1 I D [A] Z thJC [K/W] 100 0.1 0.05 10-2 10 0.01 single pulse 10-3 1 0.1 1 10 100 10-5 10-4 10-3 10-2 10-1 100 t p [s] V DS [V] Rev. 1.1 10-6 page 4 2014-04-07 IPB240N04S4-R9 5 Typ. output characteristics 6 Typ. drain-source on-state resistance I D = f(V DS); T j = 25 °C R DS(on) = (I D); T j = 25 °C parameter: V GS parameter: V GS 4 1000 6V 7V 900 5V 6.5 V 10 V 800 3 R DS(on) [mW] 700 I D [A] 600 6V 500 400 300 2 6V 5.5 V 6.5 V 1 7V 200 10 V 5V 100 0 0 7V 0 2 4 0 6 100 200 I D [A] V DS [V] 7 Typ. transfer characteristics 8 Typ. drain-source on-state resistance I D = f(V GS); V DS = 6V R DS(on) = f(T j); I D = 100 A; V GS = 10 V parameter: T j 1000 1.3 900 800 1.1 R DS(on) [mW] 700 I D [A] 600 500 400 0.9 300 0.7 200 175 °C 25 °C -55 °C 100 0.5 0 2 3 4 5 6 7 8 -20 20 60 100 140 180 T j [°C] V GS [V] Rev. 1.1 -60 page 5 2014-04-07 IPB240N04S4-R9 9 Typ. gate threshold voltage 10 Typ. capacitances V GS(th) = f(T j); V GS = V DS C = f(V DS); V GS = 0 V; f = 1 MHz parameter: I D 105 4 Ciss 3.5 104 2300 µA 3 C [pF] V GS(th) [V] Coss 230 µA 2.5 103 2 102 Crss 1.5 1 -60 -20 20 60 100 140 0 180 5 10 T j [°C] 15 20 25 12 Typ. avalanche characteristics IF = f(VSD) I AS = f(t AV) parameter: T j parameter: Tj(start) 103 1000 102 100 40 100 °C 25 °C I AV [A] I F [A] 150 °C 25 °C 101 10 100 1 0 0.2 0.4 0.6 0.8 1 1.2 1.4 V SD [V] Rev. 1.1 35 V DS [V] 11 Typical forward diode characteristicis 175 °C 30 0.1 1 10 100 1000 t AV [µs] page 6 2014-04-07 IPB240N04S4-R9 13 Typical avalanche energy 14 Drain-source breakdown voltage E AS = f(T j) V BR(DSS) = f(T j); I D = 1 mA parameter: I D 44 700 60 A 600 42 V BR(DSS) [V] E AS [mJ] 500 400 120 A 300 40 200 190 A 100 38 0 25 75 125 -60 175 -20 20 T j [°C] 60 100 140 180 T j [°C] 15 Typ. gate charge 16 Gate charge waveforms V GS = f(Q gate); I D = 240 A pulsed parameter: V DD 10 9 8V V GS 32 V Qg 8 7 V GS [V] 6 5 4 3 2 Q gate 1 Q gs Q gd 0 0 40 80 120 160 200 240 Q gate [nC] Rev. 1.1 page 7 2014-04-07 IPB240N04S4-R9 Published by Infineon Technologies AG 81726 Munich, Germany © Infineon Technologies AG 2014 All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Rev. 1.1 page 8 2014-04-07 IPB240N04S4-R9 Revision History Version Date Changes Revision 1.0 16.08.2013 Final Data Sheet Revision 1.1 Changed Hot Temperature IDSS 07.04.2014 Changed Dynamic Values Changed EAS Rev. 1.1 page 9 2014-04-07