IPC50N04S5L-5R5

IPC50N04S5L-5R5 OptiMOS™-5 Power-Transistor Product Summary VDS 40 V RDS(on),max 5.5 mW ID 50 A Features • OptiMOS™ - power MOSFET for automotive applications PG-TDSON-8-33 • N-channel - Enhancement mode - Logic Level • AEC Q101 qualified • MSL1 up to 260°C peak reflow 1 • 175°C operating temperature 1 • Green Product (RoHS compliant) • 100% Avalanche tested Type Package Marking IPC50N04S5L-5R5 PG-TDSON-8-33 5N04L5R5 Maximum ratings, at T j=25 °C, unless otherwise specified Parameter Symbol Continuous drain current1) ID Conditions Value T C=25 °C, V GS=10 V 50 T C=100°C, V GS=10V2) 42 Unit A Pulsed drain current2) I D,pulse T C=25°C 200 Avalanche energy, single pulse2) E AS I D=25A 30 mJ Avalanche current, single pulse I AS - 50 A Gate source voltage V GS - ±16 V Power dissipation P tot T C=25°C 42 W Operating and storage temperature T j, T stg - -55 ... +175 °C Rev. 1.2 page 1 2016-12-06 IPC50N04S5L-5R5 Parameter Symbol Values Conditions Unit min. typ. max. Thermal characteristics2) Thermal resistance, junction - case R thJC - - - 3.6 Thermal resistance, junction ambient R thJA 6 cm2 cooling area3) - - 50 K/W Electrical characteristics, at T j=25 °C, unless otherwise specified Static characteristics Drain-source breakdown voltage V (BR)DSS V GS=0V, I D= 1mA 40 - - Gate threshold voltage V GS(th) V DS=V GS, I D=13µA 1.2 1.6 2.0 Zero gate voltage drain current I DSS V DS=40V, V GS=0V, T j=25°C - - 1 T j=125°C2) - - 100 V DS=40V, V GS=0V, V µA Gate-source leakage current I GSS V GS=16V, V DS=0V - - 100 nA Drain-source on-state resistance R DS(on) V GS=4.5V, I D=25A - 5.7 7.9 mW V GS=10V, I D=25A - 4.4 5.5 Rev. 1.2 page 2 2016-12-06 IPC50N04S5L-5R5 Parameter Symbol Values Conditions Unit min. typ. max. - 930 1209 - 210 279 Dynamic characteristics2) Input capacitance C iss Output capacitance C oss Reverse transfer capacitance Crss - 14 21 Turn-on delay time t d(on) - 2 - Rise time tr - 2 - Turn-off delay time t d(off) - 8 - Fall time tf - 6 - Gate to source charge Q gs - 2.7 3.6 Gate to drain charge Q gd - 3.6 5.4 Gate charge total Qg - 17 23 Gate plateau voltage V plateau - 2.9 - V - - 50 A - - 200 V GS=0V, V DS=25V, f =1MHz V DD=20V, V GS=10V, I D=50A, R G=3.5W pF ns Gate Charge Characteristics2) V DD=32V, I D=50A, V GS=0 to 10V nC Reverse Diode Diode continous forward current2) IS Diode pulse current2) I S,pulse Diode forward voltage V SD V GS=0V, I F=25A, T j=25°C - 0.8 1.1 V Reverse recovery time2) t rr V R=20V, I F=50A, di F/dt =100A/µs - 30 - ns Reverse recovery charge2) Q rr - 22 - nC T C=25°C 1) Current is limited by package; with an R thJC = 3.6K/W the chip is able to carry 60 A at 25°C. 2) The parameter is not subject to production test- verified by design/characterization. 3) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm 2 (one layer, 70 µm thick) copper area for drain connection. PCB is vertical in still air. Rev. 1.2 page 3 2016-12-06 IPC50N04S5L-5R5 1 Power dissipation 2 Drain current P tot = f(T C); V GS = 10 V I D = f(T C); V GS = 10 V 50 60 50 40 40 ID [A] Ptot [W] 30 30 20 20 10 10 0 0 0 50 100 150 200 0 50 TC [°C] 100 150 200 TC [°C] 3 Safe operating area 4 Max. transient thermal impedance I D = f(V DS); T C = 25 °C; D = 0 Z thJC = f(t p) parameter: t p parameter: D =t p/T 1000 101 0.5 1 µs 100 100 10 µs ID [A] ZthJC [K/W] 0.1 100 µs 0.01 0.05 10 10-1 150 µs single pulse 1 10-2 0.1 1 10 100 VDS [V] Rev. 1.2 tp [s] page 4 2016-12-06 IPC50N04S5L-5R5 5 Typ. output characteristics 6 Typ. drain-source on-state resistance I D = f(V DS); T j = 25 °C R DS(on) = f(I D); T j = 25 °C parameter: V GS parameter: V GS 200 25 2.5 V 10 V 20 150 2.75 V RDS(on) [mW] ID [A] 3.5 V 100 50 15 3V 3.5 V 10 3V 5 10 V 2.75 V 2.5 V 0 0 1 2 0 3 0 40 80 VDS [V] 120 160 200 ID [A] 7 Typ. transfer characteristics 8 Typ. drain-source on-state resistance I D = f(V GS); V DS = 6V R DS(on) = f(T j); I D = 25 A; V GS = 10 V parameter: T j 200 9.5 160 8.5 7.5 ID [A] RDS(on) [mW] 120 80 6.5 5.5 4.5 40 175 °C 25 °C 3.5 -55 °C 0 1.5 2 2.5 3 3.5 4 4.5 VGS [V] Rev. 1.2 2.5 -60 -20 20 60 100 140 180 Tj [°C] page 5 2016-12-06 IPC50N04S5L-5R5 9 Typ. gate threshold voltage 10 Typ. capacitances V GS(th) = f(T j); V GS = V DS C = f(V DS); V GS = 0 V; f = 1 MHz parameter: I D 104 2 1.5 C [pF] 130 µA VGS(th) [V] 13 µA 103 Ciss Coss 1 102 0.5 Crss 101 0 -60 -20 20 60 100 140 0 180 10 20 30 VDS [V] Tj [°C] 11 Typical forward diode characteristicis 12 Avalanche characteristics IF = f(VSD) I A S= f(t AV) parameter: T j parameter: Tj(start) 100 103 102 IF [A] IAV [A] 25 °C 175 °C 10 100 °C 25 °C 101 150 °C 100 0 0.2 0.4 0.6 0.8 1 1.2 1.4 VSD [V] Rev. 1.2 1 1 10 100 1000 tAV [µs] page 6 2016-12-06 IPC50N04S5L-5R5 13 Avalanche energy 14 Drain-source breakdown voltage E AS = f(T j) V BR(DSS) = f(T j); I D = 1 mA 46 70 60 44 12.5 A VBR(DSS) [V] EAS [mJ] 50 40 30 42 40 25 A 20 38 50 A 10 36 0 25 75 125 -60 175 -20 Tj [°C] 20 60 100 140 180 Tj [°C] 15 Typ. gate charge 16 Gate charge waveforms V GS = f(Q gate); I D = 50 A pulsed parameter: V DD 10 V GS 9 Qg 8 8V 32 V 7 VGS [V] 6 5 V gs(th) 4 3 2 Q g(th) Q sw Q gate 1 Q gs 0 0 4 8 12 Q gd 16 Qgate [nC] Rev. 1.2 page 7 2016-12-06 IPC50N04S5L-5R5 Published by Infineon Technologies AG 81726 Munich, Germany © Infineon Technologies AG 2016 All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Rev. 1.2 page 8 2016-12-06 IPC50N04S5L-5R5 Revision History Version Date Changes Revision 1.0 14.03.2016 Final Data Sheet Revision 1.1 07.09.2016 Detailed package name added Revision 1.2 06.12.2016 Update the IDSS for Tj=25°C Rev. 1.2 page 9 2016-12-06