IPC100N04S5L1R5ATMA1

IPC100N04S5L-1R5 OptiMOS™-5 Power-Transistor Product Summary VDS 40 V RDS(on),max 1.5 mW ID 100 A Features • OptiMOS™ - power MOSFET for automotive applications PG-TDSON-8-34 • N-channel - Enhancement mode - Logic Level • AEC Q101 qualified • MSL1 up to 260°C peak reflow 1 • 175°C operating temperature 1 • Green Product (RoHS compliant) • 100% Avalanche tested Type Package Marking IPC100N04S5L-1R5 PG-TDSON-8-34 5N04L1R5 Maximum ratings, at T j=25 °C, unless otherwise specified Parameter Symbol Continuous drain current1) ID Conditions Value T C=25°C, V GS=10V 100 T C=100°C, V GS=10V2) 100 Unit A Pulsed drain current2) I D,pulse T C=25°C 400 Avalanche energy, single pulse2) E AS I D=50A 220 mJ Avalanche current, single pulse I AS - 100 A Gate source voltage V GS - ±16 V Power dissipation P tot T C=25°C 115 W Operating and storage temperature T j, T stg - -55 ... +175 °C Rev. 1.2 page 1 2016-12-06 IPC100N04S5L-1R5 Parameter Symbol Values Conditions Unit min. typ. max. Thermal characteristics2) Thermal resistance, junction - case R thJC - - - 1.3 Thermal resistance, junction ambient R thJA 6 cm2 cooling area3) - - 50 K/W Electrical characteristics, at T j=25 °C, unless otherwise specified Static characteristics Drain-source breakdown voltage V (BR)DSS V GS=0V, I D= 1mA 40 - - Gate threshold voltage V GS(th) V DS=V GS, I D=60µA 1.2 1.6 2.0 Zero gate voltage drain current I DSS V DS=40V, V GS=0V, T j=25°C - - 1 T j=125°C2) - - 100 V DS=40V, V GS=0V, V µA Gate-source leakage current I GSS V GS=16V, V DS=0V - - 100 nA Drain-source on-state resistance R DS(on) V GS=4.5V, I D=50A - 1.5 2.1 mW V GS=10V, I D=50A - 1.2 1.5 Rev. 1.2 page 2 2016-12-06 IPC100N04S5L-1R5 Parameter Symbol Values Conditions Unit min. typ. max. - 4020 5340 - 905 1200 Dynamic characteristics2) Input capacitance C iss Output capacitance C oss Reverse transfer capacitance Crss - 60 90 Turn-on delay time t d(on) - 5 - Rise time tr - 4 - Turn-off delay time t d(off) - 30 - Fall time tf - 14 - Gate to source charge Q gs - 11 15 Gate to drain charge Q gd - 15 23 Gate charge total Qg - 70 95 Gate plateau voltage V plateau - 2.7 - V - - 100 A - - 400 V GS=0V, V DS=25V, f =1MHz V DD=20V, V GS=10V, I D=100A, R G,ext=3.5W pF ns Gate Charge Characteristics2) V DD=32V, I D=100A, V GS=0 to 10V nC Reverse Diode Diode continous forward current2) IS Diode pulse current1) I S,pulse Diode forward voltage V SD V GS=0V, I F=50A, T j=25°C - 0.8 1.1 V Reverse recovery time1) t rr V R=20V, I F=50A, di F/dt =100A/µs - 52 - ns Reverse recovery charge1) Q rr - 60 - nC T C=25°C 1) Current is limited by package; with an R thJC = 1.3K/W the chip is able to carry 194A at 25°C. 2) The parameter is not subject to production test- verified by design/characterization. 3) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm 2 (one layer, 70 µm thick) copper area for drain connection. PCB is vertical in still air. Rev. 1.2 page 3 2016-12-06 IPC100N04S5L-1R5 1 Power dissipation 2 Drain current P tot = f(T C); V GS = 10 V I D = f(T C); V GS = 10 V 110 120 100 90 100 80 70 ID [A] Ptot [W] 80 60 60 50 40 40 30 20 20 10 0 0 0 50 100 150 200 0 50 100 TC [°C] 150 200 TC [°C] 3 Safe operating area 4 Max. transient thermal impedance I D = f(V DS); T C = 25 °C; D = 0 Z thJC = f(t p) parameter: t p parameter: D =t p/T 1000 101 1 µs 100 10 µs 0.5 ZthJC [K/W] 100 ID [A] 100 µs 0.1 0.05 10-1 0.01 150 µs 10 single pulse 10-2 1 10-3 0.1 1 10 100 VDS [V] Rev. 1.2 10-6 10-5 10-4 10-3 10-2 10-1 100 tp [s] page 4 2016-12-06 IPC100N04S5L-1R5 5 Typ. output characteristics 6 Typ. drain-source on-state resistance I D = f(V DS); T j = 25 °C R DS(on) = f(I D); T j = 25 °C parameter: V GS parameter: V GS 400 12 350 2.5 V 10 10 V 2.75 V 3.5 V 300 3V 8 200 RDS(on) [mΩ] ID [A] 250 3V 150 6 4 2.75V 100 3.5V 2 50 2.5V 10 V 0 0 1 2 0 3 0 100 200 VDS [V] 300 400 ID [A] 7 Typ. transfer characteristics 8 Typ. drain-source on-state resistance I D = f(V GS); V DS = 6V R DS(on) = f(T j); I D = 50 A; V GS = 10 V parameter: T j 400 3 2.5 RDS(on) [mW] ID [A] 300 200 2 1.5 100 1 175 °C 25 °C -55 °C 0 1.5 2 2.5 3 3.5 VGS [V] Rev. 1.2 0.5 -60 -20 20 60 100 140 180 Tj [°C] page 5 2016-12-06 IPC100N04S5L-1R5 9 Typ. gate threshold voltage 10 Typ. capacitances V GS(th) = f(T j); V GS = V DS C = f(V DS); V GS = 0 V; f = 1 MHz parameter: I D 104 2 Ciss Coss 1.5 600 µA C [pF] 60 µA VGS(th) [V] 103 1 Crss 102 0.5 101 0 -60 -20 20 60 100 140 0 180 10 20 30 VDS [V] Tj [°C] 11 Typical forward diode characteristics 12 Avalanche characteristics IF = f(VSD) I A S= f(t AV) parameter: T j parameter: Tj(start) 103 1000 102 100 175 °C IAV [A] IF [A] 25 °C 25 °C 100 °C 150 °C 25 °C 175 °C 101 10 100 0 0.2 0.4 0.6 0.8 1 1.2 1.4 VSD [V] Rev. 1.2 1 1 10 100 1000 tAV [µs] page 6 2016-12-06 IPC100N04S5L-1R5 13 Avalanche energy 14 Drain-source breakdown voltage E AS = f(T j) V BR(DSS) = f(T j); I D = 1 mA 46 500 450 44 400 25 A 350 VBR(DSS) [V] EAS [mJ] 300 250 200 42 40 50 A 150 100 38 100 A 50 36 0 25 75 125 -60 175 -20 Tj [°C] 20 60 100 140 180 Tj [°C] 15 Typ. gate charge 16 Gate charge waveforms V GS = f(Q gate); I D = 100 A pulsed parameter: V DD 10 V GS 9 Qg 8 8V 7 32 V VGS [V] 6 5 V gs(th) 4 3 2 Q g(th) Q sw Q gate 1 Q gs 0 0 10 20 30 40 50 60 Q gd 70 Qgate [nC] Rev. 1.2 page 7 2016-12-06 IPC100N04S5L-1R5 Published by Infineon Technologies AG 81726 Munich, Germany © Infineon Technologies AG 2016 All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Rev. 1.2 page 8 2016-12-06 IPC100N04S5L-1R5 Revision History Version Date Changes Revision 1.0 19.08.2016 Final Data Sheet Revision 1.1 07.09.2016 Detailed package data added Revision 1.2 06.12.2016 Update the IDSS for Tj=25°C Rev. 1.2 page 9 2016-12-06