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Rev. 2.1
Page 8
2018-03-28
IPB60R099CP
Figure 1
Rev. 2.1
Outline PGTO 263, dimensions in mm/inches
Page 9
2018-03-28
600VCoolMOSªCPPowerTransistor
IPB60R099CP
RevisionHistory
IPB60R099CP
Revision:2018-04-04,Rev.2.1
Previous Revision
Revision
Date
Subjects (major changes since last revision)
2.1
2018-04-04
Updated package outline
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AURIX™,C166™,CanPAK™,CIPOS™,CoolGaN™,CoolMOS™,CoolSET™,CoolSiC™,CORECONTROL™,CROSSAVE™,DAVE™,DI-POL™,DrBlade™,
EasyPIM™,EconoBRIDGE™,EconoDUAL™,EconoPACK™,EconoPIM™,EiceDRIVER™,eupec™,FCOS™,HITFET™,HybridPACK™,Infineon™,
ISOFACE™,IsoPACK™,i-Wafer™,MIPAQ™,ModSTACK™,my-d™,NovalithIC™,OmniTune™,OPTIGA™,OptiMOS™,ORIGA™,POWERCODE™,
PRIMARION™,PrimePACK™,PrimeSTACK™,PROFET™,PRO-SIL™,RASIC™,REAL3™,ReverSave™,SatRIC™,SIEGET™,SIPMOS™,SmartLEWIS™,
SOLIDFLASH™,SPOC™,TEMPFET™,thinQ™,TRENCHSTOP™,TriCore™.
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Rev.2.1,2018-04-04